TW200533769A - Cu-Ni-Si-Mg based copper alloy strip - Google Patents

Abstract

The objective of the present invention is to provide a Cu-Ni-Si-Mg based alloy which has excellent strength, electrical conductivity, stress relaxation resistance, bending workability, etching properties, wettability and plating properties, and can be stably produced. The Cu-Ni-Si-Mg based copper alloy strip is composed of a copper based alloy having a composition containing 1.0 to 4.0 mass% Ni, Si in the content of 1/6 to 1/4 of the mass% concentration of Ni, and 0.05 to 0.3 mass% Mg, and the balance Cu with inevitable impurities, and is characterized in that, in the cross-section parallel to the rolling direction, Ni-Si based compounds have distributed conditions of the following (1) and (2). (1) The number of the Ni-Si based compound grains with a grain size of 10 to 20 [mu]m is ≤ 2 pieces/mm2. (2) The number of the Ni-Si based grain groups with a length of 0.05 to 1.0 mm is ≤ 2 pieces/mm2 among the Ni-Si based grain groups composed of the Ni-Si based compound grains with a grain size of 2 to 20 μm.

Description

200533769 IX. Description of the invention: [Technical field to which Mao Ming belongs] The present invention relates to semiconducting broadcasting of copper alloy bars, special (ic), etc ... Conductive cartridges suitable for integrated circuit switches, etc. Copper alloy strips for sub-assemblies, electric appliances, and raw materials. [Prior technology] Wire rods, terminals, connectors, etc., are required to have basic copper alloys (heat transfer). In addition to these characteristics, it is also necessary to have metallurgy and electrical relaxation characteristics, resistance to sag, bow σ workability, stress workability, and punching: adhesion of human plating, bar material affinity, and engraving of balance holes. Resistance, corrosion resistance, etc. With respect to miniaturization and high electronic components in recent years, the integration of ν wireframes, terminals, and terminals has become increasingly narrow. In terms of temples, the number of pins has continued to increase, and The reliability depends on the characteristics of 材料 W and gold materials during pure assembly. Based on this background, the above-mentioned copper alloys also become more and more high. Based on the viewpoint of high conductivity, Copper alloy alloys for electronic materials, such as solid solution-strengthened, inefficient hardened copper and hardened copper alloys typified by bronze and brass. Aging treatment to supersaturate after micro / 'Λ treatment The solid solution is implemented to uniformly disperse the product and increase the strength of the alloy; the amount of solid solution elements in the heart and steel improves the electrical conductivity. Therefore, the mechanical properties of Shengsi are excellent, and A material with good electrical and thermal conductivity 200533769. Cu-Nid ^ > hafnium copper alloy in age hardening alloy is a representative copper alloy with both high strength and southern conductivity. It is a material used in electronic equipment. .The Tonghe Meng 'system was analyzed in copper matrix φ ^ J soil Benin Cu-Ni-Si-based copper alloys are produced with fine Nim · 8ι-based intermetallic compound particles to increase their strength and electrical conductivity. • In order to improve mechanical properties, additional elements other than Ni and Si are often added. Especially 疋Mg, which is a representative element that is added to Cu_Ni-Si-based copper alloys. P "Ayr I is known] The effects of VIg addition include: (1) Improved strength and stress relaxation and special properties (Japanese Patent Laid-Open) Sho 61-2501 34)-/ Av mj (3) Mg will form oxides and trap oxygen 1 to prevent the formation or coarsening of μ oxides during heat treatment (Japanese Patent Application Laid-Open No. 009-9207) )Wait. However, in the Cu-Ni-Si-based copper alloy, λΛ. &Amp; Mg added Mg, although the strength and stress relaxation characteristics can be improved, but due to the combination of τ, it is easy to produce coarse inclusions. However, there are problems in that the bending workability, the decorative properties, such as the etchability and the plating properties, are deteriorated. If inclusions appear in the alloy, it will be known that @ 竹 奵 弓 曲 workability, etching, plating, etc. will have an adverse effect.

The impurities of the Cu-NiA-based copper alloy include two types of non-metallic inclusions, such as oxides and sulfides, which are coarse Ni-Si compounds. In the case of a Cu-NWMg-based copper alloy, since the ratio & is susceptible to oxidation, the composition of the oxide is Mg0 'and the composition of the sulfide is _. However, Japanese Unexamined Patent Publication No. 05_059468 has disclosed that the production of Mg0 and Mgs can be suppressed by reducing the concentrations of 0 and s to 15 PPm or less. 200533769 On the other hand, research by Izumi Mizuo (Mizuno Masataka, Kurosawa Zou, ..., Shindo Steel Technical Research Association, v.〗 ^ P291-297) 'Right in the CnSi-based copper alloy, it contains 15at 〇 / 〇 The relative girl c ·? ", J in the said boundary g thick Nl_Sl series of precipitates will start to grow.

That is, if Mg is added to ice in Cu-Ni-Si 糸 person, ★ 丄 X ″ 5 & i, the coarse compounds will increase significantly. If a large Ni-Si car outsider 'Baoi Buhuahua 5 is added, the amount of residue generated during etching will increase, and the depositability and bending workability will deteriorate. Therefore, in Japanese Patent No. 49369,' targeting copper alloys' In order to control the inclusions specifically for actinide compounds below 10 centimeters, and adjust the number of inclusions in M port to be 50% / mm2 on the cross section of the flat rod, the cross section of the cross section in the direction of roof extension Therefore, the influence of Ni-Si-based inclusions is suppressed. [Patent Document 0 JP 61-250134 [Patent Document 2] JP 05-345941 [Patent Document 3] JP 09-209062 Gazette [Patent Document 4] JP 05-059468 [Patent Document 5] JP 2000-49369 ... ^ Non-Patent Document U Masano Takashi, Yoshio Yoshio, Ogura Tetsuzo, Never Filial , Ν〇1 · 38〇999), ρ29ι · 297 [Summary of the Invention] In Japanese Patent Application Laid-Open No. 2001-49369, it is disclosed that Cu_Ni_s is a copper-based copper c. Other alloy components such as 1 and 1 meaning copper alloys can also be applied, that is, only the case of record-summary, And 200533769 did not reveal the specific conditions of Cu-N, Si-Mg, 八, 八, 桐, 糸, 糸, copper alloys, and individual specific conditions. Also, it is aimed at the Ni-S i system coarse # +% # of human particles The focus is only on the size and average number of particles. In addition, for the size and number of inclusions in the mouth of a person to meet the requirements of the present invention, f% must be high temperature, long Timely hot rolling and solution treatment, ^ Wang and Cu_N "Sb Mg system copper man 1W manufacturing cost problems. ^ ^ ^ Σ and solution treatment may cause two ... The hot dust of time ... Sl_Mg is a coarsening of the crystal grains of copper alloy strips, and there is a problem that it cannot be defined. ^ ^ ^ T clothing and existing products (strength, bending workability). The purpose is to pass rabbits to solve the above problems. More specifically, a, the technology is to provide a Cu-Ni-Si-Mg 糸 钿 person eight skills * g 糸 copper a gold bar, which does not need to go through black ㈤ and long-term heat pressing Extending the solution to the chemical treatment process and increasing the manufacturing cost, it also has excellent strength, guiding properties, and stress resistance. And characteristics, bending workability, money engraving, affinity, and ^ double 丨 king and moon dagger are stably produced. In order to achieve the above purpose, the inventors and others have nothing to do with k different from the new point of view of 彺Ni-Si quarterly ancestral large particles are studied in depth; that is, in the past, Nb and Sl series coarse particles were used only at the time of examination. Only the size and average number of particles were examined. The new concept also focuses on the distribution of coarse particles, and investigates the effect of large particle groups of Ni-S! Particles on characteristics. Referring to FIG. 1, ^ 1 shows the representative physical energy of the coarse particle aggregates, which can be observed at a magnification of FE-SEM (electrolytic emission scanning electron microscope: manufactured by Philips). Mang γ witch-M Guang Π heart right You Qian Qian view from the load surface or right-angle cross section of the rolling direction, can be refreshing: Zhao, Fan Fan from J 砚 节 to the orthogonal direction along the thickness direction 8 200533769 Ni -Si system coarse particles 大 八 驷 # I person touch 1 丁 本 口 脰. Distant aggregates can form N i-S i large particle groups defined later.

Ni Si-based coarse particle groups have the following adverse effects on characteristics. During soldering, it is difficult for the solder to adhere to the particle group. (2) During the engraving process, Hegu * said that there was particle residue, which caused the etching surface to lose its smoothness. The particle group will produce the coating adhesion strength of the needle of the bell layer. In this part (3) when ore Ag, Ni, etc.,

hole. In addition, if sufficient particles are not obtained in the particle group, plating peeling may occur and plating may swell. (4) Workability deteriorates during bending. The particle group becomes the starting point of the crack and causes bending. (5) Delay in cold pressing The appearance deteriorates. The particle swarm is the cause of the scars, and on the other hand, the present inventors have obtained the following knowledge at the same time. (1) Regarding particles with a particle size of 10 to 20 // m2, if they form a dispersed distribution, they will adversely affect the characteristics, but their effects can be ignored. If the particle size should be less than 2 w, the particles with a particle size of 2 to 10 m will have a small effect on the characteristics if they form a dispersed distribution, but if they are aggregated, they will adversely affect the characteristics. When the group method exists, (3) particles with a particle diameter of less than 2 / zm exist in a sultry manner, and the effect on the characteristics is still small: ... and the particle group is based on the above-mentioned cognition ,system

Mg is a copper alloy strip, which uses copper-based alloys, u NVSi-manganese containing 1 · 〇 ~ 4.0% by mass 200533769, and only 1/6 ~ 1/4 of Si with concentration of 1/6 ~ 1/4. 0.3% by mass of Mg, residual Cii and unavoidable impurities; in a cross section parallel to the rolling direction, Ni-Si compound particles have the distribution conditions of conditions (1) and (2): (1) particles Ni-Si compound particles with a diameter of 10 to 20 // m are 2 / mm2 or less, (2) Ni-Si compound particles with a particle size of 2 to 20 // m have a length of 0.05 to The number of NrS! -Based particle groups of 1.0 mm is 2 or less per mm2. The Cu-Ni-Si-Mg copper alloy strip of the present invention preferably further contains at least one selected from the group consisting of Sn, Zll, and Ag in a total amount of 0.01 to 2.0% by mass. Another embodiment of the present invention is an "element for an electronic device" obtained by processing the above-mentioned alloy bar, which includes a lead frame of a semiconductor device, or a conductive spring of a connector, a terminal, a relay, a switch, or the like. The Cu-N, Mb, and Mg-based copper alloy strips of the present invention do not need to be subjected to high-temperature and long-term thermal rolling and solution treatment, and the reason for the increase caused by double cracking is excellent. Strength, electrical conductivity, ^ 4 Γ stress relief properties, bending workability, etching, affinity, and mineral deposits, so its technical value and practicability are higher than the conventional technology, and it is suitable for mo Copper alloys for square, V-wood, terminals, connectors, etc. Embodiment] (l) Ni and Si 10 200533769

Nl and Si are subjected to aging treatment to form fine particles of an intermetallic compound mainly composed of Ni2Si. As a result, the strength of the alloy can be significantly increased, and the electrical conductivity can be improved. The added concentration of Si (mass ❻ /.) Ranges from 1/6 to 1/4 of the added concentration (mass%) of Ni. When the addition amount exceeds this range, the conductivity decreases. The range of addition of Ni is ο ~ 4 ％ by mass. When the thickness is less than ι · 〇 / m / °, it is sufficient to obtain sufficient strength. When Ni exceeds 4.0% by mass, cracks may occur during hot rolling. (2) Mg

On the other hand, if Mg is added in an amount of 0.05 mass% or more to the CU-Ni-Si-based copper alloy, tensile strength and safety limit stress will be improved, and heat resistance and stress relaxation characteristics will be improved. On the other hand, if the amount of # Mg added exceeds 0.3% by mass, the manufacturability will be poor and the conductivity will be significantly reduced. … Ni-Si particles from 10 to 20 m will have a negative effect on the particle affinity, plating properties, bending workability, etc., if the particles are distributed above the particle size i 0, but only control If the cross section parallel to the rolling direction is 2 or less, the shadow can be ignored. The Ni_si-based particles referred to herein are defined as containing 50 at% S t 2 () at / ° UJl Si n particles. The particle size of Ni-Si particles = meaning the straight pinch of the smallest circle surrounding the particles (the same applies hereinafter). And the particle size: "Erzhi's" regardless of its number will cause poor characteristics ^ ^ ^ edge M copper alloy will not exist _2 Yizhi (4) Ni-Si based particle group if the particle size of 2 ... Ni_Si-based particles aggregate into a particle group, then 11 200533769 2 Blessing is not parallel to rolling.% ^ _ 戠 戠 戠 娆 Nb Sl-based particles (using FE-SEM (electrolytic radiation-type 'clothing heart tellurium He electrons micro Mirror: made by Philips) observation at 1000 times). Here, M.c./J clothing; Bu 1 糸 Particle group means that the distance (d) between adjacent Ni_si particles is 10 // m. N] -Sl-based particles are dispersed at a set of u ^ 2 ~ 20 # m ^ to the right at intervals of 10 # m, as long as the particle size is below 10 // m, Its influence on characteristics can be ignored; however, if the particles are gathered at a distance of less than 10 ", even if the particle size is less than 10 cores, as long as the particle size is less than 2 cores, the characteristics will be adversely affected. Here," Particle swarm length (L) ”refers to the diameter of the small circle that surrounds a ^ L ancestral group. The larger the swarm, or the number of swarms, the greater the effect on the characteristics. According to the inventor ’s laboratory, the Nl_Si-based particles are more aggregated to form a particle group. When the length of the particle group with a parallel cross section in the ㈣ direction is shorter than W, the number of particles will not affect the solder. Affinity, Zhongshi Γ / bending workability, etc., have an adverse effect. When the particle group length ⑹ is from 0.05 to 1.0, as long as the number of particle groups is 2 or less, the characteristics are not affected. For particle groups whose length (L) exceeds 10 positions, the number of particles will affect the characteristics, but generally there are no particle groups exceeding 1.0 mm in CfSl_alloys. (5) If additional elements other than Mg are added to the Cu-Ni-Si-Mg-based copper alloys, the elements that will react with the crime or & perform chemical reactions are added to the Cu-Ni-Si-Mg copper alloy. Since the morphology or distribution of Nl_Sl-based particles changes, the effect of the present invention cannot be obtained. On the other hand, if 7L elements such as Sn, Zn, ytterbium, etc. (which do not react with or chemically react with each other) are added for the purpose of improving strength, as in the case where these elements are not added, this issue 12 200533769 Therefore, the total value of the added amount is less than or equal to mass%, and the effect can be obtained. However, since the conductivity is lowered, it is preferably 2.0% by mass or less. More preferably, it is a desired effect. Regarding the general manufacturing procedure of Cu-Ni-Si-Mg series copper alloy bar ^ ^ series copper alloy strips, first use an atmospheric melting furnace under charcoal coating / 罘 electrolytic steel, Ni, Si, Mg # raw materials to obtain a predetermined composition Hyun: 5, r contiguous. This molten material is cast into an ingot. Then hot rolling and anti-frosting > cold rolling and heat treatment are set to process into strips with predetermined thickness and characteristics. ％ 俅 俅 次 治. The heat treatment system includes solution treatment and aging treatment. It hurts during solution treatment. The U-substrate is heated at a high temperature of 700 ~ 1000 c, so that the Ni-Si-based compound is dissolved in the arsenic, the monk ▲,, and u matrix, and the Cu matrix is recrystallized at the same time. The solution treatment may be jealous, and τ month b also serves as a hot rolling. During the aging treatment, it is heated at a temperature range of 350 ~ 55 ° C! For more than an hour, the solid solution m 81 of the solution treatment is precipitated as fine particles (main body). This aging treatment can improve the strength and conductivity. In order to obtain higher strength, cold rolling can be performed before and / or after aging. In addition, cold pressing can be delayed after aging, and stress can be returned after cold rolling ^ (low temperature_annealing). Among the above steps, the most important step for the generation of coarse Ni-Si particles is casting. The site where the Ni_Sl coarse particles are formed during casting is the grain boundary of the solidified structure. The reason is that Si and Mg are concentrated in the grain boundary (Segregation). During the cooling process of the melt, coarse Ni-Si particles will be generated (crystallized) at the grain boundaries. During the cooling process after solidification, the coarse Ni-Si particles will grow and become larger. New Ni-Si-based coarse particles will be generated (precipitated). The presence of Mg will significantly promote the formation and growth of coarse Ni-Si-based particles at the grain boundaries. 13 200533769 When coarse grades of grades are generated at the grain boundaries, 'if cast red Grain boundaries As the product increases, the distribution of coarse particles of Nl_Sl series becomes loose. Conversely, if the casting structure is coarsened, the crystal interface area becomes smaller and the distribution of coarse particles is denser. The generation frequency of the system-based particle group increases. The Cu-Nl_Sl_Mg-based copper alloy bar of the present invention does not need to increase the temperature of the hot rolling and / or solution treatment to solidify the coarse Nl_Si-based particles, but only by increasing the cooling rate during casting To control the casting structure, the desired characteristics can be obtained. &Amp; In the following, in order to make the features and the best embodiment of the present invention clearer, the embodiment will be specifically described. Using an induction furnace with an inner diameter of 60mm In a graphite crucible, 3 kg of electrolytic copper was melted, and Ni, Sl, and Mg were added to adjust to 2.5% by mass of Qin_05 by mass of Sl (the concentration of which is 1/5 μM5 #% by mass of Mg in Ng). After the molten material is adjusted to a predetermined temperature, it is cast into a mold of the shape shown in Fig. 3. In order to change the casting structure greatly, the casting temperature and mold material are changed as follows. ^ (1) Casting temperature: 1150 ° C and lucre two It is expected that Ni_Si-based particles will be dispersed by reducing the casting structure by reducing the casting temperature. 铸 (2) Mold material · Four types of fire-resistant bricks, graphite, cast iron, pure copper, Niuyi refractory bricks, graphite Increase the cooling rate in the order of each iron and pure copper. / 、 You can make Ni-Si particles dispersed by increasing the cooling rate to make the cast structure finer. 14 200533769 series particles are dispersed. Also, for comparison Manufacture Fuhuohe / 4, add Mg alloys, and investigate the effect of Mg on the formation of Ni-Si-based inclusions, etc. Qi Jiu's order each key of Lu Hai according to the following principles of Sichuan—Guang 丨 negative order Processing heat treatment to obtain a sample thickness of 0.1 5 mm.

(1) The ingot was heated at 780 ° C for 3 hours with a knives at 3 f 卩 士 #, and then hot rolled to a thickness. The hot rolling temperature is 620 ° C. (2) Remove the scale on the surface of the hot rolled material with a grinder. (3) Cold rolled to a thickness of 2mm. ⑷The solution treatment is carried out, and the system is rapidly cooled after being heated for 2Q seconds in the 78th generation. Ding Xin (5) Remove the surface oxide film by chemical polishing. (6) Cold rolled to a thickness of 5nim. (7) Continuous aging treatment, heating in hydrogen at 43 (rc for 3 hours.) (8) Chemical surface polishing to remove the surface oxide film. (9) Cold rolling to a thickness of 015 mm. (10) Stress relief annealing (Low temperature annealing), heating in hydrogen for 1 minute. The samples were evaluated in the range of oxygen concentration PPm for the following samples. Any range of 5 to 10 ppm by mass and sulfur concentration of 10 to 15 (1) The number of Ni-Si-based particles and particle groups were paralleled in the rolling direction, and were mechanically polished to a mirror surface by using diamond abrasive grains of 1 m in diameter, and then gasified at 2 (rc, 47. e). Iron 15 200533769 group: to dissolve Nl-Si-based particles. 帛 bang Kuanghe (electrolytic radiation-type scanning 2 electron microscope · made by Philips) observe the cross section 1 times, and measure the number of particles of 疋 ... 1 or more And the number of particle groups. Here, regarding the number of particles and the number of particle groups, a plurality of observation fields with an observation area of 2 and 2 are arbitrarily selected for observation and measurement from a cross section parallel to the direction of extension of the sample. No particles longer than the heart m were observed. No particles longer than 1.0 mm were observed. Particle Swarm. Regarding whether the particle and the composition of the particle swarm are positive ^ = _ FE_SEM (energy dispersive X-ray analysis _ which represents the evil person to confirm.) (2) bending workability W, as shown in Figure 2 Γ? The Xf crankshaft is parallel to the direction of M extension (-ay, ^ 9G degrees on one side of the bow radius of 0.15mm is counted as one time, and the number of times until the break or L bow bend 彺, .._ breaks is calculated. Repeat the test 5 times to find the average value of 5 times. Double (3) Solder affinity Take a 10mm wide square test piece with a width of 10mm, use acetone to measure the surface, and take 10vol% sulfuric acid aqueous solution. 5 liters, 1 T, and then washed. After that, the sample was immersed in 25 // △△ / <, immersed in the solder bath for 10 seconds. Solder ^ mass% Sn-40 mass%, The composition of the bad salamander is 60 ¥ The temperature of the branch is 23 ° t, and the test point is 10mm. The three-dimensional _ Λ 一; (4) Stress relaxation characteristics 16 200533769-(4) Stress relaxation according to the area (number of the table si00mm2 of 5 test pieces. Front + Back) The characteristics are shown in Fig. 5. For a test piece with a width of 10111111 < a length of 100mm and a thickness of ㈣15 face, the load superscript distance is 50mm, the bending stress is 50%, and the bending stress is 150. After heating for 1000 hours at ° C, the permanent deformation amount (height) y shown in FIG. 6 was measured, and the stress relaxation rate {[(y_yi) (mm) / (y〇_yOCmm)] χΐ 〇 was calculated from this. 〇 (%)}. Y] represents the initial bending height before load stress. As can be seen from Table 1, according to the Cu-Ni-Si-Mg copper alloy strip (Example 15) according to the present invention, it is possible to obtain a grade equal to or better than that of Comparative Examples 9, 10 (when Mg is not added). Bending workability, solder affinity. On the other hand, in Comparative Examples 6 to 8, although the alloy with the same composition as the present invention was used, the structure of the ingot was not sufficiently small due to the influence of the mold material and the casting temperature. Therefore, the particles having a particle diameter of 10 μm or more and The number of Ni-Si-based particle groups exceeds 2 particles / mm2, resulting in poor solder affinity and bending workability. Comparative Examples 9 and 10 are Cu-Ni-Si alloys without Mg added. If ingots were prepared under the same conditions as in Examples 5 and 7, and Mg was added, particles with diameters of m or more and __ particles were observed. The number of groups will increase. Comparative Example 9, * Bending processability and solder affinity, since Mg is not added, the number of particles having a diameter of ι0 or larger and Ni_Si-based particle groups can be suppressed to 2 / face 2 or less, but Mg is also not added. Therefore, its stress relaxation resistance is inferior to that of the examples. Further, in Japanese Patent Application Laid-Open No. 2-49369, the total particle size is limited to the following, and the number of foreign matter having a size of 5 to 10 #m is limited to 50 particles / mm2. In order to obtain this state, the heating temperature for hot rolling is limited to above. The final temperature is limited to 65 (TC or higher, and the solution treatment temperature is preferably 17 200533769. The number of N i-S i-based particles on the basis is n) von 1 · 0 / Mm, and the result of the measurement revealed that the number of particles of 5 ~ 1 〇 // ηι f helmets is θθ / mm2. This is due to the low heat pressure and solution treatment temperature. ^ Low. However, by optimizing the casting conditions to adjust the distribution of Ni-Si particles, ^ 卞 knife cloth, the number of Nl-Sl particles is still slightly better due to good solder affinity And bending workability. C Table 1]

No. Classification

Ni-Si particle swarm

Material Washing temperature rc) Ni-Si particles with a particle size of 10 / zm or more Solder is not attached Number of parts (/ 1000mm2) Stress relaxation rate Remarks (%)

[Schematic description] Figure 1 shows the schematic diagram of Ni-Si Li Xu's private personal ^. ♦, Representative form of aggregates of large particles Figure 2 is a schematic diagram showing the representative form of Nom_ observed in the parallel section of rolling. Fig. 3 shows the shape of the mold. 18 200533769 Figure 3 shows the shape of the mold. Fig. 4 is an explanatory diagram of the repeated bending test method. FIG. 5 is an explanatory diagram of a stress relaxation test method. Fig. 6 is a diagram explaining the amount of permanent deformation of the stress relaxation test method. [Description of main component symbols] L · ·· Particle group length d · Distance between particles 1 ··· Load of bending stress (punctuation distance) t · · · Thickness of test piece y〇 ... Load (height) of bending stress y ·· · Permanent deformation (height)

19

Claims (1)

200533769 X. Scope of patent application: 1. A Cu-NhS ^ Mg system, a & spear, a copper alloy strip, which uses a copper-based alloy, which contains 1.0 to 4.0% by mass of N], Qu,> The degree of impurities is only 1% to 6% of Si and 0. 05 to 0.3% by mass of Cu; impurities in the alleys and stubs parallel to the rolling direction and unavoidable Shibai Dai On the surface, m_Sl-based compound particles have the distribution conditions of conditions (1) and (2): 0) Nl_Sl-based compound particles with a particle size of 2 or less per surface 2 or less, with a particle size of 2 ~ 2〇 # m Among the two subgroups composed of Ni_Si-based compound particles, the number of Nl_Sl-based particle groups with a length of 5 to 1 will be 2 / mm2 or less. ^ 2. The Cu-Sl_Mg-based copper alloy strip as described in item i of the patent application range further contains at least one selected from% in a total amount of 0.001 to 2.0% by mass. n. Ag ~ 3. A component for electronic equipment, characterized in that it is made by processing Cu_Nl-S and Mg copper alloy strips of Shenkang Lele 1 or 2. XI. Schematic: as next page 20