CN105895786A - LED liquid silicone mold ejecting machine and technological process thereof - Google Patents
LED liquid silicone mold ejecting machine and technological process thereof Download PDFInfo
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- CN105895786A CN105895786A CN201610361016.4A CN201610361016A CN105895786A CN 105895786 A CN105895786 A CN 105895786A CN 201610361016 A CN201610361016 A CN 201610361016A CN 105895786 A CN105895786 A CN 105895786A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
Abstract
The invention discloses an LED liquid silicone mold ejecting machine and a technological process thereof. The LED liquid silicone mold ejecting machine comprises a hydraulic system, a circuit control system, a glue injection system and a mold molding and solidifying system, wherein the hydraulic system comprises a glue extracting/injecting oil cylinder, a glue extracting/injecting oil cylinder fixing plate, a glue injection container fixing plate, an air supply air pipe, a glue storage container cover, a glue extracting/injecting oil cylinder rod, a glue storage container, a glue injecting head main body, a glue injection head inlet joint, a valve core, a first fixing plate, a rotary air cylinder, a glue injection system fixing plate, an extracting/injecting rod seal ring pressure plate, a glue extracting/injecting oil cylinder rod seal ring, a valve core seal ring, a glug injection head outlet joint, a glue guide tube, a valve core positioning plate and a rotary air cylinder transmission shaft. By the LED liquid silicone mold ejecting machine, automatic high-pressure glue extraction and glue injection are achieved; the speed is high; various inner grooves of a mold are consistent in glue amount; and the encapsulating quality is ensured.
Description
Technical field
The present invention relates to a kind of LED packaging machine, particularly relate to a kind of LED liquid-state silicon rubber moulding top machine and technological process thereof.
Background technology
The encapsulation of existing LED substrate (substrate includes ceramic substrate) mode, it is typically employed in LED-baseplate with box dam, paste dam frame, dig groove and direct method for dispensing glue to reach the purpose of liquid-state silicon gel encapsulation, these techniques are the most cumbersome, and (injecting glue-quiet is released flat fluorescent glue 0.5 hour, the most roasting solidification 80-120 degree/1.5 hour, quiet put and be just roasting during the most uncured fluorescent glue start to precipitate and affect the concordance of colour temperature), with box dam in LED-baseplate, paste dam frame, dig direct method manufacturing cost for dispensing glue on groove and wafer high, directly some micelle colloid concordance is difficult to control to, packaging plastic amount is uneven, product quality is also difficult to ensure that.
Summary of the invention
For the problems referred to above, the invention provides one can automated job LED liquid-state silicon gel Encapsulation Moulds top machine and technological process thereof, cost can be effectively reduced, overcome the situation that efficiency is low and glue amount is uneven that craft and conventional point glue machine operation produce, fluorescent glue precipitation can be prevented to reach the concordance of colour temperature with silica gel and fluorescence silica gel package curing time short (3-60 second), improve quality and production efficiency.
The present invention solves that its technical problem be the technical scheme is that
A kind of LED liquid-state silicon gel Encapsulation Moulds top machine and technological process thereof, including: hydraulic system, circuit control system, injection system, mould molding cure system；
Described hydraulic system: to pressing plate (pressure plate cylinder) provide stable pressure compaction LED-baseplate and to taking out glue, injecting glue (take out, injecting glue oil cylinder) provides the stable pulling force taking out glue and the pressure of injecting glue；
Described circuit control system: PLC program control circuit and heated at constant temperature function；
Described injection system: the glue in storage glue container is taken out glue by 180 degree of rotary cylinder drive valve core switchings, the glue flow direction (title glue injecting head) of injecting glue, when taking out glue, valve core rests on and takes out glue position and (take out, injecting glue oil cylinder) bar pulls up the air pressure simultaneously added in a small amount to storage glue container (makes to take out glue unimpeded, the generation of bubble can be reduced) reach to take out the purpose of glue, in during injecting glue, adhesive pouring nozzle enters mould glue-feeder, valve core rests on injecting glue position and (takes out, injecting glue oil cylinder) bar is pressed downward against, glue is injected in mould from mould glue-feeder by adhesive pouring nozzle by leading sebific duct entrance choke valve from gum exudation mouth again；Now adhesive pouring nozzle is in mould glue-feeder, treats that pre-cure time terminates backed off after random mould glue-feeder, complete to take out glue action simultaneously after having noted glue；
Described valve core is as a stop for distal ends part, it is desirable to have, rotating part, fixed part, peristome, portion of remaining silent；Described rotating part can control whole valve core and rotate, it is therefore an objective to control peristome, remain silent portion different time towards or position；Described fixed part is for being fixed by valve core, prevents valve core moving up and down in addition to rotating；Described peristome is to receive the glue that glue-feeder flows to, and provides a memory space for glue；Described portion of remaining silent is relative with peristome, it is therefore an objective to cut-off glue flowing.
Glue is entered peristome by glue-feeder, and owing to glue-feeder capacity is fixed, therefore, during peristome full capacity, selection portion rotates, and peristome selects to other end, and glue-feeder is then blocked in portion of remaining silent, and glue is flowed out to next process procedure by peristome.
The structure of described valve core may is that cylindric, is selection portion at this cylindrical lower part, and middle part is fixed part, and the side on top is peristome, and opposite side is the portion of remaining silent, and the rotation of described valve core is to rotate along its axle center.
The structure of described valve core is it may also is that spherical, described spherical center has through hole, it is secured across this through hole by a rotary shaft fixing to be connected with spherical, at spherical top or mono-fixing groove of bottom Ke Kai, ball position is fixed by a fixture, can not also open, its position is fixed by upper bottom plate, upper surface or lower surface fluting at spheroid, form a space accommodating glue, i.e. peristome, peristome correspondence glue-feeder, when rotary shaft rotates, peristome correspondence plastic emitting opening, then peristome portion of remaining silent behind then corresponding glue-feeder, complete the input and output of a glue.
Described mould molding cure system: by thermal insulation board fixed plate, pressing plate fixed plate, pressure plate cylinder fixed plate；, mould, pressing plate (making of the low material of heat conductivity), constant temperature heating plate, add heat pipe, thermal insulation board composition, thermal insulation board is fixed in thermal insulation board fixed plate, on described thermal insulation board, constant temperature heating plate is set, arrange in this constant temperature heating plate and add heat pipe, this mould is fixed on constant temperature heating plate, and described pressing plate is arranged on the side in movable pressing board fixed plate, and cylinder rod is connected to the opposite side in movable pressing board fixed plate；Distribution inner groovy in described mould, LED-baseplate is placed between pressing plate and mould, glue runner gap (0.10 0.20mm) and inner groovy are set between LED-baseplate and mould, it is respectively provided with into glue sprue groove and air discharge duct in mould glue-feeder, glue runner position, glue is injected in mould from the lower section glue-feeder of mould side by adhesive pouring nozzle from glue injecting head, then is then exhausted from appropriate glue above mould opposite side after air discharge duct air-out；
The technological process of the present invention comprises the following steps:
1, open machine power, source of the gas, hydraulic pressure, PLC control switch, automatically control each holding function, are stored in the container on glue injecting head by the glue after mixing vacuum defoamation；
2, LED-baseplate is placed on mould；
3, job key is pressed, pressing plate advances toward mould direction, compress LED-baseplate, start injecting glue-precuring (during now injecting glue pin rests on mould glue-feeder, precuring terminates rear adhesive pouring nozzle and exits glue-feeder, prevent glue because of uncured and from glue-feeder flows out mould mould)；
4, glue is injected into flow path groove by adhesive pouring nozzle from mould glue-feeder, by being provided with glue runner gap (0.10 0.20mm) between LED-baseplate and mould, glue flows into the inner groovy in mould along glue runner gap, after glue fills mould inner groovy, glue, after air discharge duct flows out slightly, can be automatically stopped injecting glue；
5, mould heated at constant temperature 120 180 degree, make glue quickly (3-60 second) solidification；
6, after having solidified, treat that LED-baseplate pressing plate is opened, with feeding plate, the LED-baseplate of mould top package forming is taken out in mould；
In described step 3 when matched moulds, LED-baseplate pressing plate is pressing the pressure adjustable hydraulic system pressure of LED-baseplate.
The invention has the beneficial effects as follows: the LED of invention directly uses the mode of mould injecting glue to be packaged quickly (3-60 second) curing mold top package molding, and it has several advantages that compared with traditional LED encapsulation technology
1, operation advantages of simple, production cost is low, and efficiency is high, and quality is secure；Compare with traditional handicraft, save on substrate with box dam, paste dam frame and dig groove, plane method for dispensing glue reach liquid-state silicon gel encapsulation purpose, these techniques are the most cumbersome, quiet flat fluorescent glue roasting solidification 80 120 degree/1.5 hours at the beginning of 0.5 hour of releasing after injecting glue, quiet put and be just roasting during fluorescent glue start to precipitate and affect the concordance of colour temperature.
2, using automatic high pressure to take out glue, injecting glue, speed is fast, and each inner groovy glue amount of mould is consistent, it is ensured that package quality；
3, using 120 180 degree of isothermal curings of temperature, the time is short.Commonly encapsulate it is generally required to 150 degree/3-6 hour just can complete, and this packaged type only needs second used time 3-60.
Accompanying drawing explanation
Fig. 1 is embodiment of the present invention system structure block diagram；
Fig. 2 is the PLC control program process chart of the embodiment of the present invention；
Fig. 3 is embodiment of the present invention system in combination block diagram；
Fig. 4 is embodiment of the present invention injection system combiner schematic diagram；
Fig. 5 is embodiment of the present invention glue injecting head principle components structural representation；
Fig. 6 is embodiment of the present invention moulding operation combiner enlarged diagram；
Fig. 7 is embodiment of the present invention LED-baseplate, mould, enters collagen reason, feeding smelting lamps structure enlarged diagram；
Fig. 8 is embodiment of the present invention adhesive pouring nozzle, adhesive pouring nozzle framework, adhesive pouring nozzle and the structural representation of mould；
Fig. 9 is embodiment of the present invention adhesive pouring nozzle and mould enlarged diagram；
Figure 10 is embodiment of the present invention adhesive pouring nozzle and mould structure generalized section；
Figure 11 is the structural representation of the valve core of the embodiment of the present invention.
In figure: 1, injection system；2, thermal insulation board fixed plate；3, mould molding cure system；4, pressing plate fixed plate；5, pressure plate cylinder fixed plate；6, pressing plate；7, pressure plate cylinder bar and the union joint of pressing plate fixed plate；8, pressure plate cylinder bar；9, pressure plate cylinder；10, the movable guide pillar of pressing plate fixed plate；11, framework fixed plate；12, pressing plate fixed plate union joint and the buffer board of pressing plate fixed plate；13, hydraulic system；14, circuit control system；15, adhesive pouring nozzle slip framework；16, adhesive pouring nozzle；17, slide rail；18, adhesive pouring nozzle advance and retreat cylinder；19, choke valve gas joint；20, choke valve；21, choke valve enters cemented joint；22, mould glue-feeder；23, mould hose lining runner；24, aerofluxus, last person's glue groove；101, take out, injecting glue oil cylinder；102, take out, injecting glue oil cylinder fixed plate；103, storage glue container fixed plate；Add the trachea of air pressure in a small amount 104, to storage glue container；105, storage glue container cover；106, take out, injecting glue cylinder rod;107, storage glue container；108, glue injecting head main body；109, glue injecting head enters cemented joint；110, valve core；111, glue injecting head main body and the fixed plate of 180 degree of rotary cylinders；112,180 degree of rotary cylinders；113, injection system fixed plate；114, take out, injecting glue cylinder rod O-ring seal pressing plate；115, take out, injecting glue cylinder rod O-ring seal；116, valve core O-ring seal；
117, glue injecting head goes out cemented joint；118, sebific duct is led；119, valve core locating clamp plate；120,180 degree of rotary cylinder power transmission shafts；301, constant temperature heating plate；302, smelting tool；303, LED-baseplate, mould, enter glue, feeding smelting lamps structure enlarged diagram；304, LED-baseplate；305, mould；306, heated at constant temperature pipe；307, thermal insulation board；30301, LED-baseplate positioning needle；30302, the glue runner gap (0.10 0.20mm) between LED-baseplate and mould；30303, mould inner groovy.
Detailed description of the invention
Below in conjunction with the accompanying drawings technical scheme is described further.
As it is shown on figure 3, a kind of LED liquid-state silicon gel Encapsulation Moulds top machine, including: hydraulic system 13, circuit control system 14, injection system 1, mould molding cure system 3；
Described circuit control system 14, hydraulic system are fixed in a frame, described upper rack fixing architecture fixed plate 11, fixation clip oil cylinder fixed plate 5 vertical in described framework fixed plate 11 and thermal insulation board fixed plate 2, movable guide pillar 10 level of pressing plate fixed plate through oil cylinder fixed plate 5 and thermal insulation board fixed plate 2；Described mould molding cure system 3 is fixed in thermal insulation board fixed plate 2.
As shown in Figure 4, described injection system 1 includes: take out/injecting glue oil cylinder, take out/injecting glue oil cylinder fixed plate, injecting glue container fixed plate, to gas trachea 104, storage glue container cover 105, take out/injecting glue cylinder rod 106, storage glue container 107, glue injecting head main body 108, glue injecting head enters cemented joint 109, valve core 110, first fixed plate 111, rotary cylinder 112, injection system fixed plate 113, take out/note rod seal cushion rubber pressing plate 114, take out/injecting glue cylinder rod O-ring seal 115, valve core O-ring seal 116, glue injecting head goes out cemented joint 117, lead sebific duct 118, valve core location-plate 119, rotary cylinder power transmission shaft 120.
Described first fixed plate 111 fixes glue injecting head main body 108 and rotary cylinder 112 simultaneously.
Described injection system fixed plate 113 is positioned at injection system 1 foot, is provided above a rotary cylinder 112, and described rotary cylinder 112 is defaulted as the rotary cylinder of 180 °, i.e. this cylinder action once, and rotary shaft rotates 180 °.It is arranged above the first fixed plate 111 at rotary cylinder 112, rotary cylinder power transmission shaft 120 is inserted in bottom in first fixed plate 111, described rotating drive shaft connects lower part and is positioned at the valve core 110 of the first fixed plate 111, makes valve core 110 carry out the rotation of each 180 ° with rotary cylinder 112.
Such as Fig. 5, shown in 11, glue injecting head main body 108 is to be pressed in the first fixed plate 111, between glue injecting head main body 108 and the first fixed plate 111, also there is valve core locating clamp plate 119, described valve core locating clamp plate 119 snaps in the middle part of valve core 110, in the middle part of described valve core 110, indent is interior hollow toroid, after valve core locating clamp plate 119 snaps in, described valve core 110 can only carry out rotating in place motion, without being taken out/and injecting glue oil cylinder 101 is with moving up and down.
A groove is opened from the center of circle to edge in described valve core 110 top, when valve core 110 is positioned at A condition, glue injecting head enters cemented joint 109 forward notch for valve core, it is connected state with notch, be positioned at the glue injecting head at the notch back side going out cemented joint 117 is then off-state with notch, therefore glue enters glue injecting head main body 108 in storage glue container 107, then enters stopping in notch from glue injecting head main body 108.
Rotary cylinder 112 carries out 180 ° of rotations, rotary cylinder power transmission shaft 120 rotates the most accordingly, the valve core 110 being connected with rotary cylinder power transmission shaft 120 is also carried out 180 ° of rotations, now, notch goes out cemented joint 117 and connects with glue injecting head, and the glue in notch goes out cemented joint 117 from glue injecting head and exits into and lead sebific duct 118.
The right side of described glue injecting head main body connects storage glue container 107, by storage glue container supply glue.Described top then fixed oil cylinder assembly, described cylinder component moves up and down, and glue is pressed into catheter 118.
As shown in figs. 1 and 6, mould molding cure system includes: pressure plate cylinder fixed plate, pressure plate cylinder, pressure plate cylinder bar, the movable guide pillar of pressing plate fixed plate, pressing plate, thermal insulation board fixed plate, mould molding assembly；
Described pressure plate cylinder fixed plate 5 fixation clip oil cylinder 9, pressure plate cylinder bar 8 in described pressure plate cylinder 9 connects the center of pressing plate fixed plate 4, the both sides of described pressing plate fixed plate then embed in the movable guide pillar of pressing plate fixed plate, therefore, pressing plate fixed plate 8 is under the effect of pressure plate cylinder 9, and the movable guide pillar 10 along pressing plate fixed plate carries out bilateral reciprocation.
Described pressing plate 6 is right against mould molding assembly, and described mould molding assembly includes: constant temperature heating plate 301, tool 302, LED-baseplate 304, mould 305, heated at constant temperature pipe 306, thermal insulation board 307；Described thermal insulation board fixed plate 2 is fixing connects thermal insulation board 307, described thermal insulation board 307 is fixing connects constant temperature heating plate 301, there is in constant temperature heating plate 301 heated at constant temperature pipe 306, mould 305 is fixed on described constant temperature heating plate 301, LED-baseplate 304 is fixed on described mould 305, described tool 302 is to be movably arranged between mould 305 and LED-baseplate 304, it is therefore an objective to tilt the LED-baseplate 304 of molding.
As it is shown in fig. 7, there is a fixed gap between described mould and LED-baseplate, i.e. glue runner gap 30302 between LED-baseplate and mould, mould is the hemispherical of continuously arranged indent, and mould inner groovy 30303 therein is also with regard to the shape of LED grain.Having LED-baseplate positioning needle 30301 on described mould, LED-baseplate has hole, location accordingly, conveniently positions between the two.
As shown in Figure 8,9, 10, the A--A view of mould molding cure system, it can be seen that described mould molding cure system also has: adhesive pouring nozzle slip framework 15, adhesive pouring nozzle 16, slide rail 17, adhesive pouring nozzle advance and retreat cylinder 18, choke valve gas joint, choke valve 20, choke valve enter cemented joint 21；Described choke valve enters cemented joint 21 one end and is fixed on choke valve 20, and the other end connects leads sebific duct 118, is injected in mould 305 from adhesive pouring nozzle by the glue led in sebific duct 118.
Described adhesive pouring nozzle slip framework 15 is fixed in thermal insulation board fixed plate, purpose is that cylinder 18 of being retreated by adhesive pouring nozzle is fixed, adhesive pouring nozzle advance and retreat cylinder 18 connects choke valve 20, choke valve 20 carries out the reciprocating motion of left and right along slide rail 17, transport in the glue press-in adhesive pouring nozzle 16 come by leading sebific duct 118, glue enters mould glue-feeder 22 from adhesive pouring nozzle 16, enters back into mould hose lining runner 23, until glue is paved with whole mould.
Described mould outward flange also has aerofluxus, last person's glue groove 24.
Described hydraulic system, mould molding cure system are fixed in framework fixed plate 11, have support, described circuit control system 14 and hydraulic system 13 fixing on the bracket below described framework fixed plate 11.
Technology provided by the present invention also has the shell of a covering all component, and described shell has control button, controls the motion of whole system.
The technological process of the present invention is described in detail in detail below according to Fig. 1-2, comprises the following steps:
1, open machine power, source of the gas, hydraulic pressure, PLC control switch, automatically control each holding function, are stored in the container on glue injecting head by the glue after mixing vacuum defoamation；
2, LED-baseplate is placed on mould；
3, job key is pressed, pressing plate advances toward mould direction, compress LED-baseplate, start injecting glue-precuring (during now injecting glue pin rests on mould glue-feeder, precuring terminates rear adhesive pouring nozzle and exits glue-feeder, prevent glue because of uncured and from glue-feeder flows out mould mould)；
4, glue is injected into flow path groove by adhesive pouring nozzle from mould glue-feeder, by being provided with glue runner gap (0.10 0.20mm) between LED-baseplate and mould, glue flows into the inner groovy in mould along glue runner gap, after glue fills mould inner groovy, glue, after air discharge duct flows out slightly, can be automatically stopped injecting glue；
5, mould heated at constant temperature 120 180 degree, make glue quickly (3-60 second) solidification；
6, after having solidified, treat that LED-baseplate pressing plate is opened, with feeding plate, the LED-baseplate of mould top package forming is taken out in mould；
In described step 3 when matched moulds, LED-baseplate pressing plate is pressing the pressure adjustable hydraulic system pressure of LED-baseplate.
Claims (8)
1. a LED liquid-state silicon gel Encapsulation Moulds top machine, including: hydraulic system, circuit control system, injection system, mould molding cure system；It is characterized in that: described hydraulic system includes: take out/injecting glue oil cylinder, take out/injecting glue oil cylinder fixed plate, injecting glue container fixed plate, to gas trachea (104), storage glue container cover (105), take out/injecting glue cylinder rod (106), storage glue container (107), glue injecting head main body (108), glue injecting head enters cemented joint (109), valve core (110), first fixed plate (111), rotary cylinder (112), injection system fixed plate (113), take out/note rod seal cushion rubber pressing plate (114), take out/injecting glue cylinder rod O-ring seal (115), valve core O-ring seal (116), glue injecting head goes out cemented joint (117), lead sebific duct (118), valve core location-plate (119), rotary cylinder power transmission shaft (120);
Described first fixed plate (111) fixes glue injecting head main body (108) and rotary cylinder (112) simultaneously;Described injection system fixed plate (113) is positioned at injection system (1) foot, it is provided above a rotary cylinder (112), described rotary cylinder (112) is defaulted as the rotary cylinder of 180 °, i.e. this cylinder action is once, rotary shaft rotates 180 °, it is arranged above the first fixed plate (111) at rotary cylinder (112), rotary cylinder power transmission shaft (120) is inserted in bottom in first fixed plate (111), described rotating drive shaft connects lower part and is positioned at the valve core (110) of the first fixed plate (111), valve core (110) is made to carry out every time the rotation of (180) ° with rotary cylinder (112).
LED liquid-state silicon gel Encapsulation Moulds top the most according to claim 1 machine, it is characterized in that: described glue injecting head main body (108) is to be pressed in the first fixed plate (111), also there is between glue injecting head main body (108) and the first fixed plate (111) valve core locating clamp plate (119), described valve core locating clamp plate (119) snaps in the middle part of valve core (110), described valve core (110) middle part indent is interior hollow toroid, after valve core locating clamp plate (119) snaps in, described valve core (110) can only carry out rotating in place motion, without being taken out/injecting glue oil cylinder (101) is with moving up and down.
LED liquid-state silicon gel Encapsulation Moulds top the most according to claim 1 machine, it is characterised in that: mould molding cure system includes: pressure plate cylinder fixed plate, pressure plate cylinder, pressure plate cylinder bar, the movable guide pillar of pressing plate fixed plate, pressing plate, thermal insulation board fixed plate, mould molding assembly；
Described pressure plate cylinder fixed plate (5) fixation clip oil cylinder (9), pressure plate cylinder bar (8) in described pressure plate cylinder (9) connects the center of pressing plate fixed plate (4), the both sides of described pressing plate fixed plate then embed in the movable guide pillar of pressing plate fixed plate, therefore, pressing plate fixed plate (8) is under the effect of pressure plate cylinder (9), and the movable guide pillar (10) along pressing plate fixed plate carries out bilateral reciprocation.
LED liquid-state silicon gel Encapsulation Moulds top the most according to claim 3 machine, it is characterised in that: described mould molding assembly includes: constant temperature heating plate (301), tool (302), LED-baseplate (304), mould (305), heated at constant temperature pipe (306), thermal insulation board (307)；Described thermal insulation board fixed plate (2) is fixing connects thermal insulation board (307), described thermal insulation board (307) is fixing connects constant temperature heating plate (301), there is in constant temperature heating plate (301) heated at constant temperature pipe (306), the upper fixing mould (305) of described constant temperature heating plate (301), the upper fixing LED-baseplate (304) of described mould (305), described tool (302) is to be movably arranged between mould (305) and LED-baseplate (304), it is therefore an objective to tilt the LED-baseplate (304) of molding.
LED liquid-state silicon gel Encapsulation Moulds top the most according to claim 3 machine, it is characterised in that: described mould molding cure system also has: adhesive pouring nozzle slip framework (15), adhesive pouring nozzle (16), slide rail (17), adhesive pouring nozzle advance and retreat cylinder (18), choke valve gas joint, choke valve (20), choke valve enter cemented joint (21)；Described choke valve enters cemented joint (21) one end and is fixed on choke valve (20), and the other end connects leads sebific duct (118), is injected in mould (305) from adhesive pouring nozzle by the glue led in sebific duct (118).
LED liquid-state silicon gel Encapsulation Moulds top the most according to claim 1 machine, it is characterized in that, described hydraulic system, mould molding cure system are fixed in framework fixed plate (11), described framework fixed plate (11) lower section has support, described circuit control system (14) and hydraulic system (13) are fixing on the bracket, also there is the shell of a covering all component, described shell has control button, control the motion of whole system.
The technological process of 7.LED liquid-state silicon gel Encapsulation Moulds top machine, it is characterised in that comprise the following steps:
1, open machine power, source of the gas, hydraulic pressure, PLC control switch, automatically control each holding function, are stored in the container on glue injecting head by the glue after mixing vacuum defoamation；
2, LED-baseplate is placed on mould；
3, job key is pressed, pressing plate advances toward mould direction, compress LED-baseplate, start injecting glue-precuring (during now injecting glue pin rests on mould glue-feeder, precuring terminates rear adhesive pouring nozzle and exits glue-feeder, prevent glue because of uncured and from glue-feeder flows out mould mould)；
4, glue is injected into flow path groove by adhesive pouring nozzle from mould glue-feeder, by being provided with glue runner gap (0.10 0.20mm) between LED-baseplate and mould, glue flows into the inner groovy in mould along glue runner gap, after glue fills mould inner groovy, glue, after air discharge duct flows out slightly, can be automatically stopped injecting glue；
5, mould heated at constant temperature 120 180 degree, make glue quickly (3-60 second) solidification；
6, after having solidified, treat that LED-baseplate pressing plate is opened, with feeding plate, the LED-baseplate of mould top package forming is taken out in mould.
The technological process of LED liquid-state silicon gel Encapsulation Moulds top the most according to claim 7 machine, it is characterised in that in described step 3 when matched moulds, LED-baseplate pressing plate is pressing the pressure adjustable hydraulic system pressure of LED-baseplate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610361016.4A CN105895786A (en) | 2016-05-29 | 2016-05-29 | LED liquid silicone mold ejecting machine and technological process thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610361016.4A CN105895786A (en) | 2016-05-29 | 2016-05-29 | LED liquid silicone mold ejecting machine and technological process thereof |
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| CN105895786A true CN105895786A (en) | 2016-08-24 |
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| CN201610361016.4A Pending CN105895786A (en) | 2016-05-29 | 2016-05-29 | LED liquid silicone mold ejecting machine and technological process thereof |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109256448A (en) * | 2018-08-07 | 2019-01-22 | 广州市巨宏光电有限公司 | A kind of LED light moulding process |
| CN112622131A (en) * | 2020-12-29 | 2021-04-09 | 杨钥 | Hook-pressing type epoxy adhesive bubble removing device |
| CN112870467A (en) * | 2021-01-13 | 2021-06-01 | 沈阳精渡金属科技有限公司 | Negative pressure centrifugal glue injection encapsulation process and device |
| CN112895532A (en) * | 2021-02-03 | 2021-06-04 | 宜易电子(上海)有限公司 | Production process of LED silica gel lens |
| US11318642B2 (en) | 2019-12-20 | 2022-05-03 | Eaton Intelligent Power Limited | Permeable wall encapsulation mold |
-
2016
- 2016-05-29 CN CN201610361016.4A patent/CN105895786A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109256448A (en) * | 2018-08-07 | 2019-01-22 | 广州市巨宏光电有限公司 | A kind of LED light moulding process |
| US11318642B2 (en) | 2019-12-20 | 2022-05-03 | Eaton Intelligent Power Limited | Permeable wall encapsulation mold |
| CN112622131A (en) * | 2020-12-29 | 2021-04-09 | 杨钥 | Hook-pressing type epoxy adhesive bubble removing device |
| CN112870467A (en) * | 2021-01-13 | 2021-06-01 | 沈阳精渡金属科技有限公司 | Negative pressure centrifugal glue injection encapsulation process and device |
| CN112895532A (en) * | 2021-02-03 | 2021-06-04 | 宜易电子(上海)有限公司 | Production process of LED silica gel lens |
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Application publication date: 20160824 |