CN203617339U - LED liquid silica gel packaging forming machine - Google Patents
LED liquid silica gel packaging forming machine Download PDFInfo
- Publication number
- CN203617339U CN203617339U CN201320863879.3U CN201320863879U CN203617339U CN 203617339 U CN203617339 U CN 203617339U CN 201320863879 U CN201320863879 U CN 201320863879U CN 203617339 U CN203617339 U CN 203617339U
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- pressing plate
- temperature heating
- silica gel
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Abstract
The utility model discloses an LED liquid silica gel packaging forming machine. The LED liquid silica gel packaging forming machine comprises a container, a glue injection needle, a pressing plates, air cylinders, a forming mold plate, a constant-temperature heating plate, a heating tube, a heat insulation plate and a base; the heat insulation plate is arranged on the base, the constant-temperature heating plate is arranged on the heat insulation plate, the heating tube is arranged in the constant-temperature heating plate, the forming mold plate is placed o the constant-temperature heating plate, the pressing plate is placed on the forming mold plate, and the air cylinders are connected with the pressing plate; and inner grooves are distributed in the forming mold plate, an LED substrate is placed between the pressing plate and the forming mold plate, the pressing plate is provided with two through holes corresponding to each inner groove, and a drilling head is arranged in each through hole by means of moving of a slide groove. The LED liquid silica gel packaging forming machine provided by the utility model is simple and reasonable in working procedure and can effectively improve product quality and production efficiency.
Description
Technical field
The utility model relates to a kind of LED packaging machine, relates in particular to a kind of LED liquid-state silicon gel encapsulated moulding machine.
Background technology
The encapsulation of substrate mode for existing LED, conventionally adopt on LED substrate the object that reaches liquid-state silicon gel encapsulated moulding by box dam, stickup dam frame and the method for digging groove, these techniques are all comparatively cumbersome, and (injecting glue---quiet release flat fluorescent glue 0.5 hour---is roasting solidifying 1.5 hours just, quiet put and just in roasting process also uncured fluorescent glue start to precipitate and affect the consistency of colour temperature), on LED substrate box dam, paste dam frame and dig the method for packing manufacturing cost of groove high, production efficiency is low, packaging plastic amount is inhomogeneous, and product quality is also difficult to control.
Summary of the invention
For the problems referred to above, the utility model provides a kind of LED liquid-state silicon gel encapsulated moulding machine, can effectively reduce cost, overcomes glue amount inequality, fluorescence silica gel curing time short (3-60 second) can prevent fluorescent glue precipitation to reach the consistency of colour temperature, improves quality and production efficiency.
The utility model for the technical scheme that its technical problem of solution adopts is:
A kind of LED liquid-state silicon gel encapsulated moulding machine, comprising: container and injecting glue pin, pressing plate, cylinder, forming panel, constant temperature heating plate, heating tube, thermal insulation board, base; On described base, thermal insulation board is set, on described thermal insulation board, constant temperature heating plate is set, in this constant temperature heating plate, heating tube is set, on this constant temperature heating plate, be placed to section mould plate, on described forming panel, place pressing plate, described cylinder connects pressing plate; The inner groovy that distributes on described forming panel, places LED substrate between described pressing plate and forming panel, the position of the corresponding each inner groovy of described pressing plate has two through holes, in this through hole, by chute activity, drill head is set.Described drill head be shaped as funnel-form.
Inner groovy on described forming panel is that taper plays the easy demoulding.
The using method step of described a kind of LED liquid-state silicon gel encapsulated moulding machine is:
1, prepare container and injecting glue pin, fluorescence silica gel is stored in container;
2, open pressing plate, LED substrate is placed on forming panel;
3, pressing plate after depressing puts down drill head, holes, and makes to form into glue groove and plastic emitting groove on LED substrate;
4, injecting glue pin injects fluorescence silica gel to enter glue groove on LED substrate, and fluorescence silica gel enters the inner groovy in forming panel along entering glue concentrated flow, and when fluorescence silica gel is covered with after inner groovy, the plastic emitting concentrated flow from LED substrate goes out, and stops injecting glue;
5, switch on power for constant temperature heating plate heating, fluorescence silica gel quick (3-60 second) is solidified;
6, cylinder action, opens pressing plate, takes out in mould the LED substrate of encapsulated moulding;
In described step 3, in the time of matched moulds, the pressure that pressing plate presses LED substrate is 2-6Kg.
LED liquid-state silicon gel packaging machine provided by the utility model, the encapsulation of LED substrate is compared and had following advantage with respect to traditional LED encapsulation technology:
1, operation advantages of simple, production cost is low, and efficiency is high; With traditional handicraft comparison, save on substrate the object that reaches liquid-state silicon gel encapsulated moulding by box dam, the method for pasting dam frame and digging groove, these techniques are all comparatively cumbersome, and (injecting glue---quiet release flat fluorescent glue 0.5 hour---is roasting solidifying 1.5 hours just, quiet put and just in roasting process fluorescent glue start precipitation and affect the consistency of colour temperature)
2, adopt the automatic injecting glue of manipulator, speed is fast, and glue amount is consistent, guarantees package quality;
3, adopt high temperature 120-180 degree isothermal curings, the time is short.Common encapsulation generally needs just can complete for 3-6 hour, and this packaged type only needs used time 3-60 second.
Accompanying drawing explanation
Fig. 1 is the structural representation that the utility model is implemented;
Fig. 2 is the utility model embodiment LED board structure front view;
Fig. 3 is the utility model embodiment LED board structure end view;
In figure: 1, container; 2, injecting glue pin 3, pressing plate; 301, drill head; 4, LED substrate; 401, enter glue groove; 402, plastic emitting groove; 5, forming panel; 501, inner groovy; 6, constant temperature heating plate; 7, cylinder; 8, thermal insulation board; 9, base; 10, heating tube.
Embodiment
Below in conjunction with the drawings and specific embodiments, the utility model is described in further detail:
As Figure 1-3, a kind of LED liquid-state silicon gel encapsulated moulding machine, comprising: container 1 and injecting glue pin 2, pressing plate 3, cylinder 7, forming panel 5, constant temperature heating plate 6, heating tube 10, thermal insulation board 8, base 9; On described base 9, thermal insulation board 8 is set, on described thermal insulation board 8, heating tube 10 is set, on this heating tube 10, constant temperature heating plate 6 is set, on this constant temperature heating plate 6, be placed to section mould plate 5, on described forming panel 5, place pressing plate 3, described cylinder 7 connects pressing plate 3; 5 inner groovies 501 that distribute on described forming panel 5, place LED substrate 4 between described pressing plate 3 and forming panel 5, described pressing plate. and the position of corresponding each inner groovy 501 has two through holes, in this through hole, by chute activity, drill head 301 is set.Described drill head 301 be shaped as funnel-form.
After LED substrate 4 being holed by drill head 301, the position that described LED substrate 4 is corresponding with each inner groovy 501 forms into glue groove 401 and plastic emitting groove 402.The glue groove 401 of entering on described LED substrate 4 is similarly funnel-form with plastic emitting groove 402, and described plastic emitting groove 402 not only can plastic emitting, plays exhaust simultaneously.
describeda kind of LED liquid-state silicon gel encapsulated moulding machine flow process is: 1, prepare container 1 and injecting glue pin 2, fluorescence silica gel is stored in container 1;
2, open pressing plate 3, LED substrate 4 is placed on forming panel 5;
3, pressing plate 3 after depressing puts down drill head 301, holes, and makes to form into glue groove 401 and plastic emitting groove 402 on LED substrate 4;
What 4, fluorescence silica gel was injected LED substrate 4 by injecting glue pin 2 enters glue groove 401, and fluorescence silica gel flows into the inner groovy 501 in forming panel 5 along entering glue groove 401, and when fluorescence silica gel is covered with after inner groovy 501, the plastic emitting groove 402 from LED substrate 4 flows out, and stops injecting glue;
5, switch on power for constant temperature heating plate 6 heats, fluorescence silica gel is solidified;
6, cylinder 7 moves, and pressing plate 3 is opened, and takes out in mould the LED substrate 4 of encapsulated moulding.
Claims (3)
1. a LED liquid-state silicon gel encapsulated moulding machine, comprising: container and injecting glue pin, pressing plate, cylinder, forming panel, constant temperature heating plate, heating tube, thermal insulation board, base; On described base, thermal insulation board is set, on described thermal insulation board, constant temperature heating plate is set, in this constant temperature heating plate, heating tube is set, on this constant temperature heating plate, be placed to section mould plate, on described forming panel, place pressing plate, described cylinder connects pressing plate; It is characterized in that: the inner groovy that distributes on described forming panel, between described pressing plate and forming panel, place LED substrate, the position of the corresponding each inner groovy of described pressing plate has two through holes, in this through hole, by chute activity, drill head is set.
2. LED liquid-state silicon gel encapsulated moulding machine according to claim 1, is characterized in that: described drill head be shaped as funnel-form.
3. LED liquid-state silicon gel encapsulated moulding machine according to claim 1, is characterized in that: the inner groovy on described forming panel is taper.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320863879.3U CN203617339U (en) | 2013-12-26 | 2013-12-26 | LED liquid silica gel packaging forming machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320863879.3U CN203617339U (en) | 2013-12-26 | 2013-12-26 | LED liquid silica gel packaging forming machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203617339U true CN203617339U (en) | 2014-05-28 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320863879.3U Expired - Fee Related CN203617339U (en) | 2013-12-26 | 2013-12-26 | LED liquid silica gel packaging forming machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203617339U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105134505A (en) * | 2015-07-03 | 2015-12-09 | 上海长知实业有限公司 | Glue injection template and method for blade |
| CN110718617A (en) * | 2019-10-08 | 2020-01-21 | 郑州森源新能源科技有限公司 | LED fluorescent glue rapid shaping method and LED packaging method |
-
2013
- 2013-12-26 CN CN201320863879.3U patent/CN203617339U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105134505A (en) * | 2015-07-03 | 2015-12-09 | 上海长知实业有限公司 | Glue injection template and method for blade |
| CN110718617A (en) * | 2019-10-08 | 2020-01-21 | 郑州森源新能源科技有限公司 | LED fluorescent glue rapid shaping method and LED packaging method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140528 Termination date: 20141226 |
|
| EXPY | Termination of patent right or utility model |