TWI298666B - - Google Patents
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- Publication number
- TWI298666B TWI298666B TW093101645A TW93101645A TWI298666B TW I298666 B TWI298666 B TW I298666B TW 093101645 A TW093101645 A TW 093101645A TW 93101645 A TW93101645 A TW 93101645A TW I298666 B TWI298666 B TW I298666B
- Authority
- TW
- Taiwan
- Prior art keywords
- honing
- particles
- colloidal
- substrate
- honed
- Prior art date
Links
- 239000002245 particle Substances 0.000 claims description 71
- 239000003795 chemical substances by application Substances 0.000 claims description 51
- 239000002002 slurry Substances 0.000 claims description 43
- 239000000758 substrate Substances 0.000 claims description 43
- 229910000420 cerium oxide Inorganic materials 0.000 claims description 40
- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 claims description 40
- 239000002270 dispersing agent Substances 0.000 claims description 28
- 239000010419 fine particle Substances 0.000 claims description 22
- 238000004519 manufacturing process Methods 0.000 claims description 22
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 21
- 239000006185 dispersion Substances 0.000 claims description 14
- 238000000227 grinding Methods 0.000 claims description 2
- 239000003381 stabilizer Substances 0.000 claims 1
- 239000007788 liquid Substances 0.000 description 35
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 21
- 230000002776 aggregation Effects 0.000 description 17
- 238000004062 sedimentation Methods 0.000 description 16
- 239000011859 microparticle Substances 0.000 description 12
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 12
- 239000004065 semiconductor Substances 0.000 description 11
- 238000005054 agglomeration Methods 0.000 description 10
- 239000000203 mixture Substances 0.000 description 9
- 229910000422 cerium(IV) oxide Inorganic materials 0.000 description 8
- 238000001556 precipitation Methods 0.000 description 8
- 239000010453 quartz Substances 0.000 description 8
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 7
- 238000004220 aggregation Methods 0.000 description 7
- 238000000034 method Methods 0.000 description 7
- 238000003756 stirring Methods 0.000 description 7
- 229910052782 aluminium Inorganic materials 0.000 description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 6
- 238000011156 evaluation Methods 0.000 description 6
- 230000003287 optical effect Effects 0.000 description 6
- 239000011541 reaction mixture Substances 0.000 description 6
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical class [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 5
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 5
- 229910004298 SiO 2 Inorganic materials 0.000 description 5
- 235000011114 ammonium hydroxide Nutrition 0.000 description 5
- -1 antimony Chemical class 0.000 description 5
- 239000007795 chemical reaction product Substances 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 5
- 238000010790 dilution Methods 0.000 description 5
- 239000012895 dilution Substances 0.000 description 5
- 239000011521 glass Substances 0.000 description 5
- 239000004584 polyacrylic acid Substances 0.000 description 5
- 238000002360 preparation method Methods 0.000 description 5
- 238000007711 solidification Methods 0.000 description 5
- 230000008023 solidification Effects 0.000 description 5
- 239000000126 substance Substances 0.000 description 5
- 229920002125 Sokalan® Polymers 0.000 description 4
- 230000004520 agglutination Effects 0.000 description 4
- 230000007774 longterm Effects 0.000 description 4
- NUJOXMJBOLGQSY-UHFFFAOYSA-N manganese dioxide Chemical compound O=[Mn]=O NUJOXMJBOLGQSY-UHFFFAOYSA-N 0.000 description 4
- 238000002156 mixing Methods 0.000 description 4
- 150000001412 amines Chemical class 0.000 description 3
- 229910021529 ammonia Inorganic materials 0.000 description 3
- 239000003945 anionic surfactant Substances 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 239000013078 crystal Substances 0.000 description 3
- 239000004744 fabric Substances 0.000 description 3
- 239000000047 product Substances 0.000 description 3
- 238000000926 separation method Methods 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- YUTUUOJFXIMELV-UHFFFAOYSA-N 2-Hydroxy-2-(2-methoxy-2-oxoethyl)butanedioic acid Chemical compound COC(=O)CC(O)(C(O)=O)CC(O)=O YUTUUOJFXIMELV-UHFFFAOYSA-N 0.000 description 2
- HCVBQXINVUFVCE-UHFFFAOYSA-N Citronensaeure-beta-methylester Natural products COC(=O)C(O)(CC(O)=O)CC(O)=O HCVBQXINVUFVCE-UHFFFAOYSA-N 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 2
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 2
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 2
- DKGAVHZHDRPRBM-UHFFFAOYSA-N Tert-Butanol Chemical compound CC(C)(C)O DKGAVHZHDRPRBM-UHFFFAOYSA-N 0.000 description 2
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 2
- 239000012043 crude product Substances 0.000 description 2
- 238000004821 distillation Methods 0.000 description 2
- 230000005484 gravity Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000013067 intermediate product Substances 0.000 description 2
- 229910044991 metal oxide Inorganic materials 0.000 description 2
- 150000004706 metal oxides Chemical class 0.000 description 2
- 239000002736 nonionic surfactant Substances 0.000 description 2
- 230000001590 oxidative effect Effects 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 229910052707 ruthenium Inorganic materials 0.000 description 2
- 229910001925 ruthenium oxide Inorganic materials 0.000 description 2
- WOCIAKWEIIZHES-UHFFFAOYSA-N ruthenium(iv) oxide Chemical compound O=[Ru]=O WOCIAKWEIIZHES-UHFFFAOYSA-N 0.000 description 2
- 239000004576 sand Substances 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- 229920003169 water-soluble polymer Polymers 0.000 description 2
- NIQCNGHVCWTJSM-UHFFFAOYSA-N Dimethyl phthalate Chemical compound COC(=O)C1=CC=CC=C1C(=O)OC NIQCNGHVCWTJSM-UHFFFAOYSA-N 0.000 description 1
- LSNNMFCWUKXFEE-UHFFFAOYSA-N Sulfurous acid Chemical compound OS(O)=O LSNNMFCWUKXFEE-UHFFFAOYSA-N 0.000 description 1
- 229910052770 Uranium Inorganic materials 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 1
- 229910000410 antimony oxide Inorganic materials 0.000 description 1
- WPKYZIPODULRBM-UHFFFAOYSA-N azane;prop-2-enoic acid Chemical compound N.OC(=O)C=C WPKYZIPODULRBM-UHFFFAOYSA-N 0.000 description 1
- CETPSERCERDGAM-UHFFFAOYSA-N ceric oxide Chemical compound O=[Ce]=O CETPSERCERDGAM-UHFFFAOYSA-N 0.000 description 1
- DRVWBEJJZZTIGJ-UHFFFAOYSA-N cerium(3+);oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[Ce+3].[Ce+3] DRVWBEJJZZTIGJ-UHFFFAOYSA-N 0.000 description 1
- 239000008119 colloidal silica Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000007596 consolidation process Methods 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 239000002178 crystalline material Substances 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 150000002170 ethers Chemical class 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 239000008187 granular material Substances 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 239000005304 optical glass Substances 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 229920000620 organic polymer Polymers 0.000 description 1
- SIWVEOZUMHYXCS-UHFFFAOYSA-N oxo(oxoyttriooxy)yttrium Chemical compound O=[Y]O[Y]=O SIWVEOZUMHYXCS-UHFFFAOYSA-N 0.000 description 1
- VTRUBDSFZJNXHI-UHFFFAOYSA-N oxoantimony Chemical class [Sb]=O VTRUBDSFZJNXHI-UHFFFAOYSA-N 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229910001954 samarium oxide Inorganic materials 0.000 description 1
- 229940075630 samarium oxide Drugs 0.000 description 1
- FKTOIHSPIPYAPE-UHFFFAOYSA-N samarium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[Sm+3].[Sm+3] FKTOIHSPIPYAPE-UHFFFAOYSA-N 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- LFQCEHFDDXELDD-UHFFFAOYSA-N tetramethyl orthosilicate Chemical compound CO[Si](OC)(OC)OC LFQCEHFDDXELDD-UHFFFAOYSA-N 0.000 description 1
- 229910021642 ultra pure water Inorganic materials 0.000 description 1
- 239000012498 ultrapure water Substances 0.000 description 1
- JFALSRSLKYAFGM-UHFFFAOYSA-N uranium(0) Chemical compound [U] JFALSRSLKYAFGM-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1454—Abrasive powders, suspensions and pastes for polishing
- C09K3/1463—Aqueous liquid suspensions
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C19/00—Surface treatment of glass, not in the form of fibres or filaments, by mechanical means
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
- C09G1/02—Polishing compositions containing abrasives or grinding agents
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1409—Abrasive particles per se
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Life Sciences & Earth Sciences (AREA)
- Mechanical Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Silicon Compounds (AREA)
- Compounds Of Alkaline-Earth Elements, Aluminum Or Rare-Earth Metals (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003131025A JP2004331852A (ja) | 2003-05-09 | 2003-05-09 | 分散安定性に優れた研磨剤スラリー及び基板の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200424036A TW200424036A (en) | 2004-11-16 |
| TWI298666B true TWI298666B (ja) | 2008-07-11 |
Family
ID=33410568
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW093101645A TW200424036A (en) | 2003-05-09 | 2004-01-20 | Abrasive slurry having high dispersion stability and manufacturing method for a substrate |
Country Status (5)
| Country | Link |
|---|---|
| US (2) | US20040221516A1 (ja) |
| JP (1) | JP2004331852A (ja) |
| KR (1) | KR100808758B1 (ja) |
| CN (1) | CN1330733C (ja) |
| TW (1) | TW200424036A (ja) |
Families Citing this family (30)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005244123A (ja) * | 2004-02-27 | 2005-09-08 | Fujimi Inc | 研磨用組成物 |
| US7056192B2 (en) * | 2004-09-14 | 2006-06-06 | International Business Machines Corporation | Ceria-based polish processes, and ceria-based slurries |
| JP2006086462A (ja) * | 2004-09-17 | 2006-03-30 | Fujimi Inc | 研磨用組成物およびそれを用いた配線構造体の製造法 |
| KR100497413B1 (ko) * | 2004-11-26 | 2005-06-23 | 에이스하이텍 주식회사 | 텅스텐-화학적 기계적 연마에 유용한 슬러리 및 그 제조방법 |
| US7294044B2 (en) * | 2005-04-08 | 2007-11-13 | Ferro Corporation | Slurry composition and method for polishing organic polymer-based ophthalmic substrates |
| US7467988B2 (en) * | 2005-04-08 | 2008-12-23 | Ferro Corporation | Slurry composition and method for polishing organic polymer-based ophthalmic substrates |
| JP2007103463A (ja) * | 2005-09-30 | 2007-04-19 | Sumitomo Electric Ind Ltd | ポリシングスラリー、ＧａｘＩｎ１−ｘＡｓｙＰ１−ｙ結晶の表面処理方法およびＧａｘＩｎ１−ｘＡｓｙＰ１−ｙ結晶基板 |
| JP4983603B2 (ja) | 2005-10-19 | 2012-07-25 | 日立化成工業株式会社 | 酸化セリウムスラリー、酸化セリウム研磨液及びこれらを用いた基板の研磨方法 |
| WO2007055278A1 (ja) * | 2005-11-11 | 2007-05-18 | Hitachi Chemical Co., Ltd. | 酸化ケイ素用研磨剤、添加液および研磨方法 |
| TWI414811B (zh) * | 2006-03-23 | 2013-11-11 | Sumitomo Chemical Co | 具有無機微粒子層之積層體之製造方法 |
| JP4731384B2 (ja) * | 2006-04-04 | 2011-07-20 | 多摩化学工業株式会社 | 酸性で安定なコロイダルシリカの製造方法 |
| US20100062287A1 (en) * | 2008-09-10 | 2010-03-11 | Seagate Technology Llc | Method of polishing amorphous/crystalline glass to achieve a low rq & wq |
| US20100243670A1 (en) * | 2009-03-24 | 2010-09-30 | Ferro Corporation | Methods and products for replenishing a polishing slurry in a polishing apparatus |
| US9368367B2 (en) * | 2009-04-13 | 2016-06-14 | Sinmat, Inc. | Chemical mechanical polishing of silicon carbide comprising surfaces |
| CN103282160A (zh) * | 2010-12-29 | 2013-09-04 | Hoya株式会社 | 磁盘用玻璃基板的制造方法以及磁盘的制造方法 |
| WO2013065491A1 (ja) * | 2011-11-01 | 2013-05-10 | 旭硝子株式会社 | ガラス基板の製造方法 |
| CN102709523A (zh) * | 2012-06-13 | 2012-10-03 | 湖南丰源业翔晶科新能源股份有限公司 | 碳纳米管在锂离子电池导电胶中的分散工艺 |
| KR101727848B1 (ko) * | 2013-03-13 | 2017-04-17 | 가부시키가이샤 후지미인코퍼레이티드 | 용사용 슬러리, 용사 피막 및 용사 피막의 형성 방법 |
| KR20150123939A (ko) | 2013-03-13 | 2015-11-04 | 가부시키가이샤 후지미인코퍼레이티드 | 용사용 슬러리, 용사 피막 및 용사 피막의 형성 방법 |
| JP6484894B2 (ja) | 2014-03-28 | 2019-03-20 | 山口精研工業株式会社 | 研磨剤組成物、および磁気ディスク基板の研磨方法 |
| MY177370A (en) * | 2014-03-28 | 2020-09-14 | Yamaguchi Seiken Kogyo Co Ltd | Polishing composition and method for polishing magnetic disk substrate |
| JP6291069B2 (ja) | 2014-09-03 | 2018-03-14 | 株式会社フジミインコーポレーテッド | 溶射用スラリー、溶射皮膜および溶射皮膜の形成方法 |
| JP6741410B2 (ja) | 2015-09-25 | 2020-08-19 | 株式会社フジミインコーポレーテッド | 溶射用スラリー、溶射皮膜および溶射皮膜の形成方法 |
| JP6775511B2 (ja) | 2015-09-25 | 2020-10-28 | 山口精研工業株式会社 | 研磨剤組成物、および磁気ディスク基板の研磨方法 |
| TWI535730B (zh) * | 2015-10-26 | 2016-06-01 | 中日合成化學股份有限公司 | 阻燃組成物及其應用 |
| CN105838260B (zh) * | 2016-03-30 | 2018-03-27 | 济南汇川硅溶胶厂 | 一种新型纳米蓝宝石抛光液及其制备方法 |
| CN107629701B (zh) * | 2017-11-02 | 2021-04-13 | 东旭光电科技股份有限公司 | 抛光液及其制备方法 |
| JP2020050752A (ja) * | 2018-09-26 | 2020-04-02 | 株式会社バイコウスキージャパン | 研磨液、その濃縮液、研磨液を用いる研磨処理物品の製造方法及び研磨液を用いる基板の研磨方法 |
| JP6702385B2 (ja) * | 2018-09-27 | 2020-06-03 | 住友大阪セメント株式会社 | 静電チャック装置 |
| CN115074087A (zh) * | 2022-06-24 | 2022-09-20 | 广东优贝精细化工有限公司 | 一种玻璃研磨剂及其制备方法 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4462188A (en) * | 1982-06-21 | 1984-07-31 | Nalco Chemical Company | Silica sol compositions for polishing silicon wafers |
| US5264010A (en) * | 1992-04-27 | 1993-11-23 | Rodel, Inc. | Compositions and methods for polishing and planarizing surfaces |
| JP4113282B2 (ja) * | 1998-05-07 | 2008-07-09 | スピードファム株式会社 | 研磨組成物及びそれを用いたエッジポリッシング方法 |
| US6428392B1 (en) * | 1999-03-23 | 2002-08-06 | Seimi Chemical Co., Ltd. | Abrasive |
| JP4273475B2 (ja) * | 1999-09-21 | 2009-06-03 | 株式会社フジミインコーポレーテッド | 研磨用組成物 |
| US6261476B1 (en) | 2000-03-21 | 2001-07-17 | Praxair S. T. Technology, Inc. | Hybrid polishing slurry |
| CN1200066C (zh) * | 2000-05-12 | 2005-05-04 | 日产化学工业株式会社 | 抛光剂组合物 |
-
2003
- 2003-05-09 JP JP2003131025A patent/JP2004331852A/ja active Pending
-
2004
- 2004-01-20 TW TW093101645A patent/TW200424036A/zh not_active IP Right Cessation
- 2004-02-04 KR KR1020040007302A patent/KR100808758B1/ko active IP Right Grant
- 2004-02-18 US US10/779,680 patent/US20040221516A1/en not_active Abandoned
- 2004-02-18 CN CNB2004100055621A patent/CN1330733C/zh not_active Expired - Lifetime
-
2006
- 2006-10-31 US US11/589,779 patent/US20070094936A1/en not_active Abandoned
Also Published As
| Publication number | Publication date |
|---|---|
| KR100808758B1 (ko) | 2008-02-29 |
| CN1550537A (zh) | 2004-12-01 |
| JP2004331852A (ja) | 2004-11-25 |
| US20040221516A1 (en) | 2004-11-11 |
| KR20040095615A (ko) | 2004-11-15 |
| US20070094936A1 (en) | 2007-05-03 |
| TW200424036A (en) | 2004-11-16 |
| CN1330733C (zh) | 2007-08-08 |
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