KR20120104548A - Copper alloy sheet - Google Patents

Abstract

DISCLOSURE OF THE INVENTION An object of the present invention is to provide a Colson-based copper alloy sheet material that satisfies the required characteristics such as strength and bending workability as a terminal connector. [Problem] As a copper alloy plate material which contains 0.8-5% of Ni or Co, 0.2-1.5% of Si, and is made of the copper alloy composition which consists of remainder Cu and an unavoidable impurity in mass%, It has excellent strength and bendability, which controls the area ratio of crystal grains having a deviation angle of less than 15 ° from the cube orientation to less than 10%, and the grain ratio of crystal grains having a deviation angle of 15 to 30 ° from the Cube orientation to 15% or more. Copper alloy sheet for electric and electronic parts.

Description

Copper alloy sheet material {COPPER ALLOY SHEET}

BACKGROUND OF THE INVENTION Field of the Invention The present invention relates to an excellent copper alloy sheet material, and more particularly to a copper alloy sheet material excellent in strength and bending workability suitable for connection parts such as automotive terminals and connectors.

In recent years, the demand for miniaturization and weight reduction of electronic devices is increasing, and miniaturization and weight reduction of electric and electronic components are progressing. The connector terminals have a low pitch narrow pitch, and as a result, the copper alloy sheet used for these connector terminals is required to have higher strength and excellent bending workability. Although copper beryllium has been widely used for copper alloy sheet | seats which require high strength and excellent bending workability, beryllium copper is very expensive and it has strong toxicity with metal beryllium. Therefore, the usage amount of the colson alloy (Cu-Ni-Si) as an alloy which replaces these materials is increasing.

Colson alloy is an alloy in which the solubility of nickel silicide (Ni ₂ Si) in copper changes with temperature, and is a precipitation hardening alloy cured by aging precipitation treatment. Good.

However, also in this Colson alloy, when the intensity | strength of a copper alloy plate material is improved, electroconductivity and bending workability will fall. That is, it is a very difficult problem to make good electrical conductivity and bending workability in a high strength Colson alloy.

As a high-strength copper alloy excellent in bending workability, there is a technique for improving bending workability by controlling the size of the precipitate in the callone alloy (for example, refer to Patent Document 1). Moreover, the technique of improving the strength and bending workability by controlling the crystal grain diameter of a Colson alloy is proposed (for example, refer patent document 2). However, in the connector material, BW bending is performed in a curve parallel to the rolling direction by a test piece cut out in parallel in the plate width direction, but these materials do not meet the strength and bending workability required by the market. More is required.

On the other hand, in recent years, attempts to improve bending workability have been made by controlling the aggregate structure. For example, there exists a method of making bending workability favorable by controlling Cube orientation (refer patent document 3). In addition, bending workability may be improved by increasing the (20) diffraction intensity of X-rays (see Patent Document 4, for example). However, according to the findings of the inventors, increasing the Cube orientation or the (2 0 0) diffraction intensity of the X-ray is certainly effective for improving the bending workability. However, increasing these results in decreasing the work hardening coefficient when the material is deformed, thereby increasing the tensile strength. There was a problem that deterioration.

Japanese Patent Laid-Open No. 6-184680 Japanese Patent Laid-Open No. 2006-161148 Japanese Unexamined Patent Publication No. 2006-152392 Japanese Unexamined Patent Publication No. 2009-007666

The present inventors examined the mechanism in the bending process of a Colson-type copper alloy, and confirmed that the shear band which arises at the surface of a board at the time of bending is a cause of a crack. In addition, it was confirmed that the shear band can be reduced by integrating the cube orientation, but at the same time, the problem that the tensile strength is lowered is also found. As a cause of this strength drop, Cube orientation is considered to be because deformation is generated at a relatively low strength because the work hardening coefficient at the time of deformation is small, and strength is not sufficiently improved, leading to breakage.

In view of the above problems, an object of the present invention is to have excellent bending workability and excellent strength, and to provide a lead frame for electrical and electronic devices, a connector, a terminal material, and the like, particularly for a vehicle vehicle body. The present invention also provides a copper alloy sheet material for electrical and electronic equipment suitable for terminal materials, relays, switches, and the like.

The inventors of the present invention have found that excellent bending formability and high strength can be achieved by defining the area ratio of crystal grain particles having a deviation angle within 15-30 degrees from the cube orientation within a specific range. This invention came to be completed based on this knowledge.

That is, this invention is the following means.

(1) A copper alloy sheet material comprising 0.8-5% of Ni or Co and 0.2-1.5% of Si and 0.2-1.5% of Si at a mass% and formed of a copper alloy composition composed of residual Cu and unavoidable impurities. Electricity having excellent strength and bending workability, which controlled the area ratio of crystal grains having a deviation angle of less than 15 ° from the orientation to less than 10%, and the grain ratio of crystal grains having a deviation angle of 15 to 30 ° from the Cube orientation to 15% or more. Copper alloy sheet material for electronic parts.

(2) The copper alloy sheet material for electric and electronic parts according to (1), which further contains 0.05 to 0.5% of Cr.

(3) The copper alloy plate material for electric and electronic parts according to (1) or (2), which further contains 0.01 to 1.0% of one or two or more of Zn, Sn, Mg, Ag, Mn, and Zr in total.

(4) The copper alloy sheet material for electric and electronic parts according to any one of (1) to (3), in which a differential-friction cold rolling treatment is performed after the solution treatment.

(5) A copper alloy molten metal containing 0.8-5% of either or both of Ni or Co and 0.2-1.5% of Si and having a copper alloy composition composed of residual Cu and unavoidable impurities in mass%. Casting process, heating or homogenizing heat treatment process, frictional hot rolling treatment, cold rolling treatment, intermediate annealing, solution treatment, tooth friction A method for producing a copper alloy sheet material for an electric and electronic component, comprising a step of performing cold rolling and a step of performing an aging treatment.

(6) The manufacturing method of the copper alloy plate material for electrical and electronic components as described in (5) in which the said frictional cold rolling is performed using what differs in surface roughness with respect to the upper and lower rolls.

The copper alloy sheet material of the present invention has high strength, good bending workability, and exhibits high electrical conductivity. Moreover, the said physical property of a copper alloy plate material can also be improved by adding another additional element. Moreover, the improvement of the heat-peelable resistance at the time of soldering, the migration resistance, the workability at the time of hot rolling, or the improvement of a stress relaxation characteristic can also be implement | achieved.

The preferable metal structure of the copper alloy plate material for electrical and electronic components of this invention which has the high strength of this invention, favorable bending workability, and also has high electrical conductivity is demonstrated in detail. Here, the "copper alloy material" means that the copper alloy material is processed into a predetermined shape (for example, plate, steel, foil, rod, line, etc.). Means that. Among them, the plate material refers to one having a specific thickness, being stable in shape and having a width in the plane direction, and broadly including a crude material. Here, in a board | plate material, a "material surface layer" means a "plate surface layer", and a "depth position of material" means a "position in the plate thickness direction". Although the thickness of a board | plate material is not specifically limited, 8-800 micrometers is preferable and 50-70 micrometers is more preferable, considering that the effect of this invention shows more well and is suitable for a practical application.

In addition, although the copper alloy plate material of this invention defines the characteristic by the integration rate of the atomic plane in the predetermined direction of a rolled sheet, this should just have such a characteristic as a copper alloy plate material, and the shape of a copper alloy plate material Silver is not limited to a plate or a crude material, and in the present invention, a pipe can also be interpreted as a plate and handled.

(Average particle diameter)

It is preferable that the average grain size of the copper alloy sheet material of this invention shall be 50 micrometers or less. When the average grain size is less than or equal to the above upper limit, in the case of Good Way (GW) bending processing and Bad Way (BW) bending processing, shear bands that cause cracks are difficult to be generated in bending processing, which is preferable. Here, Good Way means the rolling parallel direction and Bad Way means the rolling vertical direction. In addition, the crystal grain diameter was calculated | required by JIS H0501 (cutting method).

(Regulation by EBSD measurement)

The aggregate structure of the copper alloy sheet material of the present invention has a deviation angle (orientation difference) from the Cube orientation of less than 15 ° in the measurement result by the SEM-EBSD method (described later), in particular, in order to achieve both strength and bending workability. The area ratio of the crystal grains is less than 10%, and the grain ratio of the crystal grains having a deviation angle of 15-30 degrees from the Cube orientation is 15% or more, preferably 20% or more and less than 50%.

In the case of a copper alloy plate material, mainly, as shown below, an aggregate structure called Cube orientation, Goss orientation, Brass orientation, Copper orientation, S orientation, or the like is formed, and a crystal plane corresponding thereto exists.

Formation of these aggregates varies depending on the processing and heat treatment methods even in the case of the same crystal system. In the case of the aggregate structure of materials, such as a board | plate material by rolling, although it shows in a surface and a direction, a surface is represented by {A B C} and a direction is represented by <D E F>. The display method of the crystal orientation in this specification takes the rectangular coordinate system which made X-axis the rolling direction (RD) of a material, Y-axis the sheet width direction (TD), and Z-axis the rolling normal direction (ND), Each region is represented in the form of (hkl) [uvw] using the index hkl of the crystal plane perpendicular to the Z axis and the index [uvw] in the crystal direction parallel to the X axis. In conjunction with the above notation, each orientation is expressed as follows.

Cube bearing {0 0 1} <1 0 0>

Goss bearing {0 1 1} <1 0 0>

Rotated-Goss Defense {0 1 1} <0 1 1>

Brass bearing {0 1 1} <2 1 1>

Copper bearing {1 1 2} <1 1 1>

S-direction {1 2 3} <6 3 4>

P-direction {0 1 1} <1 1 1>

As mentioned above, the aggregate structure of a normal copper alloy plate material consists of a considerable number of orientation factors, but when the composition ratio of such a crystal surface changes, the plastic behavior of materials, such as a plate material, changes, and workability, such as bending, is performed. Change.

When the aggregated structure of a conventional Colson-based high strength copper alloy sheet material is manufactured according to a conventional method, S orientations other than Cube orientation {0 0 1} <1 0 0> as in the examples described later, {1 2 3 } <6 3 4> and brass orientation {0 1 1} <2 1 1> are mainly the ratio, and the ratio of cube orientation decreases. For this reason, especially in a BW bending process, a shear band is easy to produce | generate, and bending workability deteriorates. On the other hand, when the deflection angle from the Cube orientation is less than 15 ° and the accumulation of crystal grains is increased to improve bendability, a problem arises in that the strength is lowered.

On the other hand, the aggregate structure of the copper alloy plate material of this invention is the intensity | strength and bending which the area ratio of the crystal grain whose deviation angle | corner from Cube orientation {0 0 1} <1 0 0> is 15-30% is 15% or more. It is supposed to have an aggregate structure with excellent properties. In the present invention, however, if the area ratio of the crystal grains having a deviation angle of 15-30 degrees from the Cube orientation is 15% or more, it is possible to allow other orientations to exist as negative orientations.

The density measurement of the orientation particles having a deviation angle of 15 to 30 ° from the cube orientation {0 0 1} <1 0 0> of the aggregate structure of the copper alloy sheet material was obtained by measuring the electron microscope structure by SEM using EBSD. Can be obtained by orientation analysis using the crystal orientation distribution function (ODF). Here, about the sample area whose four sides containing 400 or more crystal grains are 1200 micrometers each, it scanned in 0.5 micrometer steps and analyzed the orientation. In addition, since such an orientation distribution changes in the thickness direction of a material, it is preferable to obtain | require it by analyzing an orientation distribution arbitrarily about several points in a thickness direction, and taking the average.

This SEM-EBSD method is an abbreviation for Scanning Electron Microscopy-Electron Back Scattered Diffraction Pattern method. That is, the electron beam is irradiated to the individual crystal grains appearing on the scanning electron microscope (SEM) screen, and the individual crystal orientations are identified from the diffraction electrons.

About the shift angle from the ideal orientation shown by the said exponent, a rotation angle was computed centering around a common rotation axis, and it was set as the shift angle. For example, with respect to the S direction (2 3 1) [6 -4 3], (1 2 1) [1 -1 1] is rotated by 19.4 ° with the (20 10 17) direction as the rotation axis. This angle is referred to as a shift angle. The common rotation axis employ | adopted what can be represented by the smallest deviation angle. This deviation angle is calculated for all measurement points, and the significant digit is taken to the first decimal place.The area of each grain having an orientation of less than 15 ° and within 15-30 ° from the cube direction is divided by the total measurement area. Shall be.

In the EBSD measurement, in order to obtain a clear Kikuchi line diffraction image, after mechanical polishing, the surface of the substrate was mirror-polished using abrasive particles of colloidal silica, and then the measurement was performed. It was done.

Here, the characteristic of EBSD measurement is demonstrated as a contrast with X-ray diffraction measurement. First of all, ND // (1 1 1), (which can be measured by the X-ray diffraction method, can satisfy Bragg's condition of diffraction and obtain sufficient diffraction intensity. 2 0 0), (2 2 0), (3 1 1), (4 2 0) only five kinds of plane, the deviation angle from the cube orientation corresponds to 15-30 °, for example ND / / ( 5 1 1) The crystal orientation represented by a high index such as the plane or the ND // (9 5 1) plane cannot be measured. In other words, by adopting the EBSD measurement, it is possible to obtain information on such orientation, and the relationship between the alloy structure and the action specified thereby becomes clear. Second, the X-ray diffraction measures the amount of crystal orientation contained at about ± 0.5 ° of ND // {hkl}, but according to the EBSD measurement, the Kikuchi pattern is used, which is not limited to a specific crystal plane. Information on a vastly wide range of alloy structures can be obtained comprehensively, and it becomes clear that X-ray diffraction is difficult to specify for the entire alloy material. As mentioned above, the information and the property which can be obtained by EBSD measurement and X-ray diffraction measurement differ. In addition, unless otherwise indicated in this specification, the result of EBSD is performed with respect to the ND direction of a copper alloy plate material.

(Alloy furtherance)

Next, the reason for limitation of the chemical component composition in the copper alloy plate material of this invention is demonstrated (all content% described is mass%).

? Ni, Co, Si

Content of Ni is made into 0.5 to 5.0%. Ni is an element which contains together with Si mentioned later, forms the Ni2Si phase precipitated by an aging process, and contributes to the strength improvement of a copper alloy plate material. If the content of Ni is too small, the Ni 2 Si phase is insufficient and the tensile strength of the copper alloy plate cannot be increased. On the other hand, when there is too much content of Ni, electrical conductivity will fall and hot rolling workability will deteriorate. Therefore, content of Ni is 0.5 to 5.0%, Preferably you may be 1.5 to 4.0% of range.

Content of Co is made into 0.5 to 5.0%. Co is an element which is contained together with Si to form a precipitated Co 2 Si phase in the same manner as Ni in the aging treatment, and contributes to the improvement of the strength of the copper alloy sheet material. If the content of Co is too small, the Co 2 Si phase is insufficient and the tensile strength of the copper alloy sheet material cannot be increased. On the other hand, when there is too much content of Co, electrical conductivity will fall. In addition, hot rolling workability is deteriorated. Therefore, content of Co is made into 0.5 to 5.0%, Preferably it is 0.8 to 3.0% of range.

These Ni and Co may contain 0.5 to 5.0% in total of both. When both Ni and Co are contained, both Ni2Si and Co2Si are precipitated during the aging treatment, and the aging strength can be increased. If the total content of Ni and Co is too small, the tensile strength cannot be increased, and if too large, the electrical conductivity and hot rolling workability are lowered. Therefore, the sum total of content of Ni and Co is 0.5 to 5.0%, Preferably it is 0.8 to 4.0% of range. In particular, when high electrical conductivity is required, it is preferable to make the amount of Co added more than the amount of Ni added.

Si is contained together with Ni and Co to form a Ni 2 Si or Co 2 Si phase precipitated by an aging treatment, thereby contributing to the improvement of strength of the copper alloy sheet material. The content of Si is in the stoichiometric ratio of Ni / Si = 4.2 and Co / Si = 4.2, and the balance between conductivity and strength is the best. Therefore, the content of Si is preferably such that Ni / Si, Co / Si and (Ni + Co) / Si are in the range of 3.2 to 5.2, preferably 3.5 to 4.5.

From this range, when the Si is excessively contained in each case, the tensile strength of the copper alloy sheet can be increased. However, an excessive amount of Si is dissolved in the matrix of the copper and the conductivity of the copper alloy sheet is lowered. . Moreover, when Si contains excessively, the castability in casting and the rolling process in hot and cold will also fall, and casting crack and rolling crack will become easy to generate | occur | produce. On the other hand, if it is out of this range and there is too little content of Si, the precipitation phase of Ni2Si or Co2Si will run out, and the tensile strength of a board cannot be raised.

? Other elements

In addition to the above composition, the copper alloy may contain 0.01 to 0.5% of Cr. Cr has an effect of making the crystal grains in the alloy finer, contributing to the improvement of strength and bending workability of the copper alloy sheet material. If too small, there is no effect. If too large, crystallization will form at the time of casting, and aging strength will fall. Preferable content is 0.05 to 0.3%.

The high-strength copper alloy sheet material of the present invention is, in addition to the above basic composition, in terms of mass% as an additive element, Sn: 0.05 to 1.0%, Zn: 0.01 to 1.0%, Ag: 0.01 to 1.0%, Mn: 0.01 to 1.0%, Zr: You may contain 1 type (s) or 2 or more types of 0.1-1.0%, Mg: 0.01-1.0%. Here, when it contains 2 or more types, let the sum total be 0.01 to 1.0%. All of these elements are elements having a common effect of further improving any one of strength, electrical conductivity, and bending workability, which are the main purposes of the copper alloy of the present invention. Below, the characteristic effect of each element and the meaning of containing range are described.

Sn is an element which mainly improves the strength of a copper alloy plate material, and when used for the use which places importance on such a characteristic, it contains it selectively. If the content of Sn is too small, the strength improving effect is insufficient. On the other hand, when Sn contains, there exists a tendency for the electrical conductivity of a copper alloy plate to fall. In particular, when there is too much Sn, it will become difficult to make electrical conductivity of a copper alloy plate material more than 20% IACS. Therefore, when making it contain, it is preferable to make content of Sn into 0.01 to 1.0% of range.

By addition of Zn, the heat-peelable peeling resistance and migration resistance at the time of soldering can be improved. If the content of Zn is too small, the effect is insufficient. On the other hand, when Zn is contained, there exists a tendency for the electrical conductivity of a copper alloy plate to fall, and when there is too much Zn, it becomes difficult to make electrical conductivity of a copper alloy plate 20% IACS or more. Therefore, it is preferable to make content of Zn into 0.01 to 1.0% of range.

Ag contributes to the increase in strength of the copper alloy sheet material. If the content of Ag is too small, the effect is insufficient. On the other hand, even if it contains Ag excessively, since an effect is saturated, it is not preferable. Therefore, when making it contain, it is preferable to make content of Ag into 0.01 to 1.0% of range.

Mn mainly improves the workability in hot rolling of the alloy. If the content of Mn is too small, the effect is insufficient. On the other hand, when there is too much Mn, melt flow property at the time of casting of a copper alloy will deteriorate, and casting production yield will fall. Therefore, when it contains, the content of Mn is made into 0.01 to 1.0% of range.

Zr mainly refines a crystal grain and improves the strength and bending workability of a copper alloy plate. If the content of Zr is too small, the effect is insufficient. On the other hand, when there is too much Zr, a compound will be formed and workability, such as rolling of a copper alloy plate, will fall. Therefore, when it contains, the content of Zr is made into 0.01 to 1.0% of range.

Mg improves stress relaxation characteristics. Therefore, when stress relaxation characteristic is needed, it contains selectively in 0.01 to 1.0% of range. When Mg is too small, the target effect is inadequate, and too much Mg is unfavorable because it causes the bad effect that a conductivity falls.

(Manufacturing method, etc.)

Next, the preferable manufacturing method (preferred embodiment) of the copper alloy plate material of this invention is demonstrated below.

Colson alloy sheet material of the present invention is produced through each process of casting, hot rolling, cold rolling 1, intermediate annealing, cold rolling 2, solution heat treatment, cold rolling 3, aging heat treatment, finishing cold rolling, low temperature annealing. The manufacturing method itself of the copper alloy plate material of this invention can be manufactured by the method similar to the case of the conventional Colson alloy. Although it is necessary to limit the manufacturing conditions of each process to aggregate structure, in order to manufacture the copper alloy plate material of this invention especially, it is preferable to strictly manage the conditions of intermediate annealing and cold rolling 3.

In this embodiment, casting casts the copper alloy molten metal which component adjusted to the said composition range. Then, the ingot is faced, then heated or homogenized at 800 to 1000 ° C., and then hot rolled to cool the plate after hot rolling.

After hot rolling, the surface is roughened and cold rolling 1 is performed. If the cold rolling ratio 1 is sufficiently high, even if the final product is manufactured thereafter, the brass orientation, the S orientation, and the like do not develop excessively, and the area ratio at which the deviation angle from the cube orientation is 15 to 30 ° can be sufficiently increased. Therefore, it is preferable that the rolling ratio of cold rolling 1 is 70% or more.

In the copper alloy material of the present invention, between the cold rolling 1 and the solution heat treatment, after the intermediate annealing at 300 to 800 ° C. for 5 seconds to 2 hours, a cold rolling 2 having a rolling rate of 3 to 80% is added. It is done. By performing heat treatment at a temperature lower than the solution heat treatment temperature, an intermediate annealing can obtain the partially annealed structure which did not recrystallize a material completely. In cold rolling 2, microscopically nonuniform torsion can be introduced into the material by rolling of a relatively low processing rate. By the effect of these two processes, the desired crystal orientation can be obtained in the recrystallized texture in solution heat treatment. The more preferable range of intermediate annealing is 10 seconds-1 minute at 400-700 degreeC, and a more preferable range is 15 seconds-45 second at 500-650 degreeC. The more preferable range of the working ratio of cold rolling 2 is 5 to 55%, and more preferably 7 to 45%.

Conventionally, heat treatment such as the intermediate annealing is performed to reduce the strength by recrystallizing the material in order to reduce the load in rolling in the next step. In addition, rolling aims at making plate thickness thin, and when it is the capability of a normal rolling mill, it is common to employ the processing rate over 80%. The purpose of the intermediate annealing and cold working in the present invention is to give priority to the crystal orientation after recrystallization, unlike these general contents.

In this embodiment, solution treatment is performed at 600-1000 degreeC for 5 second-300 second. Since the necessary temperature conditions change depending on the concentration of Ni and Co, it is necessary to select an appropriate temperature condition according to the Ni and Co concentrations. If the solution temperature is equal to or higher than the lower limit, the strength is sufficiently maintained in the aging treatment step, and if the solution temperature is equal to or lower than the upper limit, the material is not softened more than necessary and shape control is appropriately realized, which is preferable. At this time, it is preferable to set the area ratio of the crystal grain whose deviation angle from a cube orientation is 15-30 degrees to 15-50%.

After the solution treatment, cold rolling 3 of 5 to 40% is performed. At the time of this cold rolling, when cold rolling of this processing rate is performed, an aggregate structure will become in the scope of the present invention, and it is preferable. According to the findings of the present inventors, when the frictional rolling is performed on a roll having a different roll roughness from cold rolling, crystal grains having a deviation angle of less than 15 ° from the Cube orientation are slightly azimuth rotated, and the deviation angle from the Cube orientation is 15 to 30 °. It can be integrated in the phosphorus orientation. This is considered to be because in the frictional rolling, the plastic restraint is different on the upper and lower surfaces of the rolled material, and the shear deformation is slightly introduced by the difference of the plastic restraint. Here, it is preferable to make the difference of the centerline average roughness Ra of an upper roll and a lower roll into 0.05-3.0 micrometers, and it is more preferable to set it as 2.4-2.8 micrometers. The roughness of the roll may be adjusted by roughening the roll with abrasive paper. Cold rolling 3 has the effect of increasing the amount of aging precipitation, and also contributes to the improvement of strength.

The aging treatment is performed at 400 to 600 ° C. for 0.5 hour to 8 hours. Since the necessary temperature conditions change depending on the concentration of Ni and Co, it is necessary to select an appropriate temperature condition according to the Ni and Co concentrations. When the temperature of the aging treatment is equal to or higher than the lower limit, the aging precipitation does not decrease and the strength is sufficiently maintained. In addition, when the temperature of the aging treatment is below the upper limit, the precipitate is not coarsened, and the strength is maintained.

It is preferable to make the processing rate of finish cold rolling after a solution treatment into 0 to 20% or less. If the processing ratio is too high, the cube bearing particles may be oriented in the brass, S and copper directions, or the like, and the texture may be out of the scope of the present invention.

Confirmation of the characteristic of the copper alloy plate manufactured by this invention is possible by the verification by EBSD analysis whether the structure of a copper alloy plate is in a prescribed range.

Example

EMBODIMENT OF THE INVENTION Below, although this invention is demonstrated in detail based on an Example, this invention is not limited to this.

Hereinafter, embodiments of the present invention will be described. Copper alloy plates of each composition shown in Table 1 were cast to produce copper alloy plates, and the characteristics such as strength, electrical conductivity, and bendability were evaluated.

First, casting was performed by the DC (Direct Chill) method to obtain an ingot having a thickness of 30 mm, a width of 100 mm, and a length of 150 mm. Next, these ingots were heated to 900 ° C., held at this temperature for 1 hour, and then hot rolled to a thickness of 14 mm to cool rapidly. Subsequently, both surfaces were faced by 1 mm and the oxide film was removed, and then cold rolling 1 having a rolling rate of 90 to 98% was performed. Thereafter, heat treatment was performed at 600 ° C to 700 ° C for 1 hour, and cold rolling 2 was performed at a cold rolling rate of 5 to 20%. Thereafter, the solution treatment was performed under various conditions of 700 to 950 ° C, and immediately cooled at a cooling rate of 15 ° C / sec or more. Next, cold rolling 3 having a rolling ratio of 5 to 40% was performed. At this time, the roll whose 0.05-3.0 micrometers difference of surface roughness Ra of an up-and-down roll was used. Next, an aging treatment was performed at 400 to 600 ° C. for 2 hours in an inert gas atmosphere, and then finish rolling with a rolling ratio of 20% or less was performed to adjust the final plate thickness to 0.15 mm. After finishing rolling, various characteristics were evaluated with the material which performed the low temperature annealing process of 30 second at 400 degreeC.

The copper alloy plate produced in this way was tested and evaluated as shown below, using the samples cut out from the copper alloy plate after the aging treatment in each case.

The area ratio of the crystal orientation particles whose deviation angle from the structure of the copper alloy plate sample and the cube orientation is less than 15 degrees, and the area ratio of the crystal orientation particles whose deviation angles are within 15-30 degrees were measured by the above-mentioned method. These results are shown in the table.

In addition, OIM5. 0 HIKARI was used.

Moreover, the area ratio of each (1) crystal orientation particle | grains, (2) tensile strength, (3) electrical conductivity, and (4) bendability of the said copper alloy plate sample were evaluated.

(1) The area ratio of the crystal orientation particles showed an area ratio where the deviation angle from the Cube orientation is less than 15 ° and an area ratio where the deviation angle from the Cube orientation is 15 to 30 °.

(2) Tensile strength was calculated | required based on JISZ22241 using the 5 test piece of JISZ2201. Tensile strength was shown up or down by an integer multiple of 5 MPa.

(3) Electrical conductivity was calculated | required based on JISH0505.

(4) Bending workability is performed by bending the test piece width w at 5 mm and bending 90 ° at bending R = 0 to 0.6 to determine the ratio of the minimum bending radius (R) and plate thickness (t) where cracking does not occur. Defined as / t.

Examples 1 to 31 of Table 1 show examples of the present invention. In Examples 1 to 31, the texture is within the scope of the present invention, and is excellent in strength and bending workability.

Table 2 shows a comparative example for the present invention. In Comparative Examples 1, 2 and 5, since the content of Ni or Co is smaller than the range specified by the present invention, the tensile strength is remarkably low. In Comparative Examples 3, 4, 6, and 7, since the content of Ni or Co was too large, cracking occurred during hot rolling, and the production was stopped.

Table 3 is an example which investigated the influence which the difference of average roughness Ra of the up-and-down rolling roll of cold rolling 3 has on the aggregate structure using the same ingot as Example of Table 1. In Examples 10-2, 10-3, 22-2, 22-3, 29-2, and 29-3 of Table 3, the aggregate structure is within the scope of the examples of the present invention, and is excellent in strength and bending workability. On the other hand, in Comparative Examples 10-2, 22-2, and 29-2, since the difference in Ra was small, the area ratio whose deviation angle from Cube orientation was less than 15 degrees was high, and intensity | strength fell. In Comparative Examples 10-3, 22-3, and 29-3, since the difference in Ra was large, the area ratio of the deviation angle from Cube orientation within 15 degrees-30 degrees was low, and bending workability fell.

In addition, the surface roughness Ra of the roll was measured based on JISB0601.

[Table 1]

[Table 2]

[Table 3]

Subsequently, in order to clarify the difference with the copper alloy plate material which concerns on this invention about the copper alloy plate material manufactured by the conventional manufacturing conditions, a copper alloy plate material is produced on the conditions, and evaluation of the same characteristic item as above is performed. It was done. In addition, unless otherwise indicated, the thickness of each board | plate material adjusted the processing rate so that it might become the same thickness as the said Example. In all, in consideration of general manufacturing conditions at the time of this application, it was set as the condition which does not employ | adopt a frictionless rolling in cold rolling after solution formation.

(Comparative Example 101) Conditions of Japanese Unexamined Patent Publication No. 2009-007666

The same metallic element as that of Example 1-1 of the present invention was blended, and the remainder was dissolved in an alloy composed of Cu and unavoidable impurities by a high frequency melting furnace, and cast at a cooling rate of 0.1 to 100 ° C / sec to obtain an ingot. After maintaining this at 900-1020 degreeC for 3 minutes to 10 hours, after performing a hot working, water quenching was performed and the surface was chamfered for oxidative scale removal. The subsequent process produced the copper alloy c01 by performing the process of the process A-3 and B-3 which are described next.

The manufacturing process includes one or two or more solution heat treatments, in which the processes are classified before and after the last solution heat treatment, and the process up to the intermediate solution is made A-3, and the solution solution is intermediate. The subsequent process was made into B-3 process.

Process A-3: Cold working having a cross section reduction rate of 20% or more, performing a heat treatment for 5 minutes to 10 hours at 350 to 750 ° C, cold working having a cross section reduction rate of 5 to 50%, 800 to 1000 The solution heat treatment for 5 second-30 minutes was performed at ° C.

Process B-3: cold working (no friction) with a cross sectional reduction rate of 50% or less, heat treatment for 5 minutes to 10 hours at 400 to 700 ° C, cold working with a 30% or less cross sectional reduction rate, The crude annealing is performed at 200-550 degreeC for 5 second-10 hours.

The obtained test body c01 differed in the manufacturing conditions from the said Example in the presence or absence of the frictional rolling, and came to the result which does not satisfy | fill a required characteristic with respect to tensile strength.

(Comparative Example 102) Conditions of Japanese Patent Laid-Open No. 2006-283059

The copper alloy of the composition of this invention example 1-1 was melt | dissolved in the air by the electric furnace under charcoal coating, and it judged whether casting was carried out. The molten ingot was hot rolled to finish thickness 15mm. Subsequently, this hot rolled material was subjected to cold rolling and heat treatment (cold rolling 1 → solvent continuous annealing → cold rolling 2 (no friction) → aging treatment → cold rolling 3 → short time annealing) to give a copper alloy having a predetermined thickness. A thin plate c02 was produced.

The obtained test body c02 differs from the said Example 1 in the presence or absence of intermediate annealing and cold rolling 2 in the manufacturing conditions, and the presence or absence of the frictional rolling, and resulted in not being able to satisfy bending workability.

(Comparative Example 103) Conditions of Japanese Patent Laid-Open No. 2006-152392

The alloy having the composition of Inventive Example 1-1 was dissolved in air in a kryptol furnace under charcoal coating and cast into a cast iron book mold, having a thickness of 50 mm, a width of 75 mm, and a length of 180. Ingot which is mm was obtained. Then, after the surface of the ingot was chamfered, hot rolling was performed at a temperature of 950 ° C. until the thickness became 15 mm, and quenched in water from a temperature of 750 ° C. or more. Next, after removing an oxidation scale, it cold-rolled and obtained the board of predetermined thickness.

Subsequently, after performing a solution treatment which heats at the temperature for 20 second using a salt bath, it quenched in water, and was cold rolled plate of each thickness by the finishing cold rolling (no friction) of the latter half. It was made. At this time, as shown below, the processing rate (%) of these cold rolling was changed variously, and it was set as the cold rolled sheet c03. As shown below, the cold rolled sheet was aged at various temperatures (° C.) and time (hr).

Cold working rate: 95%

Solvent Treatment Temperature: 900 ℃

Artificial aging hardening temperature × time: 450 ℃ × 4 hours

Plate thickness: 0.6 mm

The obtained test body c03 differs from the said Example 1 in the manufacturing conditions in the presence or absence of intermediate annealing and cold rolling 2, and the presence or absence of the frictional rolling, and it did not satisfy bending workability.

(Comparative Example 104) Conditions of Japanese Patent Laid-Open No. 2008-223136

The copper alloy shown in Example 1 was melted and cast using a vertical continuous casting machine. A 50-mm-thick sample was cut out of the obtained cast (180 mm thick), heated to 950 ° C, extracted, and hot rolling was started. At that time, the pass schedule was set such that the rolling ratio in the temperature range of 950 ° C to 700 ° C was 60% or more, and the rolling was performed in the temperature range of less than 700 ° C. The final pass temperature of hot rolling is between 600 degreeC-400 degreeC. The overall hot rolling rate from the cast steel is about 90%. After hot rolling, the oxide layer of the surface layer was removed (faced) by mechanical polishing.

Subsequently, after cold rolling, it was subjected to the solution treatment. The temperature change at the time of solution treatment was monitored by the thermocouple attached to the sample surface, and the temperature increase time from 100 degreeC to 700 degreeC in a temperature rising process was calculated | required. The temperature reached is adjusted within the range of 700 to 850 ° C depending on the alloy composition so that the average grain size after the solution treatment is 10 to 60 µm (the twin boundary is not regarded as a grain boundary). The holding time in the temperature range was adjusted in the range of 10 sec-10 min. Subsequently, about the board | plate material after the said solution treatment, the intermediate cold rolling (no friction) was performed at the rolling rate, and the aging process was then performed. The aging treatment temperature was adjusted to 450 ° C., and the aging time was adjusted to the time when the hardness peaked at aging at 450 ° C. depending on the alloy composition. According to the alloy composition, the optimum solution treatment condition and the aging treatment time were grasped by preliminary experiments. Next, finish cold rolling was performed at the rolling ratio. After finishing cold rolling, the low temperature annealing which carried out in the furnace of 400 degreeC for 5 minutes was further performed. In this manner, test material c04 was obtained. In addition, as needed, the surface was cut in the middle, and the plate | board thickness of the test material was adjusted to 0.2 mm. Main production conditions are described below.

[Condition of Example 1 of JP 2008-223136 A]

Hot rolling rate under 700 ℃ ~ 400 ℃: 56% (1 pass)

Cold rolling rate before solution treatment: 92%

Medium cold rolling Cold rolling rate: 20%

Finish Cold Rolled Cold Rolling Rate: 30%

Temperature rise time from 100 degreeC to 700 degreeC: 10 second

The obtained test body c04 differs from the said Example 1 in the presence or absence of intermediate annealing and cold rolling 2, and the presence or absence of the frictional rolling in the manufacturing conditions, and did not satisfy bending workability.

Claims (7)

A copper alloy sheet material containing 0.8-5% of Ni or Co and 0.2-1.5% of Si and 0.2-1.5% of Si, with a balance of Cu and an unavoidable impurity in mass%, which is offset from Cube orientation. For electric and electronic parts having excellent strength and bending workability, the area ratio of crystal grains having an angle of less than 15 ° is controlled to less than 10% and the area ratio of grains having a deviation angle of 15 to 30 ° from the cube orientation is 15% or more. Copper alloy sheet material. The copper alloy plate material for electrical and electronic parts according to claim 1, which further contains 0.05 to 0.5% of Cr. The copper alloy sheet material for electrical and electronic parts according to claim 1 or 2, further comprising 0.01 to 1.0% of one or two or more of Zn, Sn, Mg, Ag, Mn, and Zr in total. The copper alloy sheet material for electrical and electronic parts according to any one of claims 1 to 3, wherein a differential-friction cold rolling treatment is performed after the solution treatment. The connector which consists of the alloy plate material of Claims 1-4. A process of casting a molten copper alloy formed by a copper alloy composition containing 0.8 to 5% of Si or 0.2 to 1.5% of Si or 0.2 to 1.5% by mass in terms of mass% and remaining of Cu and inevitable impurities. Or a step of homogenizing heat treatment, a step of performing a hot rubbing treatment, a step of performing a cold rolling treatment, a step of performing an intermediate annealing, a step of performing a solution treatment, a step of performing a cold friction rolling treatment, and The manufacturing method of the copper alloy plate material for electrical and electronic components which has a process of performing an aging treatment. The manufacturing method of the copper alloy plate material for electrical and electronic components of Claim 5 which performs the said frictionless cold rolling using what differs in surface roughness with respect to the upper and lower rolls.