TWI285728B - Substrate measuring apparatus - Google Patents

Substrate measuring apparatus Download PDF

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Publication number
TWI285728B
TWI285728B TW095112661A TW95112661A TWI285728B TW I285728 B TWI285728 B TW I285728B TW 095112661 A TW095112661 A TW 095112661A TW 95112661 A TW95112661 A TW 95112661A TW I285728 B TWI285728 B TW I285728B
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TW
Taiwan
Prior art keywords
substrate
platform
support
platform portion
base
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TW095112661A
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Chinese (zh)
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TW200702628A (en
Inventor
Hiroshi Yamashita
Noriyoshi Yamashita
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Dainippon Screen Mfg
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Publication of TW200702628A publication Critical patent/TW200702628A/en
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Publication of TWI285728B publication Critical patent/TWI285728B/en

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting substrates others than wafers, e.g. chips
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N2021/9513—Liquid crystal panels

Abstract

This invention is to provide a substrate measuring apparatus capable of accurately measuring a substrate even when the substrate is enlarged. A length measuring machine of the substrate measuring apparatus of the invention comprises a base section 10, a stage section 14 to be supported by the base section 10 without receiving stress from the base section 10 in a state in which the surface tilts by a micro angle with respect to the vertical direction, a guide roller 42 and lifting roller 43 for supporting the lower end of the substrate 100 to be measured, a pedestal 15 laterally movable along the surface of the stage section 14 by being guided by guide rails 45 disposed in upper part and lower part of the stage section, and a photographing section 18 vertically movable along the pedestal 15 by being guided by a guide rail 53 disposed in the pedestal 15.

Description

1285728 •九、發明說明： 【發明所屬之技術領域】 本發明係關於-種基板測定震置’其對用以製作印刷基 板之光罩基板或液晶顯示面板用玻璃基板等基板進行測 【先前技術】 作為上述基板敎裝置之-種，制用㈣定基板表面 上兩點間距離之測長機（參照專利文⑴）。於該測長機中採 用以下結構，即沿著載置基板之平臺表面，設置有可於 X、γ方向移動之攝像部，利用該攝像部在對基板表面之 兩點進行攝像時，根據攝像部之移動量，測定該兩點間之 距離。 然而，近年來伴隨基板之大型化，於上述測長機中產生 以下問題，即載置於平臺上之基板與平臺一併彎曲，無法 進行正確之測長作業。又，利用如此基板所製作之印刷基 Φ 板或玻璃基板’通常於朝向垂直方向之狀態下使用，故於 將基板載置於水平方向之情形及朝向垂直方向之情形時， 基板變形之產生方法不同。 另一方面，於專利文獻2中，揭示有於朝向垂直方向之 狀態下，檢查液晶顯示裝置之檢查裝置。 [專利文獻1]日本專利特開2005-30879號公報 [專利文獻2]曰本專利特開2004-294271號公報 [發明所欲解決之問題] 於專利文獻2之檢查裝置中，分別配置有支持液晶顯示 110062.doc 1285728 裝置之平臺及攝像機構。於該檢查裝置中，當液晶顯示裝 置（基板）較小型時，未產生問題，但是當液晶顯示裝置大 型化時，出現液晶顯示裝置或平臺產生變形，故必須調整 攝像機構之相對位置之問題。特別是，於包含沿著載置基 板之平堂表面可於X、γ方向移動之攝像部之基板測定裝 置中，必須考慮平臺變形與攝像部位置之間的關係。 本發明係為解決上述課題研製而成者，其目的在於提供 一種於基板大型化時亦可正確測定基板之基板測定裝置。 【發明内容】 言月求項1之基板測定裝置，其特徵在於包含··基部；平 至邛其不爻到來自上述基部之應力，於其表面於對於垂 直方向具有微小角度之傾斜狀態下，由上述基部加以支 持；基板支持構件，其配設於用卩支持應測定之基板下端 部的上述平臺部之下方；樂台，其利用設置於上述平臺部 上部與下部之引導構件之引導，而可沿著上述平臺部之表 面於左右方向移動；以及攝像部，其利用設置於上述架台 之引導構件之引導，而可沿著上述架台於上下方向移動。口 j求項2如請求項！之基板測定裝置，#中於設定以上述 :臺:之表面為X、Y方向之三軸座標系日夺，上述基部包 含·第1支持部，其於限定上述平臺部在X、Y、Z方向上 移動於上述基部之狀態下，支持上述平臺部，·第2支持 部’、Μ限定上述平臺部在γ、ζ方向上移動於上述基部 之狀恶了 ’支持上述平臺部；以及第3支持部，其於限定 上述平至σ卩在Z方向上移動於上述基部之狀態下，支持上 110062.doc 1285728 述平臺部。 請求項3如請求们或請求項2之基板測定裝置，其中包 含：配設於上述平臺部之測定上述架台位置之線性標度 尺；以及配設於上述架台之測定上述攝像部位置之線性標 度尺。 。月求項4之基板測定裝置，其特徵在於其係對形成於基 板上之圖案進行攝像，並根據所攝之圖像而測定上述圖 案-中包含·基部；平臺部，於其表面對於垂直方向呈 有微小角度之傾斜狀態下，被支持於上述基部；支持機 ，·’設置於上述平臺部，並將上述基板支持於上述平臺 卩以及攝像部，設置於上述平臺部，並平行移動於保持 在上述平臺部之基板表面，上述平臺部在對於上述基台可 進:微小移動之狀態下被支持’以容許該平臺部變動。 睛求項5如請求項4之之基板測定裝置，其中上述支持機 構係導向幸昆，其為支持基板之下端部而可旋轉地配設於上 述平臺部之下端側，並於周面上包含用以引導基板之凹 部。 凊求項6係於請求項5之基板測定裝置，進而包含：待機 位置，其上端配置於較上述導向輥之上端偏向下方之處； 以及升降李昆，其上端在較上述導向輕之上端㉟向上方處所 配置之支持位置之間升降，並提昇至較由上述導向輥支持 之基板與上述導向輥所抵接之位置偏向上方。 、請求項7如請求項4之基板測定裝置，其中上述支持機構 進而包含多個導向輕’其於支持上述平臺部上之上述基板 110062.doc 1285728 ，之支持面内，支持上逃基板之背面側。 π求項8如請求項7之基板測定裝置，基中上述支持機構 著保:機構，藉由對上述基板之吸著保持而吸 輥^在ά述平臺部上’而支持上述基板之背面側之導向 内把。上相持機構進行吸著動作時，退避於平臺部 含請==項4之基板測定裝置，上述基台包 ° 、°卩，支持上述平臺部之下端部；以及上方 持部，支持較該下端部離開上 支持部於上述平臺部表面之面…方:Ρ上述下端部 其可於水平方向進行微 肖上述平臺部，以使 …IT 上述上方支持部以使上述 支持、：室部不產生上述微小角度以上之傾斜方式加以 =並：於上述平臺部表面之面内方向以可微小移動之 方式加以支持。 請求項Η)如請求項9之基板測定裝置，其中於上述上方 ==進而設置有將上述基台與上述平臺部進行連接之連 接機構’以使上述平臺部不倒向與上述傾斜方向之相反方 向’且不阻礙上述微小移動。 [發明之效果] 根據請求項卜請求項2及請求項4之基板測定裳置，加 台由設置於不受到應力而被支持之平臺部之引導構件戶斤弓二 導’而攝像部沿著該架台移動’故於基板大型化時， 正確測定基板。 根據請求項3之基板測定裝置，可正確測定攝像部之移 110062.doc 1285728 動量。 根據巧求項5至請求項7之基板測定裝置，可易於支持基板。 根據請求項8之基板測定裝置，可將基板可靠地吸著保 持於平臺上。 根據請求項9之基板測定裝置，可穩定支持平臺部。 根據請求項10之基板測定裝置，可防止平臺部歪倒。 【實施方式】 以下根據圖式對本發明之實施形態進行說明。圖j係 本發明之基板測定裝置之測長機前視圖。圖2係其側視 圖，圖3係其平面圖。再者，圖3中，僅表示出第1支持構 件11及平臺部15之主要部分，省略其他構件。 孩測長機包合·基部1 〇，其包含第丨支持構件丨丨、第2支 持構件12及基礎構件13 ;平臺部14，由該基部1〇所支持； 架台15,可沿著平臺部14之表面於左右方向移動；以及攝 像部18，其包含相互連接之攝像單元16及移動構件17，並 可沿著架台1 5於上下方向移動。 再者，於本說明書中，如圖〗至圖3所示，設定以上述平 臺部14之表面為X、γ方向之三軸座標系’並將沿著平臺 部14之表面之左右方向設為又方向’將沿著平臺部μ之表 面之上下方向設為γ方向，將垂直於平臺部14之表面之方 向設為Ζ方向。而本說明書中’根據需要’亦將乂方向稱 為左右方向，或者將Υ方向稱為上下方向。 上述基部10包含··第i支持部91，其於限定平臺部14在 X、Y、2方向上移動於基部〗〇之狀態下，支持平臺部14 110062.doc -10- 1285728 第2支持部92，其於限定平臺部14在丫、2方向上移動於基 部10之狀態下，支持平臺部14 ;以及第3支持部93，其於 限定平臺部14在Z方向上移動於基部1〇之狀態下，支持平 臺部14。平臺部14於其表面對垂直方向具有微小角度之傾 斜狀態下，藉由基部1 0而支持。 圖4係表示第1支持部91、第2支持部92及第3支持部93之 說明圖。 參照圖1及圖4(a)，於基部1〇之第2支持構件12之右側上 部’配設有抵接零件2 1。於該抵接零件2 1上，形成有剖面 呈V字狀之圓錐形凹部24。又，於平臺部14之右側下部， 配設有抵接零件22。於該抵接零件22上，亦形成有剖面呈 V字狀之圓錐形凹部25。繼而，於該等凹部24、25之間， 配設有銅球23。因此，因自身重量而載置於基部1〇上之平 臺部14 ’於限定平臺部14在X、Y、Z方向上移動於基部1〇 之狀態下’由支持部19加以支持。 參照圖1及圖4(b)，於基部10之第2支持構件12之右側上 部，配設有抵接零件26。於該抵接零件26上，形成有剖面 呈V字狀之圓錐形凹部29。又，於平臺部14之左側丁部， 配設有抵接零件27。於該抵接零件27上，形成有剖面大致 呈〕狀之大致半圓柱形凹部3 1。繼而，於該等凹部29、3 i 之間，配設鋼球28。因此，因自身重量而載置於基部丨〇上 之平臺部14，在X方向上可移動於基部10，而於限定平臺 部14在Y、Z方向上移動於基部10之狀態下，亦利用支持 部9 2加以支持。 110062.doc 12857281285728 • Ninth, the invention is related to the invention. As a kind of the above-mentioned substrate crucible device, a measuring machine for (4) the distance between two points on the surface of the substrate is used (refer to Patent (1)). In the length measuring machine, an imaging unit that can move in the X and γ directions is provided along the surface of the platform on which the substrate is placed, and the imaging unit performs imaging based on two points on the surface of the substrate. The amount of movement of the part, the distance between the two points is determined. However, in recent years, with the increase in the size of the substrate, the above-described length measuring machine has a problem that the substrate placed on the stage is bent together with the stage, and the correct length measurement operation cannot be performed. Moreover, the printing substrate Φ plate or the glass substrate 'made by the substrate is generally used in a state of being oriented in the vertical direction. Therefore, when the substrate is placed in the horizontal direction and in the vertical direction, the substrate is deformed. different. On the other hand, Patent Document 2 discloses an inspection apparatus for inspecting a liquid crystal display device in a state of being oriented in a vertical direction. [Patent Document 1] Japanese Laid-Open Patent Publication No. 2005-30879 (Patent Document 2) Japanese Patent Laid-Open Publication No. 2004-294271 (Problem to be Solved by the Invention) In the inspection apparatus of Patent Document 2, support is separately provided. LCD 110062.doc 1285728 Platform and camera mechanism. In the inspection apparatus, when the liquid crystal display device (substrate) is small, no problem occurs, but when the liquid crystal display device is enlarged, the liquid crystal display device or the stage is deformed, so that the relative position of the image pickup mechanism must be adjusted. In particular, in the substrate measuring apparatus including the imaging unit movable in the X and γ directions along the flat surface of the substrate, it is necessary to consider the relationship between the deformation of the stage and the position of the imaging unit. The present invention has been made to solve the above problems, and an object of the invention is to provide a substrate measuring apparatus capable of accurately measuring a substrate when the substrate is enlarged. According to a second aspect of the invention, a substrate measuring apparatus according to the first aspect of the present invention is characterized in that: the base portion is included; the stress is from the base portion, and the surface thereof is inclined at a slight angle to the vertical direction. Supported by the base portion; the substrate supporting member is disposed below the platform portion for supporting the lower end portion of the substrate to be measured; and the music table is guided by the guiding members provided on the upper portion and the lower portion of the platform portion, and The surface of the platform portion is movable in the left-right direction; and the imaging portion is movable in the vertical direction along the gantry by guiding by a guiding member provided on the gantry. Port j item 2 as requested! In the substrate measuring device, the three-axis coordinate system in the X and Y directions is set on the surface of the table: the base includes a first support portion, and the platform portion is defined by X, Y, and Z. Supporting the platform portion in a state of moving in the direction of the base portion, the second support portion ′, and the ridge defining the platform portion to move in the γ and ζ directions to the base portion to support the platform portion; and the third portion The support portion supports the platform portion of 110062.doc 1285728 in a state in which the flat to σ卩 is moved to the base in the Z direction. The substrate measuring device of claim 2 or claim 2, comprising: a linear scale disposed on the platform portion for measuring the position of the gantry; and a linear scale disposed on the gantry for measuring the position of the imaging portion a. . A substrate measuring apparatus according to the fourth aspect, wherein the pattern formed on the substrate is imaged, and the pattern is included in the pattern based on the captured image; the base portion is on the surface, and the surface is perpendicular to the surface Supporting the base portion in a tilted state with a slight angle; the support device is disposed on the platform portion, and supports the substrate on the platform and the imaging portion, and is disposed on the platform portion and moves in parallel to maintain On the surface of the substrate of the platform portion, the platform portion is supported in a state in which the base portion can be moved slightly to allow the platform portion to be changed. The substrate measuring device according to claim 4, wherein the support mechanism is guided to the sturdy, which is rotatably disposed on the lower end side of the platform portion to support the lower end portion of the substrate, and is included on the circumferential surface a recess for guiding the substrate. The request item 6 is the substrate measuring device of claim 5, further comprising: a standby position, wherein the upper end is disposed below the upper end of the guide roller; and the lifting and lowering is at an upper end 35 of the lower end than the guiding light The support position disposed at the upper portion is raised and lowered, and raised to a position higher than a position at which the substrate supported by the guide roller and the guide roller abut. The substrate measuring device of claim 4, wherein the supporting mechanism further comprises a plurality of guiding light plates supported on the substrate 110062.doc 1285728 on the platform portion, and supporting the back surface of the substrate side. The substrate measuring device according to claim 7, wherein the support mechanism is provided with a mechanism for supporting the back side of the substrate by sucking and holding the substrate while the suction roller is on the platform portion The guide is inside. When the upper holding mechanism performs the absorbing operation, the substrate measuring device including the == item 4 is retracted from the platform portion, and the base package includes a lower end portion of the platform portion and a lower holding portion for supporting the lower end portion. a portion away from the surface of the upper support portion on the surface of the platform portion. The bottom portion of the upper support portion is vertically slidable in the horizontal direction so that the upper support portion of the IT is such that the support portion and the chamber portion do not generate the above The tilting method above the micro angle is used to control the in-plane direction of the surface of the platform portion so as to be minutely movable. The substrate measuring device according to claim 9, wherein the above-mentioned upper== is further provided with a connecting mechanism for connecting the base and the platform portion such that the platform portion does not reverse to the opposite direction The direction ' does not hinder the above slight movement. [Effects of the Invention] According to the request item 2 and the request item 4, the substrate is placed, and the mounting unit is provided by a guide member provided on a platform portion that is not supported by the stress, and the image pickup portion is along When the gantry moves, the substrate is accurately measured when the substrate is enlarged. According to the substrate measuring device of claim 3, the movement of the imaging unit can be accurately measured. 110062.doc 1285728 Momentum. According to the substrate measuring device of the above item 5 to claim 7, the substrate can be easily supported. According to the substrate measuring apparatus of claim 8, the substrate can be reliably sucked and held on the stage. According to the substrate measuring device of claim 9, the platform portion can be stably supported. According to the substrate measuring device of claim 10, the platform portion can be prevented from tripping over. [Embodiment] Hereinafter, embodiments of the present invention will be described based on the drawings. Figure j is a front view of the length measuring machine of the substrate measuring device of the present invention. Fig. 2 is a side view thereof, and Fig. 3 is a plan view thereof. In addition, in Fig. 3, only the main portions of the first support member 11 and the platform portion 15 are shown, and other members are omitted. The child machine includes a base member 1 , which includes a second support member 丨丨, a second support member 12 and a base member 13 , a platform portion 14 supported by the base portion 1 , and a gantry 15 along the platform portion The surface of 14 is moved in the left-right direction; and the imaging unit 18 includes the imaging unit 16 and the moving member 17 connected to each other, and is movable in the vertical direction along the gantry 15. Further, in the present specification, as shown in FIG. 3 to FIG. 3, the three-axis coordinate system 'in the X and γ directions on the surface of the platform portion 14 is set and the left and right directions along the surface of the platform portion 14 are set. Further, the direction ' is set to the γ direction along the upper and lower directions of the surface of the land portion μ, and the direction perpendicular to the surface of the land portion 14 is set to the Ζ direction. In the present specification, the "direction" is also referred to as the left-right direction, or the Υ direction is referred to as the up-and-down direction. The base portion 10 includes an i-th support portion 91 that supports the platform portion 14 in a state where the platform portion 14 is moved in the X, Y, and 2 directions in the X, Y, and 2 directions. 110062.doc -10- 1285728 2nd support portion 92. The support platform portion 14 and the third support portion 93 move in the Z direction to the base portion 1 in a state where the limited platform portion 14 moves in the 丫 and 2 directions to the base portion 10; and the third support portion 93 In the state, the platform unit 14 is supported. The platform portion 14 is supported by the base portion 10 in a state where the surface thereof has a slight angle to the vertical direction. 4 is an explanatory view showing the first support portion 91, the second support portion 92, and the third support portion 93. Referring to Fig. 1 and Fig. 4(a), abutting member 2 1 is disposed on the upper right side of the second support member 12 of the base member 1'. A conical recess 24 having a V-shaped cross section is formed in the abutting part 2 1 . Further, a contact member 22 is disposed on the lower right side of the platform portion 14. A conical recess 25 having a V-shaped cross section is also formed on the abutting member 22. Then, a copper ball 23 is disposed between the recesses 24 and 25. Therefore, the platform portion 14' placed on the base portion 1 by its own weight is supported by the support portion 19 while the defined platform portion 14 is moved to the base portion 1 in the X, Y, and Z directions. Referring to Fig. 1 and Fig. 4(b), abutting member 26 is disposed on the upper right side of the second support member 12 of the base portion 10. A conical recess 29 having a V-shaped cross section is formed in the abutting member 26. Further, a contact member 27 is disposed on the left side of the platform portion 14. On the abutting member 27, a substantially semi-cylindrical recess 31 having a substantially U-shaped cross section is formed. Next, a steel ball 28 is disposed between the recesses 29, 3 i. Therefore, the platform portion 14 placed on the base portion by its own weight can be moved to the base portion 10 in the X direction, and is also utilized in a state in which the defined platform portion 14 moves in the Y and Z directions to the base portion 10. Support is supported by the support unit 92. 110062.doc 1285728

參照圖2、® 3及圖4(c)，於基部1〇之第i支持 央上部，S&設有抵接零件32 1抵接零㈣之平臺部_ 之表面為平坦面。又，於平臺部14之背面側中央上部，形 成有剖面呈v字狀之圓錐形凹部34。、繼而，在抵接交件^ =坦面與凹部32之間’配設有鋼球33。@此，因^身重 量而亦載置於第1支持構件丨丨侧之平臺部14，在χ、γ方向 上可移動於基部1()，而於限^平臺部14在2方向上移動二 基部10之狀態下，亦利用支持部92加以支持。 再者，如圖3所示，於平臺部14之上部，配設有歪倒防 止螺栓47’用以防止平臺部14因某些原因而倒向面前側。 又’同樣亦配設有下落防止螺栓（未圖示），用以使平臺部 14不會從第〗支持部91及第2支持部％脫落。 即，上述歪倒防止螺栓47容許平臺部14向乂丫方向進行 ，小移動’但於平臺部14未離開基部1G特定以上距離之狀 也下，可限定使鋼球33不會從凹部34脫落。再者，替代該 下落防止螺栓，例如，亦可利用鏈或線連接平臺部14與基 部10 〇 藉由包含上述結構之第1支持部91、第2支持部92以及第 支持邛93對平臺部14加以支持，使平臺部丨4不受到來自 之基部10之應力，於其表面對於垂直方向具有微小角度之 傾斜狀怨下，由基部10支持。此處，「不受到來自基部之 應力」係扣根據上述結構，例如根據因溫度變化而引起伸 縮率之差異，於基部10或平臺部14產生變形時，平臺部14 亦不受到因基部10之變形而產生之應力。 110062.doc -12- 1285728 ' 換言之，即使於平臺部14產生因溫度或重力等而引起之 變形或尺寸變動時，平臺部14於僅可移動微小距離之狀態 下被支持於基部1 〇，以使可容許其變動（可吸收變動量）。 再者，上述支持部93之位置，考慮支持之穩定性，可位 於較支持基板1〇〇之下端之支持部91、92往上方離開特定 距離以上之位置，較好的位置為平臺部14之上端側之中央 部附近。但是，亦可將支持部93於例如平臺部14之左右兩 籲㈣分開配置兩點以上，於兩點以上支持平臺部14。然而， 使支持部93具有多個之情形下，因考慮到會產生各支持部 ;方向之位置不一致，故較好的是，於支持部Μ上設 置Z方向之位置調整機構，例如抵接零件“之位置調整 構等。 入 又狩限定於XYZ方向上移動，而平臺部14在不 離開基部H)之限度内，與支持部92同樣地，亦可為以於χ 方向上進行微小移動之方式加以支持之結構。而且亦可以 將支持部92設置兩點以上，將平臺部14之下端設三點以上 之方式加以支持。作為上述變形例，例如，亦可載置平臺 部14’使其在構成於輥上之基部1()上，可於χ方向上產生 動。當然’將平臺部14之下端以同樣方式抵接於親 料产=加以支持’在機械精度方面較為困難，故因機械 月又產生變形問題時，如上述實施形g，亦可如 91、92之方式輯限定之多處支持平臺部U之下端。 再次參照圖I至圖3，於平臺部14之表面 向輕41，其與基板_之背面相抵接，並彳丨導絲氣·Γ 110062.doc 1285728 及多個導向輥42 ’其與基板100之下端相抵接，並引導基 板 100 〇 圖5係表不基板100與導向輥41、42之關係之說明圖。 導向輥41配置於其外周面自平臺部14之表面僅突出一部 刀之位置。又，導向輥42配置於可支持基板1〇〇之下端部 之位置。於導向輥42上，形成有用以可靠支持基板1〇〇之 下端部之凹部。該等導向輥41藉由未圖示之驅動機構，可Referring to Fig. 2, Fig. 3, and Fig. 4(c), the surface of the platform portion _ where the abutting member 32 1 abuts zero (4) is a flat surface at the upper portion of the i-th support portion of the base portion 1A. Further, a conical concave portion 34 having a v-shaped cross section is formed on the upper center portion of the back side of the platform portion 14. Then, a steel ball 33 is disposed between the abutting piece ^=the face and the recess 32'. @This is also placed on the platform portion 14 on the side of the first support member due to the weight of the body, and is movable in the χ and γ directions to the base portion 1(), and is moved in the 2 direction in the restriction platform portion 14. In the state of the second base 10, it is also supported by the support unit 92. Further, as shown in Fig. 3, on the upper portion of the platform portion 14, a tripping prevention bolt 47' is provided to prevent the platform portion 14 from falling to the front side for some reason. Further, a drop preventing bolt (not shown) is also provided so that the platform portion 14 does not fall off from the first support portion 91 and the second support portion. In other words, the trip prevention bolt 47 allows the platform portion 14 to be moved in the 乂丫 direction and moves small. However, the platform portion 14 is not separated from the base portion 1G by a predetermined distance or more, and the steel ball 33 can be prevented from falling off the recess portion 34. . Further, instead of the drop preventing bolt, for example, the platform portion 14 and the base portion 10 may be connected by a chain or a wire, and the first support portion 91, the second support portion 92, and the first support portion 93 including the above-described structure may be used for the platform portion. 14 is supported so that the platform portion 4 is not subjected to the stress from the base portion 10, and is inclined by a slight angle on the surface thereof in the vertical direction, and is supported by the base portion 10. Here, "the stress from the base portion is not buckled" according to the above configuration, for example, depending on the difference in the expansion ratio due to the temperature change, when the base portion 10 or the platform portion 14 is deformed, the platform portion 14 is not subjected to the base portion 10 The stress generated by the deformation. 110062.doc -12- 1285728 ' In other words, even when the platform portion 14 is deformed or changed in size due to temperature, gravity, or the like, the platform portion 14 is supported by the base portion 1 in a state where only a small distance can be moved, It is allowed to change (the amount of variation can be absorbed). Further, the position of the support portion 93 may be located at a position above the support portion 91, 92 at a lower end of the support substrate 1 from a predetermined distance or more in consideration of the stability of the support portion, and the position is preferably the platform portion 14. Near the center of the upper end side. However, the support unit 93 may be arranged at two or more points, for example, on the left and right sides of the platform unit 14, and the platform unit 14 may be supported at two or more points. However, when there are a plurality of support portions 93, since it is considered that each support portion is generated and the positions of the directions do not coincide with each other, it is preferable to provide a position adjustment mechanism in the Z direction on the support portion, for example, abutting parts. "The position adjustment structure, etc. is limited to move in the XYZ direction, and the platform portion 14 does not leave the base portion H). Similarly to the support portion 92, it is possible to perform minute movement in the χ direction. The support unit 92 may be provided with two or more points, and the lower end of the platform unit 14 may be provided with three or more points. As the above-described modification, for example, the platform unit 14' may be placed thereon. In the base portion 1 () formed on the roller, movement can be generated in the χ direction. Of course, 'the lower end of the platform portion 14 is abutted in the same manner as the parent product = support" is more difficult in terms of mechanical precision, When the mechanical month is deformed again, as in the above-described embodiment, the lower end of the support platform portion U may be defined as in the manner of 91, 92. Referring again to FIGS. 1 to 3, the surface of the platform portion 14 is light. 41, its base The back side of the _ is abutted, and the guide wire Γ 110062.doc 1285728 and the plurality of guide rollers 42' abut against the lower end of the substrate 100, and guide the substrate 100. FIG. 5 shows the substrate 100 and the guide roller 41. Description of the relationship between 42 and 42. The guide roller 41 is disposed on the outer peripheral surface of the outer surface of the platform portion 14 from the surface of the platform portion 14. Further, the guide roller 42 is disposed at a position below the bottom of the supportable substrate 1. A concave portion for reliably supporting the lower end portion of the substrate 1 is formed on the guide roller 42. The guide rollers 41 are provided by a driving mechanism not shown.

於圖5中實線所示之基板1〇〇之引導位置、與圖5中假設線 所示之退避位置之間移動。 再次參照圖！，於平臺部14之表面，配設有4個升降輥 43，其與基板100之下端部相抵接，並使基板ι〇〇升降。該 升降輥43之結構為，在其上端配置於較導向輥做上端偏 向下方之待機位置、與其上端配置於較導向輥42之上端偏 向上方之支持位置之間升降。又，於平臺部14之表面，形 成有未圖示之多個吸著孔。 在將基板100載置於平臺部14時，於將升降輥43配置於 待機位置之狀態下，將導向輥41、42配置於圖5中實線所 示之基板剛之引導位置，藉由該等導向輕41、42而引導 基板100。繼而，使升降輥43上升至支持位置為止。藉 此’由導向輥42所支持之基板1〇〇，成為由升降親a而^ 持。於該狀態下，將導向輥41配置於圖5中假設線所示之 基板⑽之引導位置，並且由形成於平臺㈣之表面之吸 著孔進行吸氣。藉此’基板1〇0於其下端部由升降輥43支 持之狀態下，吸著保持於平臺部14。 110062.doc -14- 1285728 上述導向輥42及升降輥43構成用以支持基板1〇〇之下端 部之本申請案的基板支持構件。 於平臺部14之表面，配設有一對向又方向延伸之導執 45。架台15由該導執45引導而可於X方向往返移動。又， 於平臺部14之表面，配設有與一對導執45平行之一對線性 標度尺46。架台15於X方向之位置，藉由一對線性標度尺 46而測定。再者，配設有一對線性標度尺钧，係為了校正 架台1 5之偏向。 如圖1及圖2所示，於平臺部14之上下兩端部，配設有線 性馬達之固定件51。又，如圖2所示，於架台15之背面， 配設有一對可動件52。架台15受到包含該等固定件5ι及可 動件52之線性馬達之驅動，而成為於χ方向往返移動之结 構。 ° 如圖1所示，於架台15之表面，配設有一對向¥方向延伸 之導執53。攝像部18中之移動構件17與攝像單元16一併， 由該導軌53引導’並可於Υ方向往返移動。又，於架台15 上’配設有與__對導軌53平行且省略圖示之線性標度尺。 攝像部18於γ方向之位置’藉由該線性標度尺而測定。 於架台15之表面，配設有線性馬達之固定件54。又，於 攝像。Ρ 18之移動構件17之背面，配設有可動件。攝像部η 受到包含該等固定件54及可動件之線性馬達之驅動，而成 為於Υ方向往返移動之結構。 圖0係攝像單元16之概要圖。 /攝像單兀16之結構為，藉由高倍率用ccd照相機㈠或 110062.doc -15- 1285728 低倍率用CCD照相機62，對同軸落射照明所照射之基板 1〇〇之圖像進行攝像。 即，從光源63出射之光，穿過一對透鏡64，於半鏡面65 上反射以後，經由物鏡66照射至吸著保持於平臺部14之表 面之基板100。繼而，於基板1〇〇之表面反射之光，穿過物 鏡66及半鏡面65以後，於鏡面67反射，併入射至半鏡面 68。入射至半鏡面68之光中一半，穿過半鏡面68，並穿過 φ 光學放大系統69以後，入射至CCD照相機61。另一方面， 入射至半鏡面68之光中剩餘一半，於半鏡面68反射，進而 於鏡面71反射以後，入射至CCD照相機62。 藉由具有以上結構之測長機測定基板1 〇〇中圖案之長度 時’於使基部100吸著保持於平臺部14之狀態下，利用攝 像單元16對基板1 00上之兩點進行攝像。繼而，藉由線性 標度尺46對攝像部18於X方向之移動量之測定、以及設置 於架台15之線性標度尺對攝像部18於¥方向之移動量之測 φ 定’而計算兩點間之距離。 此時，平臺部14不受到來自基部10之應力，於其表面對 於垂直方向具有微小角度之傾斜狀態下，由基部10加以支 持’架台15藉由未受到應力之平臺部14而於左右方向被引 導’進而，由於使攝像部18於架台15上在上下方向移動， 故當基板1 〇〇大型化時，可縮小裝置之底部空間，並可正 確進行基板100之測定。 再者，於上述實施形態中，採用以攝像單元丨6之光源63 對基板100進行照明，並對基板1〇〇之表面之反射光進行攝 110062.doc -16- 1285728 像的結構。然而，藉由以透過性材料構成平臺部14，或者 於平堂部14之中央形成開口部，而亦可採用對透過基板 100之光進行攝像之結構。 進而，上述實施形態中，於測定基板1〇〇上兩點間距離 等之測長機使用本發明，本發明亦可適用於基板檢查裝置 等其他基板測定裝置。 【圖式簡單說明】 圖1係本發明之基板測定裝置之測長機前視圖。 圖2係本發明之基板測定裝置之測長機側視圖。 圖3係本發明之基板測定裝置之測長機平面圖。 圖4UHc)係表示第i支持部91、第2支持部92及第3支持 部93之說明圖。 圖5係表示基板1〇〇與導向輥41、42之關係之說明圖。 圖6係攝像單元16之概要圖。 【主要元件符號說明】 10 基部 11 第1支持構件 12 第2支持構件 13 基礎構件 14 平臺部 15 架台 16 攝像單元 17 移動構件 18 攝像部 110062.doc -17- 1285728The guide position of the substrate 1 shown by the solid line in Fig. 5 is moved between the guide position shown by the line in Fig. 5 and the retracted position shown by the assumed line in Fig. 5. Refer to the figure again! On the surface of the platform portion 14, four lifting rollers 43 are disposed to abut against the lower end portion of the substrate 100, and the substrate is lifted and lowered. The lift roller 43 is configured such that the upper end thereof is disposed at a standby position that is lower than the upper end of the guide roller, and is raised and lowered between the support position at which the upper end is disposed above the upper end of the guide roller 42. Further, a plurality of suction holes (not shown) are formed on the surface of the platform portion 14. When the substrate 100 is placed on the land portion 14, the guide rollers 41 and 42 are placed at the guiding position of the substrate shown by the solid line in FIG. 5 in a state where the lifting roller 43 is placed at the standby position. The substrate 100 is guided by the light guides 41, 42. Then, the lift roller 43 is raised to the support position. By this, the substrate 1 supported by the guide roller 42 is held by the lifter a. In this state, the guide roller 41 is disposed at the guiding position of the substrate (10) indicated by the assumed line in Fig. 5, and is sucked by the suction hole formed on the surface of the stage (4). Thereby, the substrate 1〇0 is sucked and held by the land portion 14 in a state where the lower end portion thereof is supported by the lift rollers 43. 110062.doc -14- 1285728 The above-described guide roller 42 and lifting roller 43 constitute a substrate supporting member of the present application for supporting the lower end portion of the substrate 1〇〇. On the surface of the platform portion 14, a pair of guides 45 extending in the direction of the direction are disposed. The gantry 15 is guided by the guide 45 and is reciprocally movable in the X direction. Further, on the surface of the platform portion 14, a pair of linear scales 46 parallel to the pair of guides 45 are disposed. The position of the gantry 15 in the X direction is measured by a pair of linear scales 46. Furthermore, a pair of linear scales are provided to correct the deflection of the stand 15 . As shown in Figs. 1 and 2, a fixing member 51 for a linear motor is disposed at both upper and lower ends of the platform portion 14. Further, as shown in FIG. 2, a pair of movable members 52 are disposed on the back surface of the gantry 15. The gantry 15 is driven by a linear motor including the fixing members 5 and the movable member 52, and is configured to reciprocate in the χ direction. ° As shown in Fig. 1, on the surface of the gantry 15, a pair of guides 53 extending in the direction of the ¥ are disposed. The moving member 17 in the imaging unit 18 is guided by the guide rail 53 together with the imaging unit 16, and is reciprocally movable in the x-direction. Further, a linear scale which is parallel to the guide rail 53 and which is not shown in the figure is disposed on the gantry 15. The position of the imaging unit 18 in the γ direction is measured by the linear scale. On the surface of the gantry 15, a fixing member 54 of a linear motor is disposed. Also, in the camera. The movable member 17 of the cymbal 18 is provided with a movable member. The imaging unit η is driven by a linear motor including the fixing member 54 and the movable member, and is configured to reciprocate in the Υ direction. FIG. 0 is a schematic diagram of the imaging unit 16. The structure of the camera unit 16 is such that the image of the substrate illuminated by the coaxial epi-illumination is imaged by the CCD camera 62 at a low magnification with a ccd camera (1) or 110062.doc -15-1285728 at a high magnification. That is, the light emitted from the light source 63 passes through the pair of lenses 64, is reflected by the half mirror 65, and is then irradiated to the substrate 100 sucked and held by the surface of the stage portion 14 via the objective lens 66. Then, the light reflected on the surface of the substrate 1 passes through the objective lens 66 and the half mirror 65, is reflected by the mirror surface 67, and is incident on the half mirror 68. Half of the light incident on the half mirror 68 passes through the half mirror 68 and passes through the φ optical amplifying system 69, and is incident on the CCD camera 61. On the other hand, the remaining half of the light incident on the half mirror surface 68 is reflected by the half mirror surface 68, and further reflected by the mirror surface 71, and then incident on the CCD camera 62. When the length of the pattern in the substrate 1 is measured by the length measuring machine having the above configuration, the two points on the substrate 100 are imaged by the image pickup unit 16 while the base portion 100 is sucked and held by the land portion 14. Then, the measurement of the amount of movement of the imaging unit 18 in the X direction by the linear scale 46 and the measurement of the amount of movement of the imaging unit 18 in the ¥ direction by the linear scale provided on the gantry 15 are calculated. The distance between the points. At this time, the platform portion 14 is not subjected to the stress from the base portion 10, and is supported by the base portion 10 in a state where the surface thereof has a slight angle with respect to the vertical direction. The gantry 15 is supported in the left-right direction by the unstressed platform portion 14. Further, since the imaging unit 18 is moved in the vertical direction on the gantry 15, when the substrate 1 is enlarged, the bottom space of the device can be reduced, and the measurement of the substrate 100 can be performed accurately. Further, in the above embodiment, the substrate 100 is illuminated by the light source 63 of the image pickup unit ,6, and the reflected light on the surface of the substrate 1 is imaged by taking a picture of 110062.doc -16 - 1285728. However, by forming the land portion 14 with a transparent material or forming an opening portion at the center of the flat portion 14, it is also possible to adopt a structure for imaging light transmitted through the substrate 100. Further, in the above embodiment, the length measuring machine for measuring the distance between two points on the substrate 1 is used in the present invention, and the present invention is also applicable to other substrate measuring devices such as a substrate inspection device. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a front view of a length measuring machine of a substrate measuring device of the present invention. Fig. 2 is a side view of the length measuring machine of the substrate measuring apparatus of the present invention. Figure 3 is a plan view of the length measuring machine of the substrate measuring apparatus of the present invention. 4UHc) is an explanatory view showing the i-th support portion 91, the second support portion 92, and the third support portion 93. Fig. 5 is an explanatory view showing the relationship between the substrate 1A and the guide rolls 41, 42. FIG. 6 is a schematic diagram of the image pickup unit 16. [Main component symbol description] 10 Base 11 First support member 12 Second support member 13 Base member 14 Platform unit 15 Stand 16 Camera unit 17 Moving member 18 Camera unit 110062.doc -17- 1285728

21 抵接零件 22 抵接零件 23 鋼球 24 凹部 25 凹部 26 抵接零件 27 抵接零件 28 鋼球 29 凹部 31 凹部 32 抵接零件 33 鋼球 34 凹部 41 導向輥 42 導向幸昆 43 升降輥 45 導軌 46 線性標度尺 47 歪倒防止螺栓 51 固定件 52 可動件 53 導軌 54 可動件 61 CCD照相機 110062.doc •】8 · 1285728 62 66 91 92 93 100 CCD照相機 物鏡 第1支持部 第2支持部 第3支持部 基板 110062.doc -19-21 Abutment part 22 Abutment part 23 Steel ball 24 Recessed part 25 Recessed part 26 Abutment part 27 Abutment part 28 Steel ball 29 Recessed part 31 Recessed part 32 Abutment part 33 Steel ball 34 Recessed part 41 Guide roll 42 Guided by the Kunlun 43 Lifting roll 45 Rail 46 Linear scale 47 Tripping prevention bolt 51 Fixing member 52 Movable member 53 Guide rail 54 Movable member 61 CCD camera 110062.doc • 8 · 1285728 62 66 91 92 93 100 CCD camera objective lens 1st support 2nd support The third support substrate 110062.doc -19-

Claims (1)

1285728 十、申請專利範圍： 1 · 一種基板測定裝置，其特徵在於包含： 基部； 平臺部，其不受到來自於上述基部之應力，於其表面 對於垂直方向成微小角度傾斜之狀態下，由上述基部加 以支持； 土板支持構件’其g己&於用以支持應進行測定之基板 I 之下端部的上述平臺部之下方； 架台，其藉由被設置於上述平臺部上部與下部之引導 構件所引導，而可沿著上述平臺部之表面於左右方向移 動；以及 攝像部，其藉由被設置於上述架台之引導構件所引 導，而可沿著上述架台於上下方向移動。 2·如請求項1之基板測定裝置，其中 於設定以上述平臺部之表面為χ、γ方向之三軸座標系 • 時， 上述基部包含： 第1支持部，其於相對於上述基部，限定上述平臺部 在X、Υ、Ζ方向上移動之狀態下，支持上述平臺部； 第2支持部，其於相對於上述基部，限定上述平臺部 在Υ Ζ方向上移動之狀態下，支持上述平臺部；以及 第3支持部，其於相對於上述基部，限定上述平臺部 在Ζ方向上移動之狀態下，支持上述平臺部。 3 ·如請求項1或2之基板測定裝置，其中包含： 110062.doc 1285728 配設於上述平臺部之測定上述架台位置之線性標度 尺； 配設於上述架台’測定上述攝像部位置之線性標度 尺。 4· 一種基板測定裝置，其特徵在於對形成於基板上之圖案 進行攝像，並根據所攝之圖像而測定上述圖案，其包 含·· 基部； 平臺部’於其表面對於垂直方向成微小角度傾斜之狀 態下，被支持於上述基部； 支持機構，設置於上述平臺部，並將上述基板支持於 上述平臺部；以及 攝像部，設置於上述平臺部，並對於保持在上述平臺 部之基板表面平行移動， 上述平室。卩在對於上述基台可進行微小移動之狀態下 被支持，以容許該平臺部之變動。 5·如請求項4之基板測定裝置，其中 上述支持機構係導向輥，其為支持基板之下端部而可 方疋轉地配設於上述平臺部之下端側，並於周面上包含用 以引導基板之凹部。 6.如請求項5之基板測定裝置，其中 進而包含升降輥，於其上端配置於較上述導向輥之上 端偏向下方處之待機位置，與其上端配置於較上述導向 輥之上端偏向上方處之支持位置之間升降，並將由上述 110062.doc 1285728 導向輥所支持之基板提昇至較與上述導向輥所抵接之位 置更偏向上方處。 7·如請求項4之基板測定裝置，其中 上述支持機構進而包含多個導向輥，其於支持上述平 臺部上之上述基板之面内，支持上述基板之背面側。 8 ·如請求項7之基板測定裝置，其中 上述支持機構進而包括吸著保持機構，其係藉由對上 述基板之吸著保持而吸著保持於上述平臺部上，且支持 上，基板之背面側之導向輥’在藉由上述保持機構進行 吸著動作時，退避於平臺部内。 9·如請求項4之基板測定裝置，其中 上述基台包含：下端部支持部，支持上述平臺部之下 端部；以及上方支㈣，支龍該下端 之上方部， ）上万離開 上述下端部支持部於上述平臺部表面之面内， 述平臺部’且使其可於水平方向進行微小移動，·、 上述上方支持部以使上述所支持之平臺部 Μ小角度以上之傾钭之太— 上述 騎，並且於上述平臺 口P表面之面内方向以可微 室 ,n f ^ f< 万式加以彡牲。 1〇_如鶴求項9之基板測定裝置，其令 、 於上述上方支持部進而設置有將上述基A 部進行連接之連接機構，％述平臺 傾钭方6 4 吏上述平堂部不倒 斜方向相反之方向，以不阻礙上述微小移動/、上述 J W062.doc1285728 X. Patent application scope: 1 . A substrate measuring device, comprising: a base portion; a platform portion which is not subjected to stress from the base portion, and wherein the surface thereof is inclined at a slight angle to a vertical direction, The base support is supported; the earth support member 'is below the platform portion for supporting the lower end portion of the substrate I to be measured; and the gantry is guided by the upper portion and the lower portion of the platform portion The member is guided to move in the left-right direction along the surface of the platform portion, and the imaging portion is guided in the vertical direction along the gantry by being guided by the guiding member provided on the gantry. 2. The substrate measuring apparatus according to claim 1, wherein the base portion includes: a first support portion that is defined with respect to the base portion when the surface of the platform portion is set to a three-axis coordinate system in the γ direction The platform unit supports the platform unit in a state of moving in the X, Υ, and Ζ directions; and the second support unit supports the platform in a state in which the platform unit is moved in the Ζ direction with respect to the base portion. And a third support portion that supports the platform portion while restricting movement of the platform portion in the x direction with respect to the base portion. The substrate measuring device according to claim 1 or 2, comprising: 110062.doc 1285728 a linear scale disposed on the platform portion for measuring the position of the gantry; and a linearity disposed on the gantry to determine the position of the camera portion Scale ruler. 4. A substrate measuring apparatus characterized in that a pattern formed on a substrate is imaged, and the pattern is measured based on the captured image, and includes a base portion; the platform portion has a slight angle to a vertical direction thereof a support mechanism is provided on the base portion; a support mechanism is disposed on the platform portion, and the substrate is supported by the platform portion; and an imaging portion is disposed on the platform portion and is on a surface of the substrate held on the platform portion Move in parallel, above the flat chamber.被 It is supported in a state where the base station can be slightly moved to allow the platform unit to be changed. The substrate measuring device according to claim 4, wherein the supporting mechanism is a guide roller that is rotatably disposed on a lower end side of the platform portion and supports the lower end portion of the substrate The concave portion of the substrate is guided. 6. The substrate measuring apparatus according to claim 5, further comprising a lifting roller, wherein the upper end is disposed at a standby position that is lower than an upper end of the guide roller, and the upper end is disposed at a position higher than an upper end of the guide roller. The position is raised and lowered, and the substrate supported by the above-mentioned 110062.doc 1285728 guide roller is lifted to a position higher than the position at which the above-mentioned guide roller abuts. The substrate measuring apparatus according to claim 4, wherein the supporting means further comprises a plurality of guide rollers that support the back side of the substrate in a surface supporting the substrate on the platform portion. 8. The substrate measuring device according to claim 7, wherein the supporting mechanism further comprises a absorbing holding mechanism that is absorbing and holding on the platform portion by absorbing and holding the substrate, and supporting the back surface of the substrate The guide roller on the side is retracted from the platform portion when the suction operation is performed by the holding mechanism. 9. The substrate measuring device of claim 4, wherein the base comprises: a lower end support portion supporting the lower end portion of the platform portion; and an upper branch (four), an upper portion of the lower end of the branch, and tens of thousands of leaves the lower end portion The support portion is configured to be slightly movable in the horizontal direction in the surface of the surface of the platform portion, and the upper support portion is configured such that the supported platform portion is less than a small angle. The above-mentioned riding is carried out in the in-plane direction of the surface of the platform port P by a micro-compartment, nf ^ f < In the substrate measuring device of the above-mentioned item 9, the upper support portion is further provided with a connecting mechanism for connecting the base A portion, and the platform is tilted to the side of the flat portion. The direction of the opposite direction of the oblique direction so as not to hinder the above slight movement /, the above J W062.doc
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CN100535590C (en) 2009-09-02

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