CN102683232A - Semi-conductor packaging die and semi-conductor packaging process - Google Patents
Semi-conductor packaging die and semi-conductor packaging process Download PDFInfo
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- CN102683232A CN102683232A CN2012101778800A CN201210177880A CN102683232A CN 102683232 A CN102683232 A CN 102683232A CN 2012101778800 A CN2012101778800 A CN 2012101778800A CN 201210177880 A CN201210177880 A CN 201210177880A CN 102683232 A CN102683232 A CN 102683232A
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Abstract
The invention discloses a semi-conductor packaging die. The semi-conductor packaging die is characterized by comprising an upper die, a lower die and a high-temperature resistant diaphragm seal, wherein a plurality of product die cavities are formed on the lower die; a plurality of glue injection ports are formed on the upper die and correspond to the product die cavities; and the high-temperature resistant diaphragm seal is arranged between the upper die and the lower die. A semi-conductor packaging process comprises the following steps: the high-temperature resistant diaphragm seal is attached to the upper die; a release agent is sprayed on the upper die and the lower die; a lead frame is placed on the dies to lock the upper and the lower dies; liquid-state epoxy resin is injected into the glue injection ports sequentially; and heating, curing and the like are performed. According to the invention, the die structures are simplified and smaller dies can be used, so that the die cost is lowered, the both large-scale and small-scale production are applicable, and the related quality indexes are reached; meanwhile, a large-tonnage block press is not needed, so that the equipment cost is reduced; in addition, the adopted liquid-state epoxy resin is low in price, so that the raw material cost is saved; and the die and the packaging process, provided by the invention, are particularly suitable for LED packaging.
Description
Technical field
The invention belongs to the semiconductor packaging field, particularly relate to a kind of semiconductor packaging mold and packaging technology thereof.
Background technology
Lead frame is encapsulated in the middle of the plastic-sealed body and the epoxy seal semiconductor product of the encapsulation pattern that its pin extends in parallel to the both sides rightabout; Existing product technology all utilizes the thermosetting epoxy resin of solid to adopt the mold pressing packaging technology to make; Substantially technological process is that upper and lower mould is matched moulds under the moulding press crunch after lead frame was put into mould, utilize thermosetting epoxy resin via the preheating of high frequency preheating machine after; Put into the die feeding mouth; Use material-extruding rod to be squeezed in each product die cavity through pressure, when thermosetting epoxy resin is put into the die feeding mouth, run into mold heat and change the semi liquid state shape into and clamp-on die cavity, after after several minutes, make required product through material-extruding rod pressure via the mould running channel; Mold pressing package method defective is at present; Need utilize crunch that moulding press produces up and down two mould matched moulds make between lead frame and the mould and fit fully, otherwise epoxy resin then can the outflow from the gap between the matsurface of mould and lead frame during encapsulation, influences the lead frame welding performance.Shortcoming is that mould structure complicacy and required precision are high, and molding apparatus is expensive, mould via running channel the time running channel produce a large amount of scrap rubbers, scrap rubber at present thereby can't recycle causes cost too high and the thermosetting epoxy resin unit price expensive.
Summary of the invention
The object of the invention is that the defective to prior art provides a kind of and replaces existing lead frame and be encapsulated in the middle of the plastic-sealed body and the encapsulating mould and the packaging technology thereof of the epoxy seal semiconductor product of the dress envelope pattern that its pin extends in parallel to the both sides rightabout, makes like products with diverse packaging technology and mould structure.
The present invention adopts following technical scheme for realizing above-mentioned purpose:
A kind of semiconductor packaging mold is characterized in that: it comprises upper die and lower die and refractory seals film; Have a plurality of product die cavitys on the said counterdie; Corresponding each product die cavity is provided with a plurality of gum-injecting ports on the said patrix; Product lead frame functional areas are arranged between the upper die and lower die corresponding with the product die cavity; Said refractory seals film is arranged between the upper and lower mould, is fitted on the transverse rod strip of both sides, lead frame functional areas, is used to seal the slit between the upper and lower mould and prevents that liquid-state epoxy resin from flowing to the lead frame welding region.
A kind of semiconductor packaging process comprises the steps:
(1) utilize the automatic mould machine that pastes below patrix, to stick the refractory seals film, and the matsurface of corresponding lead frame;
(2) on upper and lower mould surface according to spraying release agent, then lead frame is put into mould and with the location hole location, the upper and lower mould matched moulds utilizes screw or quick-speed jigs that mould is locked;
(3) utilize high-accuracy point gum machine to adjust the required glue amount of each die cavity after, inject liquid-state epoxy resin successively from the patrix gum-injecting port, liquid-state epoxy resin flows in the die cavity from the lead frame functional areas, accomplishes until each die cavity injecting glue of entire die;
(4) again mould is put into the oven heating it is solidified, thereby obtain required semiconductor package product.
The invention has the advantages that packaging technology and the method that the dress that lead frame is encapsulated in the middle of the plastic-sealed body and its pin extends in parallel to the both sides rightabout seals the epoxy seal semiconductor product of pattern of having solved; Simplify mould structure and can use littler mould; Reduced die cost; Be fit to big small lot batch manufacture, and reach the correlated quality index.Simultaneously do not need the large-tonnage moulding press yet, reduced equipment cost yet.Adopt liquid-state epoxy resin cheap in addition, practiced thrift the cost of raw material.Because the refractory seals film still can obtain good elasticity and toughness after at high temperature exerting pressure, and the refractory seals film can recycle hundreds of times and just need replacings, so the use cost of refractory seals film is also lower.Mould of the present invention and packaging technology thereof are particularly useful for the encapsulation of LED.
Description of drawings
Fig. 1 is a mould decomposition elevation of the present invention;
Fig. 2 is a mould decomposition plan view of the present invention.
Embodiment
Like Fig. 1, a kind of semiconductor packaging mold shown in 2, it comprises patrix 1, counterdie 4 and refractory seals film 2; Have a plurality of product die cavitys 5 on the said counterdie 4; Corresponding each product die cavity 5 is provided with a plurality of gum-injecting ports 6 on the said patrix 1; Product lead frame 3 functional areas are arranged between patrix 1 and the counterdie 4 corresponding with product die cavity 5; Said refractory seals film 2 is arranged between the upper and lower mould, is fitted on both sides, the lead frame functional areas transverse rod strip 7, is used to seal the slit between the upper and lower mould and prevents that liquid-state epoxy resin from flowing to the lead frame welding region.Refractory seals film 2 makes according to the punching press of required encapsulating products die cavity shape, and refractory seals film 2 can be any resistant to elevated temperatures elasticity and flexible material, and said refractory seals film can recycle hundreds of times just to be needed to change.
A kind of semiconductor packaging process comprises the steps:
(1) utilize the automatic mould machine that pastes below patrix 1, to stick refractory seals film 2, and the matsurface of corresponding lead frame 3;
(2) surperficial at upper and lower mould according to spraying release agent; Then lead frame 3 is put into mould and with location hole location, the upper and lower mould matched moulds utilizes screw or quick-speed jigs that mould is locked; Make and produce coupling mechanism force between the upper and lower mould; Force refractory seals film 2 fully to be fitted and arrive crack state continuously, thereby can stop liquid-state epoxy resin to be fixed in each die cavity 5 fully, not outer lead frame 3 welding regions that flow to the matsurface of lead frame 3;
(3) utilize high-accuracy point gum machine to adjust each die cavity 5 required glue amount after, inject liquid-state epoxy resin successively from patrix gum-injecting port 6, liquid-state epoxy resin flows in the die cavity 5 from the lead frame functional areas, accomplishes until each die cavity 5 injecting glue of entire die;
Again mould is put into the oven heating it is solidified, thereby obtain required semiconductor package product.
Claims (2)
1. semiconductor packaging mold, it is characterized in that: it comprises upper die and lower die and refractory seals film; Have a plurality of product die cavitys on the said counterdie; Corresponding each product die cavity is provided with a plurality of gum-injecting ports on the said patrix; Product lead frame functional areas are arranged between the upper die and lower die corresponding with the product die cavity; Said refractory seals film is arranged between the upper and lower mould, is fitted on the transverse rod strip of both sides, lead frame functional areas, is used to seal the slit between the upper and lower mould and prevents that liquid-state epoxy resin from flowing to the lead frame welding region.
2. a semiconductor packaging process comprises the steps:
(1) utilize the automatic mould machine that pastes below patrix, to stick the refractory seals film, and the matsurface of corresponding lead frame;
(2) on upper and lower mould surface according to spraying release agent, then lead frame is put into mould and with the location hole location, the upper and lower mould matched moulds utilizes screw or quick-speed jigs that mould is locked;
(3) utilize high-accuracy point gum machine to adjust the required glue amount of each die cavity after, inject liquid-state epoxy resin successively from the patrix gum-injecting port, liquid-state epoxy resin flows in the die cavity from the lead frame functional areas, accomplishes until each die cavity injecting glue of entire die;
(4) again mould is put into the oven heating it is solidified, thereby obtain required semiconductor package product.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210177880.0A CN102683232B (en) | 2012-05-31 | 2012-05-31 | A kind of semiconductor packaging mold and packaging technology thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210177880.0A CN102683232B (en) | 2012-05-31 | 2012-05-31 | A kind of semiconductor packaging mold and packaging technology thereof |
Publications (2)
| Publication Number | Publication Date |
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| CN102683232A true CN102683232A (en) | 2012-09-19 |
| CN102683232B CN102683232B (en) | 2015-08-19 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201210177880.0A Active CN102683232B (en) | 2012-05-31 | 2012-05-31 | A kind of semiconductor packaging mold and packaging technology thereof |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102998022A (en) * | 2012-10-12 | 2013-03-27 | 安徽蓝德仪表有限公司 | Encapsulating device for sensors |
| CN103390718A (en) * | 2013-08-07 | 2013-11-13 | 昆山亿业嘉精密机械有限公司 | Forming technology and packaging method for upper die provided with ball LED package |
| CN104485408A (en) * | 2013-11-10 | 2015-04-01 | 邹志峰 | Semiconductor support |
| CN105845584A (en) * | 2016-04-25 | 2016-08-10 | 安徽安美半导体有限公司 | Semiconductor diode frame rapid assembly technology and auxiliary tool thereof |
| CN106784193A (en) * | 2017-01-03 | 2017-05-31 | 厦门天微电子有限公司 | A kind of small spacing LED photovoltaic module packaging method |
| CN114273169A (en) * | 2021-12-24 | 2022-04-05 | 连云港杰瑞电子有限公司 | Vacuum encapsulation method and tool for brick type power module |
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| CN101145528A (en) * | 2007-10-29 | 2008-03-19 | 株洲南车时代电气股份有限公司 | Semiconductor chip glue-pouring method and die |
| US20080203559A1 (en) * | 2007-02-28 | 2008-08-28 | Lee Keun-Hyuk | Power device package and semiconductor package mold for fabricating the same |
| CN101541499A (en) * | 2007-02-27 | 2009-09-23 | 东和株式会社 | Method of compression-molding light emitting elements |
| CN101582475A (en) * | 2008-12-29 | 2009-11-18 | 佛山市国星光电股份有限公司 | Method for coating phosphor powder layer on LED chip and manufacture of LED device |
| CN202721109U (en) * | 2012-05-31 | 2013-02-06 | 无锡佰恒光电科技有限公司 | Semiconductor packaging mold |
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2012
- 2012-05-31 CN CN201210177880.0A patent/CN102683232B/en active Active
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| CN101541499A (en) * | 2007-02-27 | 2009-09-23 | 东和株式会社 | Method of compression-molding light emitting elements |
| US20080203559A1 (en) * | 2007-02-28 | 2008-08-28 | Lee Keun-Hyuk | Power device package and semiconductor package mold for fabricating the same |
| CN101145528A (en) * | 2007-10-29 | 2008-03-19 | 株洲南车时代电气股份有限公司 | Semiconductor chip glue-pouring method and die |
| CN101582475A (en) * | 2008-12-29 | 2009-11-18 | 佛山市国星光电股份有限公司 | Method for coating phosphor powder layer on LED chip and manufacture of LED device |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102998022A (en) * | 2012-10-12 | 2013-03-27 | 安徽蓝德仪表有限公司 | Encapsulating device for sensors |
| CN103390718A (en) * | 2013-08-07 | 2013-11-13 | 昆山亿业嘉精密机械有限公司 | Forming technology and packaging method for upper die provided with ball LED package |
| CN103390718B (en) * | 2013-08-07 | 2016-01-20 | 昆山亿业嘉精密机械有限公司 | A kind of dribbling LED upper die forming technique and method for packing thereof |
| CN104485408A (en) * | 2013-11-10 | 2015-04-01 | 邹志峰 | Semiconductor support |
| CN105845584A (en) * | 2016-04-25 | 2016-08-10 | 安徽安美半导体有限公司 | Semiconductor diode frame rapid assembly technology and auxiliary tool thereof |
| CN106784193A (en) * | 2017-01-03 | 2017-05-31 | 厦门天微电子有限公司 | A kind of small spacing LED photovoltaic module packaging method |
| CN114273169A (en) * | 2021-12-24 | 2022-04-05 | 连云港杰瑞电子有限公司 | Vacuum encapsulation method and tool for brick type power module |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102683232B (en) | 2015-08-19 |
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