CN1986188A - Electronic card packaging process - Google Patents
Electronic card packaging process Download PDFInfo
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- CN1986188A CN1986188A CN 200510133851 CN200510133851A CN1986188A CN 1986188 A CN1986188 A CN 1986188A CN 200510133851 CN200510133851 CN 200510133851 CN 200510133851 A CN200510133851 A CN 200510133851A CN 1986188 A CN1986188 A CN 1986188A
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Abstract
The electronic card packaging process with holding assembly and mold possessing mold space, injecting port and opening to pack the element includes the following steps: 1. setting the element to be coated into the mold space, setting the holding assembly through the opening and fixing the element; 2. injecting packing material through the injecting port into the mold space; 3. withdrawing the holding assembly and connecting the opening after the element is fixed with the packing material; and 4. adding additional packing material to fill the mold space and to form one package.
Description
Technical field
The present invention relates to a kind of electronic card packaging method, particularly a kind of method for packing of small electronic card.
Background technology
At present common electronic cards is used very wide, and the trend of miniaturization is gradually arranged, such as data card (Modem Card), network card (Local Area Network Card, LAN Card) and memory card (Memory Card) or the like.The common international standards of electronic cards have pcmcia card and flash memory (Compact Flash Card, CF Card) and Security Digital (SD) (Secure Digital MemoryCard, SD Card) etc., and new specification standards also constantly the development.Though the specification details of these electronic cards is variant, the mode of its encapsulation and structure are then similar.
In general, the encapsulation of electronic cards must provide enough mechanical strength and electric property, and must meet some certain criteria (standard) standard at least, and, the employed method of packaging electronic card also must be applicable to packaging technology, can manufacture in large quantities like this, the consideration of structural strength and packaging cost develops the emphasis of electronic cards especially certainly.
Traditional electronic cards packaged type is that the edge of two conductive shells is up and down bent downwards mostly, and with the engaging mode combine with the plastics housing, and then via anchor clamps/tool (tool) up and down two conductive shell riveteds get up, and seal a frame of plastic and a printed circuit board (PCB).Because the process of the conductive shell of this electronic cards experience bending in advance, again with the mode combination of frame of plastic to engage, not only make conductive shell and frame of plastic closely not to link together, in addition, utilize the mechanical strength of the formed electronic cards structure of riveted in general relatively poor, especially in the riveted process, be very easy to cause the conductive shell distortion, so, when electronic cards is subjected to external force or the effect of deflection strength, conductive shell can be easy to loosening and come off, thereby the encapsulating structure of electronic cards just can be damaged.
Though industry is developed the packaged type of implanting with ultrasonic wave at the shortcoming of above-mentioned encapsulation at present, see also Fig. 1, it is the encapsulating structure schematic diagram of known electronic cards, wherein, with small-sized Security Digital (SD) (Mini SD Card, hereinafter to be referred as small-sized SD memory card) packaged type of conditional electronic card is described for example, as shown in the figure, small-sized SD memory card 1 comprises up and down two plastic casings 11 and is provided with electronic component 121 and the printed circuit board (PCB) 12 of golden finger 122, the process of encapsulation needs earlier printed circuit board (PCB) 12 to be held on up and down between two plastic casings 11, and place ultrasonic wave implantation board (not shown) to carry out contraposition, treat to carry out again after contraposition is finished ultrasonic wave and implant technology, so that the plastics of two plastic casings, 11 joints soften and both are sticked together together up and down, though the mode of the certain more known use riveted of mechanical strength of the formed electronic cards encapsulating structure of mode that the use ultrasonic wave is implanted is good, but being to use mode that ultrasonic wave implants printed circuit board (PCB) 12 and two plastic casings 11 up and down to be inserted ultrasonic wave in artificial mode implants in the board, and carry out to carry out the ultrasonic wave implantation after the contraposition, therefore whole encapsulation process needs the long production time, and once can only encapsulate an electronic cards structure, the demand of a large amount of manufacturings can't be satisfied, and too much production cost can be expended in the mode of artificial contraposition.
And when electronic cards is subjected to external force or the effect of deflection strength, two plastic casings 11 just are very easy to cause depressed deformation or fracture up and down, serious, the zone that engages between two plastic casings 11 up and down also can be caused the phenomenon of separation easily because of the undercapacity that binds.
Therefore, how to develop a kind of electronic cards method for packing that improves above-mentioned known technology shortcoming, real in pressing for the problem of solution at present.
Summary of the invention
Main purpose of the present invention is to provide a kind of electronic card packaging method, it will be fixed in the mold space of mould by packing element earlier by clamp assemblies, and the amount of colloid encapsulating material of waiting to inject the mold space of mould is can fix by packing element the time, just clamp assemblies is withdrawed from the mold space, and be connected with mould at the opening part of mould, excessive to prevent the colloid encapsulating material, at last the colloid encapsulating material is filled up in fact fully this mold space, can form an electronic cards packing colloid, use the method for packing of ultrasonic wave implantation to need the long production time and expend too much production cost to solve tradition, and when formed electronic cards is subjected to external force or the effect of deflection strength, two plastic housings are known from experience the shortcoming that causes depressed deformation or fracture up and down, even the shortcomings such as phenomenon that can separate in the zone that engages between two plastic casings up and down, all can solve in the lump.
For achieving the above object, of the present invention one than the broad sense form of implementation for a kind of electronic card packaging method is provided, it is by a clamp assemblies and a mould, encapsulated by packing element one, this mould has a mold space, a sprue and an opening, this method for packing comprises the following step at least: (a) will be somebody's turn to do by packing element and be arranged in this mold space of this mould, and insert this clamp assemblies this mold space and fix this by packing element from this opening part; (b) inject a colloid encapsulating material this mold space by this sprue to this mould; (c) judge whether to have fixed this by packing element via this colloid encapsulating material that this sprue injected, when judged result when being, this clamp assemblies is withdrawed from this mold space, and is connected with this mould at this opening part; And (d) this colloid encapsulating material is filled up in fact fully formed this mold space of this mould and this clamp assemblies, form a packing colloid with this.
According to conception of the present invention, should be a planar lattice array module wherein by packing element, have a plurality of golden fingers and electronic component.
According to conception of the present invention, should be a printed circuit board (PCB) that is provided with a plurality of electronic components and golden finger wherein by packing element.
According to conception of the present invention, wherein this method for packing judges by a sensing element whether this colloid encapsulating material that injects via this sprue has fixed this by packing element.
According to conception of the present invention, wherein this sensing element is an optical inductor, and its mode with optical sensor judges whether this colloid encapsulating material has fixed this by packing element.
According to conception of the present invention, wherein this sensing element is a thermal sensor, and its mode with thermoinduction judges whether this colloid encapsulating material has fixed this by packing element.
According to conception of the present invention, wherein this method for packing is controlled this colloid encapsulating material that injects via this sprue by a timing element and whether has been fixed this by packing element.
According to conception of the present invention, wherein this step (a) and step (d) adopt dijection to go out process technology to finish.
According to conception of the present invention, wherein this electronic cards is a small-sized Security Digital (SD).
According to conception of the present invention, wherein this electronic cards is a multimedia memory card.
According to conception of the present invention, wherein this colloid encapsulating material is thermoplastic plastic liquid.
According to conception of the present invention, wherein this clamp assemblies comprises one first clamping part and one second clamping part, and it is arranged at this respectively by the limit, two opposite sides of packing element, uses so that should be fixed in this mold space of this mould by packing element.
According to conception of the present invention, wherein this first clamping part is inserted in this mold space by this opening part of this mould.
According to conception of the present invention, wherein this mould also comprises a rake, in order to be replaced mutually by packing element with this.
Of the present invention another than the broad sense form of implementation for a kind of electronic card packaging method is provided, it is by a clamp assemblies and a mould, encapsulated by packing element one, this mould has a mold space, a sprue and an opening, this method for packing comprises the following step at least: (a) will be somebody's turn to do by packing element and be arranged in this mold space of this mould, make this be formed a first flow and one second runner between packing element and this mould, and insert this clamp assemblies this mold space and fix this by packing element from this opening part; (b) inject a colloid encapsulating material this mold space by this sprue, make this colloid encapsulating material coat this by packing element along this first flow and this second runner to this mould; (c) judge whether this colloid encapsulating material that is injected along this first flow and this second runner has fixed this by packing element, when judged result when being, this clamp assemblies is withdrawed from this mold space, and is connected with this mould at this opening part; And (d) this colloid encapsulating material is filled up this mould and formed this mold space of this clamp assemblies in fact fully along this first flow and this second runner, form a packing colloid with this.
According to conception of the present invention, wherein this clamp assemblies comprises one first clamping part and one second clamping part, it is arranged at this respectively by the limit, two opposite sides of packing element, with so that should be fixed in this mold space of this mould by packing element, and this first clamping part be inserted in this first flow in this mold space by this opening part of this mould.
Description of drawings
Fig. 1 is the encapsulating structure schematic diagram of known electronic cards.
Fig. 2 is the electronic cards encapsulation flow chart of preferred embodiment of the present invention.
Fig. 3 (a)～Fig. 3 (d) is the manufacturing process schematic diagram of the electronic cards of preferred embodiment of the present invention.
Wherein, description of reference numerals is as follows:
1: small-sized SD memory card 11: plastic casing
121: electronic component 122: golden finger
12: printed circuit board (PCB) 31: clamping element
312: the second clamping parts of 311: the first clamping parts
313: sensing element 32: mould
321: sprue 322: opening
323: mold space 3231: first flow
Runner 33 in 3232: the second: by packing element
331: electronic component 332: golden finger
34: plastic liquid 324: rake
35: feeder sleeve 341: rake
S21～S26: the process step of electronic card packaging method
The specific embodiment
Some exemplary embodiments that embody feature of the present invention and advantage will be described in detail in the explanation of back segment.Be understood that the present invention can have various variations different in form, its neither disengaging category of the present invention, and content wherein and the accompanying drawing usefulness that ought explain in itself, and be not in order to limit the scope of the invention.
Electronic card packaging method of the present invention is mainly used in small-sized Security Digital (SD) or multimedia memory card (Multimedia Card, MMC Card) small electronic card such as, certainly general common on the market electronic cards, for example data card, network card and memory card or the like also can be used technology of the present invention.
See also Fig. 2 and cooperate Fig. 3 (a)～Fig. 3 (d), wherein, Fig. 2 is the electronic cards encapsulation flow chart of preferred embodiment of the present invention, Fig. 3 (a)～Fig. 3 (d) is the manufacturing process schematic diagram of the electronic cards of preferred embodiment of the present invention, shown in Fig. 3 (a), electronic card packaging method of the present invention is mainly by clamp assemblies 31 and mould 32, encapsulated by packing element 33 one, clamp assemblies 31 includes first clamping part 311, second clamping part 312 and sensing element (sensor device) 313, mould 32 has sprue 321, opening 322 with and inner formed mold space 323, wherein first clamping part 311 of clamp assemblies 31 is arranged at the top of mould 32 and corresponds to opening 322 places, and second clamping part 312 then is arranged at the below of mould 32.
In preferred embodiment of the present invention, by packing element 33 is one to have planar lattice array module (the Land Grid Array Module of high-temperature stability, hereinafter to be referred as the LGA module), its inside is packaged with electronic components 331 such as internal memory and processor, and have the golden finger 332 that is used for the electric connection of electronic installation (not shown), wherein golden finger 332 corresponds to second clamping part 312 of clamp assemblies 31; Certainly, what be applicable to method for packing of the present invention is not limited to the LGA module by packing element 33, so long as be invention which is intended to be protected by packing element through the method for packing of the present invention encapsulation back miniature electric card structure that forms; For example, the present invention was suitable for also be can be a printed circuit board (PCB) that is provided with a plurality of electronic components and golden finger by packing element 33.
Please consult Fig. 2 again and cooperate Fig. 3 (a)～Fig. 3 (d), electronic card packaging method of the present invention adopts dijection to go out process technology (over molding), and its encapsulation step flow process is: at first, can will be placed in the mold space 323 of mould 32 by packing element 33 by the mechanical arm (not shown), and make by an end of packing element 33 and replace mutually with the rake 324 of mould 32, can prevent to be moved by pushing and pressing because of stressed by packing element 33, and formed a first flow 3231 between the end face of packing element 33 and the mould 32, and by formation one second runner 3232 between the bottom surface of packing element 33 and the mould 32, and first clamping part 311 of clamp assemblies 31 and the sensing element 313 that is comprised thereof are inserted in the first flow 3231 in mold space 323 from the opening 322 of mould 32, and make first clamping part 311 and be connected by a side of packing element 33, as for 312 of second clamping parts be connected by the opposite side of packing element 33, first clamping part 311 that so just can be by clamp assemblies 31 and the cooperation of second clamping part 312 make by packing element 33 is fixed in the mold space 323 of mould 32, thereby can not produce the situation of rocking (as Fig. 3 (a) in encapsulation process, reach the step S21 of Fig. 2 shown in Fig. 3 (b)).
Then, the sprue 321 of mould 32 is connected with feeder sleeve 35, and by the sprue 321 of mould 32 (it is thermoplastic plastic liquid 34 with a colloid encapsulating material, but material is not as limit) pour in the mold space 323 of mould 32, make plastic liquid 34 along being encapsulated (the step S22 that shown in Fig. 3 (b), reaches Fig. 2) by packing element 33 by 3232 pairs of formed first flow 3231 between packing element 33 and the mould 32 and second runners.
After step S22, need the sensing element 313 of the first flow 3231 by being arranged at mold space 323 to detect judgement and whether can reach fixing by the effect of packing element 33 via the plastic liquid 34 that sprue 321 pours into the first flow 3231 and second runner 3232, in preferred embodiment of the present invention, the benchmark (as step S23) that the main mode of whether sensing plastic liquid 34 with sensing element 313 is used as judging, when sensing element 313 has been sensed plastic liquid 34, the amount that expression pours into the plastic liquid 34 of the first flow 3231 and second runner 3232 has been enough to fix by packing element 33, does not rock in the process of encapsulation and can not make by packing element 33; Then, need first clamping part 311 of clamp assemblies 31 is withdrawed from mold space 323, and be connected (as step S24) with mould 32 at opening 322 places of mould 32, the part with as the external mold of mould 32 makes plastic liquid 34 can not overflow via opening 322.
Then, continue plastic liquid 34 is filled up formed mold space 323 between first clamping part 311 of mould 32 and clamp assemblies 31 (shown in Fig. 3 (c) and the step S25 of Fig. 2) fully along first flow 3231 and second runner 3232; At last, treat that after plastic liquid 34 sclerosis be removable clamp assemblies 31, mould 32 and feeder sleeve 35, can form the packing colloid (shown in Fig. 3 (d), reaching the step S26 of Fig. 2) of an electronic cards like this; In addition, the inside that the packing colloid that can make the same rake 341 (shown in Fig. 3 (d)) that forms of opposite position of packing colloid of formed electronic cards, this rake 341 can be used to guide whole electronic cards because of the rake 324 of mould 32 inserts the electronic installation that is connected smoothly.
Whether wherein, the sensing element 313 that is arranged at first clamping part 311 can be a resistant to elevated temperatures optical inductor, and its mode with optical sensor detects plastic liquid 34, can fix by packing element 33 to judge plastic liquid 34; Sensing element 313 also can be a thermal sensor in addition, its mode with thermoinduction detects plastic liquid 34, whether can fix by packing element 33 to judge plastic liquid 34, but the enforceable sensing element 313 of the present invention is not limited thereto, any can hot environment be issued to the induction plastic liquid 34 sensing element be institute of the present invention applicable scope.
Certainly, the present invention is used for judging whether plastic liquid 34 can reach fixing and be not limited to use above-mentioned sensing element 313 by the mode of packing element 33, whether any flow of judging plastic liquid 34 can reach fixing is institute of the present invention applicable scope by the mode of packing element 33, for example, manufacturer can utilize timing element to calculate the capacity of the plastic liquid 34 that is injected via feeder sleeve 35, when plastic liquid 34 arrival of injecting can be fixed by the amount of packing element 33, just first clamping part 311 of clamp assemblies 31 can be withdrawed from mold space 323, and be connected with mould 32 at opening 322 places of mould 32.
Use electronic card packaging method of the present invention to have following advantage:
1. reduce cost:
When practical application, can offer a plurality of set of molds simultaneously, and it is a plurality of by the mould inside of packing element to correspondence by mechanical arm clamping simultaneously, thereby can carry out the packaging technology of a plurality of electronic cards simultaneously, therefore can manufacture in large quantities, and compare with the manually-operated mode of known use in the mode of automatic operation and can reduce a large amount of production costs;
2. reinforced structure:
Because packaged type of the present invention uses softening plastic liquid directly to encapsulate by packing element, therefore the structural strength of formed electronic cards is preferable, when external force or the effect of deflection strength, can not cause depressed deformation or fracture;
3. water proof and dust proof:
Because packaged type of the present invention uses softening plastic liquid directly to encapsulate by packing element, formed electronic cards is that complete hermetically-sealed construction does not promptly have seam crossing, therefore can reach waterproof and dustproof effect.
In sum, electronic card packaging method of the present invention will be fixed in the mold space of mould by packing element earlier by clamp assemblies, and the amount of waiting to be injected into the colloid encapsulating material in the mold space of mould is can fix by packing element the time, just clamp assemblies is withdrawed from the mold space, and it also is connected with mould at the opening part of mould, excessive to prevent the colloid encapsulating material, at last the colloid encapsulating material is filled up fully this mold space, can form the packing colloid of an electronic cards; Compared to known technology, but the mode of method for packing cooperative mechanical automatic operation used in the present invention is manufactured in a large number, the structural strength of formed electronic cards is preferable, when external force or the effect of deflection strength, can't cause depressed deformation or fracture, and formed electronic cards is complete hermetically-sealed construction, can reach waterproof and dustproof effect.
The present invention can carry out various modifications by those skilled in the art, but the scope of neither disengaging such as the desire protection of appended claims institute.
Claims (14)
1. electronic card packaging method, it is encapsulated by packing element one by a clamp assemblies and a mould, and this mould has a mold space, a sprue and an opening, and this method for packing comprises the following step at least:
(a) will be somebody's turn to do by packing element and be arranged in this mold space of this mould, and insert this clamp assemblies this mold space and fix this by packing element from this opening part;
(b) inject a colloid encapsulating material this mold space by this sprue to this mould;
(c) judge whether to have fixed this by packing element via this colloid encapsulating material that this sprue injected, when judged result when being, this clamp assemblies is withdrawed from this mold space, and is connected with this mould at this opening part; And
(d) this colloid encapsulating material is filled up fully formed this mold space of this mould and this clamp assemblies, form a packing colloid with this.
2. electronic card packaging method as claimed in claim 1 should be a planar lattice array module by packing element wherein, had a plurality of golden fingers and electronic component, should was a printed circuit board (PCB) that is provided with a plurality of electronic components and golden finger by packing element perhaps.
3. electronic card packaging method as claimed in claim 1, wherein this method for packing judges by a sensing element whether this colloid encapsulating material that injects via this sprue has fixed this by packing element, wherein this sensing element is an optical inductor, its mode with optical sensor judges whether this colloid encapsulating material has fixed this by packing element, perhaps this sensing element is a thermal sensor, and its mode with thermoinduction judges whether this colloid encapsulating material has fixed this by packing element.
4. electronic card packaging method as claimed in claim 1, wherein this method for packing is controlled this colloid encapsulating material that injects via this sprue by a timing element and whether has been fixed this by packing element.
5. electronic card packaging method as claimed in claim 1, wherein this step (a) and step (d) adopt dijection to go out process technology to finish.
6. electronic card packaging method as claimed in claim 1, wherein this electronic cards is a small-sized Security Digital (SD) or a multimedia memory card, and this colloid encapsulating material is thermoplastic plastic liquid.
7. method for packing as claimed in claim 1, wherein this clamp assemblies comprises one first clamping part and one second clamping part, and it is arranged at this respectively by the limit, two opposite sides of packing element, uses so that should be fixed in this mold space of this mould by packing element.
8. method for packing as claimed in claim 7, wherein this first clamping part is inserted in this mold space by this opening part of this mould.
9. method for packing as claimed in claim 1, wherein this mould also comprises a rake, in order to be replaced mutually by packing element with this.
10. electronic card packaging method, it is encapsulated by packing element one by a clamp assemblies and a mould, and this mould has a mold space, a sprue and an opening, and this method for packing comprises the following step at least:
(a) will be somebody's turn to do by packing element and be arranged in this mold space of this mould, and make this be formed a first flow and one second runner between packing element and this mould, and insert this clamp assemblies this mold space and fix this by packing element from this opening part;
(b) inject a colloid encapsulating material this mold space by this sprue, make this colloid encapsulating material coat this by packing element along this first flow and this second runner to this mould;
(c) judge whether this colloid encapsulating material that is injected along this first flow and this second runner has fixed this by packing element, when judged result when being, this clamp assemblies is withdrawed from this mold space, and is connected with this mould at this opening part; And
(d) along this first flow and this second runner this colloid encapsulating material is filled up this mould and formed this mold space of this clamp assemblies fully, form a packing colloid with this.
11. electronic card packaging method as claimed in claim 10 wherein should be had a plurality of golden fingers and electronic component by packing element.
12. method for packing as claimed in claim 10, wherein this method for packing judges by a sensing element whether this colloid encapsulating material that injects via this sprue has fixed this by packing element, and this sensing element is an optical inductor, its mode with optical sensor judges whether this colloid encapsulating material has fixed this by packing element, perhaps this sensing element is a thermal sensor, and its mode with thermoinduction judges whether this colloid encapsulating material has fixed this by packing element.
13. electronic card packaging method as claimed in claim 10, wherein this method for packing is controlled this colloid encapsulating material that injects via this sprue by a timing element and whether has been fixed this by packing element.
14. electronic card packaging method as claimed in claim 10, wherein this step (a) and step (d) adopt dijection to go out process technology to finish.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200510133851 CN1986188A (en) | 2005-12-22 | 2005-12-22 | Electronic card packaging process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200510133851 CN1986188A (en) | 2005-12-22 | 2005-12-22 | Electronic card packaging process |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1986188A true CN1986188A (en) | 2007-06-27 |
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ID=38183193
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200510133851 Pending CN1986188A (en) | 2005-12-22 | 2005-12-22 | Electronic card packaging process |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1986188A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108491113A (en) * | 2018-03-05 | 2018-09-04 | 业成科技（成都）有限公司 | Ultrasonic wave touch device and preparation method thereof |
-
2005
- 2005-12-22 CN CN 200510133851 patent/CN1986188A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108491113A (en) * | 2018-03-05 | 2018-09-04 | 业成科技（成都）有限公司 | Ultrasonic wave touch device and preparation method thereof |
| CN108491113B (en) * | 2018-03-05 | 2021-03-23 | 业成科技（成都）有限公司 | Ultrasonic touch device and manufacturing method thereof |
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