CN1683580A - Cu-Ni-Si-Mg series copper alloy strip - Google Patents
Cu-Ni-Si-Mg series copper alloy strip Download PDFInfo
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- CN1683580A CN1683580A CN 200510069761 CN200510069761A CN1683580A CN 1683580 A CN1683580 A CN 1683580A CN 200510069761 CN200510069761 CN 200510069761 CN 200510069761 A CN200510069761 A CN 200510069761A CN 1683580 A CN1683580 A CN 1683580A
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- copper alloy
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- 229910000881 Cu alloy Inorganic materials 0.000 title claims abstract description 36
- 229910017873 Cu—Ni—Si—Mg Inorganic materials 0.000 title claims abstract description 19
- 229910018098 Ni-Si Inorganic materials 0.000 claims abstract description 71
- 229910018529 Ni—Si Inorganic materials 0.000 claims abstract description 71
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 20
- 239000000956 alloy Substances 0.000 claims abstract description 20
- 239000010949 copper Substances 0.000 claims abstract description 19
- 239000002210 silicon-based material Substances 0.000 claims abstract description 14
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 13
- 229910052802 copper Inorganic materials 0.000 claims abstract description 13
- 238000005096 rolling process Methods 0.000 claims abstract description 12
- 239000012535 impurity Substances 0.000 claims abstract description 3
- 239000002245 particle Substances 0.000 claims description 86
- 238000009826 distribution Methods 0.000 claims description 10
- 238000000034 method Methods 0.000 claims description 7
- 229910052725 zinc Inorganic materials 0.000 claims description 4
- 238000005452 bending Methods 0.000 abstract description 10
- 238000005530 etching Methods 0.000 abstract description 9
- 229910052710 silicon Inorganic materials 0.000 abstract description 9
- 239000000203 mixture Substances 0.000 abstract description 8
- 229910052759 nickel Inorganic materials 0.000 abstract description 8
- 229910052749 magnesium Inorganic materials 0.000 abstract description 5
- 238000007747 plating Methods 0.000 abstract description 3
- 238000005476 soldering Methods 0.000 description 17
- 230000035882 stress Effects 0.000 description 16
- 229910017876 Cu—Ni—Si Inorganic materials 0.000 description 13
- 239000000243 solution Substances 0.000 description 10
- 238000003483 aging Methods 0.000 description 9
- 230000000052 comparative effect Effects 0.000 description 9
- 238000005098 hot rolling Methods 0.000 description 9
- 238000005266 casting Methods 0.000 description 8
- 238000004519 manufacturing process Methods 0.000 description 7
- 239000006104 solid solution Substances 0.000 description 7
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 6
- 230000032683 aging Effects 0.000 description 6
- 239000010439 graphite Substances 0.000 description 6
- 239000011449 brick Substances 0.000 description 5
- 238000005097 cold rolling Methods 0.000 description 5
- 229910002804 graphite Inorganic materials 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 5
- 229910001018 Cast iron Inorganic materials 0.000 description 4
- 150000001875 compounds Chemical class 0.000 description 4
- 238000001816 cooling Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 239000011159 matrix material Substances 0.000 description 4
- 239000012778 molding material Substances 0.000 description 4
- 239000011856 silicon-based particle Substances 0.000 description 4
- 238000007669 thermal treatment Methods 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 238000007598 dipping method Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 238000011160 research Methods 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- 229910052718 tin Inorganic materials 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 2
- 238000009825 accumulation Methods 0.000 description 2
- 238000000137 annealing Methods 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 239000012776 electronic material Substances 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 229910000765 intermetallic Inorganic materials 0.000 description 2
- 238000011005 laboratory method Methods 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 239000002244 precipitate Substances 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 230000000630 rising effect Effects 0.000 description 2
- 238000005728 strengthening Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 1
- 229910000952 Be alloy Inorganic materials 0.000 description 1
- 229910001369 Brass Inorganic materials 0.000 description 1
- 229910000906 Bronze Inorganic materials 0.000 description 1
- 241000931705 Cicada Species 0.000 description 1
- 229910021578 Iron(III) chloride Inorganic materials 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 240000003936 Plumbago auriculata Species 0.000 description 1
- 208000037656 Respiratory Sounds Diseases 0.000 description 1
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 1
- 238000003723 Smelting Methods 0.000 description 1
- 238000002441 X-ray diffraction Methods 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 238000004220 aggregation Methods 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000033228 biological regulation Effects 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 239000010974 bronze Substances 0.000 description 1
- 239000003610 charcoal Substances 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- 238000005238 degreasing Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000004299 exfoliation Methods 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Substances [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 description 1
- 229910052745 lead Inorganic materials 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 238000005554 pickling Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 238000005204 segregation Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 230000008961 swelling Effects 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1
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- Conductive Materials (AREA)
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
Abstract
Description
Numbering | Classification | Molding material | Pouring temperature (℃) | Ni-Si the particle (/mm that particle diameter 10 μ m are above 2) | Ni-Si population (/mm 2) | Alternating bending number of times (inferior) (returning) | Be not stained with the number (/ 1000mm of solder 2) | Stress relaxation rate (%) | Remarks |
??1 | Embodiment | Copper | ??1150 | ????0.0 | ????0.0 | ????5.0 | ????0 | ????8 | |
??2 | Embodiment | Copper | ??1250 | ????0.5 | ????0.0 | ????4.8 | ????0 | ????13 | |
??3 | Embodiment | Cast iron | ??1150 | ????0.0 | ????0.0 | ????5.0 | ????0 | ????10 | |
??4 | Embodiment | Cast iron | ??1250 | ????1.0 | ????1.0 | ????4.2 | ????0 | ????11 | |
??5 | Embodiment | Graphite | ??1150 | ????1.0 | ????1.5 | ????3.8 | ????0 | ????9 | |
??6 | Comparative example | Graphite | ??1250 | ????2.5 | ????1.5 | ????2.2 | ????12 | ????7 | |
??7 | Comparative example | Brick | ??1150 | ????1.5 | ????3.0 | ????2.2 | ????11 | ????10 | |
??8 | Comparative example | Brick | ??1250 | ????4.0 | ????3.5 | ????1.6 | ????17 | ????12 | |
??9 | Comparative example | Graphite | ??1150 | ????0.5 | ????0.5 | ????4.4 | ????0 | ????24 | Do not add Mg |
??10 | Comparative example | Brick | ??1150 | ????1.0 | ????1.5 | ????3.6 | ????0 | ????26 | Do not add Mg |
Claims (3)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP118177/04 | 2004-04-13 | ||
JP2004118177A JP4020881B2 (en) | 2004-04-13 | 2004-04-13 | Cu-Ni-Si-Mg copper alloy strip |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1683580A true CN1683580A (en) | 2005-10-19 |
CN100350064C CN100350064C (en) | 2007-11-21 |
Family
ID=35263077
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2005100697613A Active CN100350064C (en) | 2004-04-13 | 2005-04-13 | Cu-Ni-Si-Mg series copper alloy strip |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP4020881B2 (en) |
KR (1) | KR100689687B1 (en) |
CN (1) | CN100350064C (en) |
TW (1) | TWI274786B (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101275191B (en) * | 2007-03-30 | 2010-10-27 | 日矿金属株式会社 | High-strength high-conductive copper alloy having superior hot workability |
CN102105611A (en) * | 2009-04-30 | 2011-06-22 | Jx日矿日石金属株式会社 | Cu-Ni-Si-Mg-based alloy having improved electrical conductivity and bendability |
CN102822364A (en) * | 2010-04-02 | 2012-12-12 | Jx日矿日石金属株式会社 | Cu-Ni-Si alloy for electronic material |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4959141B2 (en) * | 2005-02-28 | 2012-06-20 | Dowaホールディングス株式会社 | High strength copper alloy |
JP4247922B2 (en) | 2006-09-12 | 2009-04-02 | 古河電気工業株式会社 | Copper alloy sheet for electrical and electronic equipment and method for producing the same |
WO2009123140A1 (en) * | 2008-03-31 | 2009-10-08 | 日鉱金属株式会社 | Cu-ni-si alloy to be used in electrically conductive spring material |
JP4930527B2 (en) | 2009-03-05 | 2012-05-16 | 日立電線株式会社 | Copper alloy material and method for producing copper alloy material |
CN105463236A (en) * | 2015-12-02 | 2016-04-06 | 芜湖楚江合金铜材有限公司 | Efficient composite copper alloy wire rod and machining process thereof |
CN113690656A (en) * | 2017-07-10 | 2021-11-23 | 株式会社协成 | Contact pin, contact, inspection device, industrial spring, and suspension wire |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4154100B2 (en) * | 1999-12-17 | 2008-09-24 | 日鉱金属株式会社 | Copper alloy for electronic materials having excellent surface characteristics and method for producing the same |
-
2004
- 2004-04-13 JP JP2004118177A patent/JP4020881B2/en not_active Expired - Lifetime
-
2005
- 2005-03-28 TW TW94109548A patent/TWI274786B/en active
- 2005-04-12 KR KR20050030164A patent/KR100689687B1/en active IP Right Grant
- 2005-04-13 CN CNB2005100697613A patent/CN100350064C/en active Active
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101275191B (en) * | 2007-03-30 | 2010-10-27 | 日矿金属株式会社 | High-strength high-conductive copper alloy having superior hot workability |
CN102105611A (en) * | 2009-04-30 | 2011-06-22 | Jx日矿日石金属株式会社 | Cu-Ni-Si-Mg-based alloy having improved electrical conductivity and bendability |
CN102105611B (en) * | 2009-04-30 | 2014-09-17 | Jx日矿日石金属株式会社 | Cu-Ni-Si-Mg-based alloy having improved electrical conductivity and bendability |
CN102822364A (en) * | 2010-04-02 | 2012-12-12 | Jx日矿日石金属株式会社 | Cu-Ni-Si alloy for electronic material |
Also Published As
Publication number | Publication date |
---|---|
TW200533769A (en) | 2005-10-16 |
TWI274786B (en) | 2007-03-01 |
JP4020881B2 (en) | 2007-12-12 |
CN100350064C (en) | 2007-11-21 |
KR100689687B1 (en) | 2007-03-09 |
KR20060045599A (en) | 2006-05-17 |
JP2005298920A (en) | 2005-10-27 |
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C06 | Publication | ||
PB01 | Publication | ||
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SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C56 | Change in the name or address of the patentee |
Owner name: JX NIPPON MINING + METALS CORPORATION Free format text: FORMER NAME: NIPPON MINING + METALS CO., LTD. |
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CP01 | Change in the name or title of a patent holder |
Address after: Tokyo, Japan, Japan Patentee after: JX Nippon Mining & Metals Corporation Address before: Tokyo, Japan, Japan Patentee before: Nippon Mining & Metals Co., Ltd. |
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CP01 | Change in the name or title of a patent holder |
Address after: Tokyo, Japan, Japan Patentee after: JX NIPPON MINING & METALS CORPORATION Address before: Tokyo, Japan, Japan Patentee before: JX Nippon Mining & Metals Corporation |
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CP01 | Change in the name or title of a patent holder | ||
CP02 | Change in the address of a patent holder |
Address after: No. 10-4, erdingmu, tiger gate, Tokyo port, Japan Patentee after: JKS Metal Co.,Ltd. Address before: Tokyo, Japan Patentee before: JKS Metal Co.,Ltd. |
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CP02 | Change in the address of a patent holder |