CN102683232B - A kind of semiconductor packaging mold and packaging technology thereof - Google Patents
A kind of semiconductor packaging mold and packaging technology thereof Download PDFInfo
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- CN102683232B CN102683232B CN201210177880.0A CN201210177880A CN102683232B CN 102683232 B CN102683232 B CN 102683232B CN 201210177880 A CN201210177880 A CN 201210177880A CN 102683232 B CN102683232 B CN 102683232B
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Abstract
The present invention discloses a kind of semiconductor packaging mold, it is characterized in that: it comprises upper die and lower die and refractory seals film; Described counterdie has multiple product die cavity; On described patrix, corresponding each product die cavity is provided with multiple gum-injecting port; Described refractory seals film is arranged between upper and lower mould.A kind of semiconductor packaging process, is included on patrix and sticks refractory seals film; Release agent is sprayed at upper and lower mould; Put lead frame, locking upper and lower mould; Liquid-state epoxy resin is injected successively at gum-injecting port; The step such as be heating and curing.This invention simplifies mould structure and less mould can be used, reducing die cost, being applicable to large small lot batch manufacture, and reaching correlated quality index.Do not need large-tonnage moulding press simultaneously, decrease equipment cost yet.Adopt liquid-state epoxy resin cheap in addition, save the cost of raw material.Mould of the present invention and packaging technology thereof are particularly useful for the encapsulation of LED.
Description
Technical field
The invention belongs to technical field of semiconductor encapsulation, particularly relate to a kind of semiconductor packaging mold and packaging technology thereof.
Background technology
Lead frame to be encapsulated in the middle of plastic-sealed body and the epoxy seal semiconductor product of encapsulation pattern that extends in parallel to both sides rightabout of its pin, existing product technique all utilizes the thermosetting epoxy resin of solid to adopt moulded package technique to obtain, technological process is after lead frame puts into mould substantially, upper and lower mould is matched moulds under moulding press crunch, utilize thermosetting epoxy resin via after high cycle preheater preheating, put into die feeding mouth, material-extruding rod is used to be squeezed in each product die cavity via mold runner by pressure, run into mold heat change semi liquid state shape into when thermosetting epoxy resin puts into die feeding mouth and clamp-on die cavity by material-extruding rod pressure, obtained required product after after several minutes, current moulded package law limitation is, the crunch utilizing moulding press to produce is needed to be made to fit completely between lead frame and mould by upper and lower two pieces of mould matched moulds, otherwise epoxy resin then can flow out from the gap between mould and the matsurface of lead frame during encapsulation, affect lead frame welding performance.Shortcoming is that mould structure is complicated and required precision is high, and molding apparatus is expensive, and mould produces a large amount of scrap rubbers via running channel while running channel, and thus scrap rubber cannot be recycled at present, causes high cost and thermosetting epoxy resin unit price is expensive.
Summary of the invention
The object of the invention is that providing a kind of for the defect of prior art replaces existing lead frame and to be encapsulated in the middle of plastic-sealed body and the encapsulating mould of the epoxy seal semiconductor product of dress envelope pattern that extends in parallel to both sides rightabout of its pin and packaging technology thereof, obtains like products with diverse packaging technology and mould structure.
The present invention for achieving the above object, adopts following technical scheme:
A kind of semiconductor packaging mold, is characterized in that: it comprises upper die and lower die and refractory seals film; Described counterdie has multiple product die cavity; On described patrix, corresponding each product die cavity is provided with multiple gum-injecting port; Product lead frame functional areas are arranged between upper die and lower die corresponding with product die cavity; Described refractory seals film is arranged between upper and lower mould, is fitted on the transverse rod strip of both sides, lead frame functional areas, for sealing gap between upper and lower mould and preventing liquid-state epoxy resin from flowing to lead frame welding region.
A kind of semiconductor packaging process, comprises the steps:
(1) utilize subsides mould machine automatically below patrix, stick refractory seals film, and the matsurface of corresponding lead frame;
(2) comply with need spray release agent on upper and lower mould surface, then lead frame put into mould and locate with location hole, upper and lower mould matched moulds, utilizes screw or quick-speed jigs to be locked by mould;
(3) after utilizing high-accuracy point gum machine to adjust glue amount needed for each die cavity, inject liquid-state epoxy resin successively from patrix gum-injecting port, liquid-state epoxy resin flows in die cavity from lead frame functional areas, until each die cavity injecting glue of whole mould completes;
(4) mould being put into oven heating makes it solidify again, thus obtains required semiconductor package product.
The invention has the advantages that solving lead frame to be encapsulated in the middle of plastic-sealed body and the packaging technology of the epoxy seal semiconductor product of dress envelope pattern that extends in parallel to both sides rightabout of its pin and method, simplify mould structure and less mould can be used, reduce die cost, be applicable to large small lot batch manufacture, and reach correlated quality index.Do not need large-tonnage moulding press simultaneously, decrease equipment cost yet.Adopt liquid-state epoxy resin cheap in addition, save the cost of raw material.Due to refractory seals film at high temperature apply pressure after still can obtain good elasticity and toughness, and refractory seals film can recycle and hundreds ofly time just to need replacing, so the use cost of refractory seals film is also lower.Mould of the present invention and packaging technology thereof are particularly useful for the encapsulation of LED.
Accompanying drawing explanation
Fig. 1 is mould decomposition elevation of the present invention;
Fig. 2 is mould decomposition plan view of the present invention.
Embodiment
A semiconductor packaging mold as shown in Figure 1, 2, it comprises patrix 1, counterdie 4 and refractory seals film 2; Described counterdie 4 has multiple product die cavity 5; On described patrix 1, corresponding each product die cavity 5 is provided with multiple gum-injecting port 6; Product lead frame 3 functional areas are arranged between patrix 1 and counterdie 4 corresponding with product die cavity 5; Described refractory seals film 2 is arranged between upper and lower mould, is fitted on both sides, lead frame functional areas transverse rod strip 7, for sealing gap between upper and lower mould and preventing liquid-state epoxy resin from flowing to lead frame welding region.Refractory seals film 2 obtains according to the punching press of required encapsulating products die cavity shape, and refractory seals film 2 can be any resistant to elevated temperatures elasticity and flexible material, and described refractory seals film can recycle just to be needed for hundreds of times to change.
A kind of semiconductor packaging process, comprises the steps:
(1) subsides mould machine is automatically utilized to stick refractory seals film 2 below patrix 1, and the matsurface of corresponding lead frame 3;
(2) comply with need spray release agent on upper and lower mould surface, then lead frame 3 put into mould and locate with location hole, upper and lower mould matched moulds, screw or quick-speed jigs is utilized to be locked by mould, make to produce coupling mechanism force between upper and lower mould, force refractory seals film 2 fully to be fitted with the matsurface of lead frame 3 and arrive gapless state, thus liquid-state epoxy resin can be stoped completely to be fixed in each die cavity 5, flow to lead frame 3 welding region;
(3) after utilizing high-accuracy point gum machine to adjust glue amount needed for each die cavity 5, liquid-state epoxy resin is injected successively from patrix gum-injecting port 6, liquid-state epoxy resin flows in die cavity 5 from lead frame functional areas, until whole mould each die cavity 5 injecting glue completes;
Mould being put into oven heating makes it solidify again, thus obtains required semiconductor package product.
Claims (2)
1. a semiconductor packaging mold, is characterized in that: it comprises upper die and lower die and refractory seals film; Described counterdie has multiple product die cavity; On described patrix, corresponding each product die cavity is provided with multiple gum-injecting port; Product lead frame functional areas are arranged between upper die and lower die corresponding with product die cavity; Described refractory seals film is attached on patrix lower surface, between upper and lower mould, is fitted on the transverse rod strip of both sides, lead frame functional areas, for sealing gap between upper and lower mould and preventing liquid-state epoxy resin from flowing to lead frame welding region.
2. a semiconductor packaging process, comprises the steps:
(1) subsides mould machine is automatically utilized to stick refractory seals film at patrix lower surface, and the matsurface of corresponding lead frame;
(2) comply with need spray release agent on upper and lower mould surface, then lead frame put into mould and locate with location hole, upper and lower mould matched moulds, utilizes screw or quick-speed jigs to be locked by mould;
(3) after utilizing high-accuracy point gum machine to adjust glue amount needed for each die cavity, inject liquid-state epoxy resin successively from patrix gum-injecting port, liquid-state epoxy resin flows in die cavity from lead frame functional areas, until each die cavity injecting glue of whole mould completes;
(4) mould being put into oven heating makes it solidify again, thus obtains required semiconductor package product.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210177880.0A CN102683232B (en) | 2012-05-31 | 2012-05-31 | A kind of semiconductor packaging mold and packaging technology thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210177880.0A CN102683232B (en) | 2012-05-31 | 2012-05-31 | A kind of semiconductor packaging mold and packaging technology thereof |
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| Publication Number | Publication Date |
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| CN102683232A CN102683232A (en) | 2012-09-19 |
| CN102683232B true CN102683232B (en) | 2015-08-19 |
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| CN201210177880.0A Active CN102683232B (en) | 2012-05-31 | 2012-05-31 | A kind of semiconductor packaging mold and packaging technology thereof |
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Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102998022A (en) * | 2012-10-12 | 2013-03-27 | 安徽蓝德仪表有限公司 | Encapsulating device for sensors |
| CN103390718B (en) * | 2013-08-07 | 2016-01-20 | 昆山亿业嘉精密机械有限公司 | A kind of dribbling LED upper die forming technique and method for packing thereof |
| CN103560200A (en) * | 2013-11-10 | 2014-02-05 | 邹志峰 | Semiconductor bracket |
| CN105845584B (en) * | 2016-04-25 | 2018-04-06 | 安徽安美半导体有限公司 | A kind of semiconductor diode framework quick assembling technique and its aid |
| CN106784193A (en) * | 2017-01-03 | 2017-05-31 | 厦门天微电子有限公司 | A kind of small spacing LED photovoltaic module packaging method |
| CN114273169A (en) * | 2021-12-24 | 2022-04-05 | 连云港杰瑞电子有限公司 | Vacuum encapsulation method and tool for brick type power module |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008207450A (en) * | 2007-02-27 | 2008-09-11 | Towa Corp | Compression molding method of light-emitting element |
| KR101391925B1 (en) * | 2007-02-28 | 2014-05-07 | 페어차일드코리아반도체 주식회사 | Semiconductor package and semiconductor package mold for fabricating the same |
| CN100490105C (en) * | 2007-10-29 | 2009-05-20 | 株洲南车时代电气股份有限公司 | Semiconductor chip glue-pouring method and die |
| CN101582475B (en) * | 2008-12-29 | 2011-09-28 | 佛山市国星光电股份有限公司 | Method for coating phosphor powder layer on LED chip and manufacture of LED device |
| CN202721109U (en) * | 2012-05-31 | 2013-02-06 | 无锡佰恒光电科技有限公司 | Semiconductor packaging mold |
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