CN102998022A - Encapsulating device for sensors - Google Patents
Encapsulating device for sensors Download PDFInfo
- Publication number
- CN102998022A CN102998022A CN2012103876367A CN201210387636A CN102998022A CN 102998022 A CN102998022 A CN 102998022A CN 2012103876367 A CN2012103876367 A CN 2012103876367A CN 201210387636 A CN201210387636 A CN 201210387636A CN 102998022 A CN102998022 A CN 102998022A
- Authority
- CN
- China
- Prior art keywords
- fluting
- encapsulating device
- encapsulating
- sensor
- inner chamber
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Landscapes
- Measuring Temperature Or Quantity Of Heat (AREA)
Abstract
The invention discloses an encapsulating device for sensors. The encapsulating device comprises an encapsulating platform and a fit plate, the encapsulating platform comprises a bottom side and two opposite lateral upright sides, multiple rows of hemi-spherical inner cavities are arranged on the bottom side, the lateral upright sides are provided with oppositely arranged grooves, the fit plate is connectively inserted into the opposite grooves of the two lateral upright sides and provided with a plurality of slots for fixing temperature sensors, and the slots are perpendicular to the encapsulating platform. A die with multiple rows of spherical inner cavities is utilized, a plurality of thermistors are respectively placed into the corresponding hemi-spherical inner cavities, uniformly greased by a greasing gun and then taken out after being cured, and encapsulating efficiency for the sensors is improved.
Description
Technical field
The present invention relates to a kind of sensor encapsulating device.
Background technology
Temperature sensor comprises the conducting wire end of two mutually insulateds, is electrically connected with thermistor respectively, and this thermistor is encapsulated in the glomerate epoxy resins insulation layer of the shape end.The technique of making this spherical temperature sensor is: with thermistor with after two mutually insulated wires are electrically connected, put into one by one the mould location with spherical inner chamber, take again grease injection process, epoxy resin is encapsulated thermistor and wire termination in the shape chamber of mould, form spherical shapes, take out behind the final curing.
Present embedding mode be seal one and solidify to take out after, seal again the next one, by that analogy.This mode does not form the streamlined operation, and production efficiency is very low, demands urgently improving.
Summary of the invention
Problem for prior art exists the object of the invention is to propose a kind of sensor encapsulating device, by enforcement of the present invention, has improved sensor embedding efficient.
For reaching this purpose, the present invention by the following technical solutions:
A kind of sensor encapsulating device comprises:
Embedding platform, described embedding platform comprise bottom surface and two relative side elevations, and described bottom surface is provided with the hemispherical inner chamber of multirow, and described two side elevations have the fluting that at least one is oppositely arranged;
Jointing plate is plugged in the relative fluting of described two side elevations, has the fluting of some fixed temperature sensors, and described fluting is vertical with described embedding platform.
Preferably, described embedding platform also comprises two plate washers, is separately positioned on the outside of described two side elevations.
Preferably, the hemispherical inner chamber of described every row is mutually vertical with the hemispherical inner chamber of every row.
Preferably, have at least two fixed strips on the described jointing plate.
Preferably, described fixed strip is vertical with the fluting of described jointing plate.
Based on disclosing of above technical scheme, the present invention possesses following beneficial effect:
The present invention adopts the mould be arranged with a plurality of spherical inner chambers, and a plurality of thermistors are put into respectively the mould of corresponding hemispherical inner chamber, uses grease gun to unify greasing, after cured, takes out in the lump, has improved sensor embedding efficient.
Description of drawings
Fig. 1 is the embedding platform vertical view in a kind of sensor encapsulating device of the embodiment of the invention 1;
Fig. 2 is the embedding platform front elevation in a kind of sensor encapsulating device of the embodiment of the invention 1;
Fig. 3 is the jointing plate synoptic diagram of fixation of sensor not in a kind of sensor encapsulating device of the embodiment of the invention 1;
Fig. 4 is the jointing plate synoptic diagram of fixation of sensor in a kind of sensor encapsulating device of the embodiment of the invention 1.
Reference numeral:
10, bottom surface; 20, side elevation; 21, fluting; 30, plate washer; 40, hemispherical inner chamber; 60, jointing plate; 61, fluting; 70, sensor; 71, sensor thermistor; 80, fixed strip.
Embodiment
The embodiment of the invention 1 provides a kind of sensor encapsulating device, as shown in Figures 1 to 4, comprise: the embedding platform, described embedding platform comprises bottom surface 10 and two relative side elevations 20, it is mutually vertical with the hemispherical inner chamber of every row that described bottom surface 10 is provided with the preferred hemispherical inner chamber of described every row of the hemispherical inner chamber 40(of multiple lines and multiple rows, can certainly the out of plumb setting, also can only establish a row or column), described two side elevations 20 have at least one fluting that is oppositely arranged 21; Described embedding platform also comprises two plate washers 30, is separately positioned on the outside of described two side elevations 20, skids off fluting 21 for preventing that jointing plate from moving.Jointing plate 60 is plugged in the relative fluting 21 of described two side elevations 20, and has the fluting 61 of some fixed temperature sensors, and described fluting 61 is vertical with described embedding platform bottom surface 10.
During embedding, a plurality of sensors are fixed on the jointing plate 60, wherein, the thermistor of sensor is positioned at same end, and can use at least two fixed strips 80 that sensor is fixed on the jointing plate 60; Then jointing plate 60 is inserted in fluting corresponding to embedding platform side facade, make thermistor put into respectively corresponding hemispherical inner chamber; Use at last grease gun to unify greasing, after cured, take out in the lump.
The above; only be the better embodiment of the present invention; but protection scope of the present invention is not limited to this; anyly be familiar with those skilled in the art in the technical scope that the present invention discloses; be equal to replacement or change according to technical scheme of the present invention and inventive concept thereof, all should be encompassed within protection scope of the present invention.
Claims (5)
1. a sensor encapsulating device is characterized in that, comprising:
Embedding platform, described embedding platform comprise bottom surface and two relative side elevations, and described bottom surface is provided with the hemispherical inner chamber of multirow, and described two side elevations have the fluting that at least one is oppositely arranged;
Jointing plate is plugged in the relative fluting of described two side elevations, has the fluting of some fixed temperature sensors, and described fluting is vertical with described embedding platform.
2. sensor encapsulating device according to claim 1 is characterized in that described embedding platform also comprises two plate washers, is separately positioned on the outside of described two side elevations.
3. sensor encapsulating device according to claim 1 is characterized in that the hemispherical inner chamber of described every row is mutually vertical with the hemispherical inner chamber of every row.
4. sensor encapsulating device according to claim 1 is characterized in that having at least two fixed strips on the described jointing plate.
5. sensor encapsulating device according to claim 4 is characterized in that described fixed strip is vertical with the fluting of described jointing plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012103876367A CN102998022A (en) | 2012-10-12 | 2012-10-12 | Encapsulating device for sensors |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012103876367A CN102998022A (en) | 2012-10-12 | 2012-10-12 | Encapsulating device for sensors |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102998022A true CN102998022A (en) | 2013-03-27 |
Family
ID=47926880
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012103876367A Pending CN102998022A (en) | 2012-10-12 | 2012-10-12 | Encapsulating device for sensors |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102998022A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105890794A (en) * | 2016-06-02 | 2016-08-24 | 句容市博远电子有限公司 | Integrated encapsulating and potting device for sensor and operation method thereof |
| CN106092364A (en) * | 2016-05-26 | 2016-11-09 | 句容市博远电子有限公司 | NTC temperature sensor inserted sheet process units and method |
| CN106267749A (en) * | 2016-05-10 | 2017-01-04 | 北京云动飞扬智能科技有限公司 | A kind of built-in module of sport ball and preparation method thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5484274A (en) * | 1992-11-24 | 1996-01-16 | Neu Dynamics Corp. | Encapsulation molding equipment |
| CN101800047A (en) * | 2009-12-31 | 2010-08-11 | 中国船舶重工集团公司第七二五研究所 | Method for preparing three-component phononic crystal by using scattering objects |
| CN202048998U (en) * | 2011-05-09 | 2011-11-23 | 肇庆爱晟电子科技有限公司 | Epoxy resin packaging machine for semi-automatic thermistor temperature sensor |
| CN102683232A (en) * | 2012-05-31 | 2012-09-19 | 无锡佰恒光电科技有限公司 | Semi-conductor packaging die and semi-conductor packaging process |
-
2012
- 2012-10-12 CN CN2012103876367A patent/CN102998022A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5484274A (en) * | 1992-11-24 | 1996-01-16 | Neu Dynamics Corp. | Encapsulation molding equipment |
| CN101800047A (en) * | 2009-12-31 | 2010-08-11 | 中国船舶重工集团公司第七二五研究所 | Method for preparing three-component phononic crystal by using scattering objects |
| CN202048998U (en) * | 2011-05-09 | 2011-11-23 | 肇庆爱晟电子科技有限公司 | Epoxy resin packaging machine for semi-automatic thermistor temperature sensor |
| CN102683232A (en) * | 2012-05-31 | 2012-09-19 | 无锡佰恒光电科技有限公司 | Semi-conductor packaging die and semi-conductor packaging process |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106267749A (en) * | 2016-05-10 | 2017-01-04 | 北京云动飞扬智能科技有限公司 | A kind of built-in module of sport ball and preparation method thereof |
| CN106092364A (en) * | 2016-05-26 | 2016-11-09 | 句容市博远电子有限公司 | NTC temperature sensor inserted sheet process units and method |
| CN106092364B (en) * | 2016-05-26 | 2019-05-17 | 句容市博远电子有限公司 | NTC temperature sensor inserted sheet process units and method |
| CN105890794A (en) * | 2016-06-02 | 2016-08-24 | 句容市博远电子有限公司 | Integrated encapsulating and potting device for sensor and operation method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102998022A (en) | Encapsulating device for sensors | |
| WO2009108524A3 (en) | Method of manufacturing a dual interface separable insulated connector with overmolded faraday cage | |
| WO2012061091A3 (en) | Encapsulated die, microelectronic package containing same, and method of manufacturing said microelectronic package | |
| WO2014197370A3 (en) | Sensor package with exposed sensor array and method of making same | |
| ES2688427T3 (en) | Fluid tight contact passage | |
| CN102738351A (en) | Light emitting diode (LED) packaging structure and manufacturing method thereof | |
| MX2015013129A (en) | Moldable capsule and method of manufacture. | |
| EP3151275A3 (en) | System-in-package and fabrication method thereof | |
| JP2013012525A5 (en) | ||
| CN102403238B (en) | For the manufacture of the method for semiconductor chip panel | |
| CN103682018A (en) | Light-emitting diode and manufacturing method thereof | |
| TWI606654B (en) | Waterproof connector and its manufacturing method | |
| CN204834692U (en) | LED support | |
| CN103682066A (en) | Light-emitting diode module and manufacturing method thereof | |
| CN204130728U (en) | Wire and cable connector | |
| CN203491253U (en) | Plastic packaging structure for semiconductors | |
| CN202507484U (en) | Vacuumizing type mould | |
| US9515234B2 (en) | LED package and manufacturing method thereof | |
| CN206727392U (en) | A kind of tank commutator with modeling face extension | |
| CN104494059B (en) | Hot runner injection molding hot nozzle structure | |
| CN204962614U (en) | Lantern cover | |
| CN201945400U (en) | Injection-moulding temperature sensor for anti-thermal shock | |
| CN206834400U (en) | A combined type USB3.0 connectors | |
| CN203850149U (en) | Top cover for injection moulding terminals of power capacitor | |
| CN210469885U (en) | PCB injection molding sealing structure |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20130327 |