CN101345278B - LED chip encapsulation - Google Patents
LED chip encapsulation Download PDFInfo
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- CN101345278B CN101345278B CN2007101363106A CN200710136310A CN101345278B CN 101345278 B CN101345278 B CN 101345278B CN 2007101363106 A CN2007101363106 A CN 2007101363106A CN 200710136310 A CN200710136310 A CN 200710136310A CN 101345278 B CN101345278 B CN 101345278B
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- led chip
- mould
- support
- antecedent
- transparent material
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Abstract
The invention provides an LED chip encapsulating method, which comprises the steps as follows: a bracket where an LED chip is arranged is arranged in a die; a method by which a thermosetting transparent material precursor is emitted by using low voltage is used so as to directly form a lens which can cover the LED chip on the bracket, thus synchronously completing the encapsulating of the LED chip. The encapsulating method does not cause the influence to golden wire used during the wire bonding process, thus ensuring good quality; furthermore, by the mechanical production process, the usage of manpower can be greatly reduced, and the objects of reducing the cost and improving the production efficiency are achieved.
Description
Technical field
The relevant a kind of led chip method for packing of the present invention is meant a kind of led chip method for packing that can produce and shorten the processing procedure time in a large number especially.
Background technology
LED has advantages such as volume is little, the life-span is long, power consumption is little, therefore general being applied on 3C Product indicating device and the display unit.For improving the competitiveness on the market, how the anxious invariably pursuit of LED related industry improves the production yield and reduces production costs, to improve intrinsic advantage.And the led chip encapsulating structure comprises following two kinds haply at present.
See also Fig. 1, as shown in Figure 1, form at least one higher led chip storing platform 12 for going up in a support 10 (having metal part 101 and parts of plastics 102) that utilizes metal and plastics to constitute, it is placed at least one led chip 14 led chip and puts platform 12, on led chip 14, cover lens 15, this moment is because led chip 14 close lens 15, therefore need utilize instrument 11 to bleed in a side, opposite side instrument 13 carries out the mode of encapsulating, can form enclosed package with the tight filling of colloid in 14 of these lens 15 and led chips.
But under such manufacturing method thereof, very easily because bleed simultaneously, cause the sealed colloid A that is injected to produce bubble, and influence illumination effect, moreover processing procedure speed is quite slow, for instance, on led chip 14, put the step of lens 15, need to utilize and manually finish, can make that like this whole LED chip 14 processing procedure costs are higher.
Moreover, see also Fig. 2, another embodiment schematic diagram for prior art, it is compared to Fig. 1, led chip 14 is put platform 10 and is not formed standing shape storing platform, and therefore, such structure is when injecting colloid A encapsulation, do not need to bleed, more do not have the generation of air bubble problem and have processing procedure speed advantage faster.
But the structure in Fig. 2 because put the step of lens 16 on led chip 14, still need be utilized manually and finish, and therefore still has problems such as artificial careless mistake and human cost.And under such structural change, when led chip 14 was luminous, because of far away with lens 16 distances, so luminous efficiency was relatively poor.
In view of this, the present invention is directed to the shortcoming of above-mentioned prior art, propose a kind of led chip method for packing, effectively to overcome above-mentioned problem.
Summary of the invention
Main purpose of the present invention is to provide a kind of led chip method for packing, it injects thermosetting transparent material antecedent in low speed low pressure mode, can not produce the gold thread that routing engages under the situation of infringement, on led support, cover the lens of led chip with the shaping of thermosetting transparent material antecedent, and finish the encapsulation of led chip synchronously, reach and save human cost, a large amount of production and the advantage that shortens the processing procedure time.Can also utilize the mode of production of automation, reach lens simultaneously and make and encapsulate, when avoiding using manpower in a large number, inevasible human error.
In order to achieve the above object, the technical solution used in the present invention is:
A kind of led chip method for packing, it includes the following step:
A., one support is provided in advance, has a led chip on this support, this led chip engages with the support routing in advance, and support is placed in the die cavity of a mould;
B. heating mould;
C. inject with low speed mode and with a thermosetting transparent material antecedent and to add in the mould of pining for, inject in thermosetting transparent material antecedent and be filled to the predetermined volumes over half above the die cavity volume of this mould;
D. extract gas in this die cavity, reduce this die cavity internal gas pressure to a predetermined low pressure;
E. continue filling thermosetting transparent material antecedent, and treat that it solidify to form the lens that cover led chip; And
F. in mould, take out and formed lensed support.
After F of the present invention takes out and formed lensed support step, carry out visual inspection in regular turn in addition in mould, carry out testing electrical property and encapsulation subsequently.
When A. of the present invention provided a support step in advance, the bond of coating one thermosets on rack surface allowed rack surface combine with thermosets easily in addition.
Described bond is a silica gel.
Described thermosetting transparent material antecedent is a kind of two doses of constrictive type silica gel.
Each agent mixed proportion of described two doses of constrictive type silica gel is 1: 1.
The mold heated temperature of described B. heating mould step is 110 ℃～150 ℃.
Described C. also injects a thermosetting transparent material antecedent when adding in the mould of pining for step with low speed mode, thermosetting transparent material antecedent injection mould need reach in this mould die cavity and can hold cumulative volume amount 50%～80%, and this D. extracts the interior gas step of this die cavity and then mould inner pressure reduced to below 20 person of outstanding talent's crust (mBar).
Described thermosetting transparent material antecedent reaches 70% o'clock of cumulative volume amount, and this mould inner pressure is reduced to below the 15mBar.
Be provided with the chip for the led chip location outstanding or that nothing is outstanding on the described support in addition and put platform.
The invention provides a kind of led chip method for packing, the inventive method is as follows:
A., one support is provided in advance, has a led chip on this support, this led chip engages with the support routing in advance, and support is placed in the die cavity of a mould;
B. heating mould;
C. inject with low speed mode and with a thermosetting transparent material antecedent and to add in the mould of pining for, inject in thermosetting transparent material antecedent and be filled to the predetermined volumes over half above the die cavity volume of this mould;
D. extract gas in this die cavity, reduce this die cavity internal gas pressure to a predetermined low pressure;
E. continue filling thermosetting transparent material antecedent, and treat that it solidify to form the lens that cover led chip; And
F. in mould, take out and formed lensed support, and carry out visual inspection, carry out testing electrical property and encapsulation subsequently, to finish the led chip encapsulation.
What deserves to be mentioned is, can on rack surface, be coated with the bond of a thermosets earlier, to increase bond strength;
Aforementioned predetermined volumes can reach 50%～80% of the cumulative volume amount that can hold this thermosetting transparent material antecedent in this mould;
Aforementioned hot solidity transparent material antecedent can be two doses of constrictive type silica gel that mixed;
Aforementioned this predetermined low pressure can be that this mould inner pressure is reduced to below the 20mBar.
Beneficial effect of the present invention is: the present invention is so that low speed, low pressure mode will (thermosetting transparent material antecedent injects the mould of placing rack, and when in silica gel injects the mould die cavity, reaching the predetermined volumes over half that to hold the cumulative volume amount in the mould approximately, pressure in the mould is reduced pressure, can gold thread not produced under the situation of infringement, slowly filled thermoset transparent material antecedent forms the lens that cover led chip on support, reaches by this to save human cost, a large amount of production and the advantage that shortens the processing procedure time.In addition, mould of the present invention is put platform or is not had outstanding led chip and put platform applicable to having outstanding led chip, and mold exchange more.
Below illustrate in detail by specific embodiment, when the effect that is easier to understand purpose of the present invention, technology contents, characteristics and is reached.
Description of drawings
Fig. 1 is an embodiment schematic diagram of existing led chip encapsulation.
Fig. 2 is another embodiment schematic diagram of existing led chip encapsulation.
Fig. 3 is a flow chart of steps of the present invention.
Fig. 4 support of the present invention is inserted the mould schematic diagram.
Fig. 5 lens of the present invention form back die sinking schematic diagram.
The schematic diagram of another rack making lens of Fig. 6 the present invention.
The figure number explanation:
Support 10 metal parts 101 parts of plastics 102
Led chip 14 lens 15 lens 16
Colloid A support 20 metal bodies 21
Put platform 24 and put platform 25 moulds 30
Die cavity 301 male models 31 master molds 32
Embodiment
See also Fig. 3,4,5, be the embodiment flow chart of steps of led chip method for packing of the present invention, and the lens that the support of please consulting Fig. 4 is synchronously inserted mould signal and Fig. 5 form back die sinking schematic diagram:
A., one support 20 is provided in advance, it comprises the metal body 21 of prior art, plastics limiting section 22 and at least one led chip 23 constitute, this plastics limiting section 22 is fixed in metal body 21 surfaces, and be manufactured with the storing platform 24 of a projection in these plastics limiting section 22 central authorities, and utilize heat-conducting glue to fix this led chip 23 on the storing platform 24 of projection, and this led chip 23 engages (not shown) in advance with the support routing, go up the bond of coating one thermosets earlier in support 20 surfaces in addition, allow support 20 surfaces combine with thermosets easily, to increase bond strength, at last support 20 is placed in the die cavity 301 of 32 of the male model 31 of a mould 30 and master molds;
Abovementioned steps adopts surface mount technology to utilize heat-conducting glue that led chip 23 is fixed on the support 20, and utilizes lead such as gold thread to carry out the routing (not shown), electrically connects led chip 23 and support 20.
B. heating mould is 30 to 110 ℃～150 ℃.
C. and inject a thermosetting transparent material antecedent in the die cavity 301 that adds the mould of pining for 30 with low speed mode, this thermosetting transparent material antecedent is the two doses of constrictive type silica gel (PLIMER) that mix and heat with 1: 1 mixed proportion, be sticky flowable aqueous when just mixing, two doses of constrictive type silica gel injected (the best is 70%) that is filled to above the held cumulative volume amount of die cavity 301 volumes of this mould 30 at 50%～80% o'clock.
D. extract gas in this die cavity 301, reduce this die cavity 301 internal gas pressure to predetermined low pressure, continue two doses of constrictive type silica gel that the grazing shot pressure injection is gone into mixed proportion mixing in 1: 1 and heated, die cavity 301 internal pressures of mould 30 are reduced to below 20 person of outstanding talent's crust (mBar), the best is below the 15 person of outstanding talent crust (mBar), can avoid the gold thread bending that fractures by this.
E. continue towards die cavity 301 interior two doses of constrictive type silica gel of filling, and this moment, two doses of constrictive type silica gel were influenced by environment under low pressure and towards inserting towards die cavity 301 vacancies, because two doses of constrictive type silica gel of filling of the present invention (thermosetting transparent material antecedent) are to carry out filling with low speed low pressure, be not to be subjected to powerful attraction and quick flowing, so the process of filling die cavity 301 is difficult for producing turbulent flow, effectively reduce the chance that flow process produces disturbance and bubble, and can avoid the gold thread bending that fractures equally; After treating that two doses of constrictive type silica gel (thermosetting transparent material antecedent) solidify, can form the lens 40 that cover led chip 23, these lens 40 are made of two doses of constrictive type silica gel (thermosetting transparent material antecedent).
F. after mould 30 coolings, take out the support 20 that has been formed with lens 40, and whether product is carried out visual inspection inspects lens 40 and has and float, bubble, water wave, lack material, foreign matter, surface abnormalities, scratch, broken string, edge break and burr, carry out testing electrical property and encapsulation subsequently, to finish led chip method for packing of the present invention.
What this external demand was emphasized is that mould 30 of the present invention can be general common various kenel group structures, therefore when producing, also can have the support of led chip to carry out silica gel low pressure to several surface mount simultaneously in one group of mould and inject.
Moreover, seeing also Fig. 6, mould 30 of the present invention utilizes the outstanding led chip of the die cavity 301 applicable nothings of 32 of male model 31 and master molds to put the support 20 of platform 25, and mold exchange 30 more.
Illustrate that once more feature of the present invention is as follows:
The present invention is so that low speed, low pressure mode will (thermosetting transparent material antecedent injects the mould of placing rack, and when in silica gel injects the mould die cavity, reaching the predetermined volumes over half that to hold the cumulative volume amount in the mould approximately, pressure in the mould is reduced pressure, can gold thread not produced under the situation of infringement, slowly filled thermoset transparent material antecedent forms the lens that cover led chip on support, reaches by this to save human cost, a large amount of production and the advantage that shortens the processing procedure time.In addition, mould of the present invention is put platform or is not had outstanding led chip and put platform applicable to having outstanding led chip, and mold exchange more.
The above person is preferred embodiment of the present invention only, is not to be used for limiting scope of the invention process.All equalizations of doing according to the described feature of the present patent application scope change or modify, and all should be included in the claim of the present invention.
Claims (10)
1. led chip method for packing, it includes the following step:
A., one support is provided in advance, has a led chip on this support, this led chip engages with the support routing in advance, and support is placed in the die cavity of a mould;
B. heating mould;
C. inject with low speed mode and with a thermosetting transparent material antecedent and to add in the mould of pining for, inject in thermosetting transparent material antecedent and be filled to the predetermined volumes over half above the die cavity volume of this mould;
D. extract gas in this die cavity, reduce this die cavity internal gas pressure to a predetermined low pressure;
E. continue filling thermosetting transparent material antecedent, and treat that it solidify to form the lens that cover led chip; And
F. in mould, take out and formed lensed support.
2. led chip method for packing according to claim 1 is characterized in that, after described F takes out in mould and formed lensed support step, carries out visual inspection in regular turn in addition, carries out testing electrical property and encapsulation subsequently.
3. led chip method for packing according to claim 1 is characterized in that, when A. provided a support step in advance, the bond of coating one thermosets on rack surface allowed rack surface combine with thermosets easily in addition.
4. led chip method for packing according to claim 3 is characterized in that, described bond is a silica gel.
5. led chip method for packing according to claim 1 is characterized in that, described thermosetting transparent material antecedent is a kind of two doses of constrictive type silica gel.
6. led chip method for packing according to claim 5 is characterized in that, each agent mixed proportion of described two doses of constrictive type silica gel is 1: 1.
7. led chip method for packing according to claim 1 is characterized in that, the mold heated temperature of described B. heating mould step is 110 ℃～150 ℃.
8. led chip method for packing according to claim 1, it is characterized in that, described C. also injects a thermosetting transparent material antecedent when adding in the mould of pining for step with low speed mode, thermosetting transparent material antecedent injection mould need reach in this mould die cavity and can hold cumulative volume amount 50%～80%, and this D. extracts the interior gas step of this die cavity and then mould inner pressure reduced to below the 20mBar.
9. led chip method for packing according to claim 8 is characterized in that, described thermosetting transparent material antecedent reaches 70% o'clock of cumulative volume amount, and this mould inner pressure is reduced to below the 15mBar.
10. led chip method for packing according to claim 1 is characterized in that, is provided with the chip for the led chip location outstanding or that nothing is outstanding on the described support in addition and puts platform.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2007101363106A CN101345278B (en) | 2007-07-13 | 2007-07-13 | LED chip encapsulation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2007101363106A CN101345278B (en) | 2007-07-13 | 2007-07-13 | LED chip encapsulation |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101345278A CN101345278A (en) | 2009-01-14 |
| CN101345278B true CN101345278B (en) | 2011-01-12 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2007101363106A Expired - Fee Related CN101345278B (en) | 2007-07-13 | 2007-07-13 | LED chip encapsulation |
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| Country | Link |
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| CN (1) | CN101345278B (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102368515A (en) * | 2011-10-09 | 2012-03-07 | 常熟市广大电器有限公司 | Packaging method of LED chip |
| CN106159059A (en) * | 2015-04-13 | 2016-11-23 | 弘凯光电(深圳)有限公司 | LED encapsulation structure and manufacture method thereof |
| CN108171308B (en) * | 2018-01-16 | 2024-04-16 | 梵利特智能科技（苏州）有限公司 | Glue-pouring chip card |
| CN111758168A (en) * | 2018-02-19 | 2020-10-09 | 昕诺飞控股有限公司 | Sealed device with light engine |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1135637C (en) * | 1998-02-26 | 2004-01-21 | 翔因企业有限公司 | Method for producing unshaped light-emitting diode and its forming mold |
| CN1716646A (en) * | 2004-06-30 | 2006-01-04 | 深圳市淼浩高新科技开发有限公司 | Packaging structure of power type LED lighting light source |
| CN1960010A (en) * | 2005-10-31 | 2007-05-09 | 光硕光电股份有限公司 | Capsulation structure of white LED |
-
2007
- 2007-07-13 CN CN2007101363106A patent/CN101345278B/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1135637C (en) * | 1998-02-26 | 2004-01-21 | 翔因企业有限公司 | Method for producing unshaped light-emitting diode and its forming mold |
| CN1716646A (en) * | 2004-06-30 | 2006-01-04 | 深圳市淼浩高新科技开发有限公司 | Packaging structure of power type LED lighting light source |
| CN1960010A (en) * | 2005-10-31 | 2007-05-09 | 光硕光电股份有限公司 | Capsulation structure of white LED |
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| Publication number | Publication date |
|---|---|
| CN101345278A (en) | 2009-01-14 |
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Granted publication date: 20110112 |