CN108183161A - The packaging technology and its system of a kind of LED - Google Patents
The packaging technology and its system of a kind of LED Download PDFInfo
- Publication number
- CN108183161A CN108183161A CN201711441645.9A CN201711441645A CN108183161A CN 108183161 A CN108183161 A CN 108183161A CN 201711441645 A CN201711441645 A CN 201711441645A CN 108183161 A CN108183161 A CN 108183161A
- Authority
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- China
- Prior art keywords
- led
- glue
- molding apparatus
- carried out
- packaging technology
- Prior art date
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- Granted
Links
- 238000012536 packaging technology Methods 0.000 title claims abstract description 10
- 238000000465 moulding Methods 0.000 claims abstract description 20
- 238000000576 coating method Methods 0.000 claims abstract description 13
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims abstract description 10
- 238000012856 packing Methods 0.000 claims abstract description 6
- 238000003860 storage Methods 0.000 claims abstract description 6
- 239000003292 glue Substances 0.000 claims description 83
- 238000003780 insertion Methods 0.000 claims description 14
- 230000037431 insertion Effects 0.000 claims description 14
- 230000007246 mechanism Effects 0.000 claims description 13
- 239000004831 Hot glue Substances 0.000 claims description 11
- 239000004973 liquid crystal related substance Substances 0.000 claims description 8
- 238000004026 adhesive bonding Methods 0.000 claims description 7
- 239000000919 ceramic Substances 0.000 claims description 6
- 230000005611 electricity Effects 0.000 claims description 6
- 239000003381 stabilizer Substances 0.000 claims description 6
- 230000001105 regulatory effect Effects 0.000 claims description 4
- 239000000203 mixture Substances 0.000 claims description 3
- 239000000853 adhesive Substances 0.000 claims description 2
- 230000001070 adhesive effect Effects 0.000 claims 1
- 230000000694 effects Effects 0.000 abstract description 11
- 238000000034 method Methods 0.000 abstract description 9
- 241000218202 Coptis Species 0.000 abstract description 3
- 235000002991 Coptis groenlandica Nutrition 0.000 abstract description 3
- 230000009471 action Effects 0.000 abstract description 3
- 239000000047 product Substances 0.000 description 8
- 238000010586 diagram Methods 0.000 description 7
- 238000004806 packaging method and process Methods 0.000 description 6
- 239000000084 colloidal system Substances 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 238000012360 testing method Methods 0.000 description 5
- 230000008859 change Effects 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 230000018984 mastication Effects 0.000 description 4
- 238000010077 mastication Methods 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 238000007789 sealing Methods 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 3
- 238000005538 encapsulation Methods 0.000 description 3
- 230000017525 heat dissipation Effects 0.000 description 3
- 229910001220 stainless steel Inorganic materials 0.000 description 3
- 239000010935 stainless steel Substances 0.000 description 3
- 239000002390 adhesive tape Substances 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229920000715 Mucilage Polymers 0.000 description 1
- 208000037656 Respiratory Sounds Diseases 0.000 description 1
- 239000004568 cement Substances 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 230000001276 controlling effect Effects 0.000 description 1
- 235000013399 edible fruits Nutrition 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229910052573 porcelain Inorganic materials 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/505—Wavelength conversion elements characterised by the shape, e.g. plate or foil
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/641—Heat extraction or cooling elements characterized by the materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Coating Apparatus (AREA)
Abstract
The invention discloses a kind of novel LED package systems and techniques, a kind of packaging technology of LED, include the following steps, chip with FPC with elargol is bonded between the two first, then die bond is carried out to LED with bonder, first time molding is carried out to LED with molding apparatus, secondly fluorescent film is coated to LED with phosphor coatings equipment, molding apparatus carries out second to LED and is molded, and finally LED is packed with packing machine, and packaged LED bubbles are put in storage.The present invention breaches traditional packaging technology, LED failure and better heat-radiation effect caused by using flip-chip bonding pattern electric action, without gold thread connection, reduction bonding wire problem.
Description
Technical field
The invention belongs to the technical field more particularly to the packaging technology of novel LED a kind of that are encapsulated in LED and its it is
System.
Background technology
LED on the market is used mostly using conventional package form between wire bonding formula, i.e. chip and stent at present
Gold thread connects.This technique causes dead lamp there may be coming off between the improper gold goal of bonding wire parameter and electrode, makes LED failure,
And sub-fraction luminous energy can be absorbed with elargol die bond, package brightness is made to decrease, since encapsulating material is thin, is also easy to produce gas
Bubble, crackle and influence product reliability.
Invention content
In view of the above-mentioned problems, a kind of service life of present invention offer is long, it is effectively improved the encapsulation of the LED of LED heat dissipation problems
Technique and its system.
To achieve these goals, the present invention uses following technical scheme：A kind of packaging technology of LED, including following step
Suddenly：
S1：Elargol on point, later by die bonding to elargol, obtains LED on stent；
S2：Die bond operation is carried out to LED with bonder；
S3：First time molding is carried out to LED with molding apparatus；
S4：Fluorescent film is coated to LED with phosphor coatings equipment；
S5：Second is carried out to LED with molding apparatus to be molded；
S6：Finally LED is packed with packing machine, and packaged LED is put in storage.
Further, dryer is used to toast 2H to LED at 150 DEG C after die bond is carried out in the step S2.
Further, after the completion of the step S5 then LED testing, sortings are packed.
After the completion of the further step S5 packaging and storage is carried out to LED testing, sortings and then by the LED of normal operation.
The present invention is packaged chip using elargol, into being connected without gold thread, is less prone to bonding wire and comes off and make
Into the situation of LED failure, service life is long；And the LED package product that this kind of packaging method obtains is small while also thinner, gold
Belong to substrate to the most effective heat dissipation path only 0.2mm of radiator, along with die bond is using elargol, used relative to conventional package
Insulating cement, heat-conducting effect more preferably, substantially increase LED product service life；In addition, fluorescence is coated through being molded twice during sealing
Film covering transparent adhesive tape can also improve product colour consistency while protecting fluorescent glue, and brightness can also be promoted accordingly and energy
Enough heat dissipation problems for effectively solving conventional package, so as to improve LED service lifes.
A kind of novel LED package systems, including spot gluing equipment, molding apparatus and phosphor coatings equipment；The dispensing is set
It is standby to include quantitative point glue device, feed pipe, controller, debugger, tablet, heat emission hole, connecting line, side plate, connecting plate, workbench
Face, control handle, terminals, package platforms, control button device, before the back side of the quantitative point glue device is installed on connecting plate
Side, the back insertion of the feed pipe are installed on the inside of debugger；The molding apparatus include fixed foot pad, control panel,
Liquid crystal display, control body, operating platform, rotating disk, glue injecting head, hot melt adhesive gun barrel mechanism, electric wire, conduit, support post, fixation
Fastener, hanging ring hook, solution pressure valve, air gauge, high-pressure glue bucket.The present invention is provided with quantitative point glue device, quantitative in glue device
Knob carries out oneself and adjusts, and timing open conveys its glue to below glue device to quantitative to sebific duct at regular intervals, improves
The quantitative effect to glue；The electric wire that outer end is connected by high temperature driven device provides electric power for it, and heater is by height after connecing electricity
The heating of warm driver starts to generate high temperature, is conducted heat on injecting glue duct wall by high-efficiency heat conduction piece so that internal
Glue is improved the property of softening very adhesiveness of colloid, avoids seal process colloid and bubble occur, ensured production by hot mastication
Raw up-to-standard efficiency.
Further, the quantitative point glue device by dustband, piston spring, piston, it is quantitative to glue device, to sebific duct, close
Packing, shell, Glue dripping head composition, the lower surface of the dustband are installed on the top of piston spring, the piston spring installation
In the inside of shell, the inside of the piston with to being connected on the outside of sebific duct, the outside and gasket to sebific duct it is interior
Side fits, it is described it is quantitative be installed on to glue device on sebific duct, being fitted on the inside of the gasket to the outside of sebific duct, it is described
The upper surface of Glue dripping head is installed on to the lower section of sebific duct；Gasket fixes lower part to sebific duct, conveys glue to sebific duct
To Glue dripping head, Glue dripping head carries out quantitative point glue encapsulation to it, makes which raises the quantitative effect to glue, when making glue dispensing and packaging not
It will appear excessive glue or very few glue.
Further, the back side of the quantitative point glue device is installed on the front side of connecting plate, and the back of the feed pipe is embedding
Enter to be installed on the inside of debugger, the controller is electrically connected with connecting line, and the upper of tablet is installed below the debugger
Side, the lower surface of the tablet and the upper surface of connecting plate are mutually parallel, and the heat emission hole is integrated with controller.
Further, the hot melt adhesive gun barrel mechanism upper end is connected with electric wire lower end, the conduit lower end insertion installation
In in fixed fastener, the support post lower end is mutually welded with control body upper end, and the conduit lower end insertion is installed on high pressure
In glue bucket.
Further, the hot melt adhesive gun barrel mechanism is by high temperature driven device, injecting glue pipeline, heater, high-efficiency heat conduction piece, pottery
Porcelain housing forms, and the high temperature driven device lower end is connected with heater upper end, the injecting glue pipeline outside and high-efficiency heat conduction piece
Inside fits, and the heater is integrated with high-efficiency heat conduction piece, and the injecting glue pipeline insertion is installed on ceramic shell
It is interior；Heater is started to generate high temperature by the heating of high temperature driven device after connecing electricity, and note is being conducted heat to by high-efficiency heat conduction piece
On plastic pipe wall so that internal glue is improved the property of softening very adhesiveness of colloid, avoid seal process by hot mastication
There is bubble in colloid, has ensured the up-to-standard efficiency generated.
Further, described in phosphor coatings equipment include display screen, screw, object table, fixed frame, body, power interface,
Stabilizer blade, pressure gauge, operation panel, regulating switch, positioning device, applicator, scram button, object, cabinet door, handle, the display
Screen is electrically connected with operation panel, and the object table is located at the lower end of object, and the power interface is located at the left end of body, the pressure
Table is electrically connected with operation panel.
In conclusion the present invention has the following advantages：The situation that bonding wire comes off and causes LED failure is less prone to, is used
Long lifespan；Heat-conducting effect is good, substantially increases LED product service life；In addition, fluorescent film is coated through being molded twice during sealing
Covering transparent adhesive tape effectively increases the consistent life of product colour.
Description of the drawings
Fig. 1 is the structural diagram of the present invention.
Fig. 2 is the structure diagram of the spot gluing equipment of the present invention.
Fig. 3 is the structure diagram of die bond mechanism of the present invention.
Fig. 4 is the structure diagram of fixed station in die bond structure of the present invention.
Fig. 5 is the structure diagram of molding apparatus of the present invention.
Fig. 6 is a kind of structure diagram of hot melt adhesive gun barrel mechanism in molding apparatus of the present invention.
Fig. 7 is the structure diagram of fluorescent powder coating equipment of the present invention.
Specific embodiment
In order to which those skilled in the art is made to be better understood from the present invention program, below in conjunction in the embodiment of the present invention
Attached drawing carries out the technical solution in the embodiment of the present invention clear, complete description.
A kind of technique and system of LED encapsulation, include the following steps：S1：Elargol is put on stent by spot gluing equipment,
Later by die bonding to elargol, LED is obtained；S2：Die bond operation is carried out to LED with die bond mechanism, concrete principle is existing
Technology, so it will not be repeated；Later using dryer at a temperature of 150 DEG C, 2h is toasted to LED；S3：With molding apparatus to LED
First time molding is carried out, coining operation and principle are the prior art, and so it will not be repeated；S4：LED is coated with phosphor coatings equipment
Fluorescent film, the specific principle that coats repeat no more；S5：Second is carried out to LED with molding apparatus to be molded；S6：To LED tests point
Choosing, testing, sorting mainly be powered to LED, test whether can normal use, normally then carry out packaging and storage；Finally
LED is packed with packing machine, and packaged LED is put in storage, packing machine is the prior art, is repeated no more.
A kind of LED package systems, as shown in figs. 1-7, including spot gluing equipment 1, molding apparatus 3 and phosphor coatings equipment 4；Institute
It states spot gluing equipment 1 and includes quantitative point glue device 11, feed pipe 12, controller 13, debugger 14, tablet 15, heat emission hole 16, connection
Line 17, side plate 18, connecting plate 19, work top 110, control handle 111, terminals 112, package platforms 113, control button device
114, the back side of the quantitative point glue device 11 is installed on the front side of connecting plate 19, and the back insertion of the feed pipe 12 is installed on
The inside of debugger 14, the controller 13 are electrically connected with connecting line 17, and the lower section of the debugger 14 is installed on tablet 15
Top, the lower surface and the upper surface of connecting plate 19 of the tablet 15 are mutually parallel, and the heat emission hole 16 is one with controller 13
Body structure, the lower section insertion of the connecting line 17 are installed on the inside of work top 110, the upper surface welding of the side plate 18
In the lower section of tablet 15, the lower surface insertion of the control handle 111 is installed on the inside of work top 110, the terminals
112 are electrically connected with work top 110, and the lower surface of the package platforms 113 fits in the top of work top 110, the control
The lower surface of button pushing device 114 processed is installed on the top of work top 110, and the quantitative point glue device 11 is by dustband 101, piston
Spring 102, quantitatively forms piston 103 to glue device 104, to sebific duct 105, gasket 106, shell 107, Glue dripping head 108, described
The lower surface of dustband 101 is installed on the top of piston spring 102, and the piston spring 102 is installed on the inside of shell 107,
The inside of the piston 103 is connected with to the outside of sebific duct 105, the outside to sebific duct 105 and the inside of gasket 106
It fits, described quantify is installed on to glue device 104 on sebific duct 105, and the inside of the gasket 106 is fitted in sebific duct 105
Outside, the upper surface of the Glue dripping head 108 is installed on to the lower section of sebific duct 105, and the work top 110 is cuboid knot
Structure, a diameter of 1cm of the control handle 111, the outside of the connecting plate 19 are welded in the inside of side plate 18, the workbench
The outside vertical in face 110 is in the inside of side plate 18, described to be connected to sebific duct 105 by shell 107 with feed pipe 12, the side
Plate 18 is made of pvc, has effect at low cost, and the piston spring 102 is made of stainless steel, and has the effect of antirust.
Controller 13 described in this patent refers to change according to predetermined order the wiring and change of main circuit or control circuit
In circuit resistance value come control the startup of motor, speed governing, braking and it is reversed it is main enable device, the control handle 11 is to use hand
The manual element that control turns.
Glue needed for dispensing is injected in sebific duct 105 by it by feed pipe 12 when being used, piston spring 102 to
Lower compression, it is quantitative to carry out oneself tune to the knob in glue device 104 when quantifying to the glue arrival in sebific duct 105 to glue device 104
It saves, timing open conveys its glue to 104 lower section of glue device to quantitative to sebific duct 105 at regular intervals, and gasket 106 is by under
Portion is fixed to sebific duct 105, glue is delivered on Glue dripping head 108 to sebific duct 105, Glue dripping head 108 carries out quantitative point to it
Glue encapsulates.
It is poor that the present invention solves the quantitative effect to glue of the prior art, leads to occur excessive glue in glue dispensing and packaging
Or the problem of very few glue, being combined with each other by above-mentioned component of the invention is provided with quantitative point mucilage binding in its structure
It puts, makes, which raises the quantitative effect to glue, to make to be not in excessive glue or very few glue during glue dispensing and packaging.
Specifically, the molding apparatus 3 includes fixed foot pad 31, control panel 32, liquid crystal display 33, control body 34, behaviour
Make platform 35, rotating disk 36, glue injecting head 37, hot melt adhesive gun barrel mechanism, electric wire 39, conduit 310, support post 311, fixed fastener
312nd, hanging ring hook 313, solution pressure valve 314, air gauge 315, high-pressure glue bucket 316, control 34 lower end of body and fixed foot pad
31 upper ends are mutually welded, and the insertion of control panel 32 is installed on control body 34, and the liquid crystal display 33 is with controlling in body 34
Pcb board is connected, and 35 upper end of operating platform is connected with 36 lower end of rotating disk, the hot melt adhesive gun barrel mechanism upper end and electricity
39 lower end of line is connected, and 310 lower end of the conduit insertion is installed in fixed fastener 312,311 lower end of support post and control
34 upper end of body processed is mutually welded, and 310 lower end of the conduit insertion is installed in high-pressure glue bucket 316,316 upper end of high-pressure glue bucket
Equipped with air gauge 315, the hanging ring is linked up with 313 lower ends and is mutually welded with 316 upper end of high-pressure glue bucket, the solution pressure valve 314 and high pressure
Glue bucket 316 is integrated, the hot melt adhesive gun barrel mechanism by high temperature driven device 801, injecting glue pipeline 802, heater 803,
High-efficiency heat conduction piece 804, ceramic shell 805 form, and 801 lower end of high temperature driven device is connected with 803 upper end of heater, described
802 outside of injecting glue pipeline fits with 804 inside of high-efficiency heat conduction piece, the heater 803 and 804 being integrated of high-efficiency heat conduction piece
Structure, the insertion of injecting glue pipeline 802 are installed in ceramic shell 805,311 outer shroud of support post and fixed fastener 312
Inner ring is mutually welded, and the hot melt adhesive gun barrel mechanism lower end is connected with 37 upper end of glue injecting head, 802 lower end of injecting glue pipeline and note
37 upper end of rubber head is connected, and control 34 upper end of body is mutually binded with 35 lower end of operating platform, and the electric wire 39 is by copper wire system
Into with preferable electric conductivity, the support post 311 is made of stainless steel, and has preferable hardness.
Liquid crystal display 33 described in this patent is the filling liquid crystal material between two blocks of parallel-plates using liquid crystal material as basic module
Material, change liquid crystal material interior molecules by voltage comes column-shaped condition, and depth is shown to achieve the purpose that shading and light transmission
Shallow to differ, the air gauge 315 is a kind of instrument measured used in air pressure, and classification has a lot of kinds, and wherein tire gauge is one
Kind pneumatic tires air gauge, it is made of gauge outfit, piston, table body, scale, main spring etc..
When being used when carrying out injecting glue sealing, the electric wire 39 that outer end is connected by high temperature driven device 801 is carried for it
For electric power, heater 803 is started to generate high temperature by the heating of high temperature driven device 801 after connecing electricity, is incited somebody to action by high-efficiency heat conduction piece 804
Heat is transmitted on 802 wall of injecting glue pipeline so that for internal glue by hot mastication, ceramic shell 805 has preferable insulation effect
Fruit avoids electric conduction phenomena.
The present invention solution prior art is poor for the derived softening viscosity treatment effect of sealing, and seal process is caused to produce
There is bubble in product so that the problem of the qualification rate of the final product quality of light bulb, being combined with each other by above-mentioned component of the invention, and structure
The upper electric wire that outer end is connected by high temperature driven device provides electric power for it, and heater is started to generate by the heating of electric power after connecing electricity
High temperature is conducted heat to by high-efficiency heat conduction piece on injecting glue duct wall so that internal glue is improved glue by hot mastication
The property of softening of body very adhesiveness avoids seal process colloid and bubble occurs, has ensured the up-to-standard efficiency generated.
Specifically, the phosphor coatings equipment 4 include display screen 41, screw 42, object table 43, fixed frame 44, body 45,
Power interface 46, stabilizer blade 47, pressure gauge 48, operation panel 49, regulating switch 410, positioning device, applicator 412, scram button
413rd, object 414, cabinet door 415, handle 416, the display screen 41 are electrically connected with operation panel 49, and the object table 43 is located at object
414 lower end, the power interface 46 are located at the left end of body 45, and the pressure gauge 48 is electrically connected with operation panel 49, the tune
Section switch 410 is located at the right end of pressure gauge 48, and the regulating switch 410 is electrically connected with operation panel 49, and the positioning device is located at
The upper end of object 414, the applicator 412 are located at the lower end of operation panel 49, and the scram button 413 is electrically connected with body 45,
The cabinet door 415 is welded with 416 phase of handle, and the cabinet door 415 is located at the front end of body 45, and the positioning device is managed including FET
1101st, shell 1102, support ring 1103, window 1104, pin 1105, pedestal 1106, circuit original paper 1107, thermoelectric plate 1108,
Filter lens 1109, the FET pipes 1101 are located at the upper end of circuit original paper 1107, and the shell 1102 is integrated with window 1104
Change structure, the support ring 1103 is located at the inside of shell 1102, and the pin 1105 is through pedestal 1106, the circuit original
Part 1107 is located at the inside of shell 1102, and the lower surface and the upper surface of filter lens 1109 of the thermoelectric plate 1108 fit,
The screw 42 is threadedly coupled with fixed frame 44, and the lower surface of the body 45 is mutually welded with the upper surface of stabilizer blade 47, described to draw
Foot 1105 is electrically connected with body 45, a length of 5cm of the stabilizer blade 47, width 3cm, a height of 8cm, and the stabilizer blade 47 is cuboid knot
Structure, the object table 43 are made of stainless steel, and hardness is high and is not easy to get rusty.
Display screen 41 described in this patent is the I/O equipment for belonging to computer, i.e. input-output equipment, it is a kind of incites somebody to action centainly
Electronic document be shown to the show tools that human eye is re-reflected on screen by specific transmission device, the screw 42 is profit
With the inclined-plane circular rotating of object and the physics of frictional force and mathematical principle, the tool of implements parts is fastened by easy stages,
Screw is the general saying of fastener, and daily pet phrase, screw is industrial necessity indispensable in daily life, is such as taken a picture
The general screw of the minimum screw that machine, glasses, clock and watch, electronics etc. use, TV, electric product, musical instrument, furniture etc., as
Engineering, building, bridge are then then used in combination using large-scale screw, nut, traffic tool, aircraft, electric car, automobile etc. for big primary screw,
Screw industrially bears vital task, as long as there is industry on the earth, then the function of screw is forever important, and screw is 1,100
Joint invention over year in people's production and living, from the point of view of application field, it is the first major invention of the mankind.
Positioning device is mounted on body 45 when being used, is powered on, object is mapped in by window 1104
On filter lens 1109, analog signal is passed to by thermoelectric plate 1108 by filter lens 1109, by thermoelectric plate 1108 by signal
Circuit original paper 1107 is conveyed to, analog signal is converted by digital signal by circuit original paper 1107, by FET pipes 1101 by number
Word signal passes to body 45, starts to coat, article position is thus accurately positioned, and ensures that the coating of object is uniform.
The present invention solves prior art position calibration position inaccurate, it may appear that the phenomenon that offset, fluorescent powder is caused to apply
Non-uniform problem is covered, positioning device is mounted on body, powers on by being combined with each other by above-mentioned component of the invention,
Object is mapped in by window on filter lens, and analog signal is passed to thermoelectric plate by filter lens, will be believed by thermoelectric plate
Number circuit original paper is conveyed to, analog signal is converted by digital signal by circuit original paper, is transmitted digital signal by FET pipes
To body, start to coat, article position is thus accurately positioned, ensure that the coating of object is uniform.
Obviously, described embodiment is only the part of the embodiment of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, those of ordinary skill in the art are obtained every other without making creative work
Embodiment should all belong to the scope of protection of the invention.
Claims (9)
1. a kind of packaging technology of LED, includes the following steps：
S1：Elargol on point, later by die bonding to elargol, obtains LED on stent；
S2：Die bond operation is carried out to LED with bonder；
S3：First time molding is carried out to LED with molding apparatus；
S4：Fluorescent film is coated to LED with phosphor coatings equipment；
S5：Second is carried out to LED with molding apparatus to be molded；
S6：Finally LED is packed with packing machine, and packaged LED is put in storage.
2. a kind of packaging technology of LED according to claim 1, it is characterised in that：After die bond being carried out in the step S2
2H is toasted to LED at 150 DEG C with dryer.
3. a kind of packaging technology of LED according to claim 1, it is characterised in that：LED is surveyed after the completion of the step S5
Examination is sorted and then is packed.
4. the package system of LED packaging technologies according to claim 1, including spot gluing equipment（1）, molding apparatus（3）
And phosphor coatings equipment（4）；It is characterized in that：The spot gluing equipment（1）Including quantitative point glue device（11）, feed pipe（12）、
Controller（13）, debugger（14）, tablet（15）, heat emission hole（16）, connecting line（17）, side plate（18）, connecting plate（19）, work
Table top（110）, control handle（111）, terminals（112）, package platforms（113）, control button device（114）, the quantitative point
Adhesive dispenser（11）The back side be installed on connecting plate（19）Front side, the feed pipe（12）Back insertion be installed on debugger
（14）Inside；The molding apparatus（3）Including fixed foot pad（31）, control panel（32）, liquid crystal display（33）, control body
（34）, operating platform（35）, rotating disk（36）, glue injecting head（37）, hot melt adhesive gun barrel mechanism, electric wire（39）, conduit（310）, branch
Support column（311）, fixed fastener（312）, hanging ring hook（313）, solution pressure valve（314）, air gauge（315）, high-pressure glue bucket
（316）.
5. LED package systems according to claim 4, it is characterised in that：The quantitative point glue device（11）By dustband
（101）, piston spring（102）, piston（103）, quantitative give glue device（104）, to sebific duct（105）, gasket（106）, shell
（107）, Glue dripping head（108）Composition, the dustband（101）Lower surface be installed on piston spring（102）Top, the work
Fill in spring（102）It is installed on shell（107）Inside, the piston（103）Inside with to sebific duct（105）Outside be connected
It connects, it is described to give sebific duct（105）Outside and gasket（106）Inside fit.
6. LED package systems according to claim 4, it is characterised in that：The controller（13）With connecting line（17）Electricity
Connection, the debugger（14）Lower section be installed on tablet（15）Top, the tablet（15）Lower surface and connecting plate
（19）Upper surface be mutually parallel, the heat emission hole（16）With controller（13）It is integrated.
7. LED package systems according to claim 4, it is characterised in that：The hot melt adhesive gun barrel mechanism（38）Upper end with
Electric wire（39）Lower end is connected, the conduit（310）Lower end insertion is installed on fixed fastener（312）It is interior, the support post
（311）Lower end and control body（34）Upper end is mutually welded, the conduit（310）Lower end insertion is installed on high-pressure glue bucket（316）It is interior.
8. LED package systems according to claim 7, it is characterised in that：The hot melt adhesive gun barrel mechanism is by high temperature driven
Device（801）, injecting glue pipeline（802）, heater（803）, high-efficiency heat conduction piece（804）, ceramic shell（805）Composition, the high temperature
Driver（801）Lower end and heater（803）Upper end is connected, the injecting glue pipeline（802）Outside and high-efficiency heat conduction piece（804）
Inside fits, the heater（803）With high-efficiency heat conduction piece（804）It is integrated, the injecting glue pipeline（802）It is embedded
It is installed on ceramic shell（805）It is interior.
9. LED package systems according to claim 4, it is characterised in that：The phosphor coatings equipment（4）Including display screen
（41）, screw（42）, object table（43）, fixed frame（44）, body（45）, power interface（46）, stabilizer blade（47）, pressure gauge
（48）, operation panel（49）, regulating switch（410）, positioning device, applicator（412）, scram button（413）, object（414）, cabinet
Door（415）, handle（416）, the display screen（41）With operation panel（49）Electrical connection.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711441645.9A CN108183161B (en) | 2017-12-27 | 2017-12-27 | LED packaging process and system thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711441645.9A CN108183161B (en) | 2017-12-27 | 2017-12-27 | LED packaging process and system thereof |
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| Publication Number | Publication Date |
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| CN108183161A true CN108183161A (en) | 2018-06-19 |
| CN108183161B CN108183161B (en) | 2021-11-26 |
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ID=62547542
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|---|---|---|---|
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| CN108183161B (en) | 2021-11-26 |
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