1271522 五、發明說明（1) [技術領域] 本發明係有關用於檢查液晶面板等之探針基板及其製 造方法。 [背景技術] 先前雖有各種形式之液晶面板檢查用探針基板爲習知 ’但其代表側有例如專利第29742 1 4號所揭示之探針基 板，即，在絕緣基板上形成特定圖形之多個引線之全長 方向之一端例基材上形成絕緣樹脂層以防止上述引線之 剝離。 然而依據該先前例，有下列之問題。 該習知之探針基板利用在相鄰之引線間之間隙部分之 槽中，在與引線之厚度方向之水平相同之水平（相同高 度）形成絕緣樹脂層以防止引線之剝離，即使可以多少 提高引線之剝離強度也無法充分提高。 如所周知，形成於探針基板之引線除了線寬設定於微 小（例如，1 5 // m至2 5 // m )之外’另被要求與基材之 高度密接強度俾可經得起檢查時之壓接之攬亂或拉開等 ，惟如上述習知之探針基板’在於引線之厚度方向之水 平相同水平（相同高度）形成絕緣樹脂層時’由於引線 厚度太小（例如’ 5 // m至1 0 // m )不易擴大銜鐵與絕緣 樹脂層之接觸面積，因此’縱使可以將引線之剝離強度 提升某種程度，也無法充分提升。 另外，在重覆壓接到液晶面板等之檢查對象物以檢查 時，因爲引線上附著麈埃’與檢查對象物發生接觸不良 1271522 五、 發明說明 ( 2) ( 導通不良 ) ， 必 要 時 必 須 淸 除 此 時 將 浸 漬 醋 酸 或 異 丙 醇等溶劑 之 綿 化 棒 移 動 於 多 方 向 淸 潔 時 容 易 發 生 引 線 之剝離， 尤 其 將 該 等 綿 化 棒 橫 掃 引 線 群 移 動 以 淸 除 時 其發生更 爲 顯 著 〇 本發明係 鑑 及 上 述 缺 點 而 發 明 ， 其 巨 的 在 提 供 一 種 探 針 基板，其 充 分 經 得 起 檢 查 時 之 攪 亂 與 拉 開 等 同 時也 充 分具有經 得 起 利 用 醋 酸 或 異 丙 醇 等 溶 劑 之 淸 潔 之 引 線 之 剝離強度 及 其 製 造 方 法 〇 [發明之揭示] 本發明之 探 針 基 板 係 在 絕 緣 基 板 下 形 成於特 定 圖 形 之 多 個引線之 全 長 方 向 之 兩 端 中 ， 至 少在 一 端 側 基 材 上 形 成 用於防止 上 述 引 線 之 剝 離 之 絕 緣 樹 脂 層 其 特 徵 爲 ； 在 上述引線 之 — 端 形 成 段 部 5 且 形 成 上 述 絕 緣 樹 脂 層 以 覆 蓋上述段 部 〇 利用本發 明 之 探 針 基 板 ， 由 於 引 線 之 — 端 形 成 段 部 並 形成絕緣 樹 脂 層 以 覆 蓋 該 段 部 引 線 可 以 堅 固 地 粘合 於 絕緣樹脂 層 〇 因 此 十分 經 得 起 檢 查 時 之 攪 亂 與 拉 開 y 同時成爲 具 有 對 於利 用 醋 酸 或 異 丙 醇 等 溶 劑 之 淸 除 也 有 效之引線 之 控針 基 板 〇 另外，本 發 明 之 探 針 基 板 之 製 造 方 法 之 特 徵 具 備 ·· 下層引線 形 成 工 程 ， 利 用 加 成 法 或 減 扣 法 在 上 述 絕 緣 基 :板上將多 個 下 層 引 線 形 成 特 定 圖 案 俾 絕 緣 基 板 之 至 少 -- •端側形成 絕 緣 樹 脂 層 形 成 用 間 隙 部 ， 絕緣樹脂 層 形 成 工 程 在 上 •4- 述 絕 緣 基 材 上 面 整 體 塗 敷 1271522 五、 發明說明 ( 3) 絕 緣樹脂 液 俾 塗 覆 上 述 下 層 引 線 並 乾 燥 後 藉 由 使 用 光 罩 之紫外 線 曝 光 及 m 影 形 成 僅 塗 覆 上 述 下 層 引 線 一 七山 m 之 絕 緣樹脂 層 以 及 上層引 線 形成 工 程 利 用 電 鍍 法 在 上 述 下 層 引 線 之 露 出 部分上 層 疊 上 層 引 線 以 形成 上 端 面 位 於 上 述 絕 緣 樹 脂 層 相同水 平或 比 上 述 絕 緣 樹 脂 層 更 局 之 引 線 0 利用本 發 明 之 探 針 基 板 之 製 造 方 法 依 利 用 加 成 法 或 減 扣法將 多 個 下 層 引 線 在 絕 緣 基 板 上 形 成 特 定 之 圖 形 俾 絕緣基 材 之 至 少 — 端 側 形 成 絕 緣 樹 脂 層 形 成 用 間 隙 部 後 ，在絕 緣 基 材 上 面 整 體 塗 敷 絕 緣 樹 脂 液 俾 塗 覆 下 層 引 線 並乾燥 之 Ο 然 後 藉 由 使用 光 罩 之 紫 外 線 曝 光 及 顯 影 形 成僅覆 蓋 下 層 引 線 一 端 之 絕 緣 樹 脂 層 並 藉 由 電 鍍 法 在 下層引 線 之 露 出 部 層 疊 上 層 引 線 以 形 成 上 端 面 位於 絕 緣 樹脂層 相 同 水平 或 比 上 述 絕 緣 樹 脂 層 更 高 之 引 線 〇 藉 由 此種製 造 方 法 製 造 探 針 基 板 ， 可 以 妥 適 實 現 本 發 明 之 探 針基板 〇 本發明 之 探 針 基 板 及 其 製 造 方 法 之 較 佳 例 子 係 以 絕 緣 樹 脂塗覆 引 線 之 全 長 方 向 之 中 間 部 分 〇 有 關 該 引 線 中 間 部 分之被 覆 面 積 並 無特 別 之 限 制 ， 例 如 以 引 線 丄山 觸 部 兩 端 露 出爲理 想 〇 因 爲 引 線 之 塗 層 面 積 寬 廣 不 易 剝 離 引 線 〇 另外， 使 用 於 探 針 基 板 之 絕 緣 基 材 之 例 有 樹 脂 薄 膜 或 板狀材料 5 而 樹 脂 薄 膜 係使 用 聚 醯 亞 胺 薄 膜 〇 亦 即 其 虽 於 絕緣性所 致 〇 此外， 供 在 上 述 絕 緣 基 材 上 5- 形成 防 止 引 線 剝 離 用 之 絕 1271522 五、發明說明（4) 緣樹脂層之樹脂最好使用感光性壓克力樹脂或感光性聚 醯亞胺樹脂，此種感光性壓克力樹脂以感光性熱固化型 耐熱壓克力樹脂蓋層油墨（cover coat ink)爲理想，而感 光性聚醯亞胺樹脂以感光性聚醯亞胺樹脂前身溶液爲佳 。該等絕緣樹脂由於具有感光性因此可以進行熱處理前 之曝光，且藉由曝光後之熱處理使其固化而高精密度形 成絕緣樹脂層。 [圖式之簡單說明] 第1圖爲本發明之探針基板之平面圖。 第2圖爲表示銜鐵及絕緣樹脂層之形成形態之斜視圖 〇 第3圖爲表示探針基板之製造工程之圖，步驟a至f 表示下層引線形成工程，步驟g、h表示絕緣樹脂層形 成工程，步驟i表示上層引線形成工程之圖。 第4圖爲第3圖之右側面圖。 第5圖爲第4圖之步驟i中之Z-Z剖面圖。 第6圖爲表示上層引線之露出圖形之變形例之圖。 第7圖爲表示上層引線之露出圖形之變形例之圖。 第8圖爲表示上層引線之露出圖形之變形例之圖。 [實施發明之最佳形態] 解決先前之問題之形態有以下幾種。 茲參照圖式說明本發明之一實施例。在第1圖中，表 示本發明之探針基板之平面圖，惟該探針基板在絕緣基 材1上以一定節距形成多個引線2，且以絕緣樹脂層3 1271522 五、發明說明（5) 塗覆引線2之全長方向之一端。在斜視圖之第2圖表示 其塗覆形態。 在第2圖中，在形成於絕緣基材1之一端之絕緣樹脂 層形成用間隙部4形成絕緣樹脂層3俾覆蓋形成於引線 2群之各一端之段部5。另外，引線2係由形成於金屬 膜6上面之下層引線2a與層疊於該下層引線2a上面之 上層引線2b所構成，而金屬膜6則形成於絕緣基材1 上面。 如上所示，在絕緣基材1上形成絕緣樹脂層3俾塗覆 形成於引線2群之各一端之段部5。因此，即使將形成 有絕緣樹脂層3 —方之引線端部壓接至液晶面板等之檢 查對象物以保持導通狀態並重覆進行檢查，也可以長期 防止引線2之剝離，而且在其中間，必要時可以利用醋 酸或異丙醇等溶劑淸洗形成引線2群之面，也同樣地可 以防止引線2之剝離。 此外，第1圖及第2圖中，7表示未形成銜鐵2群之 間隙部，其中並未塡充絕緣樹脂。再者，絕緣基材1只 要具有絕緣性，不受薄膜材料或板狀材料等任何形態之 基材皆可用。通常，係使用樹脂薄膜，惟其代表例有聚 醯亞胺薄膜。此外，聚醯亞胺可以爲熱塑性，非熱塑性 之任一種。其他之絕緣基材有例如玻璃環氧基材、玻璃 改性環氧基材、玻璃B T基材等。 另一方面，用於形成絕緣樹脂層3之樹脂係使用在熱 處理前具有感光性而有曝光現象者。較理想者爲使用在 1271522 五、 發明說明 ( 6) 熱 處 理 時 之 閉 rm. 或固 化後，至少具 有200t以上之Tg之 耐 熱 性 樹 脂 且 在熱 處理前具有感 光性並 有曝光現象 者 〇 不 拘 正 型 或 負型 皆可。其代表 例有感 光性聚醯亞胺 樹 脂 前 身 溶 液 或 感光 性熱固化型耐 熱壓克 力樹脂蓋層油 墨 〇 另 外 上 述 之 探針 基板如製造工 程中之 探針基板之正 面 圖 之 第 3 圖 及 第3 圖之右側面圖 之第4 圖所示，可經 由 步 驟 a 至 f 之 下層 引線形成工程 10，步 驟g、h之絕 緣 樹 脂 形 成 工 程 1卜 以及步騾i之 上層引 線形成工程12 來 製 造 〇 在 下 層 引 線 形 成工 程1 〇中，如第3圖之步驟f及第4 圖 之 步 驟 f 所 示 ，利 用加成法在絕 緣基材 1上將多個下 層 2ί i形成於特定圖形俾在絕緣基材1之- -端側形成絕 緣 樹 脂 層 形 成 用 間隙 部4。 此 時 ， 首 先 如 第3 圖之步驟a及 第4圖 之步驟a所示 在 絕 緣 基 材 1 之全 長形成例如銅 膜等之 金屬膜6。此 可 以 藉 由 噴 鍍 或 銅箔 之粘合等適當 之方法 形成。 接 著 1 如 第 3 圖之 步驟b及第4 圖之步 驟b所示，在 金 屬 膜 6 上 面 塗 敷例 如紫外線固化 型感光性樹脂電鍍保 護 膜 (r丨 esist)8 〇 接 著 對 電 鍍 保護 膜8照射紫外 線以曝 光顯影，俾使 如 第 3 圖 之 步 驟 c所 示，覆蓋間隙 部分（ 未形成引線部 分 ) 之 金 屬 膜 6 ，並: 形成露出線路:丨 部分（j 咳成引線之部 分 ) 之 金 屬 膜 6 之電 鍍保護膜圖形 -8 - 8 a ° 1271522 五、發明說明（7) 然後，如第3圖之步驟d所示，藉由加成法，例如電 解鎳電鍍等在線路部分之金屬膜6上面形成下層引線2a ，然後，如第3圖之步驟e所示，利用鹼（alkali)剝離電 鑛保護膜8。 然後，如第3圖之步驟f所示，以例如特定濃度之鹽 酸蝕刻間隙部分之金屬膜6並去除之，同時也蝕刻去除 絕緣樹脂層形成用間隙部4之金屬膜。 接著，進行至絕緣樹脂層形成工程Π，如第4圖步驟 h所示，在該絕緣樹脂層形成工程Π，係在絕緣樹脂層 形成用間隙部4形成絕緣樹脂層3。 此時，如第3圖之步驟g及第4圖之步驟g所示，在 絕緣基材1之上面整體塗敷絕緣樹脂液3 a。亦即，藉此 ，在未形成絕緣樹脂層形成用間隙部4及下層引線2群 之間隙部7塡充絕緣樹脂液。 此種樹脂液以感光性壓克力樹脂液或感光性聚醯亞胺 樹脂液，質言之，以感光性聚醯亞胺樹脂前身溶液或感 光性熱固化型耐熱壓克力樹脂蓋層油墨爲理想。 接著，利用以光罩之紫外線曝光及顯影形成僅塗覆下 層引線2a之一端之絕緣樹脂層3。另外，在此狀態下， 間隙部7並未塡充絕緣樹脂。此外，下層引線2a之上 端面位於絕緣樹脂層3之上端面之下方。 接著，進行至上層引線形成工程1 2。該上層引線形成 工程1 2中，係利用電鍍法在下層引線2a群之露出部上 面層疊上層引線2a群。藉此，引線2群之上端面便位 1271522 五、發明說明（8) 於比絕緣樹脂層3之上端面更高處。 因爲如此形成僅塗覆下層引線2a之一端之絕緣樹脂 層3，且在下層引線2a群之露出部上面層疊上層引線 2b群，因此可在引線2群形成段部5 (參照第2圖）。 另外，如第4圖之步驟i之Z_Z剖面圖第5圖所示，因 爲下層引線2a及金屬膜6被上層引線2b所塗層，即使 爲微小之引線2也相當堅強。 以上，已對一實施形態加以敘述，惟在本發明中，也 可以不同於上述而在下層引線2a之露出部上面，以電 鍍法層疊上層引線2b而將引線2之上端面設置於與絕 緣樹脂層3之同一水平。另外，下層引線2a也可以利 用銅箔蝕刻等減扣法（s u b s t r a t i v e m e t h 〇 d)來形成。 此外，絕緣樹脂層3並非限定僅形成於絕緣基材1之 一端側，必要時也可以形成於相反側之另一端。另外， 有關引線2群之形成圖案也可以形成爲例如八字形、送 八字形等，任何圖形。另外，也可以在上層引線2b設 置露出圖形（與檢查對象物接觸之處之圖形），並設置 與第1圖之圖形不同之第6圖至第8圖所示之圖形。質 言之，即如第6圖所示之門形圖形，第7圖所示之交錯 格子圖形，以及第8圖所示標準形。該等圖形中之間隙 部7塡存著絕緣樹脂，同時，引線2之中間部分2c被 絕緣樹脂所塗覆。 在如此形成有防止引線剝離用之絕緣樹脂層3 —邊之 一端及相反側之另一端之特定長度露出之狀態下，也可 -10- 1271522 五、發明說明（9) 以塡充絕緣樹脂以塗覆引線2群，亦即，也可以塡充成 完全塗覆引線2群之中間部分2c。該塡充作業係在上層 引線形成工程1 2之後續工程之絕緣樹脂塗敷工程中進 行。另外’雖然也可以不覆蓋引線2之中間部分2c而 僅在間隙7塡充絕緣樹脂，惟在該情形下，樹脂層上面 宜塡充而形成於引線2群之上端面之下方。 [實施例1] (A) 下層銜鐵形成工程 將宇部興產公司製造之厚度75//m之聚醯亞胺薄膜所 構成之絕緣基材在氬氣中粗面化處理以改善粘合性後， 利用噴鍍法在其上面形成厚度0.3 // m之銅膜。 然後，在其上面塗敷厚2 5 // m之東京應化公司製造之 UV固化型感光性樹脂「PMER-N」。 然後，進行曝光與顯影以塗覆間隙部分（未形成引線 之部分）之銅膜，同時形成露出線路部分（形成引線之 部分）之銅膜之電鍍保護層圖形。此種線路部分之寬度 爲1 8 // m，間隙部分之寬度爲4 7 // m。 然後，利用電解鍍鎳，在線路部分形成約5 // m厚度 之鎳線圖形。接著以鹼剝離被塗敷之電鍍保護層。 接著，利用稀薄鹽酸柔蝕刻（soft etching)由該抗蝕劑 剝離而露出之間隙部分之銅膜而形成線寬1 8 // m之多個 下層引線。相鄰之下層引線間之間隙部分之寬度爲47 // m。 (B) 絕緣樹脂層形成工程 -11· 1271522 五、發明說明（10) 然後，以輥筒塗敷器將東麗公司製造之感光性聚醯亞 胺樹脂前身溶液「弗多尼斯UR5400」塗敷成可塗覆引 線群之厚度（約4 // m )，且於整平（levelling)後’以80 °C乾燥之。 然後，以光罩由絕緣基材之前端起約〇 · 2 mm之範圍內 ，以超高壓水銀燈曝光機曝光，並用專用顯影液顯影與 去除上述前端部以外之感光性聚醯亞胺樹脂。藉此製得 基材之一端部以外露出引線之探針基板。 (C)上層引線形成工程 然後，將該基板以400°C之真空加熱爐進行感光性聚 醯亞胺樹脂前身之過熱亞胺化後’在露出之下層引線上 進行鍍鎳以層疊厚約5 // m之上層引線。藉此’即形成 了其上端面位於絕緣樹脂層更上方之引線。 如此製得之探針基板在絕緣基材上形成絕緣樹脂層以 塗覆形成於引線之一端之段部’因此’引線與絕緣基材 之密接性十足，因此，即使將浸漬醋酸或異丙醇等之溶 劑之綿花棒橫刷引線群移動淸除1 00次以上’也不致發 生引線之剝離。 [實施例2] (A)下層引線形成工程 在三井化學公司製造之「埃冶弗烈克斯」，亦即厚度 爲75gm之聚醯亞胺薄膜上利用噴鍍法形成厚〇.25//m 之銅膜之銅膜上以層壓機（laminator)粘貼日合。莫屯公 司製造之UV固化型感光性樹脂之厚1 5 // m之乾膜（dry -12· 1271522 五、發明說明（11) film)「NIT215」做爲電鑛保護層。 然後，進行曝光顯影以塗覆間隙部分（未形成引線之 部分）之銅膜，同時形成露出線路部分（未成引線之部 分）之銅膜之電鍍保護層圖形。此種線路部分之寬度爲 1 8 // m，而間隔部分之寬度爲4 7 // m。 然後，利用電解鍍鎳，在線路部分形成約5 // m厚之 鎳引線圖形。然後，以鹼剝離電鍍保護層。 然後以稀薄鹽酸軟蝕刻由此種保護層剝離而露出之間 隔部分之銅膜而形成線寬1 8 μ m之多個下層引線。相鄰 之下層引線間之間隔部分之寬度爲47 μ m。 (B) 絕緣樹脂層形成工程 接著，利用輥筒將新日鐵化學公司製造之感光性耐熱 壓克力樹脂蓋層油墨（cover coat ink)「V-25 9PA」塗敷 成可塗覆引線群之厚度（約4 // m )，且以1 1 0°C乾燥 1 〇分鐘。 然後，利用光罩在由絕緣基材之前端起0.2mm之範圖 內照射3 00mj/cm2之紫外線，並以特用顯像液「V- 2 5 90D」顯影去除前端部以外之壓克力樹月旨。藉此，製 得除了基材之一端部以外露出引線之探針基板。 (C) 上層引線形成工程 接著，將該基板放在1 〇〇 °C之加熱爐中加熱1小時， 使其固化後，在露出之下層引線上鍍鎳而層合厚約5 // m之上層引線。藉此，即可形成其上端面位於比絕緣 樹脂層更高之引線。 -13- 1271522 五、發明說明（12) 如此製成之探針基板在絕緣基材上形成有絕緣樹脂層 以塗覆形成於引線一端之段部，因此，引線與絕緣基材 之密接性極佳，所以即使將浸漬醋酸或異丙醇等之溶劑 之綿花棒移動橫刷淸潔引線群1 00次以上，也未發生引 線之剝離。 [產業上之可利用性] 如上所述，本發明之探針基板及其製造方法因爲引線 被絕緣樹脂層所塗覆而牢固地粘合於絕緣基材而不易剝 離，因此，適合於施加物理上外界負荷之檢查或實施以 溶劑進行引線之淸潔。 符號說明 1…絕緣基材 2…引線 2 a…下層引線 2 b…上層引線 2c…中間部分 3…絕緣樹脂層 3a···絕緣樹脂液 4…絕緣樹脂層形成用間隙部 5…段部 6…金屬月旲 7…間隙部 8…電鍍保護膜 8a…電鍍保護膜圖形 -14-[1212] [Technical Field] The present invention relates to a probe substrate for inspecting a liquid crystal panel or the like and a method of manufacturing the same. [Background Art] Although various types of probe substrates for liquid crystal panel inspection have been conventionally used, the probe substrate disclosed in, for example, Japanese Patent No. 29142 14 is formed on the representative side, that is, a specific pattern is formed on the insulating substrate. An insulating resin layer is formed on the substrate of one of the plurality of leads in the entire length direction to prevent peeling of the lead. However, according to this prior example, there are the following problems. The conventional probe substrate uses an insulating resin layer at the same level (the same height) as the level of the thickness direction of the lead in the groove of the gap portion between the adjacent leads to prevent peeling of the lead, even if the lead can be increased somewhat The peel strength cannot be sufficiently improved. As is well known, the lead formed on the probe substrate is set to be small (for example, 1 5 // m to 2 5 // m), and is required to be intimately bonded to the substrate. The crimping of the crimping or the like is the same as in the above-mentioned conventional probe substrate, when the insulating resin layer is formed at the same level (the same height) in the thickness direction of the lead wire, because the lead wire thickness is too small (for example, '5' // m to 1 0 // m ) It is not easy to enlarge the contact area between the armature and the insulating resin layer, so that even if the peel strength of the lead can be increased to some extent, it cannot be sufficiently improved. In addition, when the object to be inspected such as a liquid crystal panel is repeatedly pressed and inspected, the contact with the object to be inspected is caused by the adhesion of the 麈 ' 127 127 127 127 127 127 127 127 127 127 127 127 127 127 127 127 127 127 127 127 127 127 127 127 127 127 127 127 127 127 127 In addition, when the cotton rod impregnated with a solvent such as acetic acid or isopropyl alcohol is moved in a multi-directional direction, the peeling of the lead wire is likely to occur, and especially when the cotton rod is swept across the lead wire group to remove it, the occurrence is more remarkable. The present invention has been invented in view of the above disadvantages, and it is an object of the present invention to provide a probe substrate which is sufficiently resistant to scrambling and pulling, etc. at the time of inspection, and which is sufficiently capable of withstanding a solvent such as acetic acid or isopropyl alcohol. Peeling strength of the clean lead and its manufacturing method〇 [Disclosed by the invention] The probe substrate of the present invention is formed on the entire length of a plurality of leads of a specific pattern under an insulating substrate An insulating resin layer for preventing peeling of the lead wire is formed on at least one end side substrate at both ends thereof, and is characterized in that a segment portion 5 is formed at the end of the lead wire and the insulating resin layer is formed to cover the above-mentioned segment portion 〇With the probe substrate of the present invention, since the end of the lead is formed into a segment and an insulating resin layer is formed to cover the segment, the lead can be firmly bonded to the insulating resin layer, so that it can withstand the disorder and opening of the inspection. y At the same time, it is a needle-controlling substrate having a lead which is effective for removing a solvent such as acetic acid or isopropyl alcohol. In addition, the method for producing a probe substrate of the present invention is characterized by a lower lead forming process, and an additive method. Or the deduction method is to form a plurality of lower layer leads on the above-mentioned insulating substrate: a specific pattern 俾 an insulating substrate at least - the end side is formed The edge portion for forming the edge resin layer, the insulating resin layer is formed on the upper surface of the insulating substrate. The coating is applied to the entire surface of the insulating substrate. 1271522 5. Inventive description (3) The insulating resin liquid layer is coated with the lower layer lead and dried to use light. The ultraviolet exposure and the m-shadow formation of the cover are formed by coating only the insulating layer of the lower layer of the lower layer and the upper layer forming process. The upper layer is laminated on the exposed portion of the lower layer by electroplating to form the upper end surface of the insulating resin layer. The lead wire of the same level or more than the above-mentioned insulating resin layer is formed by using the method of manufacturing the probe substrate of the present invention to form a specific pattern on the insulating substrate by an additive method or a subtractive method. At least - after forming the gap portion for forming the insulating resin layer on the end side, on the insulating substrate The entire surface is coated with an insulating resin liquid to coat the lower layer lead and dried. Then, an insulating resin layer covering only one end of the lower layer lead is formed by ultraviolet exposure and development using a photomask, and the upper layer lead is laminated on the exposed portion of the lower layer lead by electroplating. By forming a probe substrate having the upper end surface at the same level as the insulating resin layer or higher than the insulating resin layer, the probe substrate of the present invention can be suitably realized by the probe substrate manufactured by the manufacturing method of the present invention. A preferred example of the manufacturing method is that the intermediate portion of the entire length of the lead is coated with an insulating resin. The covering area of the intermediate portion of the lead is not particularly limited. For example, it is desirable to expose both ends of the contact portion of the lead. Wide coating area is not easy to strip the lead wire. In addition, the insulation used in the probe substrate Examples of the substrate include a resin film or a plate material 5, and the resin film is made of a polyimide film, that is, it is caused by insulation, and is formed on the insulating substrate to prevent peeling of the lead.绝1271522 V. Description of the invention (4) It is preferable to use a photosensitive acrylic resin or a photosensitive polyimide resin for the resin of the edge resin layer. The photosensitive acrylic resin is photosensitive thermosetting type heat-resistant acrylic. A resin cover coat ink is preferred, and a photosensitive polyimide resin is preferably a photosensitive polyimide resin precursor solution. Since these insulating resins are photosensitive, they can be exposed before the heat treatment, and are cured by heat treatment after exposure to form an insulating resin layer with high precision. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a plan view showing a probe substrate of the present invention. Fig. 2 is a perspective view showing a formation form of an armature and an insulating resin layer. Fig. 3 is a view showing a manufacturing process of a probe substrate, wherein steps a to f represent a lower layer lead forming process, and steps g and h represent formation of an insulating resin layer. Engineering, step i represents a diagram of the upper lead forming process. Figure 4 is a right side view of Figure 3. Fig. 5 is a Z-Z sectional view in the step i of Fig. 4. Fig. 6 is a view showing a modification of the exposed pattern of the upper layer lead. Fig. 7 is a view showing a modification of the exposed pattern of the upper layer lead. Fig. 8 is a view showing a modification of the exposed pattern of the upper layer lead. [Best Mode for Carrying Out the Invention] The following forms for solving the previous problems are as follows. An embodiment of the present invention will now be described with reference to the drawings. In the first drawing, a plan view of a probe substrate of the present invention is shown, except that the probe substrate has a plurality of leads 2 formed on the insulating substrate 1 at a certain pitch, and an insulating resin layer 3 1271522. ) coating one end of the lead 2 in the full length direction. Fig. 2 of the oblique view shows the coating form. In the second embodiment, the insulating resin layer 3 is formed in the insulating resin layer forming gap portion 4 formed at one end of the insulating base material 1, and the segment portion 5 formed at each end of the lead wire group is covered. Further, the lead 2 is composed of a lower layer lead 2a formed on the upper surface of the metal film 6 and an upper layer lead 2b laminated on the lower layer lead 2a, and the metal film 6 is formed on the insulating substrate 1. As described above, the insulating resin layer 3 is formed on the insulating base material 1, and the segment portion 5 formed at each end of the lead wire group 2 is coated. Therefore, even if the lead end portion in which the insulating resin layer 3 is formed is pressure-bonded to an inspection object such as a liquid crystal panel to maintain the conductive state and the inspection is repeated, the peeling of the lead 2 can be prevented for a long period of time, and in the middle, it is necessary The surface of the lead group 2 can be washed with a solvent such as acetic acid or isopropyl alcohol, and the peeling of the lead 2 can be prevented similarly. Further, in Fig. 1 and Fig. 2, reference numeral 7 denotes a gap portion in which the armature 2 group is not formed, and the insulating resin is not filled. Further, the insulating base material 1 is only required to have insulation properties, and is not applicable to any form of substrate such as a film material or a plate material. Usually, a resin film is used, but a representative example thereof is a polyimide film. Further, the polyimine may be either thermoplastic or non-thermoplastic. Other insulating substrates include, for example, a glass epoxy substrate, a glass modified epoxy substrate, a glass B T substrate, and the like. On the other hand, the resin for forming the insulating resin layer 3 is used to have photosensitivity and exposure phenomenon before heat treatment. It is preferred to use the heat-resistant resin having a Tg of at least 200 t or more after the heat treatment at the time of heat treatment at the time of heat treatment at 1281522. Or negative type. Representative examples thereof include a photosensitive polyimide polyimide precursor solution or a photosensitive thermosetting heat-resistant acrylic resin cap layer ink, and the above-mentioned probe substrate, such as the front view of the probe substrate in the manufacturing process, and FIG. 3 As shown in Fig. 4 of the right side view of Fig. 3, it can be manufactured by the layer lead forming process 10 of steps a to f, the insulating resin forming process of steps g and h, and the layer lead forming process 12 of step i. 〇In the lower layer forming process 1 ,, as shown in step f of FIG. 3 and step f of FIG. 4, a plurality of lower layers 2 ί i are formed on the insulating substrate 1 by a additive method. A gap portion 4 for forming an insulating resin layer is formed on the end side of the substrate 1. At this time, first, a metal film 6 such as a copper film is formed on the entire length of the insulating substrate 1 as shown in the step a of the third drawing and the step a of the fourth drawing. This can be formed by a suitable method such as sputtering or bonding of copper foil. Next, as shown in step b of FIG. 3 and step b of FIG. 4, for example, an ultraviolet curable photosensitive resin plating protective film is applied on the metal film 6, and then the plating protective film 8 is irradiated. The ultraviolet ray is developed by exposure, and as shown in step c of Fig. 3, the metal film 6 covering the gap portion (the lead portion is not formed) is formed, and: a metal film which exposes the exposed line: the 丨 portion (j is coughed into a lead portion) is formed. 6 Plating protective film pattern-8 - 8 a ° 1271522 V. Description of the invention (7) Then, as shown in step d of Fig. 3, the metal film 6 in the wiring portion by an additive method such as electrolytic nickel plating The lower layer lead 2a is formed thereon, and then, as shown in step e of Fig. 3, the electric ore protective film 8 is peeled off by alkali. Then, as shown in step f of Fig. 3, the metal film 6 of the gap portion is etched with, for example, a certain concentration of hydrochloric acid, and the metal film of the insulating resin layer forming gap portion 4 is also etched and removed. Then, the insulating resin layer forming process is performed, and as shown in step h of Fig. 4, the insulating resin layer 3 is formed in the insulating resin layer forming gap portion 4 to form the insulating resin layer 3. At this time, as shown in step g of Fig. 3 and step g of Fig. 4, the insulating resin liquid 3a is entirely coated on the upper surface of the insulating base material 1. In other words, the insulating resin layer is filled in the gap portion 7 in which the insulating resin layer forming gap portion 4 and the lower layer lead group 2 are not formed. The resin liquid is a photosensitive acrylic resin liquid or a photosensitive polyimine resin liquid, in other words, a photosensitive polyimide resin precursor solution or a photosensitive heat curing type heat-resistant acrylic resin cap layer ink. Ideal. Next, the insulating resin layer 3 coated only at one end of the lower layer lead 2a is formed by ultraviolet exposure and development with a photomask. Further, in this state, the gap portion 7 is not filled with the insulating resin. Further, the upper end surface of the lower layer lead 2a is located below the upper end surface of the insulating resin layer 3. Next, proceed to the upper layer lead forming process 1 2 . In the upper layer lead forming process 1, the upper layer lead 2a is laminated on the exposed portion of the lower layer lead 2a by electroplating. Thereby, the end face of the lead group 2 is positioned 1271522. 5. The invention (8) is higher than the upper end surface of the insulating resin layer 3. By forming the insulating resin layer 3 coated only at one end of the lower layer lead 2a and stacking the upper layer lead 2b on the exposed portion of the lower layer lead 2a, the segment portion 5 can be formed in the lead group 2 (see Fig. 2). Further, as shown in Fig. 5 of the Z_Z sectional view of the step i of Fig. 4, since the lower layer lead 2a and the metal film 6 are coated by the upper layer lead 2b, even the minute lead 2 is quite strong. In the above, an embodiment has been described. However, in the present invention, the upper layer lead 2b may be laminated by plating on the exposed portion of the lower layer lead 2a, and the upper end surface of the lead 2 may be placed on the insulating resin. The same level of layer 3. Further, the lower layer lead 2a may be formed by a buckle reduction method such as copper foil etching (s u b s t r a t i v e m e t h 〇 d). Further, the insulating resin layer 3 is not limited to be formed only on one end side of the insulating base material 1, and may be formed on the other end of the opposite side if necessary. Further, the pattern for forming the lead 2 group may be formed into, for example, a figure of eight, a figure of eight, or the like. Further, the upper lead 2b may be provided with an exposed pattern (a pattern in contact with the inspection object), and a pattern shown in Figs. 6 to 8 which is different from the pattern of Fig. 1 may be provided. In other words, the gate shape as shown in Fig. 6, the interlaced lattice pattern shown in Fig. 7, and the standard shape shown in Fig. 8. In the pattern, the gap portion 7 contains an insulating resin, and at the same time, the intermediate portion 2c of the lead 2 is coated with an insulating resin. In a state in which the specific length of one end of the insulating resin layer 3 for preventing the peeling of the lead wire and the other end of the opposite side are exposed, it is also possible to use the insulating resin in the state of the invention. The group of leads 2 is coated, that is, it can also be filled into the intermediate portion 2c of the fully coated lead group 2. This charging operation is carried out in an insulating resin coating process subsequent to the upper lead forming process 12 . Further, although the insulating resin may be filled only in the gap 7 without covering the intermediate portion 2c of the lead 2, in this case, the upper surface of the resin layer is preferably filled and formed below the end surface of the lead group 2. [Example 1] (A) Lower armature forming process An insulating substrate composed of a polyimide film of a thickness of 75/m manufactured by Ube Industries, Ltd. was roughened in argon to improve adhesion. A copper film having a thickness of 0.3 // m was formed thereon by sputtering. Then, a UV curable photosensitive resin "PMER-N" manufactured by Tokyo Ohka Co., Ltd. having a thickness of 2 5 // m was applied thereto. Then, exposure and development are performed to coat the copper film of the gap portion (the portion where the lead is not formed) while forming the plating resist pattern of the copper film exposing the wiring portion (the portion forming the wiring). The width of such a line portion is 1 8 // m, and the width of the gap portion is 4 7 // m. Then, by electroless nickel plating, a nickel wire pattern having a thickness of about 5 // m was formed in the line portion. The coated plating resist is then stripped with alkali. Next, a copper film which is peeled off by the resist to expose the gap portion is softly etched by a thin hydrochloric acid to form a plurality of lower layer wirings having a line width of 1 8 // m. The width of the gap portion between adjacent lower layer leads is 47 // m. (B) Insulation resin layer forming work -11· 1271522 V. Inventive description (10) Then, a photosensitive polyimine resin precursor solution "Verdonis UR5400" manufactured by Toray Industries Co., Ltd. was applied by a roll coater. The thickness of the lead group can be coated (about 4 // m) and dried at 80 ° C after levelling. Then, the photomask was exposed to an ultrahigh pressure mercury lamp exposure machine in a range of about 〇 2 mm from the front end of the insulating substrate, and the photosensitive polyimide resin other than the front end portion was developed and removed with a dedicated developer. Thereby, a probe substrate in which the lead is exposed outside the end of the substrate is obtained. (C) Upper lead forming process. Then, the substrate was subjected to superheat imidization of the photosensitive polyimine resin precursor in a vacuum oven at 400 ° C, and then nickel plating was performed on the exposed lower layer to have a thickness of about 5 // m above the layer leader. Thereby, the lead whose upper end surface is located above the insulating resin layer is formed. The probe substrate thus obtained forms an insulating resin layer on the insulating substrate to coat the segment formed at one end of the lead. Therefore, the adhesion between the lead and the insulating substrate is sufficient, and therefore, even if acetic acid or isopropyl alcohol is to be impregnated Wait for the solvent of the cotton flower stick horizontal brush lead group to move more than 100 times or more 'no peeling of the lead. [Example 2] (A) The lower layer lead forming process was formed by the "Eye Fritz" manufactured by Mitsui Chemicals Co., Ltd., that is, the polyimide film having a thickness of 75 gm was formed by sputtering to form a thick 〇.25// The copper film of the copper film of m is pasted with a laminator. The UV-curable photosensitive resin manufactured by Molex Corporation has a thickness of 1 5 // m dry film (dry -12· 1271522 V, invention description (11) film) "NIT215" as an electric ore protective layer. Then, exposure development is carried out to coat the copper film of the gap portion (the portion where the lead is not formed) while forming the plating resist pattern of the copper film exposing the wiring portion (the portion not to be leaded). The width of such a line portion is 1 8 // m, and the width of the spacing portion is 4 7 // m. Then, by electroless nickel plating, a nickel lead pattern of about 5 // m thick was formed in the line portion. Then, the protective layer was peeled off with alkali. Then, the protective layer was peeled off by a thin hydrochloric acid soft etching to expose a copper film of the spacer portion to form a plurality of lower layer wirings having a line width of 18 μm. The width between the adjacent lower layer leads is 47 μm. (B) Insulation resin layer forming process Next, a photosensitive heat-resistant acrylic resin cap coat ink "V-25 9PA" manufactured by Nippon Steel Chemical Co., Ltd. was applied as a coatable lead group by a roller. The thickness (about 4 // m) and dried at 1 10 ° C for 1 〇 minutes. Then, the ray is irradiated with ultraviolet rays of 300 mj/cm 2 in a pattern of 0.2 mm from the front end of the insulating substrate, and developed with a special developing liquid "V- 2 5 90D" to remove the acryl other than the front end portion. Tree month. Thereby, a probe substrate in which a lead is exposed except for one end portion of the substrate is obtained. (C) Upper lead forming process Next, the substrate was heated in a heating oven at 1 ° C for 1 hour to cure it, and nickel was plated on the exposed lower layer to a thickness of about 5 // m. Upper lead. Thereby, a lead whose upper end face is located higher than the insulating resin layer can be formed. -13- 1271522 V. INSTRUCTION DESCRIPTION (12) The probe substrate thus formed is formed with an insulating resin layer on the insulating substrate to coat the segment formed at one end of the lead, and therefore, the adhesion between the lead and the insulating substrate is extremely high. Preferably, even if the cotton wadding rod impregnated with a solvent such as acetic acid or isopropyl alcohol is moved over the cleaning brush lead group for 1 or more times, no peeling of the lead wire occurs. [Industrial Applicability] As described above, the probe substrate of the present invention and the method for producing the same are suitable for application of physics because the lead is firmly adhered to the insulating substrate by the insulating resin layer and is not easily peeled off. The inspection of the external load or the implementation of the lead cleaning with a solvent. DESCRIPTION OF SYMBOLS 1...Insulating base material 2...Lead 2 a... Lower layer lead 2 b...Upper layer lead 2c...Intermediate part 3...Insulating resin layer 3a···Insulating resin liquid 4...Insulating resin layer forming gap part 5... Section 6 ...metal moon 旲 7... gap portion 8... plating protective film 8a... plating protective film pattern-14-