CN100350064C - Cu-Ni-Si-Mg series copper alloy strip - Google Patents

Cu-Ni-Si-Mg series copper alloy strip Download PDF

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CN100350064C
CN100350064C CNB2005100697613A CN200510069761A CN100350064C CN 100350064 C CN100350064 C CN 100350064C CN B2005100697613 A CNB2005100697613 A CN B2005100697613A CN 200510069761 A CN200510069761 A CN 200510069761A CN 100350064 C CN100350064 C CN 100350064C
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前田直文
波多野隆绍
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Nippon Mining and Metals Co Ltd
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    • C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
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Abstract

Provided is a Cu-Ni-Si-Mg based alloy which has excellent strength, electrical conductivity, stress relaxation resistance, bending workability, etching properties, wettability and plating properties, and can be stably produced. The Cu-Ni-Si-Mg based copper alloy strip is composed of a copper based alloy having a composition containing 1.0 to 4.0 mass% Ni, Si in the content of 1/6 to 1/4 of the mass% concentration of Ni, and 0.05 to 0.3 mass% Mg, and the balance Cu with inevitable impurities, and is characterized in that, in the cross-section parallel to the rolling direction, Ni-Si based compounds have distributed conditions of the following (1) and (2). (1) The number of the Ni-Si based compound grains with a grain size of 10 to 20 [mu]m is <=2 pieces/mm<SP>2</SP>. (2) The number of the Ni-Si based grain groups with a length of 0.05 to 1.0 mm is <=2 pieces/mm<SP>2</SP>among the Ni-Si based grain groups composed of the Ni-Si based compound grains with a grain size of 2 to 20 [mu]m.

Description

The Cu-Ni-Si-Mg series copper alloy strip
Technical field
The present invention relates to copper alloy bar, more particularly, the present invention relates to can be used for the copper alloy bar of the electroconductibility spring material of the lead frame material of semiconducter device of so-called unicircuit (IC) or junctor, terminal, rly., switch etc.
Background technology
The alloy fundamental characteristics that needs to satisfy simultaneously high strength and high conductivity (thermal conductivity) at copper alloy for electronic material bars such as being used for lead frame, terminal, junctor.Except that these characteristics, also requiring has bendability, proof stress relaxation characteristic, thermotolerance, the adaptation with coating, soldering wettability, etching and processing, stamping-out processibility, erosion resistance etc.
On the other hand, in recent years for the miniaturization that adapts to electronic unit, highly integrated, in lead frame, terminal, junctor, pin count increase and thin spaceization all among making progress, device shape is also complicated.Simultaneously, to when assembling and the requirement of the reliability after installing improving always.Under such background, more and more higher to the requirement of above-mentioned copper alloy property of raw material.
From the viewpoint of high strength and high conductivity, in recent years, as copper alloy for electronic material, replacing was the solution strengthening type copper alloy of representative with phosphor bronze, brass etc. in the past, and the consumption of age hardening type copper alloy is increasing.In age hardening type copper alloy, by the supersaturated solid solution through solution treatment is carried out ageing treatment, when fine precipitate homodisperse, alloy strength were improved, the solid solution element amount in the copper reduced, and electroconductibility increases.Thereby can obtain mechanical property excellences such as intensity, elasticity and electroconductibility, the good material of thermal conductivity.
In age hardening type copper alloy, the Cu-Ni-Si series copper alloy is the representative copper alloy that has high strength and high conductivity concurrently, it as e-machine with material just in practicability.In this Albatra metal-, because separate out fine Ni-Si series intermetallic compound particle in the copper matrix, so intensity and electric conductivity increase.
In the Cu-Ni-Si series copper alloy, in order to improve mechanical property etc., beyond interpolation Ni and the Si there be much the situation of other elements.Particularly Mg is the representative element that adds in the Cu-Ni-Si series copper alloy.It is reported that adding Mg has effects such as following:
(1) intensity and proof stress relaxation characteristic improve (spy opens clear 61-250134 communique),
(2) hot workability improves (thing is opened flat 05-345941 communique),
(3) owing to becoming oxide compound, Mg caught oxygen, so the generation or the alligatoring (opening flat 09-209062 communique) of Si oxide compound can prevent thermal treatment the time.
But, be alloy for Cu-Ni-Si, if add Mg,, be easy to generate thick inclusion in the alloy, thereby produce bendability, etching, can plate the problem that Tu Xing etc. descends though intensity and proof stress relaxation characteristic are improved.If have inclusion in the known alloy, then to bendability, etching, can plate Tu Xing etc. detrimentally affect is arranged.
Inclusion in the Cu-Ni-Si series copper alloy has two kinds of non-metallic inclusions such as oxide compound or sulfide and thick Ni-Si based compounds.Under the situation of Cu-Ni-Si-Mg series copper alloy, because Mg than the easier oxidation of Si, is MgS so the composition of oxide compound is MgO or sulfide.But the spy opens in the flat 05-059468 communique and illustrates: if the concentration of O and S drops to below the 15ppm, then can suppress the generation of MgO and MgS.
On the other hand, report according to water open country etc., if in the Cu-Ni-Si series copper alloy, add Mg, the thick Ni-Si that then contains 15at% left and right sides Mg is that (the water open country is just grand, Yi Jian Righteousness man, Xiao Warehouse wise man makes, this filial piety of creek: stretch copper technology research association will in crystal boundary place alligatoring growth for precipitate, the 38th volume (1999), the 291-297 page or leaf).That is, if add Mg in the Cu-Ni-Si series copper alloy, then thick Ni-Si based compound significantly increases.
If thick Ni-Si based compound increases, then the dirt growing amount increases when etching, also become simultaneously and can plate except that property, bendability main reasons for decrease, therefore, the spy opens in the 2001-49369 communique and puts down in writing, for the Cu-Ni-Si series copper alloy, be below the 10 μ m by making inclusiones such as Ni-Si based compound, and in being parallel to the section of rolling direction, the inclusion number of 5-10 μ m be adjusted into 50/mm 2Below, can suppress Ni-Si is the influence of inclusion.
[patent documentation 1] spy opens clear 61-250134 communique
[patent documentation 2] spy opens flat 05-345941 communique
[patent documentation 3] spy opens flat 09-209062 communique
[patent documentation 4] spy opens flat 05-059468 communique
[patent documentation 5] spy opens the 2001-49369 communique
[non-patent literature] water open country is just grand, Yi Jian Righteousness man, Xiao Warehouse wise man makes, this filial piety of creek: stretch copper technology research association will, the 38th volume (1999), 291-297 page or leaf.
Summary of the invention
Therefore, though opening the 2001-49369 communique, the spy also comprises the Cu-Ni-Si-Mg series copper alloy, comprising being the situation that alloy can be suitable for to the Cu-Ni-Si that contains other metal ingredients such as Zn, Sn, Fe also but only put down in writing, is the condition of the indivedual specific exampless of alloy and do not disclose Cu-Ni-Si-Mg.And, be that the starting point of oversize particle is the size and the mean number of each particle to Ni-Si.Moreover size and the alloy of number in this invention claimed range in order to make inclusion must carry out long hot rolling of high temperature and solution treatment, the problem of the manufacturing cost rising of Cu-Ni-Si-Mg series copper alloy strip can occur.In addition, long hot rolling of high temperature and solution treatment also can cause the grain coarsening of Cu-Ni-Si-Mg series copper alloy strip, can not stably obtain the having desired characteristic goods of (intensity, bendability).
Therefore, the objective of the invention is to address the above problem.More particularly, problem of the present invention is, a kind of intensity, electroconductibility, proof stress relaxivity, bendability, etching, wettability with excellence that does not need to cause long hot rolling of high temperature that manufacturing cost raises and solution treatment just can make is provided, can plates being coated with property, and can stablize the Cu-Ni-Si-Mg series copper alloy strip of manufacturing.
The present inventor is in order to realize above-mentioned problem, at first from before different viewpoints, to Ni-Si is that oversize particle is furtherd investigate, consequently, be size and the mean number that the starting point of oversize particle is only noticed each particle to Ni-Si in the past, by the notion of " population " that propose first the following describes, investigating Ni-Si is the distribution of oversize particle, and research Ni-Si is the influence of oversize particle group to characteristic.
With reference now to Fig. 1,, Fig. 1 illustrates and uses FE-SEMM (field emission scanning electron microscope, PHILIPS company makes) can observed Ni-Si be the representational form of oversize particle aggregate with 1000 times multiples.When observing section parallel with rolling direction or cross section orthogonal, can observe at the Ni-Si with the orthogonal direction arrangement of thickness direction is the oversize particle aggregate.It is population that this aggregate can form the Ni-Si that defines below subsequently.
Ni-Si is that population can cause following detrimentally affect to characteristic.
(1) during soldering, is not stained with soldering on the population.
(2) during etching and processing, have residually after the particle dissolving, etching face loses smoothness.
When (3) carrying out the plating of Ag, Ni etc., on population, produce and electroplate pin hole.Or on population, can not get sufficient coating dhering strength, middle in this section meeting produces plating exfoliation or coating swelling.
(4) during bending machining, population becomes the crackle starting point, and bendability worsens.
(5) become crack reason when cold rolling, make its appearance impaired.
On the other hand, the present inventor gets the following opinion of cicada, finds:
(1) particle diameter is the particle that 10 μ m are above and 20 μ m are following, even discrete distribution also has detrimentally affect to characteristic, if but number is 2/mm 2Below, then its detrimentally affect can be ignored,
(2) particle diameter is that 2 μ m are above and less than the particle of 10 μ m, if discrete distribution is then little to the influence of characteristic, if but being gathered into population exists, for characteristic detrimentally affect is arranged,
(3) particle diameter exists even be gathered into population less than the particle of 2 μ m, and is also very little to properties influence.
The present invention is based on above-mentioned opinion and finishes, promptly, the present invention is a kind of Cu-Ni-Si-Mg series copper alloy strip, it is a kind of copper base alloy with following composition: contain the Ni of 1.0-4.0 quality %, contain the Si with respect to Ni quality % concentration 1/6-1/4 concentration, contain the Mg of 0.05%-0.3 quality %, surplus is Cu and unavoidable impurities, it is characterized in that, in the section parallel with rolling direction, the distribution of (1) and (2) below Ni-Si based compound particle has:
(1) particle diameter is that 10 μ m number above and the Ni-Si based compound particle that 20 μ m are following is 2/mm 2Below.
(2) be that the Ni-Si that the Ni-Si based compound particle more than the 2 μ m and below the 20 μ m constitutes is in the population by particle diameter, the number that length 0.05mm Ni-Si above and that 1.0mm is following is a population is 2/mm 2Below.
The present invention is a kind of Cu-Ni-Si-Mg series copper alloy strip, it is characterized in that, contains that one or more total amount is 0.01-2.0 quality % among Sn, Zn, the Ag.
Other embodiment of the present invention is the such e-machine parts of electroconductibility spring of the lead frame of the semiconductor machine that obtains of the above-mentioned alloy bar of processing or junctor, terminal, rly., switch etc.
Cu-Ni-Si-Mg series copper alloy strip of the present invention does not need to cause the long-time hot-rolled process of high temperature of manufacturing cost rising, owing to have good intensity, electroconductibility, proof stress relaxivity, bendability, etching, wettability, can plate being coated with property, so, be suitable as the copper alloy that is used in lead frame, terminal, the junctor all being higher than prior art aspect technological value and the practicality.
Description of drawings
Fig. 1 is that expression Ni-Si is the synoptic diagram of the representational form of oversize particle aggregate.
Fig. 2 is illustrated in that observed Ni-Si is the representational form of population in the section that is parallel to rolling direction.
Fig. 3 is the figure of expression mold shape.
Fig. 4 is the explanatory view of alternating bending test method.
Fig. 5 is the explanatory view of stress relaxation laboratory method.
Fig. 6 is the explanatory view about set deformation volume in the stress relaxation laboratory method.
Embodiment
(1) Ni and Si
Ni and Si form with Ni by ageing treatment 2Si is the minuteness particle of master's intermetallic compound.As a result, alloy strength significantly increases, and its electroconductibility also is improved.The interpolation concentration (quality %) of Si is the scope that Ni adds the 1/6-1/4 of concentration (quality %).If the addition of Si is outside this scope, then electric conductivity descends.The interpolation concentration of Ni is 1.0-4.0 quality %.If the interpolation concentration of Ni then can not get enough intensity less than 1.0 quality %.If the interpolation concentration of Ni is greater than 4.0 quality %, then can crack during hot rolling.
(2)Mg
If add the Mg more than the 0.05 quality % in the Cu-Ni-Si alloy, then tensile strength and yield strength improve, and thermotolerance and stress relaxation characteristic improve.On the other hand, surpass 0.3 quality % if the interpolation of Mg is put, then when manufacturing was inferior, electric conductivity also declined to a great extent.
(3) particle diameter is that 10 μ m Ni-Si above and that 20 μ m are following is a particle
Found that particle diameter is the above particles of 10 μ m, though discrete distribution, to the soldering wettability, can plate being coated with property, bendability etc. detrimentally affect is also arranged, if but particle diameter is that the above number of particle in the section parallel with rolling direction of 10 μ m is 2 mm 2Below, then its detrimentally affect to characteristic can be ignored.Here said Ni-Si is that particle is defined as the particle that contains above Ni of 50at% and the Si more than the 20at%.Ni-Si is that the particle diameter of particle is defined as the external circular diameter of particle (following same).In addition, particle diameter surpass 20 μ m particle no matter number be what and all its characteristic had detrimentally affect, in common Cu-Ni-Si alloy, do not have particle above 20 μ m.
(4) Ni-Si is a population
Above Ni-Si is that particle accumulation forms population if particle diameter is 2 μ m, then to the soldering wettability, can plate being coated with property, bendability etc. detrimentally affect is arranged.Fig. 2 is illustrated in the representational form that observed Ni-Si in the section that is parallel to rolling direction is a population (using FE-SEM (field emission scanning electron microscope, PHILIPS company makes) is 1000 times of observations with multiplying power).Here be with Ni-Si population be defined as with more than the adjacent particle diameter 2 μ m and the Ni-Si below the 20 μ m be the distance (d) of particle more than 10 μ m are with interior particle diameter 2 μ m and the Ni-Si below the 20 μ m be the aggregation of particles body.Ni-Si is when to be particle with the interval that surpasses 10 μ m disperse, if its particle diameter is below the 10 μ m, then can ignore to the detrimentally affect of characteristic, but when assembling with the distance below the 10 μ m, even below the particle diameter 10 μ m, as long as particle diameter is not less than 2 μ m, population also produces detrimentally affect to characteristic.Here " population length (L) " is defined as an external circular diameter of particle, population length is long more, and the number of population is many more, and is big more to the detrimentally affect of characteristic.But, find according to the present inventor's result of experiment: form population even the above Ni-Si of 2 μ m is a particle accumulation, in the section parallel with rolling direction, be shorter than under the situation of 0.05mm in population length (L), irrelevant with its number, can be to the soldering wettability, can plate characteristics such as being coated with property, bendability detrimentally affect is arranged, under population length (L) is situation more than the 0.05mm and below the 1.0mm, if the population number is 2/mm 2Below, then characteristic there is not detrimentally affect.In addition, length (L) surpasses the population of 1.0mm no matter how many its numbers is, all characteristic is had detrimentally affect, in common Cu-Ni-Si alloy, does not have the population above 1.0mm.
(5) the interpolation element beyond the Mg
If the element of chemical reaction takes place for adding and Ni or Si in the Cu-Ni-Si-Mg series copper alloy strip, then Ni-Si is that the form and the distribution situation of particle changes, and can not realize effect of the present invention.On the other hand, be that purpose is added Sn, Zn, the such situation that the element of chemical reaction does not take place with Ni or Si of Ag to improve intensity, equally with the situation of not adding these elements can realize effect of the present invention.But, because electric conductivity is descended, thus preferably its addition summation below 2.0 quality %, in order to obtain desirable effect, preferably more than 0.01 quality %.
The manufacturing processed that the Cu-Ni-Si-Mg series copper alloy strip is general is, at first, uses the open type smelting furnace, and raw materials such as melting electrolytic copper, Ni, Si, Mg under the condition that covers with charcoal obtain having the liquation of required composition.Then this liquation is cast as ingot casting.Carry out hot rolling then, carry out cold rolling and thermal treatment repeatedly, be processed into bar or paper tinsel with desired thickness and characteristic.Thermal treatment comprises solution treatment and ageing treatment.Solution treatment is to heat under 700-1000 ℃ high temperature, and the Ni-Si based compound is solid-solubilized in the Cu matrix, makes Cu matrix recrystallize simultaneously.Also can in hot rolling, carry out solution treatment simultaneously.Ageing treatment is at 350-550 ℃ temperature range internal heating more than 1 hour, and Ni that will the solid solution by solution treatment and Si are as with Ni 2Si is that the minuteness particle of main body is separated out.Can improve intensity and electric conductivity with this ageing treatment.In order to obtain higher intensity, carry out cold rolling before timeliness and/or after the timeliness.In addition, carrying out after the timeliness under the cold rolling situation, after cold rolling, carrying out stress relieving (low-temperature annealing).
In above-mentioned operation, be the generation of oversize particle for Ni-Si, most important operation is casting.Ni-Si is that the generation position of oversize particle is the grain boundary of solidified structure during casting, and its reason is that Si and Mg locate enrichment (segregation) in the grain boundary.In the process of setting of liquation, Ni-Si is that oversize particle generates (crystallization) at the place, grain boundary.In the process of cooling after solidifying, thick Ni-Si particle growth becomes big then, in addition, causes that also new Ni-Si is that oversize particle generates (separating out).Because the existence of Mg has promoted that significantly the Ni-Si of place, grain boundary is the generation and the growth of oversize particle.Because being oversize particle, Ni-Si generates, so if the grain boundary area is increased cast structure's miniaturization, then Ni-Si is that the distribution of oversize particle becomes sparse at the place, grain boundary.On the contrary, if make thickization of cast structure, then the grain boundary area diminishes, and Ni-Si is that the distribution of oversize particle becomes intensive, and the increase that such Ni-Si is the population occurrence frequency has been shown among Fig. 1.
Cu-Ni-Si-Mg series copper alloy strip of the present invention, even can not make thick Ni-Si because hot rolling and/or solid solution temperature raise is the particle solid solution, as long as the cast structure of speed of cooling etc. just controls and can access the copper alloy bar with desired characteristic when improving casting.
Embodiment
Clearer and more definite in order to make feature of the present invention and to implement best mode of the present invention, be specifically described with embodiment below.
With high frequency induction furnace internal diameter be in the plumbago crucible of 60mm with the fusing of 3kg electrolytic copper, add Ni, Si and Mg, the liquation composition is adjusted into 2.5 quality %Ni-0.5 quality %Si with respect to (Ni quality % 1/5 concentration)-0.15 quality %Mg.After liquation adjusted to specified temperature, be cast in the mold shown in Figure 3.In order to change the size of cast structure, make pouring temperature and molding material that following variation take place.
(1) pouring temperature: under 1150 ℃ and 1250 ℃ of two kinds of conditions, carry out.By reducing pouring temperature, be expected to make cast structure to become fine, making Ni-Si is that particle disperses.
(2) molding material: under refractory brick, graphite, cast iron, four kinds of conditions of fine copper, carry out.According to the order of refractory brick, graphite, cast iron, fine copper, speed of cooling strengthens.Be expected to make cast structure to become fine by strengthening speed of cooling, making Ni-Si is that particle disperses.
In addition, as a comparison, also make and do not add the alloy that adds Mg, and to have studied Mg be the influence that generates of inclusion etc. to Ni-Si.
According to following order ingot casting is processed thermal treatment then, obtain the sample that thickness is 0.15mm.
(1) under 780 ℃ with ingot casting heating 3 hours after, being hot rolled to thickness is 8mm.Temperature when hot rolling finishes is 620 ℃.
(2) with shredder the lip-deep oxide skin of hot rolled plate is removed.
(3) being cold-rolled to thickness of slab is 2mm.
(4) heated 20 seconds down at 780 ℃,, carry out solution treatment with this then at quenching-in water.
(5) remove surface film oxide by chemical rightenning.
(6) being cold-rolled to thickness of slab is 0.5mm.
(7) in hydrogen 430 ℃ the heating 3 hours, carry out ageing treatment with this.
(8) remove surface film oxide by chemical rightenning.
(9) being cold-rolled to thickness of slab is 0.15mm.
(10) in hydrogen 400 ℃ the heating 1 minute, carry out stress relieving (low-temperature annealing) with this.
Sample to such manufacturing carries out following evaluation.In addition, in each sample, the concentration range of O all is 5-10 quality ppm, and the concentration range of S all is 10-15 quality ppm.
(1) Ni-Si is the number of particle and population
By using diameter is that dipping was 2 minutes when stirring in the ferric chloride in aqueous solution of 20 ℃, 47 ° Be (baume) after the mechanical polishing of the diamond abrasive of 1 μ m will the section parallel with rolling direction be processed into minute surface.With the dissolving of Cu matrix, revealing the residual Ni-Si in dissolving back is particle by this etch processes.Use FE-SEM (field emission scanning electron microscope, PHILIPS company makes) to observe this section, measure 10 μ m above particle number and population number with 1000 times magnification.The particle here and population number are that the section viewing area from parallel with the rolling direction of sample with picked at random is 2mm 2A plurality of field of view in observe and measure.In addition, do not observe the particle that surpasses 20 μ m.Do not observe the population that length surpasses 1.0mm yet.By analyze the form of its representative with the EDS (energy dispersion type X-ray analysis) of FE-SEM, confirm that the composition of particle and population is that Ni-Si is a particle.
(2) bendability
As shown in Figure 4, on the bending axis direction parallel (Bad Way), carry out 90 degree alternating bendings, calculate until the number of times that ruptures with the method that will be once back and forth can be regarded as 1 time so that the bending radius of 0.15mm is one-sided with rolling direction.Experiment is carried out 5 times, asks 5 times mean value.
(3) soldering wettability
Adopting width is the rectangle test film of 10mm, with its surperficial degreasing, uses the aqueous sulfuric acid pickling of 10vol% with acetone.Then, in 25% rosin-ethanol, sample flooded after 5 seconds in the soldering groove 10 seconds of dipping.The composition of soldering is 60 quality %Sn-40 quality %Pb, and the soldering temperature is 230 ℃, and the impregnating depth of sample is 10mm.If, on the sample that has, can observe the point-like position of not being stained with soldering with the specimen surface behind the stereomicroscope observation soldering dipping.At 1000mm 2Area (pro and con of 5 test films) in obtain this number of not being stained with the soldering position.
(4) stress relaxation characteristic
As shown in Figure 5, at the test film of the thickness t=0.15mm that is processed into wide 10mm * long 100mm
Go up at gauge length l=50mm carrying height y 0The stress in bending of=20mm is determined at 150 ℃ and heats set deformation volume (highly) y shown in Figure 6 after 1000 hours, computed stress relaxation rate { [(y-y 1) (mm)/(y 0-y 1) (mm)] * 100 (%) }.In addition, y 1It is the initial stage bending height before the bearing stress.
As can be seen from Table 1, can obtain according to the present invention having than not adding comparative example 9 under the Mg situation and 10 equal or higher excellent in vending workability, the Cu-Ni-Si-Mg series copper alloy strip (embodiment 1-5) of soldering wettability.
On the other hand, though comparative example 6-8 is the alloy identical with composition of the present invention, because the influence of molding material, pouring temperature, so ingot structure is tiny inadequately, particle diameter is that the number of above particle of 10 μ m and Ni-Si population surpasses 2/mm 2, soldering wettability, bendability descend.
Comparative example 9 and 10 is the Cu-Ni-Si alloys that do not add Mg, makes ingot casting with identical with embodiment 5 and 7 respectively condition, and hence one can see that, and by adding Mg, making particle diameter is the number increase of above particle of 10 μ m and Ni-Si population.Because do not add Mg, particle diameter is that the above particle of 10 μ m and the number of Ni-Si population are suppressed to 2/mm 2Below, so the bendability of comparative example 9 and 10 and soldering wettability are good, but because do not add Mg, so its proof stress relaxation characteristic poor than embodiment.
In addition, open in the 2000-49369 communique the spy, the size of all particles all is below the 10 μ m, and the inclusion number of 5-10 μ m size is defined as 50/mm 2And in order to obtain this state, regulation hot rolling Heating temperature is more than 800 ℃, and end temp is more than 650 ℃, and solid solution temperature is preferred more than 800 ℃.By the embodiment of the invention 5 as can be seen, the above Ni-Si particle number of particle diameter 10 μ m is 1.0/mm 2, in addition, the particle number of the 5-10 μ m that measures with additive method is 60/mm 2This is because hot-rolled temperature and solid solution temperature are low.But,,,, still can access good soldering wettability and alternating bending processibility although the number of Ni-Si particle is more by adjusting the distribution of Ni-Si particle by setting appropriate casting condition.
Table 1
Numbering Classification The zinc mold materials Water the zinc temperature (℃) Ni-Si the particle (/mm that particle diameter 10 μ m are above 2) Ni-Si population (/mm 2) Alternating bending number of times (inferior) (returning) Be not stained with the number (/ 1000mm of solder 2) Stress relaxation rate (%) Remarks
1 Embodiment Steel 1150 0.0 0.0 5.0 0 8
2 Embodiment Steel 1250 0.5 0.0 4.8 0 13
3 Embodiment Cast iron 1150 0.0 0.0 5.0 0 10
4 Embodiment Cast iron 1250 1.0 1.0 4.2 0 11
5 Embodiment Graphite 1150 1.0 1.5 3.8 0 9
6 Comparative example Graphite 1250 2.5 1.5 2.2 12 7
7 Comparative example Brick 1150 1.5 3.0 2.2 11 10
8 Comparative example Brick 1250 4.0 3.5 1.6 17 12
9 Comparative example Graphite 1150 0.5 0.5 4.4 0 24 Do not add Mg
10 Comparative example Brick 1150 1.0 1.5 3.6 0 26 Do not add Mg

Claims (3)

1, a kind of Cu-Ni-Si-Mg series copper alloy strip, it is a kind of by the following copper base alloy that constitutes of forming: the Ni that contains 1.0-4.0 quality %, contain the Si with respect to Ni mass percentage concentration 1/6-1/4 concentration, contain the Mg of 0.05%-0.3 quality %, surplus is Cu and unavoidable impurities; It is characterized in that, in the section parallel with rolling direction, the distribution of (1) and (2) below Ni-Si based compound particle has:
(1) particle diameter is that 10 μ m number above and the Ni-Si based compound particle that 20 μ m are following is 2/mm 2Below,
(2) more than by particle diameter 2 μ m and the Ni-Si that constitutes of the Ni-Si based compound particle below the 20 μ m be in the population, length is that the number that 0.05mm Ni-Si above and that 1.0mm is following is a population is 2/mm 2Below.
2, Cu-Ni-Si-Mg series copper alloy strip according to claim 1, its feature also be, further contains more than one elements among Sn that total amount is 0.01-2.0 quality %, Zn, the Ag.
3, process the e-machine parts that claim 1 or 2 described alloy bars obtain.
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CN102105611B (en) * 2009-04-30 2014-09-17 Jx日矿日石金属株式会社 Cu-Ni-Si-Mg-based alloy having improved electrical conductivity and bendability
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