TWI290743B - Method and system of dry cleaning a processing chamber - Google Patents
Method and system of dry cleaning a processing chamber Download PDFInfo
- Publication number
- TWI290743B TWI290743B TW094113311A TW94113311A TWI290743B TW I290743 B TWI290743 B TW I290743B TW 094113311 A TW094113311 A TW 094113311A TW 94113311 A TW94113311 A TW 94113311A TW I290743 B TWI290743 B TW I290743B
- Authority
- TW
- Taiwan
- Prior art keywords
- cleaning
- dry cleaning
- plasma
- processing system
- rate
- Prior art date
Links
- 238000012545 processing Methods 0.000 title claims abstract description 76
- 238000005108 dry cleaning Methods 0.000 title claims abstract description 47
- 238000000034 method Methods 0.000 title claims abstract description 44
- 230000008569 process Effects 0.000 claims abstract description 25
- 238000004140 cleaning Methods 0.000 claims description 31
- 239000000758 substrate Substances 0.000 claims description 27
- 239000007789 gas Substances 0.000 claims description 16
- 239000002245 particle Substances 0.000 claims description 14
- 239000001301 oxygen Substances 0.000 claims description 9
- 229910052760 oxygen Inorganic materials 0.000 claims description 9
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 8
- 238000009832 plasma treatment Methods 0.000 claims description 7
- 238000012360 testing method Methods 0.000 claims description 7
- 238000012544 monitoring process Methods 0.000 claims description 6
- 230000009467 reduction Effects 0.000 claims description 4
- 230000005611 electricity Effects 0.000 claims description 3
- 239000012535 impurity Substances 0.000 claims description 3
- 238000006116 polymerization reaction Methods 0.000 claims description 3
- 239000011538 cleaning material Substances 0.000 claims 1
- 238000012937 correction Methods 0.000 claims 1
- 239000003344 environmental pollutant Substances 0.000 claims 1
- 238000006213 oxygenation reaction Methods 0.000 claims 1
- 238000000053 physical method Methods 0.000 claims 1
- 231100000719 pollutant Toxicity 0.000 claims 1
- 238000010187 selection method Methods 0.000 claims 1
- 230000015572 biosynthetic process Effects 0.000 abstract description 7
- 238000001514 detection method Methods 0.000 abstract description 3
- 238000004544 sputter deposition Methods 0.000 abstract description 2
- 230000006698 induction Effects 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 238000000151 deposition Methods 0.000 description 5
- 230000008021 deposition Effects 0.000 description 5
- 230000003287 optical effect Effects 0.000 description 5
- 229920000642 polymer Polymers 0.000 description 4
- 238000009825 accumulation Methods 0.000 description 3
- 230000008878 coupling Effects 0.000 description 3
- 238000010168 coupling process Methods 0.000 description 3
- 238000005859 coupling reaction Methods 0.000 description 3
- 230000007547 defect Effects 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 239000000835 fiber Substances 0.000 description 3
- 239000010419 fine particle Substances 0.000 description 3
- 230000006872 improvement Effects 0.000 description 3
- 238000009616 inductively coupled plasma Methods 0.000 description 3
- 238000002347 injection Methods 0.000 description 3
- 239000007924 injection Substances 0.000 description 3
- 239000010409 thin film Substances 0.000 description 3
- 238000007743 anodising Methods 0.000 description 2
- 238000004380 ashing Methods 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 238000004993 emission spectroscopy Methods 0.000 description 2
- 238000000295 emission spectrum Methods 0.000 description 2
- 238000013401 experimental design Methods 0.000 description 2
- 239000010408 film Substances 0.000 description 2
- 235000011389 fruit/vegetable juice Nutrition 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000002002 slurry Substances 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 238000001228 spectrum Methods 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 235000017166 Bambusa arundinacea Nutrition 0.000 description 1
- 235000017491 Bambusa tulda Nutrition 0.000 description 1
- 101100366060 Caenorhabditis elegans snap-29 gene Proteins 0.000 description 1
- 206010011469 Crying Diseases 0.000 description 1
- 235000010469 Glycine max Nutrition 0.000 description 1
- 244000068988 Glycine max Species 0.000 description 1
- 244000082204 Phyllostachys viridis Species 0.000 description 1
- 235000015334 Phyllostachys viridis Nutrition 0.000 description 1
- 101100073099 Schizosaccharomyces pombe (strain 972 / ATCC 24843) its3 gene Proteins 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000011425 bamboo Substances 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 238000009529 body temperature measurement Methods 0.000 description 1
- 239000006227 byproduct Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 235000013399 edible fruits Nutrition 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 230000004313 glare Effects 0.000 description 1
- 238000005305 interferometry Methods 0.000 description 1
- 229910052743 krypton Inorganic materials 0.000 description 1
- DNNSSWSSYDEUBZ-UHFFFAOYSA-N krypton atom Chemical compound [Kr] DNNSSWSSYDEUBZ-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000013307 optical fiber Substances 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 238000010926 purge Methods 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 230000003134 recirculating effect Effects 0.000 description 1
- 239000003507 refrigerant Substances 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 238000012552 review Methods 0.000 description 1
- 230000001568 sexual effect Effects 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 239000000344 soap Substances 0.000 description 1
- 230000003595 spectral effect Effects 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 210000004243 sweat Anatomy 0.000 description 1
- 230000032258 transport Effects 0.000 description 1
- 238000001392 ultraviolet--visible--near infrared spectroscopy Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32082—Radio frequency generated discharge
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
- B08B7/0035—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32798—Further details of plasma apparatus not provided for in groups H01J37/3244 - H01J37/32788; special provisions for cleaning or maintenance of the apparatus
- H01J37/32853—Hygiene
- H01J37/32862—In situ cleaning of vessels and/or internal parts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32917—Plasma diagnostics
- H01J37/32935—Monitoring and controlling tubes by information coming from the object and/or discharge
- H01J37/32963—End-point detection
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Epidemiology (AREA)
- Public Health (AREA)
- Optics & Photonics (AREA)
- Drying Of Semiconductors (AREA)
- Plasma Technology (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/834,370 US20050241669A1 (en) | 2004-04-29 | 2004-04-29 | Method and system of dry cleaning a processing chamber |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200540942A TW200540942A (en) | 2005-12-16 |
| TWI290743B true TWI290743B (en) | 2007-12-01 |
Family
ID=34961726
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW094113311A TWI290743B (en) | 2004-04-29 | 2005-04-26 | Method and system of dry cleaning a processing chamber |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US20050241669A1 (https=) |
| JP (1) | JP2007535169A (https=) |
| TW (1) | TWI290743B (https=) |
| WO (1) | WO2005111265A1 (https=) |
Families Citing this family (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7449416B2 (en) * | 2004-09-01 | 2008-11-11 | Axcelis Technologies, Inc. | Apparatus and plasma ashing process for increasing photoresist removal rate |
| US7959984B2 (en) * | 2004-12-22 | 2011-06-14 | Lam Research Corporation | Methods and arrangement for the reduction of byproduct deposition in a plasma processing system |
| US20060218680A1 (en) * | 2005-03-28 | 2006-09-28 | Bailey Andrew D Iii | Apparatus for servicing a plasma processing system with a robot |
| JP2007158230A (ja) * | 2005-12-08 | 2007-06-21 | Nec Electronics Corp | プラズマエッチング装置のクリーニング方法、およびプラズマエッチング装置 |
| US20070234955A1 (en) * | 2006-03-29 | 2007-10-11 | Tokyo Electron Limited | Method and apparatus for reducing carbon monoxide poisoning at the peripheral edge of a substrate in a thin film deposition system |
| JP4162094B2 (ja) * | 2006-05-30 | 2008-10-08 | 三菱重工業株式会社 | 常温接合によるデバイス、デバイス製造方法ならびに常温接合装置 |
| CN100587902C (zh) | 2006-09-15 | 2010-02-03 | 北京北方微电子基地设备工艺研究中心有限责任公司 | 在线预测刻蚀设备维护的方法 |
| TW200930135A (en) * | 2007-08-31 | 2009-07-01 | Tokyo Electron Ltd | Organic electronic device, organic electronic device manufacturing method, organic electronic device manufacturing apparatus, substrate processing system, protection film structure and storage medium with control program stored therein |
| JP5688227B2 (ja) * | 2010-02-26 | 2015-03-25 | 株式会社日立ハイテクノロジーズ | エッチング装置、制御シミュレータ、及び半導体装置製造方法 |
| JP5997555B2 (ja) * | 2012-09-14 | 2016-09-28 | 東京エレクトロン株式会社 | エッチング装置およびエッチング方法 |
| CN106414789A (zh) * | 2013-11-21 | 2017-02-15 | 恩特格里斯公司 | 用于在等离子体系统中使用的室组件的表面涂层 |
| JP6544902B2 (ja) * | 2014-09-18 | 2019-07-17 | 東京エレクトロン株式会社 | プラズマ処理装置 |
| CN109075066B (zh) * | 2016-03-31 | 2023-08-04 | 东京毅力科创株式会社 | 使用无晶片干式清洗发射光谱来控制干式蚀刻过程的方法 |
| US10043641B2 (en) * | 2016-09-22 | 2018-08-07 | Applied Materials, Inc. | Methods and apparatus for processing chamber cleaning end point detection |
| KR102520779B1 (ko) | 2016-11-18 | 2023-04-11 | 도쿄엘렉트론가부시키가이샤 | 제조 공정에서 입자 유도 아크 검출을 위한 조성 발광 분광법 |
| CN110431655A (zh) | 2017-03-17 | 2019-11-08 | 东京毅力科创株式会社 | 用于蚀刻度量改进的表面改性控制 |
| CN109216241B (zh) * | 2018-09-04 | 2021-03-12 | 上海华力微电子有限公司 | 一种刻蚀副产物智能自清洁方法 |
| KR102054147B1 (ko) * | 2019-10-21 | 2019-12-12 | 주식회사 아이엠티 | 테스트 장치 |
| US12306044B2 (en) | 2022-09-20 | 2025-05-20 | Tokyo Electron Limited | Optical emission spectroscopy for advanced process characterization |
| US12158374B2 (en) | 2022-10-25 | 2024-12-03 | Tokyo Electron Limited | Time-resolved OES data collection |
| US12362158B2 (en) | 2022-10-25 | 2025-07-15 | Tokyo Electron Limited | Method for OES data collection and endpoint detection |
Family Cites Families (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59142839A (ja) * | 1983-02-01 | 1984-08-16 | Canon Inc | 気相法装置のクリ−ニング方法 |
| US4563367A (en) * | 1984-05-29 | 1986-01-07 | Applied Materials, Inc. | Apparatus and method for high rate deposition and etching |
| JPH07169693A (ja) * | 1993-12-16 | 1995-07-04 | Mitsubishi Electric Corp | 横型減圧ｃｖｄ装置及びそのクリーニング方法 |
| JP3193265B2 (ja) * | 1995-05-20 | 2001-07-30 | 東京エレクトロン株式会社 | プラズマエッチング装置 |
| US5846373A (en) * | 1996-06-28 | 1998-12-08 | Lam Research Corporation | Method for monitoring process endpoints in a plasma chamber and a process monitoring arrangement in a plasma chamber |
| JP3667893B2 (ja) * | 1996-09-24 | 2005-07-06 | 川崎マイクロエレクトロニクス株式会社 | 半導体装置の製造方法 |
| US6443165B1 (en) * | 1996-11-14 | 2002-09-03 | Tokyo Electron Limited | Method for cleaning plasma treatment device and plasma treatment system |
| US6274058B1 (en) * | 1997-07-11 | 2001-08-14 | Applied Materials, Inc. | Remote plasma cleaning method for processing chambers |
| US6534007B1 (en) * | 1997-08-01 | 2003-03-18 | Applied Komatsu Technology, Inc. | Method and apparatus for detecting the endpoint of a chamber cleaning |
| US6081334A (en) * | 1998-04-17 | 2000-06-27 | Applied Materials, Inc | Endpoint detection for semiconductor processes |
| US6254717B1 (en) * | 1998-04-23 | 2001-07-03 | Sandia Corporation | Method and apparatus for monitoring plasma processing operations |
| US6010967A (en) * | 1998-05-22 | 2000-01-04 | Micron Technology, Inc. | Plasma etching methods |
| WO2002000962A1 (en) * | 2000-06-28 | 2002-01-03 | Mks Instruments, Inc. | System and method for in-situ cleaning of process monitor of semi-conductor wafer fabricator |
| JP2002057143A (ja) * | 2000-08-07 | 2002-02-22 | Hitachi Ltd | 浮遊異物検出装置 |
| US6852242B2 (en) * | 2001-02-23 | 2005-02-08 | Zhi-Wen Sun | Cleaning of multicompositional etchant residues |
| US20030005943A1 (en) * | 2001-05-04 | 2003-01-09 | Lam Research Corporation | High pressure wafer-less auto clean for etch applications |
| WO2002090615A1 (en) * | 2001-05-04 | 2002-11-14 | Lam Research Corporation | Duo-step plasma cleaning of chamber residues |
| TW200410337A (en) * | 2002-12-02 | 2004-06-16 | Au Optronics Corp | Dry cleaning method for plasma reaction chamber |
-
2004
- 2004-04-29 US US10/834,370 patent/US20050241669A1/en not_active Abandoned
-
2005
- 2005-02-17 WO PCT/US2005/005208 patent/WO2005111265A1/en not_active Ceased
- 2005-02-17 JP JP2007510718A patent/JP2007535169A/ja not_active Withdrawn
- 2005-04-26 TW TW094113311A patent/TWI290743B/zh not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| JP2007535169A (ja) | 2007-11-29 |
| TW200540942A (en) | 2005-12-16 |
| US20050241669A1 (en) | 2005-11-03 |
| WO2005111265A1 (en) | 2005-11-24 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |