CN202487665U - Lead frame for producing light-emitting diode - Google Patents
Lead frame for producing light-emitting diode Download PDFInfo
- Publication number
- CN202487665U CN202487665U CN2011205756318U CN201120575631U CN202487665U CN 202487665 U CN202487665 U CN 202487665U CN 2011205756318 U CN2011205756318 U CN 2011205756318U CN 201120575631 U CN201120575631 U CN 201120575631U CN 202487665 U CN202487665 U CN 202487665U
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- China
- Prior art keywords
- support
- lead frame
- soldering
- platforms
- emitting diode
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- Expired - Fee Related
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Abstract
The utility model relates to a lead frame for producing a light-emitting diode, which is a lead frame for producing a semiconductor light-emitting diode. The lead frame comprises multiple groups of parallely-arranged LED supports (4). Each support (4) is provided with positioning holes (3) at the bottom, horizontal ribs (2) at the central portion and spacedly-arranged frameworks (1) as well. The top of each support (4) is provided with a function region (21), in which bosses (9, 10, 11) and soldering platforms (5, 6, 7, 8) are arranged. Pins (12, 13, 14, 15) are disposed at the bottom of each support (4). The central portion of each pin (12, 13, 14, 15) is connected via the horizontal ribs (2) and is provided with a clamping point (16). LED chips (17, 18, 19) are arranged on corresponding bosses (9, 10, 11), which are higher than the plane of the soldering platforms (5, 6, 7, 8) by 0.1-1 mm. In the utility model, according to the positions where the chips are fixed, a differentiation method is adopted to adjust the length of the corresponding soldering platforms, so as to make the length of the soldering platforms extend to the closest corresponding side of the fixed chips, making the connecting line shorter and the connection more reliable.
Description
Technical field:
The utility model relates to the process units of semiconductor light-emitting-diode, especially produces the down-lead bracket that semiconductor light-emitting-diode is used.
Background technology:
Traditional full-color support mainly contains two kinds: 1, Piranha all-colour LED support; 2, the full-color support of SMD; Mainly containing reflector forms with each utmost point pin.The effect of reflector mainly is to contain chip, and play the optically focused effect, makes light have certain directivity, and it is to be used for being connected of chip and external circuit that each utmost point goes between, and lights LED with driving.Traditional full-color support all be glass at the bottom of a plane, each chip all is fixed on same plane, because chip thickness is variant, causes the mixed light effect relatively poor.
Summary of the invention:
The purpose of the utility model is: provide a kind of production light-emitting diodes effective down-lead bracket.
It comprises that the bottom is provided with location hole (3), and the middle part is provided with horizontal bar (2), and the many pack supports of LED platoon (4) of skeleton (1) are set at interval; The top of every pack support (4) is provided with functional area (21); Boss (9,10,11) is set, welding stage (5,6,7,8) in the functional area (21); The bottom of each support (21) is provided with pin (12,13,14,15); The middle part of each pin (12,13,14,15) is connected by horizontal bar (2), and the middle part is provided with stuck point (16); Led chip (17,18,19) is set respectively on each boss.
Boss (9), (10), (11) exceed welding stage (5,6,7,8) plane 0.1-1mm.
The utility model adopts the differentiation mode, and the height that exceeds three boss of welding stage is set to inconsistent, according to three kinds of primary colours chip thickness differences and corresponding the setting.Difference in height is single unfixing about 0.1mm, according to the chip thickness discrepancy adjustment.The three primary colors chip is separately fixed in the middle of three boss; According to the chip fixed position, adjust corresponding welding stage length, make welding stage length extend to consolidate the nearest corresponding side of chip, the bonding wire of three primary colors chip is connected accomplishes left and right sides line, make line shorter, connect more reliable.
Description of drawings:
Accompanying drawing 1 is the front view of the utility model support;
Accompanying drawing 2 is vertical views of the utility model support;
Accompanying drawing 3 is upward views of the utility model support;
Accompanying drawing 4 is left views of the utility model support;
Accompanying drawing 5 is stereograms of the utility model support;
Accompanying drawing 6 is single the stereograms 1 after the cutting of the utility model support;
Accompanying drawing 7 is single the stereograms 2 after the cutting of the utility model support;
Accompanying drawing 8 is the utility model production control flow charts.
Embodiment:
It comprises that the bottom is provided with location hole (3), and the middle part is provided with horizontal bar (2), and the many pack supports of LED platoon (4) of skeleton (1) are set at interval; The top of every pack support (4) is provided with functional area (21), and boss (9,10,11) is set in the functional area (21), welding stage (5,6,7,8); The bottom of every pack support (4) is provided with pin (12,13,14,15); The middle part of each pin (12,13,14,15) is connected by horizontal bar (2); Correspondence has been provided with led chip (17,18,19) on three boss; And after accomplishing encapsulation, again horizontal bar (2) is cut off, form stuck point (16) at the middle part of each pin (12,13,14,15).Boss (9), (10), (11) exceed welding stage (5,6,7,8) plane 0.1-1mm.
The many pack supports of LED platoon (4) go out finished product behind sheet material → punching press 1 → punching press 2 → cleaning → end plating → cleaning → silver-plated → cut → bending → shaping process; In Sheet Metal Forming Technology, at first make location hole (3), and then die-cut single pack support (4), be connected with skeleton (1) by horizontal bar (2) between every pack support (4).Again that each welding stage (5), (6), (7), (8), led chip (17,18,19) is fixing functional area (21) and pin (12), (13), (14), (15) are die-cut comes out, and at last boss (9), (10), (11) punching press shaping is come out.Pin (12), (13), (14), (15) are communicated with external circuit; Welding stage (5), (6), (7) are three independently utmost points, and that welding stage (8) is connected with solid brilliant functional area (21) is as a whole as public pole, have heat-conducting effect concurrently.Led chip (17), (18), (19) are individually fixed in boss (9,10,11) central authorities, adopt lead (20) that chip electrode is coupled together with connecting line (20) with corresponding welding stage (5), (6), (7), (8) again.
Through mould with horizontal bar (2) and support (4) base towards separating, but need stay stuck point (16), the location when being beneficial to plug-in unit towards each pin of timesharing.
Claims (2)
1. produce the effective down-lead bracket of light-emitting diodes for one kind, it comprises that the bottom is provided with location hole (3), and the middle part is provided with horizontal bar (2), and the many pack supports of LED platoon (4) of skeleton (1) are set at interval, and it is characterized in that: the top of every pack support (4) is provided with functional area (21); Boss (9,10,11) is set, welding stage (5,6,7,8) in the functional area (21); The bottom of each support (21) is provided with pin (12,13,14,15); The middle part of each pin (12,13,14,15) is connected by horizontal bar (2), and the middle part is provided with stuck point (16); Led chip (17,18,19) is set respectively on each boss.
2. the effective down-lead bracket of production light-emitting diodes as claimed in claim 1 is characterized in that: boss (9), (10), (11) exceed welding stage (5,6,7,8) plane 0.1-1mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011205756318U CN202487665U (en) | 2011-12-31 | 2011-12-31 | Lead frame for producing light-emitting diode |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011205756318U CN202487665U (en) | 2011-12-31 | 2011-12-31 | Lead frame for producing light-emitting diode |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202487665U true CN202487665U (en) | 2012-10-10 |
Family
ID=46962060
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011205756318U Expired - Fee Related CN202487665U (en) | 2011-12-31 | 2011-12-31 | Lead frame for producing light-emitting diode |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202487665U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103700757A (en) * | 2013-12-02 | 2014-04-02 | 深圳市蓝科电子有限公司 | Surface-mounted LED (light-emitting diode) lead frame and manufacturing method thereof |
| CN107275274A (en) * | 2017-07-27 | 2017-10-20 | 重庆平伟实业股份有限公司 | Diode automatic feed mechanism |
-
2011
- 2011-12-31 CN CN2011205756318U patent/CN202487665U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103700757A (en) * | 2013-12-02 | 2014-04-02 | 深圳市蓝科电子有限公司 | Surface-mounted LED (light-emitting diode) lead frame and manufacturing method thereof |
| CN107275274A (en) * | 2017-07-27 | 2017-10-20 | 重庆平伟实业股份有限公司 | Diode automatic feed mechanism |
| CN107275274B (en) * | 2017-07-27 | 2023-06-27 | 重庆平伟实业股份有限公司 | Diode automatic feeding mechanism |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20121010 Termination date: 20151231 |
|
| EXPY | Termination of patent right or utility model |