CN203950835U - package of photoelectric element - Google Patents
package of photoelectric element Download PDFInfo
- Publication number
- CN203950835U CN203950835U CN201420237610.9U CN201420237610U CN203950835U CN 203950835 U CN203950835 U CN 203950835U CN 201420237610 U CN201420237610 U CN 201420237610U CN 203950835 U CN203950835 U CN 203950835U
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- mentioned
- photoelectric cell
- colloid
- printing opacity
- packaging body
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- 239000000084 colloidal system Substances 0.000 claims abstract description 179
- 238000007639 printing Methods 0.000 claims abstract description 103
- 238000004806 packaging method and process Methods 0.000 claims abstract description 64
- 238000012856 packing Methods 0.000 claims description 16
- 239000013078 crystal Substances 0.000 claims description 7
- 239000004065 semiconductor Substances 0.000 claims description 6
- 230000008878 coupling Effects 0.000 claims description 3
- 238000010168 coupling process Methods 0.000 claims description 3
- 238000005859 coupling reaction Methods 0.000 claims description 3
- 238000012536 packaging technology Methods 0.000 abstract description 5
- 239000000463 material Substances 0.000 description 10
- 238000010586 diagram Methods 0.000 description 9
- 238000004519 manufacturing process Methods 0.000 description 6
- 239000012780 transparent material Substances 0.000 description 6
- 239000000758 substrate Substances 0.000 description 4
- 239000003822 epoxy resin Substances 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 238000013459 approach Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85909—Post-treatment of the connector or wire bonding area
- H01L2224/8592—Applying permanent coating, e.g. protective coating
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Abstract
The utility model discloses a photoelectric element's packaging body. The packaging body of the photoelectric element comprises a carrier, the photoelectric element and a light-transmitting colloid. The photoelectric element is provided with a first surface and a second surface which are opposite to each other and two side surfaces which are opposite to each other. The second surface is coupled to the carrier. Both side surfaces are adjacent to the first surface and the second surface. The transparent colloid has elasticity and covers at least one of the first surface and the two side surfaces of the photoelectric element. The utility model has the advantages of improved packaging technology's stability and the associativity between printing opacity colloid and light tight colloid to the structure has been simplified and the cost is reduced.
Description
Technical field
The utility model is relevant with semiconductor packages, particularly about a kind of packaging body of photoelectric cell.
Background technology
Please refer to Fig. 1, Fig. 1 is the schematic diagram of the package body structure of traditional photoelectric cell.As shown in Figure 1, in the packaging body 1 of photoelectric cell, photoelectric cell 10 is arranged on substrate (or lead frame) 12, and covers photoelectric cell 10 with curable transparent material 14, after transparent material 14 solidifies, then by mould, epoxy resin 18 is carried out to compression molding.
But, due to the tolerance between mould and transparent material 14, make can leave some culls 16 on the transparent material 14 after solidifying, cause the light transmittance variation of transparent material 14, hinder the light of part and inject photoelectric cell 10.In addition, the packaging body 1 of photoelectric cell need arrange lens 17 and carrys out collected light.Due between epoxy resin 18 and substrate (or lead frame) 12, need by bonding, welding or engaging be connected, its associativity is poor.Adding the packaging technology of traditional photoelectric cell only can carry out for single photoelectric cell 10, cannot once produce in a large number and the packaging body 1 of each photoelectric cell between amount of variability be also difficult to control, cause stability and the yield of packaging technology of traditional photoelectric cell not good.
Utility model content
Therefore, the utility model proposes a kind of packaging body of photoelectric cell, the problems referred to above that suffered to solve prior art.
The packaging body that is a kind of photoelectric cell according to a specific embodiment of the present utility model.In this embodiment, the packaging body of photoelectric cell comprises carrier, photoelectric cell and printing opacity colloid.Photoelectric cell has each other relative first surface and second surface and both side surface respect to one another.Second surface couples carrier.Both side surface is all adjacent with first surface and second surface.Printing opacity colloid has elasticity and covers at least one side surface in first surface and the both side surface of photoelectric cell.
In an embodiment, the Shore of printing opacity colloid (shore) A hardness number is between between 30A to 70A.
In an embodiment, the packaging body of photoelectric cell more comprises a light tight colloid, is arranged on carrier and is covered to small part printing opacity colloid.
In an embodiment, the hardness of light tight colloid is greater than the hardness of printing opacity colloid.
In an embodiment, light tight colloid has perforate.The position of at least a portion of perforate is through to the outer surface of printing opacity colloid corresponding to the first surface of photoelectric cell and perforate.
In an embodiment, the outer surface of printing opacity colloid presents a curved surface.
In an embodiment, curved surface has at least one curvature.
In an embodiment, curved surface has at least one sunk area.
In an embodiment, photoelectric cell is semiconductor grain.
The packaging body that is a kind of photoelectric cell according to another specific embodiment of the present utility model.In this embodiment, the packaging body of photoelectric cell comprises carrier, photoelectric cell and printing opacity colloid.Photoelectric cell is arranged on carrier.Printing opacity colloid has a coefficient of elasticity, and is covered to small part photoelectric cell.The coated at least part of printing opacity colloid of packing colloid coated carrier.Wherein, the coefficient of elasticity of printing opacity colloid is that Xiao A hardness value is between between 30A to 70A.
In an embodiment, packing colloid is light tight colloid, and packing colloid has perforate, and perforate is exposed to small part printing opacity colloid.
In an embodiment, photoelectric cell is semiconductor sensor crystal grain, comprises first surface, second surface, detecting part and multiple conduction connector.In the time that photoelectric cell is coupled to carrier, first surface is in the face of carrier.Second surface and first surface are opposing, and have window.Detecting part is arranged between first surface and second surface, and is exposed at least partly window.Multiple conduction connectors are arranged at first surface, and with detecting part electric property coupling, be coupled to carrier for photoelectric cell.
In an embodiment, the hardness of packing colloid is greater than the hardness of printing opacity colloid.
Compared to prior art, the packaging body of the photoelectric cell that the utility model proposes has following advantages:
(1) can once produce by same mould the packaging body of a large amount of photoelectric cells, not only significantly improving production efficiency and reduce production costs outside, also can effectively reduce the amount of variability between the packaging body of each photoelectric cell, to promote the stability of packaging technology of photoelectric cell.
(2) because printing opacity colloid and the light tight colloid covering on it are colloid, associativity is between the two better.
(3) because the outer surface of printing opacity colloid presents curved surface shape, can reach the effect that is converged to photoelectric cell, needn't be as the prior art in photoelectric cell top arranging extra lens, can simplified structure and reduce costs.
Can be further understood by following embodiment and accompanying drawing about advantage of the present utility model and spirit.
Brief description of the drawings
Fig. 1 is the schematic diagram of the package body structure of traditional photoelectric cell.
Fig. 2 to Fig. 7 is respectively the schematic diagram of the different embodiment of the packaging body of photoelectric cell of the present utility model.
Fig. 8 A to Fig. 8 D is respectively the schematic diagram of each manufacturing step of the packaging body of the photoelectric cell in Fig. 2.
Main element symbol description:
1,2,3,4,5,6A, 6B, 7: the packaging body of photoelectric cell
10,20,30,40,50,70: photoelectric cell
12: substrate (or lead frame)
14: transparent material
16: cull
18: epoxy resin
17: lens
60A: the first photoelectric cell
60B: the second photoelectric cell
22,32,42,52,62,72: carrier
24,34,44,54,74: printing opacity colloid
64A: the first printing opacity colloid
64B, 64B ': the second printing opacity colloid
26,36,46,56,66: light tight colloid
27,29,37,39,47,49,57,59: wire
67A, 69A: the first wire
67B, 69B: the second wire
28,38,48,58,78: perforate
68A: the first perforate
68B, 68B ': the second perforate
M: mould
R: sunk area
75: conduction connector
76: packing colloid
701: first surface
702: second surface
703: detecting part
704: window
705: base material
706: cover body
Embodiment
The packaging body that is a kind of photoelectric cell according to a preferred embodiment of the present utility model.In this embodiment, the packaged photoelectric cell of the packaging body of the photoelectric cell the utility model proposes there is no specific restriction, and photoelectric cell can be light transmitting wafer, light sensing wafer or other any photoelectric cell, is determined by actual demand.
Please refer to Fig. 2, Fig. 2 is the schematic diagram of the packaging body of the photoelectric cell of embodiment for this reason.As shown in Figure 2, the packaging body 2 of photoelectric cell comprises photoelectric cell 20, carrier 22, printing opacity colloid 24, light tight colloid 26 and wire 27 and 29.In fact, carrier 22 can be lead frame, ceramic substrate or printed circuit board (PCB).
Photoelectric cell 20 has upper surface respect to one another and lower surface and both side surface respect to one another.Both side surface is all adjacent with upper surface and lower surface.Photoelectric cell 20 is arranged on carrier 22, and by wire 27 and 29 and carrier 22 be electrically connected.The lower surface of photoelectric cell 20 is positioned on carrier 22.
It should be noted that, although that the photoelectric cell 20 in this embodiment adopts is routing support plate (WireBond, WB) packaged type, be electrically connected to carrier (for example routing support plate) 22 by wire 27 and 29, but in another embodiment, photoelectric cell also can adopt crystal covered carrier-board (Flip Chip, FC) packaged type, for example, by conduction connector (bump bond) photoelectric cell (for example IC wafer) is electrically connected to carrier (for example crystal covered carrier-board), is detailed later in Fig. 7 and related description.
Printing opacity colloid 24 covers upper surface and the both side surface of photoelectric cell 20.Printing opacity colloid 24 has elasticity and its outer surface presents a curved surface.
It should be noted that, although the curved outer surface of the printing opacity colloid 24 in this embodiment only has single curvature, in fact, the curved outer surface of printing opacity colloid also can have different multiple curvature, treats that Fig. 4 to Fig. 6 B is below elaborated.
Light tight colloid 26 is arranged on carrier 22 and covers printing opacity colloid 24.Light tight colloid 26 has perforate 28, and perforate 28 can run through the outer surface of light tight colloid 26 to printing opacity colloid 24.
It should be noted that, although whole position of the perforate 28 in this embodiment is all corresponding to the upper surface of photoelectric cell 20, but in fact,, the perforate of light tight colloid also can only have the position of part corresponding to the upper surface of photoelectric cell, treats that Fig. 5 and Fig. 6 B are below elaborated.
Then, inquire into for the printing opacity colloid 24 in the packaging body of photoelectric cell 2 and the hardness of light tight colloid 26.
In the utility model, the hardness of light tight colloid 26 can be greater than the hardness of printing opacity colloid 24.That is to say, the packaging body 2 of photoelectric cell is hard by material and the poor light tight colloid 26 of elasticity is covered with the softer and preferably printing opacity colloid 24 of elasticity of material.
It should be noted that, Shore (shore) the A hardness number that the printing opacity colloid 24 that the utility model adopts has after solidifying is between between 30A to 70A.If compare with actual object, the material hardness of printing opacity colloid 24 roughly between mouse pad such as, between belt, except the material such as mouse pad and belt, within the hardness of the materials such as the sole of rubber scrape along running shoes also drops on this hardness range.
In a preferred embodiment, printing opacity colloid 24 has Shore (shore) the A hardness number of 55A, and its hardness is roughly between the hardness of erasing rubber and the hardness of the sole of running shoes, but not as limit.
26, the light tight colloid adopting as for the utility model can be the black glue of common encapsulation, and it can become very hard after solidifying, therefore its Shore having (shore) A hardness number can be higher than 70A.
Please refer to Fig. 3, the schematic diagram of the packaging body of the photoelectric cell that Fig. 3 is another embodiment.As shown in Figure 3, the packaging body 3 of photoelectric cell comprises photoelectric cell 30, carrier 32, printing opacity colloid 34, light tight colloid 36 and wire 37 and 39.
Fig. 3 and Fig. 2 difference are: the printing opacity colloid 24 in Fig. 2 covers upper surface and the both side surface of photoelectric cell 20, but the printing opacity colloid 34 in Fig. 3 only covers upper surface and the left-hand face of photoelectric cell 30, do not cover the right lateral surface of photoelectric cell 30.
In addition, the position that wire 27 and 29 in Fig. 2 is electrically connected to carrier 22 is all covered by printing opacity colloid 24, also covered by printing opacity colloid 34 though be electrically connected to the position of carrier 32 as for the wire 39 in Fig. 3, the position that wire 37 is electrically connected to carrier 32 is covered by light tight colloid 36.
Please refer to Fig. 4, the schematic diagram of the packaging body of the photoelectric cell that Fig. 4 is another embodiment.As shown in Figure 4, the packaging body 4 of photoelectric cell comprises photoelectric cell 40, carrier 42, printing opacity colloid 44, light tight colloid 46 and wire 47 and 49.
Fig. 4 and Fig. 2 difference are: the curved outer surface of the printing opacity colloid 24 in Fig. 2 only has single curvature and do not form any sunk area, but the curved outer surface of printing opacity colloid 44 in Fig. 4 has two different curvature and is formed with sunk area R.
Please refer to Fig. 5, the schematic diagram of the packaging body of the photoelectric cell that Fig. 5 is another embodiment.As shown in Figure 5, the packaging body 5 of photoelectric cell comprises photoelectric cell 50, carrier 52, printing opacity colloid 54, light tight colloid 56 and wire 57 and 59.
Fig. 5 and Fig. 4 difference are: whole position of the perforate 48 of the light tight colloid 46 in Fig. 4 is all corresponding to the upper surface of photoelectric cell 40, but the perforate 58 of the light tight colloid 56 in Fig. 5 only has the position of part corresponding to the upper surface of photoelectric cell 50, and the position of another part corresponds to carrier 52.
It should be noted that, the packaging body 2 to 5 of the photoelectric cell in above-described embodiment all only encapsulates single photoelectric cell, but the packaging body of photoelectric cell in fact of the present utility model also can encapsulate multiple photoelectric cells according to actual demand simultaneously.
For example, as shown in Figure 6A, the packaging body 6A of photoelectric cell comprises the first photoelectric cell 60A, the second photoelectric cell 60B, carrier 62, the first printing opacity colloid 64A, the second printing opacity colloid 64B, light tight colloid 66, the first wire 67A and 69A and the second wire 67B and 69B.Light tight colloid 66 has the first perforate 68A and the second perforate 68B.
The curved outer surface of the first printing opacity colloid 64A has two different curvature and is formed with a sunk area R.The curved outer surface of the second printing opacity colloid 64B has single curvature and does not form any sunk area.The position of the part of the first perforate 68A of light tight colloid 66 is corresponding to the upper surface of the first photoelectric cell 60A.Whole position of the second perforate 68B of light tight colloid 66 is all corresponding to the upper surface of the second photoelectric cell 60B.
The first printing opacity colloid 64A covers upper surface and the left-hand face of photoelectric cell 60A, is covered by light tight colloid 66 as for the right lateral surface of photoelectric cell 60A.The upper surface of photoelectric cell 60B and both side surface are all covered by the second printing opacity colloid 64B.
Suppose that the first photoelectric cell 60A and the second photoelectric cell 60B are respectively light transmitting wafer and light sensing wafer, the light that the first photoelectric cell (light transmitting wafer) 60A sends can penetrate outside packaging body 6A by the first perforate 68A of the first printing opacity colloid 64A and light tight colloid 66, extraneous light also can be injected the second printing opacity colloid 64B by the second perforate 68B of light tight colloid 66, and injects the second photoelectric cell (light sensing wafer) 60B after optically focused via the second printing opacity colloid 64B.Thus, the packaging body 6A of the illustrated photoelectric cell of Fig. 6 A can be used as and approaches sensor.
As shown in Figure 6B, the packaging body 6B of photoelectric cell comprises the first photoelectric cell 60A, the second photoelectric cell 60B, carrier 62, the first printing opacity colloid 64A, the second printing opacity colloid 64B ', light tight colloid 66, the first wire 67A and 69A and the second wire 67B and 69B.Light tight colloid 66 has the first perforate 68A and the second perforate 68B '.
The curved outer surface of the first printing opacity colloid 64A has two different curvature and is formed with a sunk area R.The curved outer surface of the second printing opacity colloid 64B ' has single curvature and does not form any sunk area.The position of the part of the first perforate 68A of light tight colloid 66 is corresponding to the upper surface of the first photoelectric cell 60A.Whole position of the second perforate 68B ' of light tight colloid 66 is all corresponding to the upper surface of the second photoelectric cell 60B.
The first printing opacity colloid 64A covers upper surface and the left-hand face of photoelectric cell 60A, is covered by light tight colloid 66 as for the right lateral surface of photoelectric cell 60A.The upper surface and the both side surface that are different from the photoelectric cell 60B in Fig. 6 A are all covered by the second printing opacity colloid 64B, the second printing opacity colloid 64B ' in Fig. 6 B only covers upper surface and the right lateral surface of photoelectric cell 60B, is covered by light tight colloid 66 as for the left-hand face of photoelectric cell 60B.
Suppose that the first photoelectric cell 60A and the second photoelectric cell 60B are respectively light transmitting wafer and light sensing wafer, the light that the first photoelectric cell (light transmitting wafer) 60A sends can penetrate outside packaging body 6 by the first perforate 68A of the first printing opacity colloid 64A and light tight colloid 66, extraneous light also can be injected the second printing opacity colloid 64B ' by the second perforate 68B ' of light tight colloid 66, and injects the second photoelectric cell (light sensing wafer) 60B after optically focused via the second printing opacity colloid 64B '.Thus, the packaging body 6B of the illustrated photoelectric cell of Fig. 6 B can be used as and approaches sensor.
Also be a kind of packaging body of photoelectric cell according to another preferred embodiment of the present utility model.In this embodiment, the packaged photoelectric cell of the packaging body of the photoelectric cell the utility model proposes there is no specific restriction, and photoelectric cell can be light transmitting wafer, light sensing wafer or other any photoelectric cell, is determined by actual demand.
As shown in Figure 7, the packaging body 7 of photoelectric cell comprises photoelectric cell 70, carrier 72, printing opacity colloid 74, multiple conduction connector 75 and packing colloid 76.Photoelectric cell 70 is arranged on carrier 72, and photoelectric cell 70 is coupled to carrier 72 by multiple conduction connectors 75.Printing opacity colloid 74 has a coefficient of elasticity, and is covered to small part photoelectric cell 70.In this embodiment, the hardness of packing colloid 76 is greater than the hardness of printing opacity colloid 74.The coefficient of elasticity of printing opacity colloid 74 is that Xiao A hardness value is between between 30A to 70A, but not as limit.
The coated at least part of printing opacity colloid 74 of packing colloid 76 coated carrier 72.In this embodiment, packing colloid 76 is light tight colloid, and packing colloid 76 has perforate 78.Perforate meeting is exposed to small part printing opacity colloid 74.
Suppose that photoelectric cell 70 is for semiconductor sensor crystal grain, as shown in Figure 7, photoelectric cell 70 comprises first surface 701, second surface 702, detecting part 703, base material 705 and covers body 706.In the time that photoelectric cell 70 is coupled to carrier 72, the first surface 701 of photoelectric cell 70 can be in the face of carrier 72.The second surface 702 of photoelectric cell 70 can be opposing with first surface 701, and second surface 702 can have window 704.Detecting part 703 is arranged between the first surface 701 and second surface 702 of photoelectric cell 70, and at least part of detecting part 703 can be exposed to window 704.Multiple conduction connectors 75 are arranged at the first surface 701 of photoelectric cell 70, and with detecting part 703 electric property couplings, be coupled to carrier 72 for photoelectric cell 70.
It should be noted that, although the printing opacity colloid 74 of the packaging body 7 of the photoelectric cell shown in Fig. 7 has covered whole photoelectric cell 70, but in fact the printing opacity colloid 74 of the packaging body 7 of photoelectric cell also can only cover a part for photoelectric cell 70, for example printing opacity colloid 74 only covers first surface 701 and a side surface of photoelectric cell 70, but not as limit.
Moreover, although the curved outer surface of the printing opacity colloid 74 of the packaging body 7 of the photoelectric cell shown in Fig. 7 has single curvature and does not form any sunk area, but in fact the curved outer surface of printing opacity colloid 74 also can have two different curvature and form sunk area, is not limited with this example.
In addition, although whole position of the perforate 78 of the packing colloid 76 shown in Fig. 7 is all corresponding to the second surface 702 of photoelectric cell 70, but in fact the perforate 78 of packing colloid 76 also can only have the position of part corresponding to the second surface 702 of photoelectric cell 70, is not limited with this example.
Next, each step of the manufacture method of the packaging body 2 of the photoelectric cell in Fig. 2 is described by the schematic diagram of Fig. 8 A to Fig. 8 D.
First, as shown in Figure 8 A, photoelectric cell 20 is arranged on carrier 22, and by wire 27 and 29 and carrier 22 be electrically connected.Photoelectric cell 20 has upper surface respect to one another and lower surface and both side surface respect to one another.Both side surface is all adjacent with upper surface and lower surface.The lower surface of photoelectric cell 20 is positioned on carrier 22.
It should be noted that, the illustrated photoelectric cell 20 of Fig. 8 A is to adopt routing support plate (Wire Bond, WB) packaged type, is electrically connected to carrier 22 by wire 27 and 29.In fact, the utility model also can adopt the crystal covered carrier-board shown in Fig. 7 (Flip Chip, FC) packaged type, by conduction connector 75, photoelectric cell 70 is electrically connected to carrier 72, there is no specific restriction.
Then, as shown in Figure 8 B, printing opacity colloid 24 is covered to upper surface and the both side surface of photoelectric cell 20.Printing opacity colloid 24 has elasticity and its outer surface presents a curved surface.
Then, as shown in Figure 8 C, mould M is arranged on the outer surface of not yet curing printing opacity colloid 24.Now, mould M can apply a pressure on not yet curing printing opacity colloid 24, makes the outer surface with flexible printing opacity colloid 24 may be subject to mould M applied pressure and produce distortion.In fact, mould M is arranged at the visual actual demand in position on the outer surface of not yet curing printing opacity colloid 24 and adjusts, and is formed on the position of wanting with the perforate 28 that makes light tight colloid 26.
After setting mould M, said method injects light tight colloid 26 in mould M again, to make light tight colloid 26 be arranged on carrier 22 and to cover printing opacity colloid 24, as shown in Fig. 8 D.After light tight colloid 26 and printing opacity colloid 24 all solidify, the hardness of the light tight colloid 26 after solidifying can be greater than the hardness of the printing opacity colloid 24 after solidifying, therefore, except mould M can exert pressure on printing opacity colloid 24, the large and poor light tight colloid 26 of elasticity of hardness also can be exerted pressure and elasticity less in hardness preferably on printing opacity colloid 24.
In fact Shore (shore) the A hardness number that the printing opacity colloid 24 that, the utility model adopts has after solidifying is between between 30A to 70A.If compare with actual object, the material hardness of printing opacity colloid 24 roughly between mouse pad such as, between belt, except the material such as mouse pad and belt, within the hardness of the materials such as the sole of rubber scrape along running shoes also drops on this hardness range.
In a preferred embodiment, printing opacity colloid 24 has Shore (shore) the A hardness number of 55A, and its hardness is roughly between the hardness of erasing rubber and the hardness of the sole of running shoes, but not as limit.26, the light tight colloid adopting as for the utility model can be the black glue of common encapsulation, and it can become very hard after solidifying, therefore its Shore having (shore) A hardness number can be higher than 70A.
After injecting light tight colloid 26 in mould M and completing and solidify, mould M is removed, can obtain the packaging body 2 of photoelectric cell as shown in Figure 2.It should be noted that, the light tight colloid 26 completing after solidifying can have perforate 28.Because mould M is arranged on the outer surface of printing opacity colloid 24, make the perforate 28 of light tight colloid 26 can run through the outer surface of light tight colloid 26 to printing opacity colloid 24.In fact, the position of the perforate 28 of light tight colloid 26 can all or part of upper surface corresponding to photoelectric cell 20, looks closely actual demand and determines.
In addition, because printing opacity colloid 24 has good elasticity, therefore, in the time that the mould M on the outer surface that is arranged at printing opacity colloid 24 removes, the pressure of the suffered mould M of the outer surface of printing opacity colloid 24 disappears, and the curved outer surface of printing opacity colloid 24 may be stretched in the perforate 28 of light tight colloid 26 a little and be out of shape.
Compared to prior art, the packaging body of the photoelectric cell that the utility model proposes has following advantages:
(1) can once produce by same mould the packaging body of a large amount of photoelectric cells, not only significantly improving production efficiency and reduce production costs outside, also can effectively reduce the amount of variability between the packaging body of each photoelectric cell, to promote the stability of packaging technology of photoelectric cell.
(2) because printing opacity colloid and the light tight colloid covering on it are colloid, associativity is between the two better.
(3) because the outer surface of printing opacity colloid presents curved surface shape, can reach the effect that is converged to photoelectric cell, needn't be as the prior art in photoelectric cell top arranging extra lens, can simplified structure and reduce costs.
By the above detailed description of preferred embodiments, be to wish more to know to describe feature of the present utility model and spirit, and not with above-mentioned disclosed preferred embodiment, category of the present utility model limited.On the contrary, its objective is that hope can contain in the category of the claim that is arranged in the wish application of the utility model institute of various changes and tool equality.
Claims (13)
1. a packaging body for photoelectric cell, is characterized in that, comprising:
One carrier;
One photoelectric cell, has first surface and second surface in face to face each other and both side surface respect to one another, and wherein above-mentioned second surface couples above-mentioned carrier, and above-mentioned both side surface is all adjacent with above-mentioned first surface and above-mentioned second surface; And
One printing opacity colloid, has elasticity and covers at least one side surface in above-mentioned first surface and the above-mentioned both side surface of above-mentioned photoelectric cell.
2. the packaging body of photoelectric cell as claimed in claim 1, is characterized in that, the Shore hardnes figure of above-mentioned printing opacity colloid is between between 30A to 70A.
3. the packaging body of photoelectric cell as claimed in claim 1, is characterized in that, the packaging body of above-mentioned photoelectric cell more comprises:
One light tight colloid, is arranged on above-mentioned carrier and is covered to the above-mentioned printing opacity colloid of small part.
4. the packaging body of photoelectric cell as claimed in claim 3, is characterized in that, the hardness of above-mentioned light tight colloid is greater than the hardness of above-mentioned printing opacity colloid.
5. the packaging body of photoelectric cell as claimed in claim 3, it is characterized in that, above-mentioned light tight colloid has a perforate, and the position of at least a portion of above-mentioned perforate is through to the outer surface of above-mentioned printing opacity colloid corresponding to the above-mentioned first surface of above-mentioned photoelectric cell and above-mentioned perforate.
6. the packaging body of photoelectric cell as claimed in claim 1, is characterized in that, the outer surface of above-mentioned printing opacity colloid presents a curved surface.
7. the packaging body of photoelectric cell as claimed in claim 6, is characterized in that, above-mentioned curved surface has at least one curvature.
8. the packaging body of photoelectric cell as claimed in claim 6, is characterized in that, above-mentioned curved surface has at least one sunk area.
9. the packaging body of photoelectric cell as claimed in claim 6, is characterized in that, above-mentioned photoelectric cell is semiconductor crystal grain.
10. a packaging body for photoelectric cell, is characterized in that, comprising:
One carrier;
One photoelectric cell, is arranged on above-mentioned carrier;
One printing opacity colloid, has a coefficient of elasticity, and is covered to the above-mentioned photoelectric cell of small part; And
One packing colloid, coated at least part of above-mentioned printing opacity colloid coated above-mentioned carrier,
Wherein, above-mentioned coefficient of elasticity is that Xiao A hardness value is between between 30A to 70A.
The packaging body of 11. photoelectric cells as claimed in claim 10, is characterized in that, above-mentioned packing colloid is a light tight colloid, and above-mentioned packing colloid has a perforate, and above-mentioned perforate is exposed to the above-mentioned printing opacity colloid of small part.
The packaging body of 12. photoelectric cells as claimed in claim 10, is characterized in that, above-mentioned photoelectric cell is semiconductor sensor crystal grain, comprising:
One first surface, in the time that above-mentioned photoelectric cell is coupled to above-mentioned carrier, above-mentioned first surface is in the face of above-mentioned carrier;
One second surface, opposing with above-mentioned first surface, and there is a window;
One detecting part, is arranged between above-mentioned first surface and above-mentioned second surface, and is exposed at least partly above-mentioned window; And
Multiple conduction connectors, are arranged at above-mentioned first surface, and with above-mentioned detecting part electric property coupling, be coupled to above-mentioned carrier for above-mentioned photoelectric cell.
The packaging body of 13. photoelectric cells as claimed in claim 10, is characterized in that, the hardness of above-mentioned packing colloid is greater than the hardness of above-mentioned printing opacity colloid.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW103206817 | 2014-04-18 | ||
| TW103206817U TWM486862U (en) | 2014-04-18 | 2014-04-18 | Optoelectronic device packaging object |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203950835U true CN203950835U (en) | 2014-11-19 |
Family
ID=51892856
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420237610.9U Expired - Fee Related CN203950835U (en) | 2014-04-18 | 2014-05-09 | package of photoelectric element |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN203950835U (en) |
| TW (1) | TWM486862U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107359280A (en) * | 2017-07-11 | 2017-11-17 | 京东方科技集团股份有限公司 | A kind of display panel and its method for packing, preparation method, display device |
-
2014
- 2014-04-18 TW TW103206817U patent/TWM486862U/en not_active IP Right Cessation
- 2014-05-09 CN CN201420237610.9U patent/CN203950835U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107359280A (en) * | 2017-07-11 | 2017-11-17 | 京东方科技集团股份有限公司 | A kind of display panel and its method for packing, preparation method, display device |
Also Published As
| Publication number | Publication date |
|---|---|
| TWM486862U (en) | 2014-09-21 |
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| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20141119 Termination date: 20160509 |