CN101847674A - LED chip lens packaging method - Google Patents
LED chip lens packaging method Download PDFInfo
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- CN101847674A CN101847674A CN200910129158A CN200910129158A CN101847674A CN 101847674 A CN101847674 A CN 101847674A CN 200910129158 A CN200910129158 A CN 200910129158A CN 200910129158 A CN200910129158 A CN 200910129158A CN 101847674 A CN101847674 A CN 101847674A
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- led chip
- mould
- packaging method
- lens packaging
- chip lens
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Abstract
The invention discloses an LED packaging method which comprises the following steps of: (a) heating a mold to keep above a preset temperature in a direct mode or an indirect mode; (b) placing a bracket assembly in the mold with a mold cavity; (c) pressurizing and filling thermoset transparent material into the mold cavity of the mold at a preset flow rate after the mold is tightly closed, and extruding and discharging gas in the mold cavity simultaneously; (d) solidifying the thermoset transparent material in the mold cavity due to the preset heating temperature of the mold; (e) opening the mold to take a bracket out, wherein a lens is formed on the surface of the bracket; and (f) finishing the LED chip lens packaging. The LED chip lens packaging method has the advantages of greatly improving the production yield, prolonging the service life of the product, greatly shortening the time in the whole production process, greatly improving the capacity and the yield and completely reducing the cost.
Description
Technical field
The present invention relates to a kind of technical field of led chip encapsulation, particularly a kind of led chip lens packaging method.
Background technology
The led chip method for packing of prior art sees also No. 96122810 " led chip method for packing " that applicant elder generation forward direction TaiWan, China is filed an application, the procedure for producing step that it is main:
A) put a bracket component in the mould of a tool one die cavity, this assembly comprises
One has easily and the support of a thermosetting transparent material mating surface; And
One be arranged on this support, have plural contact and its contact routing be connected to the led chip in this support precalculated position;
B) heat this mould;
C) with this thermosetting transparent material antecedent, inject in this die cavity, up to being filled to a predetermined volumes over half above this die cavity volume with the flow velocity that is lower than a predetermined speed;
D) extract gas in this die cavity, make and form a predetermined low pressure in this die cavity; And
E) continue to fill this thermosetting transparent material antecedent, and treat its curing; With this, be provided with the lens that the formation one of led chip side is made of this thermosetting transparent material at this bracket component.
Though above-mentionedly can reach the purpose that originally set, and praised by industry and manufacturing person, still, in the generation of processing procedure, then can produce following puzzlement:
1. because bracket component in placing mould and after closing, can begin heating mould, in other words, when taking-up has been positioned at the bracket component of mould, this mould is cooled under the normal temperature, can make the operator in mould, take out the bracket component that has had lens, processing procedure so, certainly will make that closing beginning heating time behind the mould and the beginning temperature fall time before the die sinking each time each time accounts for all that to finish the required whole ratio of total time that produces of led chip encapsulation quite long, and cause its speed of production and output can't further rise to a puzzlement greatly.
2. because the prior art means must " be injected die cavity to reaching predetermined volumes over half with lower flow velocity (promptly being lower than predetermined speed) ", will certainly make that the time that produces of required time also can be elongated relatively, simultaneously, again with after " extracting the interior gas of die cavity earlier " to predetermined low pressure, the segmentation processing procedure of " continuous be filled up to die cavity in till " again, more can cause the required time that increases processing procedure once more, and making easily that segmentation enters the not high and permutation and combination of molecular density conjugation between thermosetting transparent material in the die cavity more can't homogenizing, and do not cause light transmittance good and reduce useful life, and then cause and produce yield and can't further rise to a puzzlement greatly more really comprehensively.
3. hold as described in the 2nd, because the gas in the die cavity is to use the extraction mode, in other words, must utilize mould air-extractor in addition just can accomplish, therefore, not only must additionally increase air-extractor or mechanical implement, simultaneously, also can significantly improve equipment cost and be another big puzzlement.
Summary of the invention
For overcoming above-mentioned defective, main purpose of the present invention is to provide a kind of have a large amount of productions fast, shortening processing procedure time, raising process rate, the light transmittance that increases lens and the led chip lens packaging method in useful life.
For achieving the above object, led chip lens packaging method of the present invention, it comprises the following step:
A) this mould heats via direct or indirect mode and is maintained until more than the predetermined temperature;
B) put bracket component in mould with die cavity;
C) be filled in the die cavity of mould with predetermined flow velocity pressurization by again the thermosetting transparent material being continued after closely the covering of mould, and synchronously gas extruding in the die cavity discharged;
D) treat that the interior thermosetting transparent material of die cavity causes its curing because of the preset heating temperature of mould;
E) die sinking and taking-up surface have formed lensed support;
F) finish the lens packages of led chip.
Led chip lens packaging method of the present invention, utilize the moulding mode of production of automatic mold blocking, reach and have the synchronous effect that thermosetting transparent material and limit air draft are injected in the limit pressurization in the die cavity, effectively solve and improve the phenomenon that the prior art die cavity must sectional feeding be bled again, cause the higher and permutation and combination of molecular density between the thermosetting transparent material in die cavity homogenizing more, make light transmittance and refractive index become higher, significantly raising is produced yield and is increased outside useful life, simultaneously, also the whole production time can be shortened significantly, and can improve production capacity and output greatly, and then the progressive effect that comprehensively reduces cost.
Description of drawings
Fig. 1 is a flow chart of steps of the present invention.
Decomposition generalized section when Fig. 2 is positioned over mould for the present invention with support.
Combination generalized section when Fig. 3 closes ejaculation for Fig. 2 mould.
Fig. 4 is Fig. 3 action decomposition generalized section after finishing.
Fig. 5 does not have the decomposition generalized section that outstanding led chip is put the bracket component of platform for the present invention adopts.
Embodiment
Below in conjunction with accompanying drawing the specific embodiment of the present invention is described in further detail.
Led chip lens packaging method of the present invention, to shown in Figure 5, its steps flow chart is as follows as Fig. 1:
As described in step 31, earlier mould 24 (being male and female mould 242,244) is installed on and is opening on the board, again via direct mode (finger print tool self heat that produces, be that group is provided with heater in the mould) or indirect mode (refer to the non-high-temperature that directly self is produced by mould, the high-temperature that promptly utilizes board, heating plate etc. to be produced conducts on the mould) heating be maintained until more than the predetermined temperature (promptly about 70 ℃～200 ℃);
As step 33, bracket component 2 is placed in the die cavity 240 of male and female mould 242,244 moulds of being formed 24; See also Fig. 1 and Fig. 2, in addition, the present invention also can be before bracket component 2 be placed in the die cavity 240 of mould 24, as described in step 32, support 22 surfaces that led chip 20 is installed are uniformly distributed in bond (primer) on it with coating method (as: spraying .. etc.), wherein this bond can be used as provides thermosetting transparent material (Silicone) and the identical material on these support 22 surfaces or the usefulness of the associativity between support 22 surperficial unlike materials, in other words, can make these support 22 surfaces become the surface that easily combines with thermosetting transparent material (Silicone).This support 22 comprises metal body 221, is formed at the limiting section 222 on the metal body 221, and in this example, support 22 has led chip 20 and puts platform 220, its top is shown in above-mentioned prior art, for example adopt surface mount technology, utilize heat-conducting glue fixed L ED chip 20, and utilize as leads such as gold threads and carry out routing (not shown) connection led chip 20 plural contacts and support 22, and become a bracket component 2.Certainly, as be familiar with present technique field person and can understand easily, above-mentioned rack surface is handled and also be can be electricity slurry processing (i.e. electricity slurry cleaning way).
In this example, this thermosetting transparent material (Silicone) is made of two doses of silica gel intermixtures with the thick liquid shape that can flow, and two doses of above-mentioned silica gel intermixtures can be divided into host (being that industry is commonly called as the A agent) and short coal agent (being that industry is commonly called as the B agent), and above-mentioned host and short coal agent be have flowable thick liquid mixed mutually;
Subsequently as step 34, the thermosetting transparent material is continued to be filled in the die cavity of mould again by after closely the covering of male and female mould 242,244, and synchronously the extruding of the gas in the die cavity is discharged with predetermined flow velocity pressurization; In other words, can cause two doses of silica gel intermixtures (being host and short coal agent) that have been positioned on the board to go ahead of the rest with proper proportion mixing back after forming a thermosetting transparent material (Silicone) with the thick liquid shape that can flow, to be suitable mixed proportion (as 1: 1 or 10: 1 or 25: 1.. etc. be the best) is mixed two doses of silica gel intermixtures (being the thermosetting transparent material) of formation and pressurizes and be injected in the die cavity 240 that has predetermined temperature in the mode of predetermined flow velocity, in other words, two doses of silica gel intermixtures (being the thermosetting transparent material) are injected into via inlet 241 in pressurization and are thermosetting transparent material and limit air draft (promptly discharging) are injected in the limit pressurization from small air flue 243 synchronous effect in the die cavity 240 that has predetermined temperature, improve the phenomenon that existing die cavity must sectional feeding be bled again and effectively solve, to cause the higher and permutation and combination of molecular density homogenizing more, make light transmittance and refractive index become higher, fill up the predetermined volumes (as Fig. 3) of these die cavity 240 volumes up to the thermosetting transparent material fully; And the above-mentioned mode of filling up predetermined volumes can be " constant speed is filled up mode continuously " or be " mode of filling up of non-uniform velocity continuously ";
Because being the brute force of being bled when filling up predetermined volumes, the thermosetting transparent material do not attract and quick flowing, it fills up and is difficult for producing turbulent flow in die cavity 240 processes, the probability of entrapped air pockets is significantly reduced, and slowly process of flowing also is enough to prevent the gold thread bending that fractures, to reduce product deterioration risk.
As step 36, treat that thermosetting transparent material in the die cavity 240 is because of after the preset heating temperature (promptly about 70 ℃～200 ℃) of mould 24 causes it to solidify, just be formed with the lens 30 that silica gel intermixture (being the thermosetting transparent material) is constituted in the outside that this bracket component 2 is provided with led chip 20, in other words, the formed lens 30 of thermosetting transparent material can coat led chip 20 and place on the bracket component 2, at last, get final product die sinking and take out the support 22 (as step 37) that the surface has been formed with lens 30, and then finish lens 30 encapsulation (as step 38) of led chip 20, see also Fig. 4.
Again after step 38, the bracket component 2 that the surface has been formed with lens 30 will be taken out, and it is carried out visual inspection, for example whether lens 30 float, bubble, water wave, lens lack material, foreign matter, surface abnormalities or scratch, edge break are arranged, break and prevent to expose silica gel and form burr; At last, an excision unwanted part of frame peripheral as burr, metal outer frame etc., and is carried out testing electrical property, in the hope of improving the shipment yield of led chip of the present invention.
What this external demand was emphasized is that the present invention also can be formed by several structures that mould is organized as shown in Figure 2, and when producing, and Overmolded mode is injected in the pressurization that one group of mould can have the bracket component 2 of led chip 20 to carry out the silica gel intermixture to several surface mount simultaneously.Support 22 of the present invention can adopt and not have the led support 22 that outstanding led chip is put platform as shown in Figure 5.
The present invention injects the pressurization of two doses of silica gel intermixtures in the die cavity of the mould of placing rack in module automation mode, and can not produce under the situation of infringement gold thread, on bracket component, form the lens that cover led chip, reach the whole production time that significantly shortens, significantly improve production capacity output and the advantage that reduces cost greatly, and mould is applicable to have outstanding led chip to put platform or does not have that outstanding led chip is put platform and mold exchange more.
The above is preferred embodiment of the present invention, is not to be used for limiting scope of the invention process.Therefore, all equalizations of doing according to described feature of claim of the present invention and spirit change or modify, and all should be included in the protection range of the present invention.
Claims (10)
1. led chip lens packaging method is characterized in that comprising the following step:
A) this mould heats via direct or indirect mode and is maintained until more than the predetermined temperature;
B) put bracket component in mould with die cavity;
C) be filled in the die cavity of mould with predetermined flow velocity pressurization by again the thermosetting transparent material being continued after closely the covering of mould, and synchronously gas extruding in the die cavity discharged;
D) treat that the interior thermosetting transparent material of die cavity causes its curing because of the preset heating temperature of mould;
E) die sinking and taking-up surface have formed lensed support;
F) finish the lens packages of led chip.
2. led chip lens packaging method as claimed in claim 1 is characterized in that: this bracket component is placed in more to include before the die cavity of mould and handles this rack surface and become the surface treatment step that easily combines with a thermosetting transparent material.
3. led chip lens packaging method as claimed in claim 2, it is characterized in that: this surface treatment step is uniformly distributed in bond on it with coating method, and bond can be used as thermosetting transparent material and the identical material of the rack surface of bracket component or the usefulness of the associativity between another unlike material are provided.
4. led chip lens packaging method as claimed in claim 3, it is characterized in that: the thermosetting transparent material is made of a kind of two doses silica gel intermixtures with the thick liquid shape that can flow, and can be injected in the die cavity that is filled in mould, and be coated on bracket component one end that is positioned at die cavity.
5. as claim 1 or 4 described led chip lens packaging methods, it is characterized in that: this bracket component comprises that one has easily and the support and of thermosetting transparent material mating surface is arranged on this support, has a led chip that is connected to this support precalculated position with upper contact and its contact routing.
6. led chip lens packaging method as claimed in claim 4 is characterized in that: this mould adopts discerptible male model and master mold design.
7. led chip lens packaging method as claimed in claim 6 is characterized in that: the heating predetermined temperature of this mould is about 70 ℃～200 ℃.
8. led chip lens packaging method as claimed in claim 5 is characterized in that: this support more comprises metal body and led chip storing platform.
9. led chip lens packaging method as claimed in claim 8 is characterized in that: this support comprises that more metal body, led chip put platform and be formed at limiting section on this metal body.
10. led chip lens packaging method as claimed in claim 4 is characterized in that: these two doses of silica gel intermixtures can be divided into host and short coal agent, and host and short coal agent are the thick liquid with flowable and mix mutually.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200910129158A CN101847674A (en) | 2009-03-27 | 2009-03-27 | LED chip lens packaging method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200910129158A CN101847674A (en) | 2009-03-27 | 2009-03-27 | LED chip lens packaging method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101847674A true CN101847674A (en) | 2010-09-29 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200910129158A Pending CN101847674A (en) | 2009-03-27 | 2009-03-27 | LED chip lens packaging method |
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| CN (1) | CN101847674A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102130228A (en) * | 2010-12-23 | 2011-07-20 | 陕西科技大学 | LED bonding wire heating mold |
| CN102157634A (en) * | 2011-01-19 | 2011-08-17 | 木林森股份有限公司 | Method and mold for packaging high-power LED (light emitting diode) liquid silicon rubber |
| CN102185044A (en) * | 2011-04-01 | 2011-09-14 | 木林森股份有限公司 | High-power light emitting diode (LED) liquid silicone rubber encapsulation method and encapsulation mould |
| CN102368530A (en) * | 2011-10-09 | 2012-03-07 | 常熟市华海电子有限公司 | LED (light-emitting diode) chip packaging structure |
| CN107160632A (en) * | 2017-05-11 | 2017-09-15 | 东莞智昊光电科技有限公司 | The manufacture method and manufacturing equipment of LED support and the LED support |
-
2009
- 2009-03-27 CN CN200910129158A patent/CN101847674A/en active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102130228A (en) * | 2010-12-23 | 2011-07-20 | 陕西科技大学 | LED bonding wire heating mold |
| CN102157634A (en) * | 2011-01-19 | 2011-08-17 | 木林森股份有限公司 | Method and mold for packaging high-power LED (light emitting diode) liquid silicon rubber |
| CN102157634B (en) * | 2011-01-19 | 2012-10-24 | 木林森股份有限公司 | Method and mold for packaging high-power LED (light emitting diode) liquid silicon rubber |
| CN102185044A (en) * | 2011-04-01 | 2011-09-14 | 木林森股份有限公司 | High-power light emitting diode (LED) liquid silicone rubber encapsulation method and encapsulation mould |
| CN102185044B (en) * | 2011-04-01 | 2013-02-06 | 木林森股份有限公司 | High-power light emitting diode (LED) liquid silicone rubber encapsulation method and encapsulation mould |
| CN102368530A (en) * | 2011-10-09 | 2012-03-07 | 常熟市华海电子有限公司 | LED (light-emitting diode) chip packaging structure |
| CN107160632A (en) * | 2017-05-11 | 2017-09-15 | 东莞智昊光电科技有限公司 | The manufacture method and manufacturing equipment of LED support and the LED support |
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Application publication date: 20100929 |