Classifications

• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
  • H01H1/00—Contacts
  • H01H1/0036—Switches making use of microelectromechanical systems [MEMS]
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B81—MICROSTRUCTURAL TECHNOLOGY
  • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
  • B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
  • B81B3/0035—Constitution or structural means for controlling the movement of the flexible or deformable elements
  • B81B3/0054—For holding or placing an element in a given position
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
  • H01H37/00—Thermally-actuated switches
  • H01H37/02—Details
  • H01H37/32—Thermally-sensitive members
  • H01H37/46—Thermally-sensitive members actuated due to expansion or contraction of a solid
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
  • H01H67/00—Electrically-operated selector switches
  • H01H67/22—Switches without multi-position wipers
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B81—MICROSTRUCTURAL TECHNOLOGY
  • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
  • B81B2201/00—Specific applications of microelectromechanical systems
  • B81B2201/01—Switches
  • B81B2201/012—Switches characterised by the shape
  • B81B2201/014—Switches characterised by the shape having a cantilever fixed on one side connected to one or more dimples
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B81—MICROSTRUCTURAL TECHNOLOGY
  • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
  • B81B2203/00—Basic microelectromechanical structures
  • B81B2203/05—Type of movement
  • B81B2203/053—Translation according to an axis perpendicular to the substrate
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
  • H01H1/00—Contacts
  • H01H1/12—Contacts characterised by the manner in which co-operating contacts engage
  • H01H1/14—Contacts characterised by the manner in which co-operating contacts engage by abutting
  • H01H1/24—Contacts characterised by the manner in which co-operating contacts engage by abutting with resilient mounting
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
  • H01H1/00—Contacts
  • H01H1/0036—Switches making use of microelectromechanical systems [MEMS]
  • H01H2001/0042—Bistable switches, i.e. having two stable positions requiring only actuating energy for switching between them, e.g. with snap membrane or by permanent magnet
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
  • H01H37/00—Thermally-actuated switches
  • H01H2037/008—Micromechanical switches operated thermally

Definitions

• the present invention relates to a switch array, for example, a switch array that turns on or off any one of a plurality of input lines and a plurality of output lines.
• a switch array that can selectively turn on or off any of a plurality of input lines and a plurality of output lines
• a relay mounting board described in Japanese Patent Laid-Open No. 10-283893.
• the relay embedded board described in this Japanese Patent Laid-Open No. 10-283893 has three inputs and three outputs crossed, a relay is provided in each crossing region, and nine ultra-small relays are embedded in a thin base material. It is. In this example, it is possible to turn on / off any relay S.
• the relay embedded in the relay carrying substrate described in Japanese Patent Laid-Open No. 10-283893 is ultra-compact, it can turn on and off a small control current with a small contact capacity. However, it cannot be used for applications such as turning on or off lighting devices. This is because a current of several amperes must be turned on and off to turn on and off the lighting device.
• an object of the present invention is to provide a switch array that can flow a large current and can maintain a connected state without a driving current having a small on-resistance.
• the present invention is provided in a region where the first wiring layer, the second wiring layer sterically intersecting the first wiring layer, and the first wiring layer and the second wiring layer are intersected. And a connection structure for selectively connecting the first and second wiring layers, the connection structure having one end connected to the first wiring layer and the other end connected to the second wiring layer. There is provided a deformable member that faces the wiring layer in an insulating state with an interval and is deformed so that the other end is electrically connected to the second wiring layer and maintained in that state.
• the first substrate includes a first substrate and a second substrate that are provided at intervals, the first substrate is provided with a first wiring layer, and the other end of the deformable member A through hole is formed at a position corresponding to the side, and the connection structure includes a connection maintaining member arranged to cover the through hole, and the connection maintaining member is deformed through the through hole and presses the deforming member.
• the connection state of the first and second wiring layers can be maintained via the deformation member only by passing the through hole through the connection maintaining member and pressing the deformation member.
• connection maintaining member is deformed by being heated and presses the deforming member
• the connection maintaining member has a heat deformation characteristic and is heated.
• the member itself expands, contracts, and deforms and presses the deformed member.
• the connection maintaining member adheres to the connection state between the deformed deformed member and the second wiring layer. Includes adhesive members that are maintained by force. With these connection maintaining members, it is possible to maintain the connection state of the first and second wiring layers via the deformable member without requiring a driving current.
• Another aspect of the present invention is provided on the other surface of the substrate so as to three-dimensionally intersect the first wiring layer provided on one surface of the substrate in an insulated state with respect to the first wiring layer.
• the first wiring layer and the second wiring layer can be electrically connected without the need for a drive current simply by filling the through hole with a conductive member.
• a switch array comprising a connection structure for selectively electrically connecting the first wiring layer and the second wiring layer, the connection structure having one end connected to the first wiring layer and the other An end is connected to the second wiring layer and includes a connection wiring layer that cuts off the connection between the first wiring layer and the second wiring layer by being cut.
• connection state of the first and second wiring layers can be maintained at all times, and the connection between the first and second wiring layers can be cut off by cutting, so that the connection state is maintained.
• Driving current can be eliminated.
• the film includes a film extending over the space, and the connection wiring layer is formed on the film and is cut by applying mechanical pressure.
• the connection wiring is formed.
• the layer is a wiring layer having a larger resistance component than the first and second wiring layers, and is melted by flowing a large current between the first and second wiring layers.
• the connection state of the first and second wiring layers can be maintained by the connection wiring layer, and the connection state can be cut off by cutting.
• Still another aspect of the present invention provides a first wiring layer, a second wiring layer that three-dimensionally intersects the first wiring layer in an insulated state, the first wiring layer, and the second wiring.
• a switch array provided at each intersection region with a layer and having a connection structure for selectively connecting the first and second wiring layers, wherein at least one of the first and second wiring layers Is configured to be displaced toward the other wiring layer so that the displacement state can be maintained, and is arranged between the first and second wiring layers and only the pressurized portion is applied by applying pressure.
• Each of the contact members is provided with a connection region that comes into electrical contact with each other when pressurized.
• the first and second wiring layers are electrically connected to each other via the conductive member by pressing one of the first and second wiring layers, so that a driving current is not required. That The connection state can be maintained.
• connection region is an electrode provided in the first and second wiring layers, and further includes an insulator provided on an electrode other than the predetermined electrode.
• An electrode provided with an insulator is not connected to an opposing electrode.
• the conductive member is formed by mixing conductive particles in an insulating elastic sheet.
• Still another aspect of the present invention provides a first wiring layer, a second wiring layer that three-dimensionally intersects the first wiring layer in an insulated state, and a three-dimensional structure that is insulated from the first wiring layer.
• the first wiring layer and the second or third wiring layer provided in respective crossing regions of the third wiring layer, the first wiring layer, the second wiring layer, and the third wiring layer.
• a switch array with a connection structure that selectively connects to the first wiring layer, and the three-dimensional intersection of the first and second wiring layers can be displaced to maintain the state.
• the selectively displaced part realizes the electrical connection at the intersecting part.
• any force of the second and third wiring layers can be displaced to electrically connect to the first wiring layer, and only the displaced wiring layer can be connected to the first wiring layer. Can be connected to other layers, and no other wiring layer is connected to the first wiring layer.
• the first wiring layer includes a first branch layer and a second branch layer that branch and sterically intersect with the second and third wiring layers, the first branch layer and the second branch layer.
• Each branch layer is provided so that it can be displaced and maintained in its state, and the displaced branch layer realizes electrical connection at the intersection.
• a large current can be passed, and a connection state can be maintained without a driving current having a small on-resistance.
• FIG. 1A is a cross-sectional view showing a switch using a thermoplastic sheet included in a switch array of one embodiment of the present invention.
• FIG. 1B is a cross-sectional view showing a state in which a thermoplastic sheet included in a switch array of one embodiment of the present invention is pressed with a pin.
• thermoplastic sheet included in the switch array of one embodiment of the present invention is deformed. It is sectional drawing which shows a mode that the switch was closed.
• FIG. 2 A cross-sectional view showing a modified example of a switch using a thermoplastic sheet included in a switch array according to an embodiment of the present invention.
• FIG. 3A is a cross-sectional view showing a switch using a foamable sheet included in a switch array according to another embodiment of the present invention.
• FIG. 3B A sectional view showing a state in which the foamable sheet included in the switch array in another embodiment of the present invention is deformed and the switch is closed.
• FIG. 4A A sectional view showing a switch using an adhesive layer included in a switch array in still another embodiment of the present invention.
• FIG. 4B is a cross-sectional view showing a state where a cantilever included in a switch array according to still another embodiment of the present invention is brought into contact with an adhesive layer.
• FIG. 4C A sectional view showing a state in which the other end of the cantilever included in the switch array according to still another embodiment of the present invention is connected to the wiring layer.
• FIG. 5A is a waist perspective view showing a switch included in a switch array in still another embodiment of the present invention.
• FIG. 5B is a cross-sectional view taken along line 5B-5B in FIG. 5A.
• FIG. 6 A diagram showing the configuration of a switch array in still another embodiment of the present invention.
• FIG. 7] is a plan view showing a switch array using an adhesive layer according to another embodiment of the present invention.
• FIG. 8 is a cross-sectional view taken along line 8A-8A in FIG.
• FIG. 9 is a plan view of a switch array using a membrane according to still another embodiment of the present invention.
• FIG. 10A is a sectional view taken along line 10A-10A in FIG.
• FIG. 10B is a cross-sectional view taken along line 10B-10B in FIG.
• FIG. 10C is a cross-sectional view of another example taken along line 10B-10B in FIG.
• FIG. 10D is a cross-sectional view taken along line 10D-10D in FIG.
• FIG. 11 is a view showing a modification of the switch array shown in FIG.
• FIG. 12 is a perspective view showing a switch array according to still another embodiment of the present invention.
• FIG. 13A is a cross-sectional view of a wiring layer, electrode pads, and an anisotropic conductive sheet taken along line 13A-13A shown in FIG.
• FIG. 13B is a cross-sectional view of the wiring layer, electrode pad, and anisotropic conductive sheet along line 13A-13A shown in FIG. 12, showing a state where the electrode pad is pressed.
• FIG. 13C is a cross-sectional view of the wiring layer, electrode pad, and anisotropic conductive sheet shown in FIG. 12, showing a state in which the electrode pad is pressed, and the pad and conductive particles are insulated by an insulator. It shows how it is.
• FIG. 14 is a diagram showing a modification of the embodiment shown in FIG.
• FIG. 15 is a perspective view showing a switch array in still another embodiment of the present invention.
• FIG. 16 is a perspective view showing a switch array in still another embodiment of the present invention.
• FIG. 1A to 1C are cross-sectional views showing the switches included in the switch array of one embodiment of the present invention.
• the switch 10 is provided in one intersection region in the switch array.
• the insulating film 14 and the upper substrate 15 are provided in parallel with a predetermined distance from the lower substrate 11 and the insulating film 12.
• a first wiring layer 16 is provided on the lower surface of the insulating film 14, and a second wiring layer 13 is provided on the insulating film 12 so as to three-dimensionally intersect the first wiring layer 16. It has been.
• a cantilever 17 as a deforming member is provided in an intersecting region between the first wiring layer 16 and the second wiring layer 13, and one end of the cantilever 17 is connected to the first wiring layer 16.
• the other end of the cantilever 17 is provided facing the second wiring layer 13 in an insulated state with a gap.
• the first wiring layer 16, the second wiring layer 13, and the cantilever 17 are formed of a metal material such as Nikkenore or copper. The other end of the cantilever 17 can be appropriately selected so that the on-resistance with respect to the second wiring layer 13 is reduced.
• a through hole 18 is formed in the insulating film 14 and the upper substrate 15 by wet etching at a position corresponding to the other end side of the cantilever 17.
• the opening on the top surface of the upper substrate 15 is large and the opening on the bottom surface is small. This is to facilitate insertion of the pin 20 shown in FIG. 1B into the through hole 18.
• a thermoplastic sheet 19 such as vinyl chloride as a connection maintaining member that is deformed by heating is disposed so as to cover the through hole 18.
• the connection maintaining member forms a connection structure together with the deformable member. As shown in FIG.
• the pin 20 is heated and the surface of the thermoplastic sheet 19 above the through hole 18 is pressed against the cantilever 17 side, so that the thermoplastic sheet 19 has the through hole 18 as shown in FIG. It passes through and deforms, and the force lever 17 is pressed. As a result, the other end of the cantilever 17 is electrically connected to the second wiring layer 13 and the switch 10 is closed.
• thermoplastic sheet 19 When the thermoplastic sheet 19 is heated by the pins 20 and then cooled, the thermoplastic sheet 19 maintains the connection state shown in FIG. 1C in which the other end of the cantilever 17 is in contact with the second wiring layer 13. As a result, after the switch 10 is closed, it is not necessary to supply energy such as continuing the current flow, so that the connection state can be maintained. Since the cantilever 17 can be selected in any shape, increasing the contact area between the second wiring layer 13 and the other end of the cantilever 17 can reduce the on-resistance and increase the large current. It is also possible to flow.
• thermoplastic sheet 19 it is preferable to select a material that does not adhere to the thermoplastic sheet 19 when the pin 20 is heated to press the thermoplastic sheet 19. Further, it is preferable to heat the cantilever 17 at a temperature or atmosphere that does not oxidize the force that transfers heat to the cantilever 17 when the pin 20 is heated and the thermoplastic sheet 19 is pressed.
• FIGS. 3A and 3B are cross-sectional views showing modifications of the switch 10 shown in FIGS. 1A to 1C.
• the switch 10b in this example includes a foam sheet 22 and a glass substrate 23, which are connection maintaining members, on the upper substrate 15, instead of the thermoplastic sheet 19 shown in FIGS. 1A to 1C.
• the foamable sheet 22 is a foamable material containing a large number of air bubbles.
• the foamable sheet 22 is heated and the internal air bubbles expand.
• it may be a material that expands its volume or changes its shape when heated.
• the expanded foam sheet 22 passes through the through hole 18, deforms, and presses the cantilever 17 as shown in FIG. 3B. Therefore, the other end of the cantilever 17 is brought into contact with the second wiring layer 13.
• Ability to do S When the foamable sheet 22 is cooled, the state where the other end of the cantilever 17 is connected to the second wiring layer 13 can be maintained.
• the other end of the cantilever 17 can be maintained connected to the second wiring layer 13, so the switch 10 b is closed. After that, the connection state can be maintained without supplying energy such as continuing to flow current.
• the contact area between the second wiring layer 13 and the other end of the cantilever 17 can be increased, the on-resistance can be reduced and a large current can flow.
• FIGS. 4A to 4C are cross-sectional views of switches included in a switch array according to another embodiment of the present invention.
• the thermoplastic sheet 19 is used to bring the other end of the force punch lever 17 into contact with the first wiring layer 13, whereas this embodiment is an example of a deformable member.
• An adhesive layer 25 as an adhesive member is used. That is, similarly to the embodiment of FIGS. 1A to 1C, as shown in FIG. 4A, the second wiring layer 13 is formed on the insulating film 12 on the lower substrate 11, and the cantilever 17a One end is connected to the first wiring layer 16.
• the other end of the cantilever 17a is formed so that the surface facing the second wiring layer 13 is flat.
• An adhesive layer 25 such as a double-sided tape is attached on the second wiring layer 13 so as to face the cantilever 17a in an insulated state, except for a portion facing the other end of the cantilever 17a.
• Through holes 21 are formed in the insulating film 14 and the upper substrate 15 at corresponding positions above the adhesive layer 25.
• the deformed state of the cantilever 17a is maintained by the adhesive force of the adhesive layer 25 even if the pin 20 is removed, the other end of the cantilever 17a is connected to the first wiring layer 13 as shown in FIG. 4C. You can stay connected.
• the state where the other end of the cantilever 17a is in contact with the second wiring layer 13a can be maintained by the adhesive force of the adhesive layer 25, so that the current continues to flow after the switch 10c is closed.
• the connection state can be maintained without supplying energy.
• the contact area between the second wiring layer 13 and the other end of the cantilever 17a can be arbitrarily increased, so that the on-resistance can be reduced and a large current can flow. .
• the adhesive layer 25 may be an organic resin such as a resist or polyimide.
• an improvement in contact pressure due to thermal shrinkage of the adhesive layer 25 can also be expected.
• FIG. 5A and FIG. 5B are diagrams showing a switch included in a switch array of still another embodiment of the present invention
• FIG. 5A is a perspective view of a main part
• FIG. 5B is a line 5B—
• FIG. 5B is a cross-sectional view taken along 5B.
• the switch 10d in this embodiment electrically connects the wiring layers 31 and 33 using a conductive base 36 as a conductive member.
• the first wiring layer 31 and the first wiring layer 31 are three-dimensionally crossed in an insulating state with the interlayer insulating layer 35 interposed therebetween.
• a wiring layer 33 is formed.
• a through hole 34 for filling the conductive member is formed in a region where the first wiring layer 31 and the second wiring layer 33 intersect with each other. The through hole 34 passes through the first wiring layer 31 and the interlayer insulating film 35, and exposes the surface of the second wiring layer 33 on the side of the interlayer insulating film 35.
• the conductive paste 36 is filled in the through hole 34.
• the wiring layers 31 and 33 are electrically connected.
• the melted solder may be poured into the through hole 34.
• the first wiring layer 31 and the second wiring layer 33 formed on both surfaces of the substrate 30 are crossed to penetrate the first wiring layer 31 and the substrate 30 in the intersecting region.
• Form hole 34 and penetrate Since the switch l Od can be configured simply by filling the hole 34 with the conductive paste 36, the configuration can be greatly simplified.
• after closing the switch Id it is not necessary to supply energy such as continuing the current flow, so that the connection state can be maintained, and the first wiring layer 31 and the second wiring layer 33 can be connected to the conductive paste 36 or solder.
• the on-resistance can be reduced to a negligible level and a large current can flow.
• FIG. 6 is a diagram showing the configuration of a switch array in still another embodiment of the present invention.
• the switch array 1 shown in FIG. 6 forms a matrix so that the input line of human power 1 to input 5 and the output line of output 1 to output 5 intersect, and the corresponding input line and output line are in the intersection region. Is connected to the switch 10e.
• any of the switches 10, 10a, 10b, 10c, and 10d shown in FIGS. 1A, 1B, 1C to 5A, and 5B can be applied.
• the corresponding input and output can be connected by turning on one of the switches in the intersection region.
• the switch array shown in FIG. 6 has a plurality of inputs and a force that connects the switch 10e to a matrix intersection region having a plurality of outputs.
• the present invention may be applied to a switch array having a plurality of outputs or a switch array having one output for a plurality of inputs.
• FIG. 7 is a plan view of a switch array according to another embodiment of the present invention
• FIG. 8 is a sectional view taken along line H8A-8A in FIG.
• the switch array 60 of this embodiment is configured with two inputs and two outputs as an example.
• an insulating film 12 is formed on the lower substrate 11, and although not shown on the insulating film 12, the input pads 41 and 42 and the output pads 51 and 52 shown in FIG. Is formed.
• strip-shaped second wiring layers 43 and 44 that are connected to the input pads 41 and 42 and serve as input lines are formed on the insulating film 12.
• the first wiring layers 53 and 54 connected to the output pads 51 and 52 and serving as output lines intersect the second wiring layers 43 and 44 in an insulated state and pass over each other. Is formed.
• the wiring layer 53 is insulated.
• Switches 61, 62, 63, and 64, which are connection structures, are connected to the intersecting regions of the second wiring layers 43 and 44 and the first wiring layers 53 and 54, respectively.
• the switch 61 is formed so as to intersect the second wiring layer 43 and connected to the second wiring layer 43, and one end of the switch 61 is connected to the first wiring layer 53.
• a movable member 65 as a connected deformable member.
• the movable member 65 includes a metal layer 67 formed on the lower surface of the substrate 66 and a movable contact 68 formed on the other end.
• the movable contact 68 faces the wiring layer 45 at an interval, and is connected to the wiring layer 45 when the movable member 65 is deformed.
• An adhesive layer 25 such as a double-sided tape is provided between the metal layer 67 and the insulating layer 12 of the movable member 65.
• the insulating film 14 having the through holes 21 shown in FIGS. 4A to 4C formed on the switch 61 facing the lower substrate 11 and the insulating film 12 and An upper substrate 15 may be provided.
• the movable member 65 of any of the switches 61 to 64 in the intersecting region is pressed, so that the adhesive force by the adhesive layer 25 is applied. It is possible to maintain the deformation of the movable member 65 and bring the movable contact 68 into contact with the wiring layer 45. Thereby, after closing any of the switches 61 to 64, it is not necessary to supply energy such as continuing the current, and the connection state can be maintained. Moreover, also in this embodiment, since the movable contact 68 can be formed in an arbitrary shape, the on-resistance can be reduced and a large current can be passed.
• FIG. 9 is a plan view of a switch array according to another embodiment of the present invention, and FIGS. 10A to 10D are sectional views taken along lines 10A—10A, 10B—10B, 10D—10D of FIG. is there.
• the switch array 70 shown in FIG. 9 is similar to the switch array 60 of the embodiment shown in FIG. 7, and the input nodes 41, 42, 51, 52 and the self-wire layers 43, 44, 53 , 54.
• Switches 7 :! to 74 which are connection structures, are connected to the intersection region of each self-wire layer 4 3, 44 and 53, 54.
• the switch 71 includes a strip-shaped wiring layer 45 connected to cross the wiring layer 43, a strip-shaped wiring layer 55 connected to cross the wiring layer 53, and a through conductor 56 so as to cross the wiring layer 55.
• the wiring layer 46 connected and formed on the extension line of the wiring layer 45, and between the wiring layers 45 and 46 And a connection wiring layer 47 formed so as to be connected to each other.
• the wiring layers 43, 45, and 46 are formed on the insulating film 12 shown in FIGS. 10A to 10D, and the wiring layer 55 is formed on the interlayer insulating film 57.
• connection wiring layer 47 may be planar and bent a plurality of times.
• a space 77 is formed in the substrate 11 by etching leaving a part of the substrate 11, and a part of the substrate 11 and the insulating film 12 are formed on the space 77.
• a membrane 76 composed of is formed.
• the membrane 76 may be formed only from the insulating film 12 without leaving a part of the substrate 11.
• connection wiring layer 47 is formed in order to connect the wiring layers 43 and 53 in the initial state.
• the connection wiring layer 47 can be easily cut.
• the connection wiring layer 47 is formed with a narrow width or a metal material having a small thickness so as to be easily cut as compared with the other wiring layers 45, 46, and 55.
• the other switches 72 to 74 are configured in the same manner as the switch 71.
• the switches 71 to 74 are all in a connected state when the switch array 70 is formed, and the force to turn off the corresponding switch by cutting the connection wiring layer 47 S it can.
• the input wiring layer 43 or 44 and the output wiring layer 53 or 54 are connected by the connection wiring layer 47 via the wiring layers 45, 46, and 55. There is almost no voltage drop in switches 71 to 74 even when a large current flows.
• connection wiring layer 47 by pushing it with a pin or the like as another embodiment, as another connection layer 43, 45, 46, 55, 53 as the connection wiring layer 47.
• the wiring layer with a large resistance component is formed by making the thickness thinner or narrower than the wiring layer, and a voltage is applied between the input pad 41 and the output pad 51 to increase the connection wiring layer 47. You may make it blow by sending an electric current. In this example, it can be easily cut by passing a large current.
• FIG. 11 is a diagram showing a modification of the switch included in the switch array shown in FIG.
• the switch 71a included in the switch array 70a shown in FIG. 11 is the switch 71a shown in FIG. Only the portion corresponding to the tug 71 is extracted, and an opening for facilitating the tearing of the membrane is provided on the outer periphery of the membrane 80 in place of the membrane 76. In this way, when pressure is applied to the membrane 80 with a pin or the like, the opening plays a role like a cut line, and the connection wiring layer 47 can be easily cut.
• FIG. 12 is a perspective view showing a switch array according to still another embodiment of the present invention.
• FIGS. 13A to 13C are upper and lower wiring layers and electrodes along line 13A-13A shown in FIG. It is sectional drawing of a pad and an anisotropic conductive sheet.
• a plurality of lower wiring layers 91 and 92 as first wiring layers are provided on the lower substrate 90 shown in FIG. 12, and the upper substrate 100 is three-dimensionally formed on the lower wiring layers 91 and 92.
• Upper wiring layers 101 to 103 are provided as a plurality of intersecting second wiring layers.
• Pads 94 to 99 are formed on the lower wiring layers 91 and 92, and nodes 104 to 109 force S are formed on the upper wiring layers 101 to 103 so as to face the pads 94 to 99.
• These pads 94 to 99 and 104 to 109 constitute electrodes which are connection regions.
• any one of the lower wiring layers 91 and 92 and the upper wiring layers 101 to 103 is composed of a deformable member that can be deformed by pressing, but is not necessarily a deformable member.
• a deformable member that can be deformed by pressing, but is not necessarily a deformable member.
• an insulating material is interposed in advance between pads that are not desired to be conducted, and the upper board 100 is pressed against the lower board 90 (by pressing both boards together) to obtain a desired electrical connection.
• a mechanism for maintaining the displacement due to the pressing of the upper and lower substrates 90 and 100 is required, but it can be realized by, for example, a package including a panel structure.
• An anisotropic conductive sheet 110 having elasticity is disposed between the lower wiring layers 91, 92 and the upper wiring layers 101-103.
• the anisotropic conductive sheet 110 is obtained by mixing conductive particles 121 in an insulating sheet 120 having a predetermined thickness as shown in FIGS. 13A to 13C.
• the pad 105 and the pad 95 are kept insulated by the insulating sheet 120 as shown in FIG. 13A.
• the pad 105 presses the anisotropic conductive sheet 110 as shown in FIG. Since the conductive particles 121 are in contact with each other, the pad 105 and the pad 95 are electrically connected.
• the pads 94, 96, 97, 98 around the pads 95 of the lower wiring layers 91, 92 are covered with insulators 111 to 113 such as insulating paste.
• the pads 105 and 95 are electrically connected via the anisotropic conductive sheet 110
• the pads 109 and 99 are electrically connected via the anisotropic conductive sheet 110 when pressed on the pads 109 of the wiring layer 103. If you want to electrically connect the pads 94, 96, 97, 98 of the lower wiring layers 91, 92 and the pads 104, 106, 107. 108 of the upper layer 101-103, as necessary
• the insulators 111 to 113 may be removed.
• anisotropic conductive sheet 110 has elasticity, for example, FIG.
• connection maintaining member may be provided to maintain the connection state shown in FIG. 13B.
• the thermoplastic sheet shown in FIGS. 1A to 1C or the foamable sheet described in FIGS. 3A and 3B may be used as the connection maintaining member.
• the upper wiring layer 102 provided with the pad 105 is pressed to be brought into electrical contact with the desired pad 95 via the anisotropic conductive sheet 110. Since they can be connected, a large current can flow, the on-resistance can be reduced, and the connection state can be maintained without a driving current.
• FIG. 14 is a view showing a modification of the embodiment shown in FIG.
• the peripheral pads 94 other than the pad 95 that is electrically connected to the pad 105 via the anisotropic conductive sheet 110 when the pad 105 of the upper wiring layer 102 is pressed.
• 96, 97, 98 Super insulation 111, 114, 112, 113 was coated.
• pads 94, 96, 97, and 98 are not covered with an insulating material.
• the anisotropic conductive sheet 110 is formed by partially displacing the upper wiring layer 102 by, for example, pressing the pad 105 of the upper wiring layer 102 with the pin 20 shown in FIG. 1B.
• FIG. 15 is a perspective view showing a switch array according to still another embodiment of the present invention.
• the upper wiring layers 131 and 132 as the displaceable first wiring layers are opposed to the lower wiring layers 135 and 136 as the second and third wiring layers. These are arranged so as to cross three-dimensionally with an interval of.
• Each of the intersecting portions of the upper wiring layers 131 and 132 and the lower wiring layers 135 and 136 is in an insulated state in the initial state.
• the pin 20 or the like shown in FIG. 1C is selectively displaced, only the intersecting portion of the upper wiring layer 131 is displaced and contacts the lower wiring layer 135 to be electrically connected.
• thermoplastic sheet shown in FIGS. 1A to 1C or the thermoplastic sheet shown in FIGS. 3A and 3B on the upper wiring layers 131 and 132 in order to maintain the displacement state of the upper wiring layer 131, the thermoplastic sheet shown in FIGS. 1A to 1C or the thermoplastic sheet shown in FIGS. 3A and 3B on the upper wiring layers 131 and 132. What is necessary is just to arrange
• the upper wiring layers 1 31 and 132 are made of a member that can be displaced and maintained in this state, an electrical connection can be achieved by displacing either the upper wiring layers 131 or 132 without providing a connection maintaining member. It may be connected to.
• FIG. 16 is a perspective view showing a switch array according to still another embodiment of the present invention.
• the upper wiring layers 141 and 142 and the lower wiring layers 145 and 146 are three-dimensionally crossed at a predetermined interval.
• the first and second branch layers 151 and 152 facing the layers 145 and 146 are provided, the upper wiring layer 142 is branched, and the branch layers 153 and 154 facing the lower wiring layers 145 and 146 are provided.
• the branch layer 15 :! to 154 is made of a displaceable member.
• the tip of the branch layer 151 when the tip of the branch layer 151 is displaced by the pin 20 shown in FIGS. 1A to 1C, the tip of the branch layer 151 contacts the lower layer wiring 145 to electrically Connected It is.
• the thermoplastic sheet shown in FIGS. 1A to 1C or the foamability shown in FIGS. 3A and 3B on the upper wiring layers 141 and 142 What is necessary is just to arrange
• the branch layers 151 to 154 that can maintain the displaced state are used, it is not necessary to provide a connection maintaining member.
• the switch array of the present invention can be used to turn on and off a large current.

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• Physics & Mathematics (AREA)
• Engineering & Computer Science (AREA)
• Computer Hardware Design (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Electromagnetism (AREA)
• Thermal Sciences (AREA)
• Push-Button Switches (AREA)
• Micromachines (AREA)
• Contacts (AREA)

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• 2005
  • 2005-03-22 JP JP2005082121A patent/JP4498181B2/ja not_active Expired - Fee Related
• 2006
  • 2006-03-09 TW TW095107873A patent/TW200707489A/zh not_active IP Right Cessation
  • 2006-03-20 US US11/886,856 patent/US7994443B2/en not_active Expired - Fee Related
  • 2006-03-20 CN CNB200680000146XA patent/CN100521019C/zh not_active Expired - Fee Related
  • 2006-03-20 EP EP06729485A patent/EP1863046A4/en active Pending
  • 2006-03-20 WO PCT/JP2006/305517 patent/WO2006101067A1/ja not_active Ceased

Patent Citations (6)

Non-Patent Citations (1)

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