TWI295206B - - Google Patents

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Publication number
TWI295206B
TWI295206B TW095123108A TW95123108A TWI295206B TW I295206 B TWI295206 B TW I295206B TW 095123108 A TW095123108 A TW 095123108A TW 95123108 A TW95123108 A TW 95123108A TW I295206 B TWI295206 B TW I295206B
Authority
TW
Taiwan
Prior art keywords
protective sheet
laser
processing
nozzle
sheet
Prior art date
Application number
TW095123108A
Other languages
English (en)
Chinese (zh)
Inventor
Yasunari Matsumoto
Masaru Kanaoka
Touru Murai
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Application granted granted Critical
Publication of TWI295206B publication Critical patent/TWI295206B/zh

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/18—Working by laser beam, e.g. welding, cutting or boring using absorbing layers on the workpiece, e.g. for marking or protecting purposes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • B23K26/142—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor for the removal of by-products
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/34—Coated articles, e.g. plated or painted; Surface treated articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/34—Coated articles, e.g. plated or painted; Surface treated articles
    • B23K2101/35—Surface treated articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/02—Iron or ferrous alloys
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/02—Iron or ferrous alloys
    • B23K2103/04—Steel or steel alloys
    • B23K2103/05—Stainless steel
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/08—Non-ferrous metals or alloys
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/08—Non-ferrous metals or alloys
    • B23K2103/10—Aluminium or alloys thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/08—Non-ferrous metals or alloys
    • B23K2103/12—Copper or alloys thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/30—Organic material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/30—Organic material
    • B23K2103/36—Wood or similar materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/30—Organic material
    • B23K2103/42—Plastics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B23K2103/52—Ceramics

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Laser Beam Processing (AREA)
TW095123108A 2005-06-27 2006-06-27 TWI295206B (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005186047 2005-06-27
PCT/JP2006/312329 WO2007000915A1 (ja) 2005-06-27 2006-06-20 レーザ加工方法およびレーザ加工ヘッド

Publications (1)

Publication Number Publication Date
TWI295206B true TWI295206B (ja) 2008-04-01

Family

ID=37595169

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095123108A TWI295206B (ja) 2005-06-27 2006-06-27

Country Status (5)

Country Link
JP (3) JP4978195B2 (ja)
KR (1) KR100853073B1 (ja)
CN (3) CN101428370B (ja)
TW (1) TWI295206B (ja)
WO (1) WO2007000915A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI673631B (zh) * 2010-07-23 2019-10-01 Ｎｖｆ科技有限公司 產生一裝置之至少一濾波器之方法、觸敏裝置及非暫時性電腦可讀取媒體

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100078418A1 (en) * 2008-09-26 2010-04-01 Electro Scientific Industries, Inc. Method of laser micro-machining stainless steel with high cosmetic quality
DE112011100039B4 (de) 2010-06-14 2014-01-02 Mitsubishi Electric Corp. Laserbearbeitungsvorrichtung und Laserbearbeitungsverfahren
JP6260136B2 (ja) * 2013-08-07 2018-01-17 株式会社Ｇｓユアサ 蓄電素子の製造方法および蓄電素子
CN103978312A (zh) * 2014-04-16 2014-08-13 苏州萃田精密机械有限公司 一种铝板表面凹槽加工装置
CN104043904A (zh) * 2014-06-09 2014-09-17 江苏大学 一种背面侧吹气体辅助激光切割的方法及装置
DE102015215316A1 (de) * 2015-08-11 2016-06-30 Schuler Automation Gmbh & Co. Kg Verfahren zur Herstellung einer Blechplatine mittels Laserschneiden und Verwendung einer Kunststofffolie
JP6315634B2 (ja) 2016-05-18 2018-04-25 株式会社アマダホールディングス 複合加工システム及びレーザ切断加工方法
CN109759728B (zh) * 2019-01-23 2020-08-14 西安交通大学 一种利用增加保护层改善微孔形貌的方法
CN109877448A (zh) * 2019-03-20 2019-06-14 大族激光科技产业集团股份有限公司 一种柔性膜材的加工系统及加工方法
CN114888454A (zh) * 2022-05-25 2022-08-12 深圳市杰普特光电股份有限公司 一种电池极片的切割方法

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JPH0543994Y2 (ja) * 1985-07-19 1993-11-08
JPH02286327A (ja) * 1989-04-28 1990-11-26 Amada Co Ltd レーザ加工用の金属板
CN1040514C (zh) * 1993-10-21 1998-11-04 三菱电机株式会社 加工头及激光加工装置
JP3405799B2 (ja) * 1994-03-04 2003-05-12 ファナック株式会社 レーザ加工方法
JP3512634B2 (ja) * 1998-05-11 2004-03-31 三菱電機株式会社 レーザ加工方法、被レーザ加工物の生産方法、およびレーザ加工装置、並びに、レーザ加工または被レーザ加工物の生産方法をコンピュータに実行させるプログラムを格納したコンピュータが読取可能な記録媒体
JP4366534B2 (ja) * 2000-02-01 2009-11-18 澁谷工業株式会社 レーザ加工方法
JP4304808B2 (ja) * 2000-02-04 2009-07-29 澁谷工業株式会社 レーザ加工方法
JP4221540B2 (ja) * 2000-06-27 2009-02-12 澁谷工業株式会社 レーザ加工方法およびその装置
JP3425425B2 (ja) * 2000-07-07 2003-07-14 日本車輌製造株式会社 極薄金属板のレーザ切断加工装置
US6423928B1 (en) * 2000-10-12 2002-07-23 Ase Americas, Inc. Gas assisted laser cutting of thin and fragile materials
JP2002283088A (ja) * 2001-03-23 2002-10-02 Sumitomo Heavy Ind Ltd レーザ加工の裏面傷防止方法及びレーザ加工装置
TW524726B (en) * 2001-04-23 2003-03-21 Furukawa Electric Co Ltd Adhesive tape for laser dicing
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CN1579697A (zh) * 2003-08-07 2005-02-16 鸿富锦精密工业（深圳）有限公司 一种激光加工方法
CN1704213A (zh) * 2004-05-28 2005-12-07 宝丽科技集团有限公司 具双喷嘴的脆性工件切割设备
JP4873863B2 (ja) * 2005-01-14 2012-02-08 日東電工株式会社 レーザー加工品の製造方法及びレーザー加工用粘着シート
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI673631B (zh) * 2010-07-23 2019-10-01 Ｎｖｆ科技有限公司 產生一裝置之至少一濾波器之方法、觸敏裝置及非暫時性電腦可讀取媒體

Also Published As

Publication number Publication date
JP5360177B2 (ja) 2013-12-04
CN102151992A (zh) 2011-08-17
WO2007000915A1 (ja) 2007-01-04
CN101428370B (zh) 2013-05-29
JP4978195B2 (ja) 2012-07-18
JP2011251344A (ja) 2011-12-15
CN102151992B (zh) 2012-11-21
CN101005916A (zh) 2007-07-25
JP2011251345A (ja) 2011-12-15
CN100513049C (zh) 2009-07-15
KR100853073B1 (ko) 2008-08-19
KR20070061796A (ko) 2007-06-14
JP5360176B2 (ja) 2013-12-04
CN101428370A (zh) 2009-05-13
JPWO2007000915A1 (ja) 2009-01-22

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MM4A Annulment or lapse of patent due to non-payment of fees