CN210469885U - PCB injection molding sealing structure - Google Patents
PCB injection molding sealing structure Download PDFInfo
- Publication number
- CN210469885U CN210469885U CN201920708882.5U CN201920708882U CN210469885U CN 210469885 U CN210469885 U CN 210469885U CN 201920708882 U CN201920708882 U CN 201920708882U CN 210469885 U CN210469885 U CN 210469885U
- Authority
- CN
- China
- Prior art keywords
- pcb
- inner shell
- shell
- injection molding
- sealing structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000001746 injection moulding Methods 0.000 title claims abstract description 19
- 238000007789 sealing Methods 0.000 title claims abstract description 13
- 239000004033 plastic Substances 0.000 claims abstract description 7
- 229920003023 plastic Polymers 0.000 claims abstract description 7
- 239000000463 material Substances 0.000 claims description 6
- 238000000465 moulding Methods 0.000 claims description 6
- 238000000034 method Methods 0.000 abstract description 4
- 230000008602 contraction Effects 0.000 abstract description 3
- 238000001816 cooling Methods 0.000 abstract description 3
- 238000002347 injection Methods 0.000 abstract description 3
- 239000007924 injection Substances 0.000 abstract description 3
- 125000006850 spacer group Chemical group 0.000 abstract description 3
- AGCPZMJBXSCWQY-UHFFFAOYSA-N 1,1,2,3,4-pentachlorobutane Chemical compound ClCC(Cl)C(Cl)C(Cl)Cl AGCPZMJBXSCWQY-UHFFFAOYSA-N 0.000 description 5
- 230000002265 prevention Effects 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005536 corrosion prevention Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 239000012778 molding material Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Landscapes
- Injection Moulding Of Plastics Or The Like (AREA)
Abstract
The utility model provides a pair of PCB injection molding sealing structure, including PCB, inner shell and shell, PCB moulds plastics the parcel in the inner shell, be equipped with several spacing groove in the inner shell, electronic component on the PCB is respectively at the spacing inslot, the shell wraps up the inner shell, PCB's both ends are equipped with the wire respectively, the wire passes inner shell and shell respectively. Compared with the prior art, the utility model provides a pair of PCB injection seal structure is equipped with several spacer groove in the inner shell, has disperseed the shrinkage stress of inner shell, and inner shell and PCB board contact surface reduce, and the effort that reduces the inner shell and produce when the internal contraction appears in the cooling process leads to PCB to appear warping, has guaranteed PCB's normal use.
Description
Technical Field
The utility model relates to a PCB seals technical field, specifically is a PCB seal structure of moulding plastics.
Background
The Printed circuit board, i.e., Printed circuit board, is abbreviated as PCB. The printed circuit board etches complex circuit copper wires between parts on a board after careful and orderly planning, provides a main support body for mounting and interconnecting electronic components, and is an indispensable basic part of all electronic products. In the application process of the PCB, a sealing structure is generally required to be adopted for sealing so as to play the roles of dust prevention, water prevention and corrosion prevention. The existing PCB sealing adopts double-layer injection molding sealing, but when the injection molding sealing is adopted, due to the fact that injection molding materials have shrinkage performance, the PCB is easy to deform and the like under the action of stress concentration after long-time use.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a PCB seal structure of moulding plastics to solve the technical problem in the background art.
In order to achieve the above object, the present invention provides the following technical solutions:
the utility model provides a PCB seal structure of moulding plastics, includes PCB, inner shell and shell, the PCB wraps up in the inner shell of moulding plastics, be equipped with several interval groove in the inner shell, electronic component on the PCB is respectively at interval inslot, the shell wraps up the inner shell, the both ends of PCB are equipped with the wire respectively, the wire passes inner shell and shell respectively.
The inner shell is formed by injection molding of PE materials and a PCB.
The outer shell is made of PVC materials and is formed by injection molding with the inner shell.
Compared with the prior art, the utility model provides a pair of PCB injection seal structure is equipped with several spacer groove in the inner shell, has disperseed the shrinkage stress of inner shell, and inner shell and PCB board contact surface reduce, and the effort that reduces the inner shell and produce when the internal contraction appears in the cooling process leads to PCB to appear warping, has guaranteed PCB's normal use.
Drawings
FIG. 1: a schematic structural diagram of a PCB injection molding sealing structure is provided.
Detailed Description
The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention.
Specific example 1: referring to fig. 1, in an embodiment of the present invention, a PCB injection molding sealing structure includes a PCB1, an inner shell 2 and an outer shell 3, the PCB1 is encapsulated in the inner shell by injection molding, a plurality of spacing grooves 201 are disposed in the inner shell 2, the spacing grooves 201 are different in shape and size, electronic components on the PCB1 are disposed in the spacing grooves 201 respectively, the inner shell 2 is encapsulated by the outer shell 3, wires 4 are disposed at two ends of the PCB1 respectively, and the wires 4 pass through the inner shell 2 and the outer shell 3 respectively.
The inner shell 2 is formed by injection molding of PE material and PCB. And after the inner shell 2 and the PCB1 are subjected to injection molding and sealing, the outer shell 3 is subjected to injection molding again by adopting a PVC material and the inner shell 2 subjected to injection molding.
Compared with the prior art, the utility model provides a pair of PCB injection seal structure is equipped with several spacer groove in the inner shell, has disperseed the shrinkage stress of inner shell, and inner shell and PCB board contact surface reduce, and the effort that reduces the inner shell and produce when the internal contraction appears in the cooling process leads to PCB to appear warping, has guaranteed PCB's normal use.
It is obvious to a person skilled in the art that the invention is not restricted to details of the foregoing exemplary embodiments, but that it can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.
Claims (3)
1. The utility model provides a PCB seal structure of moulding plastics which characterized in that: including PCB, inner shell and shell, the PCB wraps up in the inner shell of moulding plastics, be equipped with several spacing groove in the inner shell, electronic component on the PCB is respectively at the spacing inslot, the shell wraps up the inner shell, the both ends of PCB are equipped with the wire respectively, the wire passes inner shell and shell respectively.
2. The PCB injection molding sealing structure of claim 1, wherein: the inner shell is formed by injection molding of PE materials and a PCB.
3. The PCB injection molding sealing structure of claim 1, wherein: the outer shell is made of PVC materials and is formed by injection molding with the inner shell.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920708882.5U CN210469885U (en) | 2019-05-17 | 2019-05-17 | PCB injection molding sealing structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920708882.5U CN210469885U (en) | 2019-05-17 | 2019-05-17 | PCB injection molding sealing structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210469885U true CN210469885U (en) | 2020-05-05 |
Family
ID=70437847
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920708882.5U Active CN210469885U (en) | 2019-05-17 | 2019-05-17 | PCB injection molding sealing structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210469885U (en) |
-
2019
- 2019-05-17 CN CN201920708882.5U patent/CN210469885U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20220105 Address after: 523000 room 212, building 3, No. 42, Muxuan Chuangye 1st Road, Changping Town, Dongguan City, Guangdong Province Patentee after: Guangdong Lianji Precision Industry Co.,Ltd. Address before: 523000 District A, 29 Beach Road, Chen Wu Sixth Industrial Zone, Changan Town, Dongguan, Guangdong. Patentee before: INTERCONNECT PRODUCTS Ltd. |
|
| TR01 | Transfer of patent right | ||
| CP03 | Change of name, title or address |
Address after: 523000, No. 138 Gangjian Road, Changping Town, Dongguan City, Guangdong Province Patentee after: Lianji Precision Electronics Co.,Ltd. Country or region after: China Address before: 523000 room 212, building 3, No. 42, Muxuan Chuangye 1st Road, Changping Town, Dongguan City, Guangdong Province Patentee before: Guangdong Lianji Precision Industry Co.,Ltd. Country or region before: China |
|
| CP03 | Change of name, title or address |