TWI274786B - Cu-Ni-Si-Mg based copper alloy strip - Google Patents

Abstract

The objective of the present invention is to provide a Cu-Ni-Si-Mg based alloy which has excellent strength, electrical conductivity, stress relaxation resistance, bending workability, etching properties, wettability and plating properties, and can be stably produced. The Cu-Ni-Si-Mg based copper alloy strip is composed of a copper based alloy having a composition containing 1.0 to 4.0 mass% Ni, Si in the content of 1/6 to 1/4 of the mass% concentration of Ni, and 0.05 to 0.3 mass% Mg, and the balance Cu with inevitable impurities, and is characterized in that, in the cross-section parallel to the rolling direction, Ni-Si based compounds have distributed conditions of the following (1) and (2). (1) The number of the Ni-Si based compound grains with a grain size of 10 to 20 mum is <= 2 PIECES/MM<2>. (2) The number of the Ni-Si based grain groups with a length of 0.05 to 1.0 mm is <= 2 PIECES/MM<2> among the Ni-Si based grain groups composed of the Ni-Si based compound grains with a grain size of 2 to 20 mum.

Description

1274786 IX. OBJECTS OF THE INVENTION: TECHNICAL FIELD The present invention relates to copper alloy strips, and more particularly to lead frames, connectors, terminals, relays, switches, etc. for semiconductor devices suitable for integrated circuits (1C) and the like. A copper alloy strip of conductive spring material. [Prior Art] Copper alloys for electronic materials used in wirework, terminals, connectors, etc., are required to have high strength and high electrical conductivity (heat transfer) in the basic properties of the alloy. In addition to these characteristics, bending workability, stress resistance resistance, adhesion to a plating layer, solder affinity, etching workability, punching property, corrosion resistance, and the like are also required. On the other hand, with the recent miniaturization and high integration of electronic components, the number of pins of the wire, the connector, and the like have continued to increase, and the shape of the pin is gradually reduced by π ′ and 70 pieces are complicated. At the same time, the requirements for the disc . Based on this background, the above-mentioned requirements for the properties of the copper-based materials are also becoming higher and higher. From the viewpoint of the strength of the earth and the conductivity of the bismuth, the use of copper alloys for electronic materials has been used in the case of solid solution-reinforced cups represented by bismuth bronze and brass, but the use of age-hardened copper alloys in recent years. The hardening type copper alloy is continuously increased in the use of the door (4). The supersaturated solid solution after the melting treatment is subjected to k-effect treatment, so that the precipitates are uniformly dispersed, and the strength of the alloy is increased, and The solid solution element in the copper is reduced, and the MW ^ 杈歼 conductivity is used. Therefore, the mechanical properties such as the strength of the net purchase characteristics can be obtained, and the electrical conductivity and thermal conductivity are good. Material: Cu-Nij彳 λ 糸 steel alloy in age hardening alloy, which is a representative copper alloy with high strength and high electrical conductivity, ρ香砍八冋强 u 1 is used in electronic machine crying materials. The copper alloy is used to extract fine Ni-Si intermetallic compound particles in the copper matrix to improve the strength and electrical conductivity. In the Cu-Ni-Si copper alloy, it is good. For mechanical properties, etc., additional elements other than Ni and Si are added. In particular, g' is a representative element added to Cu-Ni-Si beryllium copper alloy. The known additive effects include: (1) Lifting strength and stress relaxation resistance characteristics, soil, and properties (Japanese special edition) (13) The hot workability is improved. (3) Mg forms a vapor to capture oxygen, and the milk prevents the formation or coarsening of Si oxide during heat treatment (Japan) Special opening of the 10th 09_2〇9〇62 bulletin), etc. However, when adding force to the WSU copper alloy, although it can be improved

Strength and stress relaxation characteristics, but due to the A, the gold is easy to produce coarse inclusions, and there are problems such as writing, curved workability, Susie ^, and plating properties. If inclusions are present in the alloy, it is known that it has an adverse effect on the processing of the bow, the etching property, and the plating property.

The non-metallic inclusions of the Cu-Ni-Si-based copper alloys are not the non-metallic inclusions of the oxide or sulfide temples, the coarse r χτ. The Nl_Sl糸 compound of the ancestor 2 Kind

The production of Cu_N Bu Si_Mg is a y 丄 丄 丄 丄 丄 f f f f f f f f Μ Μ Si Si Si Si Si Si Si Si Si Si Si Si Si Si Si Si Si Si Si Si Si Si Si Si Si Si Si Si Si Si Si Si However, 曰本特开平〇5-〇5946S sister eight reduced to s, 8 5 tiger bulletin has revealed that if the 〇, s concentration -PPm or less, can inhibit the formation of MgO and MgS. Ϊ 274786 On the other hand, according to the study of Mizuno (such as Mizuno Masao, filial piety, extension of copper technique, Yi see Yinan, Xiaojia-297), if a series of steels contain a coarse Ni_ of about 15at% Mg If the handle / g is in the grain boundary, that is, if it is in CU-Ni-Si f, the object will start to grow. The compound will increase significantly. g 丨 丨 丨 Si Si Si 若 若 若 若 若 若 若 若 若 若 若 若 若 若 若 若 若 若 若 若 若 若 若 若 若 若 若 若 若 若 若 若 若 若 若 若 若 若 若 若 若 若 若 若 若 若 若 若 若 若 若2〇〇1-化人榀荣 a I is a copper s gold, which is controlled by Ni(Si) a substance-specific inclusions in 1()&quot;m debris number 喟敕 helmet Lu Wei / and 5 The number of clips of ~10 is 5 〇/匪2 in the cross section parallel to the rolling direction, which inhibits the influence of NbSi inclusions. [Patent Document 1] Japanese Laid-Open Patent Publication No. JP-A No. Hei. No. Hei. No. Hei. No. Hei. JP-A-2001-49369 (Non-Patent Document 1) Mizuno Masahiro, Yoshimi Yoshio, Ogura Tesaku, / Hyomoto Takashi's Research Institute of Copper Technology, vol. 38 (1999), p291_297 [Invention] Special Opening 2001- In the publication No. 49369, Cu_Ni_Si-Mg-based copper si' is disclosed, but the content thereof is applicable to an eu_Wi-Si-based copper alloy containing other metal components such as Zn, Sn, and Fe, that is, only one case is described, and 1274786 The conditions for the specific conditions of the Cu N Bu S Bu Mg system and the copper alloy are revealed. "The focus of the Νΐ·~ coarse particles is only the size of each particle: the average number. In addition, in order to make the size and number of inclusions in the alloy = the range required by the invention, it is necessary to manufacture high temperature. For a long time: 仃 愿 愿 愿 溶 溶 溶 溶 溶 溶 溶 溶 溶 溶 溶 溶 溶 溶 溶 溶 溶 溶 溶 溶 溶 溶 溶 溶 溶 溶 溶 溶 溶 溶 溶 溶 溶 溶 溶 溶 溶 溶 溶 溶 溶 溶The crystal of the CulS-Mg-based copper alloy strip is in a state of turbulence, and there is a problem that it is impossible to stably produce a product having a predetermined characteristic (strength, bending workability). Therefore, the object of the present invention is to solve the above problems. The second storage is provided with a CU_Nl-Sl, which is a copper alloy strip, which does not require high temperature, inter-turn hot rolling and solution treatment, etc., which causes an increase in manufacturing cost' and has excellent strength, electrical conductivity and stress resistance. The tempering property, the bending edging property, the _ sex, the affinity, the mineralization property, and the mineralization property can be manufactured in a smashing manner. The present inventors have, in order to achieve the above object, firstly, in order to differentiate from a new viewpoint, a Nl_Sl system Carrying out coarse particles In-depth study. That is, 'the focus of the Ni-Sl system coarse particles in the past, focusing only on the particle size and the average number, the present invention produces the following "particle group: Concept 2 while focusing on the Nl_Si system coarse particles Distribution state, and adjust the influence of a large particle group of Ni-Si system on the characteristics. Referring to Fig. 1 'Fig. 1 shows a collection of Ni_si coarse particles which can be observed by surface magnification using FE_SEM (electrolytic emission scanning electron microscope: manufactured by Philips) Representative form of the body. From the viewpoint of the cross section or the right-angle cross section parallel to the rolling direction, it is observed that the Ni-Si-based coarse particle aggregate of I274786 is arranged in the orthogonal direction of the thickness direction. The aggregate can form a subsequently defined system. Large particle group.

The Ni-Si coarse particle group has the following adverse effects on the characteristics. (1) When soldering, solder is hard to adhere to the particle group. (2) During the machining of the remainder, there will be particle residue, which will make the etched surface lose its smoothness. (3) When Ag, Ni, etc. are plated, a pinhole of plating is formed on the particle group. Further, sufficient plating adhesion strength cannot be obtained on the particle group, and peeling of the plating layer and swelling of the plating layer occur in this portion. (4) When bending, the particle group becomes the starting point of the crack, and the bending workability is deteriorated. (5) In the case of cold pressing delay, the particle group is the cause of the flaw, and the surface appearance is deteriorated. On the other hand, the present inventors simultaneously obtained the following recognition. (1) Regarding the particles having a particle diameter of 10 to 2 Å#m, if a dispersion distribution is formed, Lu will adversely affect the characteristics. However, if the control is 2 or 2 or less, the influence is negligible. (2) Particles having a particle diameter of 2 to 10/m have a small influence on the characteristics when they are dispersed, but if they are aggregated, they adversely affect the characteristics of the particle group. (7) Regarding particles having a particle size of less than m, even if they are aggregated, they exist as a particle group, and their influence on properties is still small. The present invention is based on the above-mentioned cognition, and provides a -CU-Ni-Si-Mg-based copper alloy strip using a copper-based alloy containing U~mass% of 127478.6 Ni, and a degree of disparity of only Ni mass% of concentration 1/ 6 to 1/4 of Si, 〇〇5 to 〇·3 mass% of Mg, and residual Cu and unavoidable impurities; in the cross section parallel to the ^ direction, the 'Ni_Sl 纟 compound particles have the condition (1) and the cloth state: (1) The particle size H) to the Ni-Si-based compound particles are 2 / _2 or less, and (7) the m_si-based particle group composed of the Nl_Si-based compound particles of the granules 2 to 20 # m, the length (10) ~ The number of particle groups is 2/mm2 or less. The Cu-Ni-Si-Mg-based copper alloy strip of the present invention preferably further contains at least a selected from the group consisting of Sn, Zn, and Ag in a total amount of 0.01 to 2.0% by mass. According to still another embodiment of the present invention, an element for an electronic device obtained by processing the above-described alloy strip includes a lead frame of a semiconductor device or a conductive spring connected to a terminal, a relay, a switch, or the like. The Cu-Ni-Si-Mg-based copper alloy strip of the present invention does not require high temperature and long-term heat rolling and solution treatment, and the manufacturing cost is increased, and has excellent strength, electrical conductivity, and resistance. Since the stress relaxation property, the bending workability, the etching property, the affinity, and the plating property are high, the technical value and practicality are higher than those of the prior art, and it is suitable for a copper alloy used for a lead frame, a terminal, a connector, or the like. [Embodiment] (l) Ni and Si 1274786

Ni electrical extension

Ni and Sl' can form fine particles mainly composed of %si: intergeneric compounds by aging treatment. As a result, the strength of the alloy can be remarkably increased while the conductivity is improved. The added concentration (% by mass) of Si is in the range of 1/6 to 1/4 of the added concentration (% by mass). When the amount of Si added exceeds this range, the lead is lowered. The range of addition of Νι is 1〇~4 〇质量%. Ni is lower than I·. When the amount is %, sufficient strength cannot be obtained, and when Ni exceeds 4 〇 #% by weight, cracks may occur during hot pressing. (2) When Mg is added to the Cu-Ni-Si-based copper alloy in an amount of 5% by mass or more of Mg, the tensile strength and the female full-limit stress are increased, and the heat resistance and the stress relaxation property are also improved. On the other hand, when the amount of addition of Mg exceeds 〇·3 mass%, the manufacturability is inferior and the electrical conductivity is largely lowered. (3) Ni-Si particles having a particle diameter of 1 〇 to 20 # m, if particles having a particle diameter of 10 or more are formed into a dispersion distribution, they may adversely affect solder affinity, plating property, bending workability, and the like, but When the cross section parallel to the rolling direction is controlled to be 2/mm 2 or less, the shadow is negligible. The Ni-Si-based particles referred to herein are defined as particles containing 5 at% of Ni and containing 20 at% or more of Si. The particle diameter of the Ni_Si particles is defined as the diameter of the smallest circle surrounding the particles (the same applies hereinafter). Further, particles having a particle diameter of more than 20/zm may adversely affect the characteristics regardless of the number of particles, but generally no particles of more than 2 Å/m are present in the Cu-Ni-Si-based copper alloy. (4) If the Ni-Si-based particles of the Ni-Si-based particle group are aggregated into a particle group with a particle size of 2 // m or more, the 11 1274786 2 is observed and the parallel cross-section is observed (8) is the representative shape of the particle group ( FE-SEM (electrolytic radiation scanning electron microscope: Philips public observation, 1 00 times observation). Here, the Ν^ system particle group means that the distance (4) between adjacent Ni_; 糸 particles is 1〇&quot;m The aggregate of particle diameters 2 to 2 is formed. When the Ni-Si particles are dispersed at intervals of (4) 1 〇, only when the particle position is below 10 # m, the influence on the characteristics can be ignored; If the particle size below the particle size (7) is less than 2, the particle size will have an adverse effect on the characteristics. Here, the "particle group length (L)" refers to the surrounding particle group. The diameter of the smallest circle, the larger the particle group, or the larger the number of particle groups, the greater the influence on the characteristics. According to the experimental results of the inventors, even if the particles above 2 cents are aggregated into the particle group, The length of the particle group in the parallel section of the rolling direction (5) is 0.05 mm, and the number of the particles does not affect the solder pro When the particle length (6) is 0.0540 mm, the particle length (6) is 0.0540 mm, and the particle size is not affected by the number of particles. The particle group of more than one 〇 , , , , , , 不 不 Cu Cu Cu Cu Cu Cu Cu Cu Cu Cu Cu Cu Cu Cu Cu Cu Cu Cu Cu Cu Cu Cu Cu Cu Cu Cu Cu Cu Cu Cu Cu Cu Cu Cu Cu Cu Cu Cu Cu Cu Cu In the Ni-Si-Mg-based copper alloy strip, an element which reacts with or reacts chemically is changed. The shape or distribution of the Ni_Sl-based particles may change, and the effect of the present invention may not be obtained. For the purpose of adding an element such as Sn, Zn, Ag, or the like (which does not chemically react with Sichuan or Si), the total amount of the added amount of the amount of the present invention can be obtained in the same manner as in the case where the element is not added. The following effects are obtained. However, since the conductivity is lowered to 2% by mass or less, more preferably 0.01 is desired. Regarding cU-Nl-Sl, the copper alloy strip is used in an atmosphere smelting furnace. Charcoal covered with smelting electrolytic copper, order: first raw materials Obtaining a certain composition of the dazzling Sl, Mg, and then heat &gt; 1 extension, and then repeat η "object W into a surface ingot. And there is a itching "introduction and heat treatment, to process into", no flaw thickness And the characteristics of the strip or foil. 埶 采 孙 孙 与 与 与 与 与 与 与 n n n n n n n n n n n n n

When the treatment is carried out, the L1Q is used to heat the Sl Ί έ έ a a, ι 〜 π / dish, and the Mi Sl compound is dissolved in the &amp; base for recrystallization. The solid and 'β τ can sometimes be subjected to hot calendering in order to treat the Cu substrate. The aging department is 350~55°. . When the temperature range is increased by 俾ΐ, the Ni 盥 which is solid-solved by the solution treatment is precipitated with S1 as fine particles (mainly Ni 2 Si). This aging treatment increases strength and electrical conductivity. For greater strength, cold calendering can be carried out before and/or after aging treatment. Also, after the treatment, the cold pressing delay is performed, and the stress relief annealing (low temperature annealing) can be performed after the cold rolling.疋 In the above steps, the most important step for producing Ni_Si-based coarse particles is casting. Casting_ N "Si-based coarse particles are formed at the mouth, and, and my aa boundary. The reason is that Si and Mg are concentrated at the grain boundary (segregation. During the cooling of the melt, (4) is a coarse particle. Produced at the grain boundary (crystallization). During the cooling process after solidification, the coarse Ni_Si particles will grow and become larger, and new Ni-Si and coarse particles may also be formed (precipitated). The presence of Mg significantly promotes Ni- When the coarse particles of the Si system are formed and grown at the grain boundary. 13 1274786 When the Ni-Si coarse particles are generated at the grain boundaries, if the cast structure is made fine and the grain boundary area is increased, the distribution of the Ni_Si coarse particles becomes loose. On the other hand, when the cast structure is coarsened, the grain boundary area is reduced, and the distribution of Ni_si and coarse particles is increased, and the frequency of generation of the Ni_Si-based particle group 'as shown in Fig. 1 is increased. Cu-Ni of the present invention. -Si-M§ is a copper alloy strip, and the coarse Ni_si-based particles are solid-solved without increasing the temperature of hot rolling and/or solution treatment, and the cast structure can be controlled only by accelerating the cooling rate at the time of casting. • The desired characteristics. Below, in order to The features and preferred embodiments of the present invention will be more clearly described by way of specific examples. In a graphite induction crucible having an inner diameter of 60 rnm, 3 kg of electrolytic copper is melted, and Nl, Sl, and Mg are added and adjusted. 2·5 mass% _〇.5 = 里o/oSx (the concentration is 1/5 of Ni) _015 mass% Mg of the melt component. After the melt is adjusted to a predetermined temperature, it is cast in the shape of Fig. 3 In the mold φ. In order to make a large change in the cast structure, the casting temperature and the mold material are changed as follows: (1) Washing temperature: 115 (TC and 125 (TC two conditions. Expected to reduce the 'turning' The temperature makes each microstructure finer and the Ni_y particles are dispersed. '' 夂(2) Mold material: Four kinds of T parts, such as refractory brick, graphite, cast iron, and pure copper, in the order of refractory brick, graphite, cast iron, and pure copper. Increasing the cooling rate. It is expected that the Ni_si particles will be dispersed by increasing the cooling rate, and the Ni_si particles will be dispersed. 14 127478.6 The particles are dispersed. In addition, the alloy without Mg is prepared for comparison, and the Mg pair is investigated. Effect of generating Ni-Si inclusions Etc.. The tantalum ingot was subjected to processing heat treatment in the following order to obtain a sample having a thickness of 1515 mm. (1) After heating the casting for 3 hours, the hot rolling heat rolling temperature was 62 〇.

(2) The scale of the surface of the hot rolled material is removed by a grinder. (3) Cold rolling to a plate thickness of 2 mm. (4) The solution treatment was carried out at 78 Torr. After heating for 2 seconds, it is rushed in the water. ~ (5) Chemical polishing is used to remove the surface oxide film. (6) Cold rolling to a plate thickness 〇 5ιηιη. (7) The yoke aging treatment is 4; 3 在 in hydrogen. Heating for 3 hours (8) Chemical polishing to remove the surface oxide film. (9) Cold rolling to a plate thickness of 15rnm. (1〇) yoke stress relief annealing (low temperature annealing), which is 4 (8) in hydrogen. ◦ Heat up for 1 minute. 5 The following evaluations were performed on the prepared samples. Any of the samples was carried out in the range of an oxygen concentration of 5 ppm by mass and a sulfur concentration of 1 Torr to 15 ppm by mass. (1) Ni-Si 糸 particles and the number of particle groups The parallel cross section in the rolling direction is finished into a mirror surface by mechanical grinding using a diameter Ι/zm diamond abrasive grain, and then 2 (rc, 47ie ferric chloride)

15 ^ 74786 matrix ', and Ni-Si particles were eluted. The cross section was observed by FE_SEM (electrolytic radiation type sweeping bun microscope: manufactured by Philips) at a magnification of 1 ,, and the number of particles of 1 〇 m or more and the number of particle groups were measured. Here, the number of particles and the number of particle groups are observed and measured from a cross section parallel to the rolling direction of the sample, and a plurality of observation fields having an observation area of 2 mm 2 are selected. Asia has not observed more than 2 〇 # m particles. No particle group with a length exceeding 1.0 mm was observed. Whether or not the particles and the particle group components are systemic particles are analyzed by FE-SEM^EDS (energy dispersive spectroscopy). (2) Bending workability w, as shown in Fig. 2, the bending axis is parallel to the direction of the dust extension (Bad / I is made? I'm: the diameter of the 〇·ΐ5_ is 9 〇 反 反 反 , , , , ^Number of times of rupture. Repeat the test 5 times and obtain the average value of 5 times. (3) Solder affinity Take a short length of 10 mm, f 4 rectangular S-type test piece, and use 10 VO1% sulfuric acid aqueous solution with acetone. After the surface was removed from the rosin-ethanol for 5 seconds, the sample was immersed in the solder at 4%, and the sample was immersed in 25% of the section. The immersed in the Zhike tank was immersed for 1 〇 second by mass of Sn-40 mass%, and the bad section was composed of 60 pings. The degree of the dish/dish is 23〇. (:, the wisdom is rough, the robbing, the degree of the main condition is ―. After the dip solder is observed with a stereo microscope, the second:: Test __ to see the spot-like solder unattached parts. The surface area of the two surfaces (the surface of the five test pieces is the number of I000 mm2. ^ surface), and the "unattached portion" (4) stress relaxation characteristics are obtained. 16 1274786 (4) Stress relaxation characteristics are shown in Fig. 5, and are wide. 1〇111111&gt;&lt;long loomm, thickness dip 15mm test piece' to make the load on the punctuation point distance l = 50mm, high y 〇 == 2 〇 mm bending stress, add 1 50 ° C After 1 hour, the amount of permanent deformation (height) y shown in Fig. 6 was measured, and the stress relaxation rate {[(y_yi)(mm) / (^_ yamm)] χΐ〇〇 (%)} was calculated. Yi represents the initial bending height before the load stress.

As can be seen from Table 1, according to the Cu_Ni_Si_Mg-based copper alloy strip of the present invention, Examples 1 to 5), it is possible to obtain a good bending workability and solder with Comparative Example 9, No. 1 (without adding § Affinity. On the other hand, in Comparative Examples 6 to 8, although the alloy of the same composition is used in the present invention, the prayer structure is not sufficiently small due to the influence of the mold material and the casting temperature, so the particle diameter is m or more. The number of particles and the number of Ni—Si-based particles is more than two/mm 2′, which causes deterioration in solder affinity and f-curvature. The particles of # m or more and the Ni—Si-based or lower are also poor in the absence of Mg. In Comparative Example 9, the lanthanum was not added with yttrium to capture the Si alloy. If the ingot was produced under the same conditions as in Examples 5 and 7, and Mg was added, the diameter of the above particles and the number of Ni_Si-based particles were observed. In addition, in Comparative Example 9, the bending edging property and the solder affinity, since the number of the diameter ι〇 particle group can be suppressed to 2/mm2' without adding Mg, the stress relaxation property is higher than that of the embodiment. The number of inclusions of all particle size limits is limited to 50. The thermal temperature is limited to 800 °C and The melting treatment temperature is preferably set to 10/m or less in the publication of JP-A-2000-49369, and is 5 to 10/zm in size/mm2. To obtain this state, the hot rolling plus 'end temperature is limited to 650 ° C. Above, the number of Ni Si-based particles on 17 1274786 is i · 〇 / mm 2 , and the number of particles of 5 10 &quot; m is 6 / / mm 2 as a result of measurement. This is due to hot rolling The temperature and the solution treatment temperature are lower than those of the 彳 所 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 Oh, it is still possible to obtain good tantalum affinity and bending workability when the number of Ni-Si particles is slightly larger. [Table 1]

BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 shows a representative form of a collection of schematic diagrams of Ni-Si coarse particles. Fig. 2 is a schematic diagram showing the representative form of the Nl_si-based particle group. Figure 3 shows the shape of the mold 18 1274786 Figure 3 shows the shape of the mold. Fig. 4 is an explanatory view of a repeated bending test method. Fig. 5 is an explanatory diagram of a stress relaxation test method. Fig. 6 is an explanatory diagram showing the amount of permanent deformation of the stress relaxation test method. [Description of main component symbols] L...particle group length d···particle distance 1··· bending stress load (punctuation distance) t···test piece thickness y〇...bending stress load (height) y·· ·The amount of permanent deformation (height)

19

Claims (1)

2006. 09 1. A Cu-Ni-Si-JVls &amp; Μ Renren α s 糸 steel alloy strip, using a copper-based alloy containing 1.0 to 4.0% by mass of V ^ , N1 in the middle, and a concentration of only Ni % concentration of 1/6 to 1/4 of Si, 〇.〇5~〇·3 皙晋〇/n&gt; A, , Mg, and the cii of the residue and inevitable impurities; in parallel with the calendering direction In the cross section, the Ni-Si-based compound particles have the distribution states of the conditions (1) and (2): (1) The particle size is 10 to 20 // m \ \T· c • The person is M-Ni-Si糸In the case where the number of the compound particles is 2/mm2 or less, ... (2) The group of the (8) compound particles composed of the particles (2) is a group of particles (1) in the particle group, and the particle group of the length G g5 to 1 g is two. /mm2 or less. 2. The Cn-Ni-Si_Mg-based copper alloy system of the patent application No. 4 is further contained in the total amount of 〇 m 〇 a and 曰. / 诛' Scoop 〇 〇 1 to 2.0% by mass of at least one selected from the group consisting of Sn and z. n Ag 十一,图·· 如次页 20