TWI298171B - - Google Patents
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- Publication number
- TWI298171B TWI298171B TW095107873A TW95107873A TWI298171B TW I298171 B TWI298171 B TW I298171B TW 095107873 A TW095107873 A TW 095107873A TW 95107873 A TW95107873 A TW 95107873A TW I298171 B TWI298171 B TW I298171B
- Authority
- TW
- Taiwan
- Prior art keywords
- wiring layer
- layer
- wiring
- connection
- switch array
- Prior art date
Links
- 239000000758 substrate Substances 0.000 claims description 43
- 239000012212 insulator Substances 0.000 claims description 8
- 238000006073 displacement reaction Methods 0.000 claims description 7
- 238000010438 heat treatment Methods 0.000 claims description 7
- 239000002245 particle Substances 0.000 claims description 7
- 239000004744 fabric Substances 0.000 claims description 3
- 238000012423 maintenance Methods 0.000 claims description 3
- 210000001061 forehead Anatomy 0.000 claims 1
- 238000010899 nucleation Methods 0.000 claims 1
- 239000010410 layer Substances 0.000 description 233
- 239000012790 adhesive layer Substances 0.000 description 14
- 229920001169 thermoplastic Polymers 0.000 description 14
- 239000004416 thermosoftening plastic Substances 0.000 description 14
- 238000005187 foaming Methods 0.000 description 12
- 239000000463 material Substances 0.000 description 8
- 230000004048 modification Effects 0.000 description 7
- 238000012986 modification Methods 0.000 description 7
- 230000001070 adhesive effect Effects 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 239000011229 interlayer Substances 0.000 description 4
- 239000011159 matrix material Substances 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 239000000725 suspension Substances 0.000 description 3
- 238000003491 array Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 239000012528 membrane Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 239000002689 soil Substances 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 1
- 241000270666 Testudines Species 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000000994 depressogenic effect Effects 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000002305 electric material Substances 0.000 description 1
- 238000009429 electrical wiring Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 229910052707 ruthenium Inorganic materials 0.000 description 1
- 230000001568 sexual effect Effects 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H1/00—Contacts
- H01H1/0036—Switches making use of microelectromechanical systems [MEMS]
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
- B81B3/0035—Constitution or structural means for controlling the movement of the flexible or deformable elements
- B81B3/0054—For holding or placing an element in a given position
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H37/00—Thermally-actuated switches
- H01H37/02—Details
- H01H37/32—Thermally-sensitive members
- H01H37/46—Thermally-sensitive members actuated due to expansion or contraction of a solid
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H67/00—Electrically-operated selector switches
- H01H67/22—Switches without multi-position wipers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2201/00—Specific applications of microelectromechanical systems
- B81B2201/01—Switches
- B81B2201/012—Switches characterised by the shape
- B81B2201/014—Switches characterised by the shape having a cantilever fixed on one side connected to one or more dimples
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2203/00—Basic microelectromechanical structures
- B81B2203/05—Type of movement
- B81B2203/053—Translation according to an axis perpendicular to the substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H1/00—Contacts
- H01H1/12—Contacts characterised by the manner in which co-operating contacts engage
- H01H1/14—Contacts characterised by the manner in which co-operating contacts engage by abutting
- H01H1/24—Contacts characterised by the manner in which co-operating contacts engage by abutting with resilient mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H1/00—Contacts
- H01H1/0036—Switches making use of microelectromechanical systems [MEMS]
- H01H2001/0042—Bistable switches, i.e. having two stable positions requiring only actuating energy for switching between them, e.g. with snap membrane or by permanent magnet
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H37/00—Thermally-actuated switches
- H01H2037/008—Micromechanical switches operated thermally
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electromagnetism (AREA)
- Thermal Sciences (AREA)
- Push-Button Switches (AREA)
- Micromachines (AREA)
- Contacts (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005082121A JP4498181B2 (ja) | 2005-03-22 | 2005-03-22 | スイッチアレイ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200707489A TW200707489A (en) | 2007-02-16 |
| TWI298171B true TWI298171B (https=) | 2008-06-21 |
Family
ID=37023728
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW095107873A TW200707489A (en) | 2005-03-22 | 2006-03-09 | Switch array |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US7994443B2 (https=) |
| EP (1) | EP1863046A4 (https=) |
| JP (1) | JP4498181B2 (https=) |
| CN (1) | CN100521019C (https=) |
| TW (1) | TW200707489A (https=) |
| WO (1) | WO2006101067A1 (https=) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20110102696A (ko) * | 2010-03-11 | 2011-09-19 | 삼성전자주식회사 | 레버 버튼 및 이를 구비하는 전자 기기 |
| ES2436644T3 (es) * | 2011-03-28 | 2014-01-03 | Delfmems | Conmutador de punto de cruce MEMS de RF y matriz de conmutador de punto de cruce que comprende conmutadores de punto de cruce MEMS de RF |
| DE102011103598B4 (de) * | 2011-05-30 | 2017-04-06 | Heraeus Deutschland GmbH & Co. KG | Laminat zur Herstellung eines Schalters |
| US8779592B2 (en) * | 2012-05-01 | 2014-07-15 | Taiwan Semiconductor Manufacturing Company, Ltd. | Via-free interconnect structure with self-aligned metal line interconnections |
| FR2996352B1 (fr) * | 2012-10-02 | 2014-10-31 | Alstom Technology Ltd | Dispositif de contact electrique de type doigt de contact a fort courant nominal |
| US9322764B2 (en) * | 2013-06-10 | 2016-04-26 | Xerox Corporation | Adsorption material-based humidity sensor |
| US9363885B1 (en) * | 2013-06-12 | 2016-06-07 | Meiko Electronics Co., Ltd. | Method of fabricating heat dissipating board |
| JP2017091917A (ja) * | 2015-11-13 | 2017-05-25 | レノボ・シンガポール・プライベート・リミテッド | スイッチ装置及び電子機器 |
| US11296437B1 (en) * | 2020-10-12 | 2022-04-05 | Pablo Oscar Olivera Brizzio | Optimally interconnectable terminal matrix with circuit identification |
Family Cites Families (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5815957B2 (ja) * | 1979-11-20 | 1983-03-28 | 松下電器産業株式会社 | 接点付プリント配線基板の製造方法 |
| JPH03127736A (ja) | 1989-10-13 | 1991-05-30 | Koushindou:Kk | 漢方薬特殊加味桂枝茯苓丸料製剤及び製法 |
| JPH03127736U (https=) * | 1990-02-23 | 1991-12-24 | ||
| JPH07161255A (ja) * | 1993-12-03 | 1995-06-23 | Fujikura Ltd | メンブレンスイッチ |
| JPH07245034A (ja) * | 1994-03-06 | 1995-09-19 | Yokogawa Hewlett Packard Ltd | スイッチの接点構造およびスイッチマトリックスの接点構造 |
| US5723834A (en) * | 1996-11-19 | 1998-03-03 | Morton International, Inc. | Horn membrane switch with rupturable strain relief bridging connector |
| JPH10283893A (ja) | 1997-04-03 | 1998-10-23 | Omron Corp | 超小型リレー埋設基板 |
| CN1145993C (zh) * | 1998-12-22 | 2004-04-14 | 三菱电机株式会社 | 开关,开关用卡合板和开关用卡合板的固定方法 |
| JP2000188049A (ja) * | 1998-12-22 | 2000-07-04 | Nec Corp | マイクロマシンスイッチおよびその製造方法 |
| US6307169B1 (en) * | 2000-02-01 | 2001-10-23 | Motorola Inc. | Micro-electromechanical switch |
| KR100929601B1 (ko) * | 2001-08-20 | 2009-12-03 | 허니웰 인터내셔널 인코포레이티드 | 스냅작동식 열 스위치 |
| ATE417021T1 (de) * | 2001-11-09 | 2008-12-15 | Wispry Inc | Mems-einrichtung mit dreischichtigem strahl und diesbezügliche verfahren |
| US6717825B2 (en) * | 2002-01-18 | 2004-04-06 | Fci Americas Technology, Inc. | Electrical connection system for two printed circuit boards mounted on opposite sides of a mid-plane printed circuit board at angles to each other |
| KR100467318B1 (ko) * | 2002-06-04 | 2005-01-24 | 한국전자통신연구원 | 저항식 전자기계적 접촉을 이용하는 미세전자기계적 소자 |
| JP4116420B2 (ja) * | 2002-12-18 | 2008-07-09 | 富士通株式会社 | 電気接点装置およびその製造方法 |
| US6859119B2 (en) * | 2002-12-26 | 2005-02-22 | Motorola, Inc. | Meso-microelectromechanical system package |
| JP3127736U (ja) * | 2006-08-31 | 2006-12-14 | 宇盟實業有限公司 | アルミニウム型 |
-
2005
- 2005-03-22 JP JP2005082121A patent/JP4498181B2/ja not_active Expired - Fee Related
-
2006
- 2006-03-09 TW TW095107873A patent/TW200707489A/zh not_active IP Right Cessation
- 2006-03-20 US US11/886,856 patent/US7994443B2/en not_active Expired - Fee Related
- 2006-03-20 CN CNB200680000146XA patent/CN100521019C/zh not_active Expired - Fee Related
- 2006-03-20 EP EP06729485A patent/EP1863046A4/en active Pending
- 2006-03-20 WO PCT/JP2006/305517 patent/WO2006101067A1/ja not_active Ceased
Also Published As
| Publication number | Publication date |
|---|---|
| JP4498181B2 (ja) | 2010-07-07 |
| CN1942987A (zh) | 2007-04-04 |
| EP1863046A4 (en) | 2009-07-01 |
| JP2006269120A (ja) | 2006-10-05 |
| EP1863046A1 (en) | 2007-12-05 |
| WO2006101067A1 (ja) | 2006-09-28 |
| US20090045039A1 (en) | 2009-02-19 |
| TW200707489A (en) | 2007-02-16 |
| CN100521019C (zh) | 2009-07-29 |
| US7994443B2 (en) | 2011-08-09 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |