CN103560200A - Semiconductor bracket - Google Patents
Semiconductor bracket Download PDFInfo
- Publication number
- CN103560200A CN103560200A CN201310596193.7A CN201310596193A CN103560200A CN 103560200 A CN103560200 A CN 103560200A CN 201310596193 A CN201310596193 A CN 201310596193A CN 103560200 A CN103560200 A CN 103560200A
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- Prior art keywords
- pin
- conductive
- district
- chip pin
- chip
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
Abstract
The invention relates to the technical field of LEDs including direct-insert LED brackets and provides a semiconductor bracket. The semiconductor bracket solves the problems that the placing positions of LED chips are less and the cost of LEDs is high according to a traditional bracket. The semiconductor bracket comprises an upper bracket body, a middle bracket body provided with a cross beam, and a lower bracket body. A plurality of upper single bodies are arranged on the upper bracket body. Each upper single body comprises an upper chip pin provided with a chip placing position and an upper conductive pin. A plurality of lower single bodies are arranged on the lower bracket body, and the lower single bodies and the upper single bodies are asymmetrically arranged. Each lower single body comprises a lower chip pin provided with a chip placing position and a lower conductive pin. The upper single bodies and the lower single bodies are respectively and fixedly connected with the cross beam. The middle bracket body is provided with an upper chip pin lengthening area and a lower chip pin lengthening area, and the bottom of the upper chip pin lengthening area is lower than the top of the lower chip pin lengthening area. Chip placing positions are arranged on the upper portion and the lower portion of the bracket, so the number of the LEDs is doubled, and the cost of the LEDs is reduced greatly.
Description
Technical field
The present invention relates to the LED technical field that comprises LED support, LED belongs to semiconductor.
Background technology
LED support is to comprise the needed support of the semiconductor production such as LED, particularly sheet straight cutting LED support.Existing straight cutting LED support is to only have top to be provided with LED chip to place position, and LED chip placement position is few, and LED quantity is few, and support cost is high, and LED cost is high.
Summary of the invention
The present invention places position less and the high problem of LED cost in order to solve LED chip in existing straight cutting LED support, proposes a kind of semi-conductive support, and the technical solution used in the present invention is:
, including the support of sheet, support is divided into upper bracket, middle bracket and lower bracket, and lower bracket is below upper bracket, and middle bracket is between upper bracket and lower bracket, and middle bracket includes 1 above crossbeam; Described upper bracket is provided with a plurality of upper monomers; Described in each, upper monomer includes 1 above upper chip pin and 1 above upper conductive pin, and upper chip pin is fixedly connected with middle bracket respectively with upper conductive pin; It is a plurality of and the non-laterally zygomorphic lower monomer of upper monomer that described lower bracket includes quantity; Described in each, lower monomer includes 1 above lower chip pin and 1 above lower conductive pin, and lower chip pin is fixedly connected with middle bracket respectively with lower conductive pin; The bottom of described upper monomer is fixedly connected with described middle bracket; The top of described lower monomer is fixedly connected with described middle bracket; Described middle bracket is provided with the upper conductive feet to the upper chip pin lengthening district of downward-extension, for upper conductive pin to downward-extension for upper chip pin and lengthens district, for the upwardly extending lower chip pin of lower chip pin, lengthens district and lengthen district for the upwardly extending lower conductive feet of lower conductive pin; Described upper chip pin lengthens the bottom position in district and the bottom position in upper conductive feet lengthening district all lengthens the tip position in district lower than lower chip pin, and upper chip pin lengthens the bottom position in district and the bottom position in upper conductive feet lengthening district all lengthens the tip position in district lower than lower conductive feet.
Described upper chip pin lengthens district, lower chip pin and lengthens district, upper conductive feet and lengthen district and lower conductive feet and lengthen among district arbitrarily that both are non-intersect, and non-intersect is independent separately, and both do not contact arbitrarily.
Described upper chip pin is fixedly connected with crossbeam; Described lower chip pin is fixedly connected with crossbeam.
Described upper chip pin and upper conductive pin extend downwardly into respectively the bottom of middle bracket; Described lower chip pin and lower conductive pin extend up to respectively the top of middle bracket.
Chip pin in described middle bracket, lower chip pin, on conductive pin and lower conductive pin be staggered.
The left part of described middle bracket and right part are respectively equipped with for more than 1 through hole to material fork stentplacement.
The space, left and right of described through hole is greater than 1 millimeter.
On described, in monomer, conductive pin is positioned at the left side or the right of chip pin on each; In described lower monomer, each lower conductive pin is positioned at the left side or the right of a lower chip pin.
The upper surface of described upper chip pin is provided with for placing the upper chip of semiconductor chip and places position; Described upper conductive pin is provided with for being electrically connected the upper bonding wire position of semiconductor chip; The lower surface of described lower chip pin is provided with for placing the lower chip of semiconductor chip and places position; Described lower conductive pin is provided with for being electrically connected the lower bonding wire position of semiconductor chip.
What described upper chip pin lengthened district, lower chip pin lengthening district, upper conductive feet lengthening district and lower conductive feet lengthening district spatial placement is all metal material.
Described upper chip pin lengthens district, lower chip pin lengthens district, upper conductive feet lengthening district and lower conductive feet lengthening district and is arranged in described crossbeam.
The invention has the beneficial effects as follows: straight cutting LED support is that above and below is all provided with LED chip placement position, LED chip is placed many one times of position, (going up monomer and lower monomer is not symmetrical position relationship for upper monomer and the asymmetric setting of lower monomer, if when symmetrical upper monomer conflict with the pin of lower monomer just do not save material), many one times of LED quantity, significantly reduce the required support cost of LED, approximately reduce by 40 percent support cost, significantly reduce LED cost.
Accompanying drawing explanation
Fig. 1 is the main TV structure schematic diagram of the embodiment of the present invention;
Fig. 2 is the plan structure schematic diagram of the upper monomer of the embodiment of the present invention.
Embodiment
The present embodiment is the preferred embodiment of the present invention, and other every its principle is identical with the present embodiment or approximate with basic structure, all within protection range of the present invention.
Shown in seeing figures.1.and.2, a kind of semi-conductive support, include the support of the sheet of metal material, support is divided into upper bracket 1, middle bracket 2 and lower bracket 3, lower bracket 3 is below upper bracket 1, middle bracket 2 is between upper bracket 1 and lower bracket 3, and middle bracket 2 includes in 2 crossbeam 5(middle bracket 22 crossbeams 5 of the longest strip on left and right directions); Described upper bracket is provided with a plurality of upper monomers; Described in each, upper monomer includes 1 upper chip pin 11 and 1 upper conductive pin 12, and upper chip pin 11 is positioned at the right of conductive pin 12; It is a plurality of and the non-laterally zygomorphic lower monomer of upper monomer (going up monomer and lower monomer is not symmetrical position relationship) that described lower bracket 3 includes quantity; Described in each, lower monomer includes 1 lower chip pin 13 and 1 lower conductive pin 14, and lower chip pin 13 is positioned at the right of lower conductive pin 14; The bottom of described upper monomer is fixedly connected with described middle part 2 supports; The top of described lower monomer is fixedly connected with described middle bracket 2; Described middle bracket 2 is provided with the upper conductive feet to the upper chip pin lengthening district of downward-extension, for upper conductive pin to downward-extension for upper chip pin and lengthens district, for the upwardly extending lower chip pin of lower chip pin, lengthens district and lengthen district for the upwardly extending lower conductive feet of lower conductive pin; Described upper chip pin lengthens the bottom position in district and the bottom position in upper conductive feet lengthening district all lengthens the tip position in district lower than lower chip pin, and upper chip pin lengthens the bottom position in district and the bottom position in upper conductive feet lengthening district all lengthens the tip position in district lower than lower conductive feet.
Described upper chip pin lengthens district, lower chip pin and lengthens district, upper conductive feet and lengthen district and lower conductive feet and lengthen among district arbitrarily that both are non-intersect, and non-intersect is independent separately, and both do not contact arbitrarily.
Described upper chip pin 11 and upper conductive pin 12 extend downwardly into respectively middle bracket 2 bottoms, the downward extension of upper chip pin 11 is exactly the metal material that described upper chip pin lengthens the spatial placement in district, and the downward extension of upper conductive pin 12 is exactly the metal material that described upper conductive feet lengthens the spatial placement in district; Described lower chip pin 13 and lower conductive pin 14 extend up to respectively middle bracket 2 tops, it is exactly the metal material that described lower chip pin lengthens the spatial placement in district that lower chip pin 13 extends upward part, and it is exactly the metal material that described lower conductive feet lengthens the spatial placement in district that lower conductive pin 14 extends upward part; Described upper chip pin 11, upper conductive pin 12, lower chip pin 13 and lower conductive pin 14 are fixedly connected with described crossbeam 5 respectively.
The left part of described middle bracket 2 and right part are respectively equipped with for 2 through holes 4 to material fork stentplacement, and through hole 4 is square.
The space, left and right of described through hole 4 is greater than 1 millimeter.
The upper surface of described upper chip pin 11 is provided with for placing the upper chip of 1 above semiconductor chip and places position; Described upper conductive pin 12 is provided with for being electrically connected the upper bonding wire position of semiconductor chip; The lower surface of described lower chip pin 13 is provided with for placing the lower chip of 1 above semiconductor chip and places position; Described lower conductive pin 14 is provided with for being electrically connected the lower bonding wire position of semiconductor chip.
What described upper chip pin lengthened district, lower chip pin lengthening district, upper conductive feet lengthening district and lower conductive feet lengthening district spatial placement is all metal material.
In the production of support, employing is first gone out cuboid flitch in longer book raw metal plate, cuboid flitch is removed certain position and is separated with raw material plate, pressing equipment has corresponding rack upper surface or top, lower surface or bottom, support upper side, punching press model and the mechanism of support lower side and mid-stent, can be with the punching press of various ordered pair cuboid flitch, general subpunch top and bottom (can synchronously also can carry out step by step punching press), rush again the side of support top and support bottom, finally go out mid-stent, also can support top, side and the mid-stent of support bottom are gone out simultaneously.Described through hole 4 also can strengthen distance between adjacent two upper monomers and lower monomer and form.
When using support to produce LED; first complete after monomer die bond baking; again support is turned around; lower monomer, then completes lower monomer die bond baking upward, then go up monomer and lower monomer bonding wire (support is distinguished positive and negative placement) respectively; carry out again upper monomer sealing baking; for protecting lower monomer, lower monomer can be socketed protection mould bar, carries out afterwards lower monomer sealing baking.Also can complete after monomer die bond baking bonding wire sealing baking, then carry out lower monomer die bond baking bonding wire sealing baking.Instantly monomer adds man-hour, and for protecting upper monomer, upper monomer can be socketed protection mould bar or first not disassemble adhesive filling mould bar; During lower monomer encapsulating, down, upward, while toasting afterwards, in order not affect the colloid of upper monomer, baking box is provided with a plurality of strip gabs to upper monomer to lower monomer, also can add heat insulating strip, and upper monomer upward and expose heating region.Support turns around, and former top becomes below, and former below becomes top, and now the lower surface of former lower chip pin becomes towards top.
The straight cutting LED support for the three-in-one LED of RGB (forming a LED through encapsulation in 1 red 1 green 1 blue three LED chips are placed on LED chip placement position), on 1, monomer has 1 upper chip pin 11 and 3 upper conductive pin 12(to go up the left side that chip pin 11 is positioned at conductive pin 12), 1 lower monomer has chip pin 13 under 1 lower chip pin 13 and 3 lower conductive pin 14(to be positioned at the left side of lower conductive pin 14), in middle bracket 2 according on chip pin 11, lower chip pin 13, the 1st upper conductive pin 12, the 1st lower conductive pin 14, the 2nd upper conductive pin 12, the 2nd lower conductive pin 14, the order of the 3rd upper conductive pin 12 and the 3rd lower conductive pin 14 is arranged.
If upper chip pin lengthens district, lower chip pin lengthens district, upper conductive feet lengthens district and lower conductive feet lengthening district is arranged in described crossbeam, go up chip pin, upper conductive pin, extension and crossbeam that chip pin and lower conductive pin extend in middle bracket are structure as a whole, after upper monomer and lower monomer difference die bond bonding wire sealing baking, chip pin on stamping out in middle bracket, upper conductive pin, (upper chip pin lengthens district to lengthening pin corresponding to chip pin and lower conductive pin difference, lower chip pin lengthens district, upper conductive feet lengthen district and lower conductive feet lengthen in district adjacent both to have enough spacing to be convenient to punching press), can again electroplate rear use.
Straight cutting LED support of the present invention is that above and below is all provided with LED chip placement position, LED chip is placed many one times of position, the raw material of part lower bracket have just been increased, LED with regard to energy production twice, be equivalent to significantly reduce the required support cost of each LED, approximately reduce by 40 percent support cost, significantly reduced LED cost.
Claims (10)
1. a semi-conductive support, include the support of sheet, support is divided into upper bracket, middle bracket and lower bracket, and lower bracket is below upper bracket, middle bracket is between upper bracket and lower bracket, and middle bracket includes 1 above crossbeam; It is characterized in that: described upper bracket is provided with a plurality of upper monomers; Described in each, upper monomer includes 1 above upper chip pin and 1 above upper conductive pin, and upper chip pin is fixedly connected with middle bracket respectively with upper conductive pin; It is a plurality of and the non-laterally zygomorphic lower monomer of upper monomer that described lower bracket includes quantity; Described in each, lower monomer includes 1 above lower chip pin and 1 above lower conductive pin, and lower chip pin is fixedly connected with middle bracket respectively with lower conductive pin; The bottom of described upper monomer is fixedly connected with described middle bracket; The top of described lower monomer is fixedly connected with described middle bracket; Described middle bracket is provided with the upper conductive feet to the upper chip pin lengthening district of downward-extension, for upper conductive pin to downward-extension for upper chip pin and lengthens district, for the upwardly extending lower chip pin of lower chip pin, lengthens district and lengthen district for the upwardly extending lower conductive feet of lower conductive pin; Described upper chip pin lengthens the bottom position in district and the bottom position in upper conductive feet lengthening district all lengthens the tip position in district lower than lower chip pin, and upper chip pin lengthens the bottom position in district and the bottom position in upper conductive feet lengthening district all lengthens the tip position in district lower than lower conductive feet.
2. a kind of semi-conductive support according to claim 1, is characterized in that: among described upper chip pin lengthening district, lower chip pin lengthening district, upper conductive feet lengthening district and lower conductive feet lengthening district, both are non-intersect arbitrarily.
3. a kind of semi-conductive support according to claim 1, is characterized in that: described upper chip pin is fixedly connected with crossbeam; Described lower chip pin is fixedly connected with crossbeam.
4. a kind of semi-conductive support according to claim 1, is characterized in that: described upper chip pin and upper conductive pin extend downwardly into respectively the bottom of middle bracket; Described lower chip pin and lower conductive pin extend up to respectively the top of middle bracket.
5. a kind of semi-conductive support according to claim 4, is characterized in that: chip pin in described middle bracket, lower chip pin, on conductive pin and lower conductive pin be staggered.
6. a kind of semi-conductive support according to claim 1, is characterized in that: the left part of described middle bracket and right part are respectively equipped with for more than 1 through hole to material fork stentplacement.
7. a kind of semi-conductive support according to claim 6, is characterized in that: the space, left and right of described through hole is greater than 1 millimeter.
8. a kind of semi-conductive support according to claim 1, is characterized in that: on described, in monomer, conductive pin is positioned at the left side or the right of chip pin on each; In described lower monomer, each lower conductive pin is positioned at the left side or the right of a lower chip pin.
9. a kind of semi-conductive support according to claim 1, is characterized in that: what described upper chip pin lengthened district, lower chip pin lengthening district, upper conductive feet lengthening district and lower conductive feet lengthening district spatial placement is all metal material; The upper surface of described upper chip pin is provided with for placing the upper chip of semiconductor chip and places position; Described upper conductive pin is provided with for being electrically connected the upper bonding wire position of semiconductor chip; The lower surface of described lower chip pin is provided with for placing the lower chip of semiconductor chip and places position; Described lower conductive pin is provided with for being electrically connected the lower bonding wire position of semiconductor chip.
10. a kind of semi-conductive support according to claim 1, it is characterized in that: a kind of semi-conductive support according to claim 1, is characterized in that: described upper chip pin lengthens district, lower chip pin lengthens district, upper conductive feet lengthening district and lower conductive feet lengthening district and is arranged in described crossbeam.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310596193.7A CN103560200A (en) | 2013-11-10 | 2013-11-25 | Semiconductor bracket |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310555155 | 2013-11-10 | ||
| CN201310555155.7 | 2013-11-10 | ||
| CN201310596193.7A CN103560200A (en) | 2013-11-10 | 2013-11-25 | Semiconductor bracket |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103560200A true CN103560200A (en) | 2014-02-05 |
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Family Applications (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310596193.7A Pending CN103560200A (en) | 2013-11-10 | 2013-11-25 | Semiconductor bracket |
| CN201410000871.3A Pending CN103730564A (en) | 2013-11-10 | 2014-01-02 | Semiconductor support |
| CN201410626957.7A Pending CN104485408A (en) | 2013-11-10 | 2014-11-10 | Semiconductor support |
Family Applications After (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410000871.3A Pending CN103730564A (en) | 2013-11-10 | 2014-01-02 | Semiconductor support |
| CN201410626957.7A Pending CN104485408A (en) | 2013-11-10 | 2014-11-10 | Semiconductor support |
Country Status (1)
| Country | Link |
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| CN (3) | CN103560200A (en) |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100965942B1 (en) * | 2008-09-02 | 2010-06-23 | 동광전자 주식회사 | The electronic display board formed with the roll |
| CN201522825U (en) * | 2009-10-16 | 2010-07-07 | 深圳市华海诚信电子显示技术有限公司 | LED display screen |
| CN201994013U (en) * | 2011-01-04 | 2011-09-28 | 大连路明光电工程有限公司 | LED (light-emitting diode) double-sided display screen |
| CN102637390B (en) * | 2012-04-01 | 2014-11-26 | 深圳市威斯泰克光电技术有限公司 | Lamp belt split screen of LED (Light-Emitting Diode) display screen |
| CN102683232B (en) * | 2012-05-31 | 2015-08-19 | 无锡佰恒光电科技有限公司 | A kind of semiconductor packaging mold and packaging technology thereof |
| CN203231193U (en) * | 2013-05-14 | 2013-10-09 | 锦益光电科技(上海)有限公司 | Energy-saving double-faced light emitting LED (Light Emitting Diode) light tube for advertising lightbox |
-
2013
- 2013-11-25 CN CN201310596193.7A patent/CN103560200A/en active Pending
-
2014
- 2014-01-02 CN CN201410000871.3A patent/CN103730564A/en active Pending
- 2014-11-10 CN CN201410626957.7A patent/CN104485408A/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| CN103730564A (en) | 2014-04-16 |
| CN104485408A (en) | 2015-04-01 |
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| C06 | Publication | ||
| PB01 | Publication | ||
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20140205 |