1287330 七、指定代表圖： (一）本案指定代表圖為：第二圖。 (一)本代表圖之元件符號簡單說明： S21 S26:電子卡之封裝方法之流程步驟 八、本案若有化學式時，請揭示最能顯示發明特徵的化學式： 九、發明說明： 【發明所屬之技術領域】 本案係關於一種電子卡之封裝方法，尤指一種小型電子卡之 封装方法。 【先前技術】 目如4見的電子卡應用甚廣，並有逐漸小型化之趨勢，諸如 數據卡(Modem Card)、網路卡(Local Area Network Card, LAN Card) 以及記憶卡(Memory Card)等等。電子卡常見的國際標準規格有 PCMCIA卡與快閃記憶卡(Compact Flash Card，CF Card)以及安全 數位記憶卡(Secure Digital Memory Card，SD Card)等，且新的規格 標準亦不斷地在發展當中。這些電子卡的規格細節雖有差異，惟 其封裝的方式與結構則大同小異。 !287330 般來a ’電子卡之難必須提供足_機械及電氣性 月匕且至少須符合某些特定的標準⑼_㈣)規範，再者，封褒電 子卡所使狀方法還必需翻於封裝縣，如此才能夠大量的生 產製造’當舰構強度以及封裝成本的考量更是發展電子卡之重 點。 *傳統的電子卡封裝方式大多將上下的兩個導電殼之週緣向下 彎折，並以卡合的方式與塑膠外框結合後，再、經夾/治具(t〇〇i)將上 下的兩個導電郝卩合絲，並包封住歸框及—印刷電路板。由 於此種電子卡之導電㊅必須事先經歷彎折的製程，再與塑膠框以 卡合的方式結合，*但使得導驗與歸框不能緊㈣連接在一 起’此外’卿鉚合所形成的電子卡結構之機械強度—般來說較 差，尤其於鉚合過程巾非常容將致導電殼變形，如此一來，當 電子卡受到外力或撓曲力量作㈣，導電殼纽料鬆動與脫 落，而電子卡之封裝結構便會受到損壞。 雖然目前業界針對上述封裝的缺點開發出以超音波植入的封 裝方式，請參_-圖，為習知電子卡之職結構示細，其中， 係以小型女全數位記憶卡（MiniSDCard，以下簡稱小型SD記惊 卡）為例來姻傳統電子卡的封裝方式，如圖所示，小型犯記憶 卡1係包含上下兩塑膠殼體u以及設置有電子元件121及金手指 122之印刷電路板12，封裝的過程需先將印刷電路板12夾持於上 下兩塑膠殼體11之間，並置於超音波植人機台（未圖示）中進行 1287330 對位，待對位完成後才執行超音波植人縣，赌上下兩塑膠殼 體11接合處之瓣軟化而使兩者黏著在—起，雖錢用超音波植 入的方式卿觸電子卡難結構的機麵度確實較習知使用柳 合的方式好’但是錢超音波植人的方式需要以人工的方式將印 刷電路板12與上下兩歸殼體u置入超纽植入機台中，且進 行對位後才錄行超音波植人，因此魏縣過雜要較長的生 產時間’且—次只能封裝__個電子卡結構，無法因應大量生產製 造的需求’且以人工對位的方式會耗費過多的生產成本。 而且當電子卡受到外力或撓曲力量作用時，上下兩塑膠殼體 η就非常容易造成凹陷變形或斷裂的缺失，嚴重的話，上下兩塑 膠殼體11之間接合的區域，也會因為黏合的強度不足而容易造成 分離的現象。 、因此，如何發展-種可改善上述習知技術缺失之電子卡封裝 方法，實為目前迫切需要解決之問題。 【發明内容】 餘ft主要目的在於提供，子卡之封裝方法，其係藉由 寺、、且件先將被包覆元件固定於模具之_空間中，並待注入模 =塑=間中的膠質封裝材料的量已經可資固定被包覆元件 ^才__·麵线，胁模狀如處轉 以防止膠__卜溢，最彳__靜、、完、 1287330 電子卡封細，俾解決傳統使用超音 本，且方轉錄長的生糾㈣及耗f過乡的生產成 田形成之電子卡受到外力或撓曲力量作用時，上下兩塑 :會造細晴形_峨，甚嫩下兩塑膠殼體之 S 口的區域會發生分離的現轉缺點，皆可—併解決。 為達上述目的，本案之一較廣義實施態樣為提供一種電子卡 线裝方法，其係藉由-鱗組件及—模具，對-被包覆元件進 订封裝，該模具係具有—塑模空間、—注料口及_開口，其至少 包含下列步驟：⑻將雜包覆元件設置於該模具之該塑模空間 中’且自該開口處將該祕組件置人雜模空財並固定該被包 覆元件；⑼透過紐料口注人—M封裝懸至雜具之該麵 空間中；（C)判斷經由該注料口所注入之該膠質封裝材料是否已固 定該被包覆元件，當判斷結果為是時，將該夾持組件退出該塑模 空間，並於該開口處與該模具連接；以及(d)將該膠質封裝材料實 質上完全填滿該模具及該夾持組件所形成之該塑模空間，藉此形 成一封裝膠體。 根據本案之構想，其中該被包覆元件係為一平面閘格陣列模 組，具有複數個金手指及電子元件。 根據本案之構想’其中該被包覆元件係為設置有複數個電子 元件及金手指之一印刷電路板。 根據本案之構想，其中該封裝方法係藉由一感測元件來判斷 8 1287330 經由該注料口所注入之該膠質封裝材料是否已固定該被包覆元 件。 70 根據本案之構想’其中該感測元件係為—光感應器，其係以 -光學感應的方式來判斷該膠質封裂材料是否已固定該被^覆元 . 件。 根據本案之構想’其中該_元件係為—減絲，其係以 熱感應的方式來觸該膠質封裝材料是否已固定該被包覆元件。 • 根據本案之構想，其中該封裳方法係藉由-計時元件來押制 經由該注料口所注入之該膠質封裝材料是否已固定該被㈣元 件。 根據本案之構想，其中該步驟（a)及⑷係湖雙射出加 工技術所完成。 減核之構想，其愤電升鱗—小财全触記憶卡。 根據本案之構想，其中該電子卡係為-多媒體記憶卡。 根據本案之構想，其中該膠f封裝材料係為加熱軟k塑膠液 體。 根據本案之構想，其愧夾持組件係包含—第—夾持部及— 第二夾持部’其係分別設置於該被包覆元件之兩相對侧邊，用以 -使該被包覆元件固定於該模具之該塑模空間中。 • 根據本案之構想’其巾該第—靖部係由雜具之該開口處 置入該塑模空間中。 1287330 根據本案之構想，其中該模具更包含一傾斜部，用以與該被 包覆元件相抵頂。 #案之另一較廣義實施態樣為提供一種電子卡之封裝方法，其係藉 由一夾持組件及-模具，對-被包覆元件進行封裝，該模具係具 有-麵空間、一注料口及一開口，其至少包含下列步驟：⑷將 該被包覆元件設置於該模具之該麵如巾，使該被包覆元件與 該模具之間形成-第-流道及—第二流道，且自該開口處將該爽 持組件置入該塑模空間中並固定該被包覆元件；（b)透過該注料口 注入一膠質封裝材料至該模具之該塑模空間中，使該膠質封裝材 料>'口者該弟一流道及該第二流道包覆該破包覆元件；（c)判斷沿著 該弟",L道及該弟二流道所注入之該膠質封裝材料是否已固定該 被包覆元件，當判斷結果為是時，將該夾持組件退出該塑模空間， 並於該開口處與該模具連接；·以及(d)沿著該第一流道及該第二流· 道將該膠質封裝材料實質上完全填滿該模具及該夾持組件所形成 之該塑模空間，藉此形成一封裝膠體。 根據本案之構想’其中該炎持組件係包含一第一夾持部及一 第二夾持部，其係分別設置於該被包覆元件之兩相對侧邊，用以 使該被包覆元件固定於該模具之該塑模空間中，且該第一爽持部 係由該模具之該開口處置入該塑模空間之該第一流道中。 1287330 【實施方式】 體現本案特徵與優點的—些典型實施例將在後段的說明中詳 細欽述。絲朗是核_在不__上具有各種的變化， 其白不脫離本案的鱗，且其中的内容及圖示在本質上係當作說 明之用，而非用以限制本案之範圍。 本案之電子卡之封袭方法主要應用於小型安全數位記憶卡 (Secure Digital Card，SD Card)或多媒體記憶卡（Multimedia • Card，MMC㈣)等小型電子卡，當然一般市面上常見之電子卡，1287330 VII. Designation of representative representatives: (1) The representative representative of the case is: the second picture. (1) Brief description of the symbol of the representative figure: S21 S26: Flow chart of the encapsulation method of the electronic card 8. If there is a chemical formula in this case, please disclose the chemical formula that best shows the characteristics of the invention: IX. Description of the invention: TECHNICAL FIELD This case relates to a method for packaging an electronic card, and more particularly to a method for packaging a small electronic card. [Prior Art] The electronic card as seen in 4 is widely used, and there is a trend of gradually miniaturization, such as a modem card, a local area network card (LAN card), and a memory card (Memory Card). and many more. Common international standard specifications for electronic cards include PCMCIA cards, Compact Flash Cards (CF Cards), and Secure Digital Memory Cards (SD Cards), and new specifications are constantly evolving. . Although the specifications of these electronic cards are different, the way and structure of the packages are similar. !287330 The general e-card difficulty must provide sufficient _ mechanical and electrical months and at least meet certain specific standards (9) _ (four)) specifications, in addition, the method of sealing electronic cards must also be turned over the package county In order to be able to produce a large amount of production, the consideration of the strength of the ship and the cost of packaging is the focus of the development of electronic cards. *Traditional electronic card packaging method mostly bends the periphery of the upper and lower two conductive shells downward, and combines with the plastic outer frame in a snap-fit manner, and then the clamp/clamp (t〇〇i) will be pressed up and down. The two conductive Hao 卩 卩 ,, and enclose the framing and - printed circuit board. Since the conductive six of the electronic card must undergo a bending process beforehand, and then combined with the plastic frame in a snap-fit manner, *but the guide and the frame cannot be tightly connected (four) are connected together by the 'further' The mechanical strength of the electronic card structure is generally poor, especially when the riveting process towel is very versatile and will cause the conductive shell to be deformed. Thus, when the electronic card is subjected to external force or flexing force (4), the conductive shell material loosens and falls off. The package structure of the electronic card will be damaged. Although the industry has developed a package method based on ultrasonic implants for the shortcomings of the above-mentioned packages, please refer to the _-picture, which is a detailed description of the structure of the conventional electronic card, which is a small female full memory card (MiniSDCard, below) For example, the small SD memory card is a package of a conventional electronic card. As shown in the figure, the small memory card 1 includes two upper and lower plastic housings u and a printed circuit board provided with electronic components 121 and gold fingers 122. 12, the packaging process needs to first clamp the printed circuit board 12 between the upper and lower plastic housings 11, and placed in the ultrasonic implanting machine (not shown) for 1287330 alignment, to be executed after the alignment is completed Ultrasonic Zhiren County, gambling the upper and lower two plastic shells 11 joints of the softening of the petals to make the two stick together, although the money is ultrasonically implanted, the degree of difficulty in the structure of the electronic card is indeed better than the conventional The method of using Liuhe is good, but the way of super-sonic implanting requires the manual placement of the printed circuit board 12 and the upper and lower casings into the super-injection machine, and the recording is performed after the alignment. Sound waves implanted people, so Wei County To heteroaryl longer production time 'and - __ times can only be encapsulated electronic card structure, mass production can not be due to manufacturing needs' manner and with the artificial bit will consume excessive production costs. Moreover, when the electronic card is subjected to an external force or a flexing force, the upper and lower plastic shells η are very likely to cause the deformation of the depression or the lack of fracture. In severe cases, the area between the upper and lower plastic shells 11 is also adhered. Insufficient strength can easily cause separation. Therefore, how to develop an electronic card packaging method that can improve the above-mentioned conventional technology is an urgent problem to be solved. SUMMARY OF THE INVENTION The main purpose of the remaining ft is to provide a method for packaging a daughter card, which is to fix the coated component in the space of the mold by the temple and the member, and to be injected into the mold. The amount of colloidal encapsulation material can be fixed to the covered component ^ _ _ face line, the shape of the threat is turned to prevent glue _ _ _ overflow, the most 彳 _ _ static, finished, 1287330 electronic card seal,俾Resolve the traditional use of super-sound, and the long-term transcription of the square (4) and the consumption of the production of the electronic card formed by Narita by external force or flexing force, the upper and lower two plastics: will make a fine shape _ 峨, even The shortcomings of the S-ports of the two plastic casings will be separated and can be solved. In order to achieve the above object, one of the more general embodiments of the present invention provides an electronic card wire loading method, which is a package of a coated component by a scale component and a die, the die having a mold a space, a filling port and an opening, comprising at least the following steps: (8) disposing a miscellaneous covering element in the molding space of the mold' and placing the secret component in the opening and emptying the fixed component The coated component; (9) is inserted into the space of the surface of the glove through the filling port; (C) determining whether the encapsulated material injected through the injection port has fixed the covered component When the determination result is YES, the clamping assembly is withdrawn from the molding space and connected to the mold at the opening; and (d) the gelatinous encapsulating material substantially completely fills the mold and the clamping assembly The molding space is formed, thereby forming an encapsulant. According to the concept of the present invention, the coated component is a planar gate array module having a plurality of gold fingers and electronic components. According to the concept of the present invention, the coated component is a printed circuit board provided with a plurality of electronic components and a gold finger. According to the concept of the present invention, the encapsulation method determines whether the encapsulated component has been fixed by the glue encapsulation material injected through the injection port by a sensing component. 70 According to the concept of the present invention, wherein the sensing element is a light sensor, it is optically inductively determined whether the glue sealing material has fixed the component. According to the concept of the present invention, wherein the element is a minus wire, it is thermally sensitive to whether the encapsulated material has been fixed to the coated component. • According to the concept of the present invention, the method of sealing is to control whether the (4) element is fixed by the glue encapsulating material injected through the injection port by the timing element. According to the concept of the present case, the steps (a) and (4) are completed by the double injection processing technology of the lake. The concept of reducing the nuclear, its anger and power scale - Xiaocai full touch memory card. According to the concept of the present case, the electronic card is a multimedia memory card. According to the concept of the present invention, the glue f encapsulating material is a heated soft k plastic liquid. According to the concept of the present invention, the jaw clamping assembly comprises a first clamping portion and a second clamping portion respectively disposed on opposite sides of the coated component for enabling the coating The component is fixed in the molding space of the mold. • According to the concept of the case, the first part of the towel is placed in the mold space by the opening of the jig. 1287330 According to the concept of the present invention, the mold further includes an inclined portion for abutting against the covered member. Another generalized embodiment of the present invention provides a method of packaging an electronic card by encapsulating a coated component by a clamping assembly and a mold having a face space and a note. a nozzle and an opening, comprising at least the following steps: (4) disposing the coated component on the face of the mold, such as a towel, forming a first-channel and a second between the coated component and the mold a flow path, and the cleaning component is placed into the molding space from the opening and the coated component is fixed; (b) a gelatinous encapsulating material is injected through the injection opening into the molding space of the mold , the gelatinous encapsulating material > 'the mouth of the younger and the second flow channel to cover the broken cladding component; (c) judged along the younger brother, the L road and the second runner Whether the gelatinous encapsulating material has fixed the coated component, and when the judgment result is yes, the clamping component is withdrawn from the molding space, and is connected to the mold at the opening; and (d) along the first The first-class channel and the second-flow channel substantially completely fill the mold and the gelatinous encapsulating material Holding the mold space formed by the assembly, thereby forming an encapsulant. According to the concept of the present invention, the illuminating component comprises a first clamping portion and a second clamping portion respectively disposed on opposite sides of the coated component for the coated component And being fixed in the mold space of the mold, and the first holding portion is disposed in the first flow path of the mold space by the opening of the mold. 1287330 [Embodiment] Some exemplary embodiments embodying the features and advantages of the present invention will be described in detail in the following description. Silk is a nuclear _ there are various changes in the __, the white does not deviate from the scale of the case, and the contents and illustrations are used for the purpose of description, rather than to limit the scope of the case. The e-card entrapment method of this case is mainly applied to small electronic cards such as small-scale secure digital card (SD Card) or multimedia memory card (Multimedia • Card, MMC (4)). Of course, the common electronic card on the market,
#J^«+(ModemCard) > ^^(L〇cal Area Network Card, LAN#J^«+(ModemCard) > ^^(L〇cal Area Network Card, LAN
Card)以及記憶卡(Mem〇ry Card)等等亦可應用本案之技術。 明參閱第—圖並請配合第三圖⑷〜⑷，其中，第二圖係為本 案較佳實施例之電子卡封褒流程圖，第三圖⑷〜⑷係為本案較佳 •.實施例之電子卡之製造流程示意圖，如第王圖⑷所示，本案電子 卡之封裝方法主要藉由趙組件31及模具32，對—被包覆元件 • 33進行封農，夾持組件31包含有第一夾持部311、第二夾持部312 以及感測元件（sensordevice)313，模具32係具有注料口 321、 開口 322以及其内部所形成之塑模空間323，其中夾持組件31之 第一夾持部311係設置於模具32之上方且相對應於開口 322處， 而第二夾持部312則設置於模具32之下方。 於本案較佳實施例中，被包覆元件33係為一具有耐高溫特性 之平面閘格陣列模組（Land Grid Array Module，以下簡稱LGA模 組），其内部係封裝有記憶體以及處理器等電子元件331，且具有 11 1287330 用來與電子裝置（未圖示）電性連接之金手指332，其尹金手指 332係相對應於央持組件之第二夾持部312，·當然，適用於本 案之封裝方法之被包覆元件33並不侷限於lga模組，只要是經過 本案之職方法封驗所形成電子卡結構之被包覆元件均 為本案所欲倾之細；舉綱言，本案所適用之被包覆元件33 亦可為設置有複數個電子元件及金手指之一印刷電路板。 明再參閱第一圖及配合第三圖（a)~(d)，本案電子卡之封裝方 法係採用雙射出加工技術（Qver mQlding)且其封裝步驟流程係 為.首先’可藉由機械手臂（未圖示）將被包覆元件33置放於模 具32之塑稹空間323巾’並使被包覆元件33的一端與模具32之 傾斜部324相抵頂，可防止被包覆元件33因受力而被推抵移動， 且被包覆元件33的頂面與模具32之間形成一第一流道期而 被包覆元件33之底面與模具32之間形成—第二流道3232，且自 模具32之開口 322處將夾持組件31之第一夾持部311及其所包 含之感測元件313置入麵空間323之第一流道3231中並使第 -夾持部311與被包覆元件33之一侧相連接，至於第二夹持部312 則與被包覆元件33之另連接，如此—來就可藉由夹持組件 31之第-夾持部311及第二夾持部312的配合使被包覆元件汩 固定於模具32之塑模空間323中，而不會於封裝過程中產生晃動 的情形（如第三圖（a) (b)所示及第二圖之步驟s⑴。 接著’將模具32之注料口 321與供料管35連接’並由模具 12 1287330 32之注料口 將-膠質封裝材料(其係為加熱軟化之塑膠液體 34 ’但材料不以此為限)灌入模具32之塑模空間咖中，使得塑 膠液體34沿著被包覆元件33與模具32之間所形成之第一流道 3231及第一流道3232對被包覆元件33進行封裝（如第二圖（匕） 所示及第二圖之步驟S22)。 在步驟S22之後，需藉由設置於塑模空間323之第一流道犯3工 之感測元件313來偵測判斷經由注料口 321灌入第一流道3231及 第二流道3232之塑膠液體34是否已經可以達到固定被包覆元件 33的功效了，於本案較佳實施例中，主要以感測元件gig是否感 應到有塑膠液體34的方式來作為判斷的基準（如步驟從3)，當感 測元件313感應到有塑膠液體34時，表示灌入第一流道3231及 第二流道3232之塑膠液體34的量已經足以固定被包覆元件％， 而不會使被包覆元件33於封裝的過程中晃動；接著，需將夾持組 件31之第一夾持部311退出塑模空間323，並於模具32之開口 322處與模具32連接（如步驟S24)，以作為模具32之外模的一 部分，使得塑膠液體34不會經由開口 322溢出。 然後，沿著第一流道3231及第二流道3232繼續將塑膠液體 34完全填滿模具32及夾持組件31之第一夾持部311之間所形成 之塑模空間323 (如第三圖（c)所示及第二圖之步驟S25);最後， 待塑膠液體34硬化後即可移除夾持組件31、模具32及供料管35, 如此即可形成一電子卡之封裝膠體（如第三圖（d)所示及第二圖 13 1287330 2步糊）；另外，因模具32之傾斜糊會使得卿成之電子 卡之封裝膠體的相對處同樣形成一傾斜部341 (如第三圖⑷所 示> 該傾斜部341可用來導引整個電子卡之封裝膠體麵插入所 連接之電子裝置内部。 其中，設置於第-夾持部311之感測元件313可為一耐高溫 之光感應H，其彭X光學感躺方絲制瓣液體％，以判斷 歸液體34是否可資固定被包覆元件33;另外感測元件313也可 為-熱感應H，其伽X鋪觸方絲__賴％，以判斷 塑膠液體34是否可資固定被包覆元件33,但是本案可實施之感測 請313並不侷限於此，任何可於高溫環境下達_應塑膠液體 34的感測元件均為本案所適用之範圍。 ®然，本案用來判斷塑膠液體34是否已經可以達到固定被包 覆元件33的方式並不侷限於使用上述之感測元件313，任何可判 斷塑膠液體34流量是否已經可以達到固定被包覆元件33的方式 均為本案所適用之範圍，舉例而言，製造廠商可利用計時元件來 計算經由供料管35所注入塑膠液體34的容量，當注入的塑膠液 體34到達可固定被包覆元件33的量時，就可將夾持組件31之第 一夾持部311退出塑模空間323，並於模具32之開口 322處與模 具32連接。 1287330 使用本案之電子卡之封裝方法具有下述優點: 1·降低成本： 於實際應㈣可啊開設乡健具組’並藉由賊手臂同時 夾持複數健包覆元件至龍的内部，就可_進行複數個 電子卡的封裝製程’因此麟大量的生產製造，且以自動化運作 的方式與習知使狀工作業的方式相較可降低大量的生產成本； 2·強化結構： 由於本案之封裝方式係使用軟化之娜液體直接封裝被包覆 疋件’因此所形成之電子卡的結構強度較佳，#外力或撓曲力量 作用時，财纽細關形或随的缺失； 3·防水防塵： 由於本案之封裝方式係使用軟化之解液體直接封裝被包覆 轉’所形成的電子卡為完全密聽構即沒有接縫處，因此可達 到防水及防塵的功效。 綜上所述，本案之電子卡之封裝方法鋪域雜件先將被 =覆疋件_於模具之塑模空間中，並待注人至模具之塑模空間 ^膠質難她軸_綱，峨持組 出塑&空間’而其並於模具之開口處與模具連接，以防止谬 二、裝材料外溢’最後轉質封裝材料完全填滿_毅間，即 ^成—電子卡之封鍊體；她於習知技術本案所使用之封裝 可配口機械自動化運作的方式大量生產製造，所形成之電子 15 1287330 卡的結構強度較佳，當外力或撓曲力量翻時，並不會造成凹陷 變形或斷㈣缺失，且卿成之電子卡為完全密聽構，可達到 防水及防塵的功效。是以，本案之電子卡之封裝方法極具產業利 用之價值，爰依法提出申請。 ， 本案得由熟知此項技術之人士任施匠思而為諸般修飾，然皆 不脫如附申請專利範圍所欲保護者。Card) and Mem〇ry Card, etc. can also apply the technology of this case. Please refer to the first figure and please cooperate with the third figure (4)~(4), wherein the second figure is the flow chart of the electronic card sealing of the preferred embodiment of the present invention, and the third figure (4)~(4) is the preferred embodiment of the present invention. The manufacturing process diagram of the electronic card, as shown in the figure (4) of the first king, the packaging method of the electronic card of the present case is mainly to seal the coated component 33 by the Zhao component 31 and the die 32, and the clamping component 31 includes The first clamping portion 311, the second clamping portion 312, and the sensor device 313 have a filling port 321, an opening 322, and a molding space 323 formed therein, wherein the clamping assembly 31 The first clamping portion 311 is disposed above the mold 32 and corresponds to the opening 322 , and the second clamping portion 312 is disposed below the mold 32 . In the preferred embodiment of the present invention, the coated component 33 is a Land Grid Array Module (LGA module) having a high temperature resistance characteristic, and the internal package is provided with a memory and a processor. The electronic component 331 has a gold finger 332 for electrically connecting to an electronic device (not shown), and the Yinjin finger 332 corresponds to the second clamping portion 312 of the holding component. The coated component 33 suitable for the packaging method of the present invention is not limited to the lga module, and the covered component of the electronic card structure formed by the method of the method of the present case is the fineness of the case; In other words, the coated component 33 to which the present invention is applied may also be a printed circuit board provided with a plurality of electronic components and a gold finger. Referring to the first figure and the third figure (a)~(d), the electronic card packaging method of this case adopts double injection processing technology (Qver mQlding) and its packaging step flow is: firstly, by mechanical arm (not shown), the coated member 33 is placed in the plastic space 323 of the mold 32, and one end of the covered member 33 is abutted against the inclined portion 324 of the mold 32, thereby preventing the coated member 33 from being damaged. The force is pushed to move, and a first flow path period is formed between the top surface of the cladding member 33 and the mold 32 to form a second flow path 3232 between the bottom surface of the cladding member 33 and the mold 32, and The first clamping portion 311 of the clamping assembly 31 and the sensing element 313 thereof are inserted into the first flow channel 3231 of the surface space 323 from the opening 322 of the mold 32, and the first clamping portion 311 is wrapped. One side of the covering member 33 is connected, and the second clamping portion 312 is connected to the other of the covered member 33, so that the first clamping portion 311 and the second clamping portion of the clamping assembly 31 can be used. The cooperation of the portion 312 allows the coated component to be fixed in the molding space 323 of the mold 32 without sloshing during the packaging process. The situation (as shown in the third figure (a) (b) and the second step s (1). Then 'connect the injection port 321 of the mold 32 to the supply pipe 35' and the injection port of the mold 12 1287330 32 The gelatinous encapsulating material (which is a heat-softened plastic liquid 34' but not limited thereto) is poured into the molding space of the mold 32 so that the plastic liquid 34 is along the coated member 33 and the mold 32. The first flow path 3231 and the first flow path 3232 formed between the first flow path 3231 and the first flow path 3232 are packaged (as shown in the second figure (匕) and the second step S22). After step S22, it is set by The first flow channel of the molding space 323 is configured to detect whether the plastic liquid 34 injected into the first flow path 3231 and the second flow path 3232 via the injection port 321 can reach the fixed coated component. 33. In the preferred embodiment of the present invention, the sensing element gig senses whether there is a plastic liquid 34 as a reference for judging (as in step 3), when the sensing element 313 senses a plastic liquid. At 34 o'clock, the plastic liquid poured into the first flow path 3231 and the second flow path 3232 The amount of 34 is sufficient to fix the covered component % without swaying the coated component 33 during the packaging process; then, the first clamping portion 311 of the clamping assembly 31 is required to exit the molding space 323, and Connected to the mold 32 at the opening 322 of the mold 32 (as in step S24) as part of the outer mold of the mold 32 such that the plastic liquid 34 does not escape through the opening 322. Then, along the first flow path 3231 and the second flow The lane 3232 continues to completely fill the mold cavity 323 formed between the mold 32 and the first clamping portion 311 of the clamping assembly 31 (as shown in the third diagram (c) and the second step S25). Finally, after the plastic liquid 34 is hardened, the clamping assembly 31, the mold 32 and the supply tube 35 can be removed, so that an encapsulation colloid of the electronic card can be formed (as shown in the third figure (d) and the second Fig. 13 1287330 2-step paste); in addition, due to the tilting paste of the mold 32, the opposite portion of the encapsulating colloid of the electronic card of the Qingcheng is also formed with an inclined portion 341 (as shown in the third figure (4)> To guide the encapsulation surface of the entire electronic card into the connected electronic device . The sensing element 313 disposed on the first clamping portion 311 can be a high temperature resistant light sensing H, and the Peng X optical sensation lie in the square valve liquid % to determine whether the liquid 34 can be fixedly covered. The sensing element 313 can also be a thermal sensing H, and the gamma X can be used to determine whether the plastic liquid 34 can be used to fix the coated component 33, but the sensing can be implemented in this case. Please note that 313 is not limited to this. Any sensing element that can reach the plastic liquid 34 in a high temperature environment is applicable to the scope of the present application. ® However, the manner in which the present invention is used to determine whether the plastic liquid 34 can reach the fixed coated component 33 is not limited to the use of the sensing component 313 described above, and any can determine whether the flow of the plastic liquid 34 can reach the fixed coated component. The manner of 33 is applicable to the scope of the present application. For example, the manufacturer can use the timing component to calculate the capacity of the plastic liquid 34 injected through the supply pipe 35, and when the injected plastic liquid 34 reaches the fixable coated component 33 The first clamping portion 311 of the clamping assembly 31 can be withdrawn from the molding space 323 and joined to the mold 32 at the opening 322 of the mold 32. 1287330 The method of packaging the electronic card using the present invention has the following advantages: 1. Reduce the cost: In actual practice, (4) can open the township health kit' and use the thief arm to simultaneously hold the plurality of health-covered components to the inside of the dragon. Can carry out a plurality of electronic card packaging process 'Therefore, a large number of manufacturing processes, and in an automated way of operation compared with the conventional way of working in the industry can reduce a large number of production costs; 2 · Strengthen the structure: Because of the case The packaging method uses the softening liquid to directly encapsulate the coated component. Therefore, the structural strength of the electronic card formed is better. When the external force or the flexing force acts, the financial button is thin or missing; Dustproof: Because the package method of this case is to use the softened liquid to directly encapsulate the electronic card formed by the coating, the electronic card is completely closed, that is, there is no seam, so the waterproof and dustproof effect can be achieved. In summary, the packaging method of the electronic card in this case will be covered by the 疋 疋 于 in the mold space of the mold, and to be injected into the mold space of the mold ^ colloid is difficult for her axis _ gang, Holding the group of plastic & space' and connecting it to the mold at the opening of the mold to prevent the second material and the material from overflowing. The final conversion package material is completely filled with _ yi, that is, the ^ - electronic card seal The chain body; she is mass-produced in the way that the package can be equipped with automatic mechanical operation in the case of the conventional technology. The formed electronic 15 1287330 card has better structural strength, and when the external force or flexing force is turned over, it will not The deformation or breakage of the depression is caused, and the electronic card of Qingcheng is completely closed, which can achieve waterproof and dustproof effects. Therefore, the packaging method of the electronic card in this case is of great value for industrial use, and the application is filed according to law. This case has been modified by people who are familiar with the technology, but it is not intended to be protected by the scope of the patent application.
16 1287330 【圖式簡單說明】 第-圖：其係為習知電子卡之封裝結構示意圖。 第一圖··其係為本餘佳實施例之電子卡躲流程圖。 第二圖（a)〜（d):其係本案較佳實施例之電子卡之製造流程示 意圖。16 1287330 [Simple description of the diagram] Fig.: It is a schematic diagram of the package structure of the conventional electronic card. The first figure is the flow chart of the electronic card hiding in the embodiment of the present invention. Second Figures (a) - (d): This is a schematic diagram of the manufacturing process of the electronic card of the preferred embodiment of the present invention.
【主要元件符號說明】 1 :小型SD記憶卡 11 :塑膠殼體 121 ·電子元件 122 :金手指 12 :印刷電路板 31 ·•夾持組件 311 :第一夾持部 312 :第二夾持部 313 :感測元件 32 :模具 321 :注料口 322 :開口 323 :塑模空間 3231 :第一流道 3232 :第二流道 33 :被包覆元件 331 ·電子元件 332 ··金手指 34 :塑膠液體 35 :供料管 324 :傾斜部 341 :傾斜部 S21〜S26:電子卡之封裝方法之流程步驟 17[Description of main component symbols] 1 : Small SD memory card 11 : Plastic case 121 · Electronic component 122 : Gold finger 12 : Printed circuit board 31 · Clamping component 311 : First clamping part 312 : Second clamping part 313: sensing element 32: mold 321 : injection port 322 : opening 323 : molding space 3231 : first flow path 3232 : second flow path 33 : coated element 331 · electronic component 332 · · golden finger 34 : plastic Liquid 35: supply tube 324: inclined portion 341: inclined portion S21 to S26: flow of the electronic card packaging method step 17