CN1254687C - Probe substrate and method of mfg. probe substrate - Google Patents
Probe substrate and method of mfg. probe substrate Download PDFInfo
- Publication number
- CN1254687C CN1254687C CNB028073193A CN02807319A CN1254687C CN 1254687 C CN1254687 C CN 1254687C CN B028073193 A CNB028073193 A CN B028073193A CN 02807319 A CN02807319 A CN 02807319A CN 1254687 C CN1254687 C CN 1254687C
- Authority
- CN
- China
- Prior art keywords
- mentioned
- probe substrate
- layer
- insulating resin
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Measuring Leads Or Probes (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
A probe substrate, wherein step parts (5) are formed at one end of each of a plurality of leads (2) formed in a specified pattern on an insulation base material (1) (for example, resin film), an insulation resin layer (3) is formed on the insulation base material (1) so as to cover the step parts (5), and the upper end surfaces of the leads (2) are positioned above the insulation resin layer (3).
Description
Technical field
The present invention relates to be used to detect the probe substrate and the manufacture method thereof of liquid crystal board etc.
Background technology
In the past, people are known to be used to detect the various forms of the probe substrate of liquid crystal board etc., have as its typical example, for example Japan speciallys permit No. 2974214 disclosed probe substrate, promptly, on a distolateral base material of the whole length direction of a plurality of leads that forms with predetermined pattern on the insulating substrate, form the probe substrate of the insulating resin layer that prevents above-mentioned wire dropping.
But, utilize above-mentioned example in the past, there is following problem.
Even the insulating resin layer of formation and the same level of conductor thickness direction (sustained height) in the groove of the space segment of this known probe substrate between adjacent wires, prevent wire dropping, and can improve the intensity that comes off of lead to a certain extent, also be difficult to it is fully improved.
As everyone knows, the lead that is formed on the probe substrate disposes with small (for example 15 μ m-25 μ m) line width, require the adhesion strength of itself and substrate high again to bearing when checking the caused cut of crimping and drawing back etc., but the known probe substrate that picture is above-mentioned, when forming insulating resin layer with the same level of conductor thickness direction (sustained height), because of conductor thickness small (for example, 5 μ m-10 μ m) be difficult to the contact area of lead and insulating resin layer is enlarged, promptly enable to a certain extent the intensity that comes off of lead is improved, also be difficult to fully with its enhancing.
When making probe crimping liquid crystal board etc. check the object rechecking, can adhere to dust on the lead to take place and inspection object loose contact (poor flow), to clean in case of necessity, but this moment, the cotton rod of dipping ethanol and isopropyl alcohol equal solvent moves when cleaning to multi-direction, wire dropping easily takes place, and when making cotton excellent vertical wires group move cleaning, this phenomenon is more obvious especially.
The present invention finishes in view of the foregoing.The purpose of this invention is to provide a kind of probe substrate and manufacture method thereof, this probe substrate has the cut that is produced when higher wire dropping intensity is checked fully bearing and draws back etc., can also fully bear the cleaning of being carried out with ethanol and isopropyl alcohol equal solvent simultaneously.
Summary of the invention
Probe substrate of the present invention is to form at least one distolateral base material in the two ends of whole length directions of a plurality of down layer conductors with predetermined pattern on the insulating substrate, coated the probe substrate of the insulating resin layer that prevents above-mentioned wire dropping, it is characterized in that, coat with insulating resin layer at above-mentioned at least one end of layer conductor down, and the side of the following part that does not coat of layer conductor with insulating resin layer and above stacked topping wire, form the step part between the layer conductor and topping wire down at an end of layer conductor down thus.
According to probe substrate of the present invention, form step part between this time layer conductor and the topping wire at following layer conductor one end, the insulating resin layer that forms this step part of covering makes down layer conductor be securely fixed in insulating resin layer.Thus, become and have that can fully bear the cut that is produced when checking and draw back etc., also can fully bear the probe substrate of the lead of the cleaning of being carried out with ethanol and isopropyl alcohol equal solvent simultaneously.
In addition, the manufacture method of probe substrate of the present invention has following feature: for form the space segment that insulating resin layer forms usefulness on insulating substrate at least one distolateral, utilize addition or subtraction to form operation with the following layer conductors that predetermined pattern forms a plurality of layer conductors down on above-mentioned insulating substrate; Ultraviolet exposure and video picture after the drying, are carried out with photomask to cover above-mentioned layer conductor down in the whole surface that insulating resin liquid is coated on above-mentioned insulating substrate, form the insulating resin layer formation operation that only covers the above-mentioned insulating resin layer of layer conductor one end down; The side of the exposed parts of above-mentioned down layer conductor and above, with coating method lamination topping wire, form jump in the following end of layer conductor and form the upper surface of above-mentioned topping wire and above-mentioned insulating resin layer forms operation with topping wire high or that be positioned at the lead above the above-mentioned insulating resin layer.
According to the manufacture method of probe substrate of the present invention, utilize addition or subtraction on above-mentioned insulating substrate, to form after a plurality of down layer conductors, to form the space segment that insulating resin layer forms usefulness on distolateral in that insulating substrate is at least one with predetermined pattern; Afterwards insulating resin liquid is coated on the whole surface of above-mentioned insulating substrate, makes its drying with topped layer conductor down.Below, by with the ultraviolet exposure and the video picture of photomask, form and only cover the above-mentioned insulating resin layer of layer conductor one end down, the side of the above-mentioned exposed parts of layer conductor down and above, through coating method lamination topping wire, form jump in the end of layer conductor down.That is, form its upper surface and above-mentioned insulating resin layer with high or be positioned at the topping wire of above-mentioned insulating resin layer top.By such manufacture method, can make probe substrate, better realize probe substrate of the present invention.
Probe substrate of the present invention and manufacture method thereof an example preferably are to utilize insulating resin to cover the center section of the whole length direction of layer conductor down.Do not have special restriction for the area coverage of this lead center section, for example, better reach the degree that all expose at the lead both ends.The lead area coverage enlarges, and then lead is difficult to come off.
An example that is used for the insulating substrate of probe substrate is resin film and board-like material, can use Kapton as resin film.That is, good because of its insulativity.
On above-mentioned insulating substrate, as forming the insulating resin layer that prevents that wire dropping from using, be fit to photosensitive acryl resin or photosensitive polyimide resin, simultaneously, as photosensitive acryl resin, available photosensitive heat curing type heat-proof acrylic resin surface coating coating (cover coat ink), and, be fit to use the photosensitive polyimide resin precursor solution as the photosensitive polyimide resin.These insulating resins are because of having photonasty, thus can before thermal treatment, expose, and after the exposure, solidify through thermal treatment, can form precision good insulation performance resin bed.
Description of drawings
Fig. 1 is the planimetric map of probe substrate of the present invention.
Fig. 2 is the stereographic map of the formation form of expression lead and insulating resin layer.
Fig. 3 is the figure of expression probe substrate manufacturing process, represents the formation operation of the following layer conductor of step a-f respectively; Step g, the insulating resin layer of h forms operation; The topping wire of step I forms operation.
Fig. 4 is the right view of Fig. 3.
Fig. 5 is the sectional view of the Z-Z of Fig. 4 step I.
Fig. 6 is the synoptic diagram that topping wire exposes the variation of pattern.
Fig. 7 is the synoptic diagram that topping wire exposes the variation of pattern.
Fig. 8 is the synoptic diagram that topping wire exposes the variation of pattern.
Embodiment
Below for solving the mode of problem in the past.
With reference to accompanying drawing, describe with regard to one embodiment of the invention.In Fig. 1, represent the appearance that probe substrate of the present invention is overlooked, this probe substrate is on insulating substrate 1, forms a plurality of leads 2 at certain intervals, and covers with the end of insulating resin layer 3 with lead 2 whole length directions.In Fig. 2 of stereographic map, show the mode of this covering.
In Fig. 2,, form insulating resin layer 3 so that its covering is formed on the step part 5 of 2 groups of each ends of lead at the space segment 4 that is used on insulating substrate 1, forming insulating resin layer.In addition, lead 2 is made of the following layer conductor 2a and the topping wire 2b of lamination on this time layer conductor 2a that are formed on the metal film 6.And metal film 6 is formed on the insulating substrate 1.
On insulating substrate 1, form insulating resin layer 3 like this so that its step part 5 that will be formed at 2 groups of each ends of lead covers.Therefore,, make the wire termination that is formed with insulating resin layer 3 remain on conducting state even inspection objects such as liquid crystal board are carried out crimping, and rechecking, also can prevent coming off of lead 2 for a long time.And during this period,, can prevent coming off of lead 2 too even with ethanol and isopropyl alcohol equal solvent the surface that forms 2 groups in lead is cleaned when needing.
Among Fig. 1 and Fig. 2, the space segment of 2 groups of formation of the 7 no leads of expression, here, the naked resin is filled.In addition, as long as insulating substrate 1 has insulativity, can be membraneous material and board-like material etc., the base material of any form gets final product.Usually use resin film, as its typical example, available Kapton.In addition, both available thermoplastic Kapton, the also Kapton of available non-thermal plasticity.As other insulating substrate, for example useable glass epoxy base material, glass sex change epoxy base material, glass BT base material etc.
On the other hand, as the resin that forms insulating resin layer 3, can be used on the resin that has photonasty before the thermal treatment and can exposure imaging.Better, have the heat-resistant resin of the Tg more than 200 ℃ at least and before thermal treatment, have photonasty and the resin of energy exposure imaging with heat treated closed loop with after solidifying.In available negative-type, the positive type any.As the typical example of this resin, available photosensitive polyimide resin precursor solution and photosensitive heat curing voltinism heat-proof acrylic resin surface coating coating.
Manufacturing for above-mentioned probe substrate, for example, the topping wire that shown in Figure 4 as the right view of the front view (FV) Fig. 3 of the probe substrate in the manufacturing process and Fig. 3, the insulating resin layer that forms operation 10, step g, h through the following layer conductor of step a-f form operation 11 and step I forms operation 12 and makes.
Form in the operation 10 at following layer conductor, shown in the step f of the step f of Fig. 3 and Fig. 4, on insulating substrate 1, utilize addition that a plurality of layer conductor 2a are down formed predetermined pattern so that the space segment 4 of a distolateral formation insulating resin layer formation usefulness of insulating substrate 1.
At this moment, at first, shown in the step a of the step a of Fig. 3 and Fig. 4, form for example metal film 6 such as copper film along the whole length of insulating substrate 1.Suitable methods such as this available sputter and Copper Foil are bonding form.
Below, shown in the step b of the step b of Fig. 3 and Fig. 4, on metal film 6, be coated with for example anti-plate film of ultraviolet hardening photoresist (plating resist) 8.
Next, irradiation ultraviolet radiation to anti-plate film 8, exposure imaging, shown in the step c of Fig. 3, form anti-plate film figure 8a, the metal film 6 of its covering space part (part that no lead forms) makes the metal film 6 of line part (forming the part of lead) expose simultaneously.
Below, shown in the steps d of Fig. 3, utilize addition, for example electronickelling etc. will descend layer conductor 2a to form on the metal film 6 of online part, after this simultaneously, with alkali anti-plate film 8 be peeled off shown in Fig. 3 step e.
Shown in the step f of Fig. 3, the hydrochloric acid that utilizes normal concentration for example carries out etching to the metal film 6 of space segment, is removed, and space segment 4 etchings that also insulating resin layer formed usefulness are simultaneously removed.
Then move to insulating resin layer and form operation 11, form in the operation 11, shown in the step h of Fig. 4, on the space segment 4 of insulating resin layer formation usefulness, form insulating resin layer 3 at this insulating resin layer.
At this moment, shown in the step g of the step g of Fig. 3 and Fig. 4, coating insulating resin liquid 3a on whole insulating substrate 1 with layer conductor 2a group under covering, promptly, thus, insulating resin liquid is filled in the space segment of insulating resin layer formation usefulness and does not have on the space segment 7 of 2 groups of formation of layer conductor down.
For this insulating resin liquid, being fit to more specifically is to be fit to photosensitive polyimide resin precursor solution and photosensitive heat curing type heat-proof acrylic resin surface coating coating with photonasty acryl resin liquid or photosensitive polyimide resin liquid.
Below, through ultraviolet exposure and video picture, form and only cover the insulating resin layer 3 of layer conductor 2a one end down with photomask.In addition, at this state, fill at space segment 7 naked resins.Moreover the upper surface of following layer conductor 2a is positioned at the below lower than the upper surface of insulating resin layer 3.
Then, move on to topping wire and form operation 12.Form in operation 12 in this topping wire, utilize electrochemical plating with topping wire 2b group lamination on layer conductor 2a group's down exposed parts.Thus, the upper surface of 2 groups in lead is positioned at the top higher than the upper surface of insulating resin layer 3.
Only cover the insulating resin layer 3 of layer conductor 2a one end down because of forming like this, and with topping wire 2b group lamination on layer conductor 2a group's down exposed parts, so just can form the step part 5 (with reference to Fig. 2) that is positioned at 2 groups in lead.In addition, as shown in Figure 5, Fig. 5 is the Z-Z sectional view of Fig. 4 step I, covered by topping wire 2b because of descending layer conductor 2a and metal film 6, so even fine lead 2, its intensity is also bigger.
More than, though narrate with regard to an embodiment, among the present invention, also can be with above-mentioned different, utilize electrochemical plating with topping wire 2b lamination on the exposed parts of layer conductor 2a down, with sustained height with lead 2 upper surfaces and insulating resin layer 3 phase configuration.In addition, also can utilize subtractions such as Copper Foil etching to form down layer conductor 2a.
For the formation of insulating resin layer 3, not necessarily, also can form by the other end over there when needing only in a distolateral formation of insulating substrate 1.In addition, also can be for example splayed, herringbone etc. for the formation pattern of 2 groups in lead, can form any pattern.Moreover it is different with the pattern of Fig. 1 also can to make topping wire 2b expose pattern (with the pattern of checking the object contact position), is configured to the pattern shown in Fig. 6-8.Specifically, door shape pattern, black and white sub-box pattern as shown in Figure 7 and canonical form as shown in Figure 8 as shown in Figure 6.On these patterns and space segment 7, be filled with insulating resin, with insulating resin 2 lead 2 center section 2c are covered simultaneously.
Like this, the mode that the other end on the end that is formed with the insulating resin layer 3 that prevents that wire dropping from using and opposite thereof is exposed with certain-length, fill to cover the insulating resin of 2 groups in lead, promptly also can fill insulating resin so that the center section 2c of 2 groups in lead is covered fully.This filling utilizes the insulating resin painting process to carry out after topping wire forms operation 12.In addition, also can not cover the center section 2c of lead 2, only insulating resin is filled on the space segment 7, and this moment better be carry out such filling so that resin bed above be formed on than low below, 2 groups of upper surfaces of lead.
(A) layer conductor forms operation down
Base material is made by Ube Industries, Ltd, and thickness is that the Kapton of 75 μ m constitutes.In the argon gas insulating substrate is carried out the asperities processing, improve its adhesiveness after, utilize sputtering method to form the copper film of thick 0.3 μ m thereon.
Then, as the anti-plate film, with 25 μ m thickness UV curing type photoresist " PMER-N " is coated on the copper film, this resin should be changed Co., Ltd. by Tokyo and make.
Moreover, carry out exposure imaging, form the anti-plate film figure, with the copper film covering of space segment (not forming the part of lead), the copper film of line part (forming the part of lead) is exposed.The width of this line part is 18 μ m, and the width of space segment is 47 μ m.
Form the nickel wire line pattern of the about 5 μ m of thickness through the online part of electronickelling.Then, with alkali the anti-plate film that is coated with is peeled off.
Peel off and the copper film of the space segment that exposes through the anti-plate film with the soft etching of watery hydrochloric acid (soft etching), forming conductor width is a plurality of layer conductors down of 18 μ m.The width of the space segment between adjacent following layer conductor is 47 μ m.
(B) insulating resin layer forms operation
Utilizing roller to be coated with photosensitive polyimide resin precursor solution (Off ォ ト ニ one ス UR5400) that eastern レ Co., Ltd. makes, thickness is approximately 4 μ m makes it to cover the lead group, and after leveling, carries out 80 ℃ of dryings.
Utilize photomask, in the about 0.2mm scope of distance insulating substrate front end, utilize the exposure of ultrahigh pressure mercury lamp exposure machine, will carry out video picture except that the photosensitive polyimide resin the above-mentioned fore-end with special-purpose imaging liquid again and remove.Thus, can obtain except that an end parts of base material the probe substrate that lead exposes.
(C) topping wire forms operation
In 400 ℃ vacuum furnace, to this substrate carry out the photosensitive polyimide resin precursor cross hot-imide after, in the following layer conductor that the exposes nickel plating that powers on, lamination thickness is approximately the topping wire of 5 μ m.Thus, just form the lead that the upper surface is positioned at the insulating resin layer top.
The probe substrate of gained like this, because of on insulating substrate, being formed with insulating resin layer so that its covering is formed on the step part of lead one end, so the tack of lead and insulating substrate is enough, even the cotton rod of dipping ethanol and isopropyl alcohol equal solvent is moved perpendicular to the lead group, when carrying out the cleaning more than 100 times, wire dropping does not take place yet.
(A) layer conductor forms operation down
" the エ Star チ ヤ one Off レ Star Network ス " that makes in Mitsui Chemicals, Inc, be that thickness is to form on the above-mentioned copper film of copper film that thickness is 0.25 μ m by sputtering method on the Kapton of 75 μ m, the thickness that lamination adheres to as the anti-plate film is the dry film " NIT215 " of 15 μ m, and it is by closing the UV curing type photoresist that モ one ト Application Co., Ltd. makes day.
Carry out exposure imaging, form the anti-plate film figure,, the copper film of line part (forming the part of lead) is exposed with the copper film of covering space part (not forming the part of lead).The width of this line part is 18 μ m, and space segment is 47 μ m.
Then, by electronickelling, form the nickel wire line pattern that thickness is approximately 5 μ m on the online part.Through alkali the anti-plate film that is coated with is peeled off.
The space segment copper film that exposes peeling off through the anti-plate film with watery hydrochloric acid carries out soft etching, and forming conductor width is a plurality of layer conductors down of 18 μ m.Space segment width between adjacent following layer conductor is 47 μ m.
(B) insulating resin layer forms operation
The photonasty thermotolerance acryl resin surface coating coating (V-259PA) that utilizes roller coating Nippon Steel Chemical Co., Ltd to make on it, thickness is approximately 4 μ m and makes it to cover the lead group, carries out 110 ℃ of dryings of 10 minutes.
Utilize photomask, in the about 0.2mm scope of distance insulating substrate front end, irradiation 300mJ/cm
2Ultraviolet ray, use special-purpose imaging liquid " V-259OD " will the acryl resin except that said front part to carry out video picture again and remove.Thus, can obtain except that an end parts of base material the probe substrate that lead exposes.
(C) topping wire forms operation
In 100 ℃ heating furnace, heated this substrate 1 hour, make its heat curing after, in the following layer conductor that the exposes nickel plating that powers on, lamination thickness is approximately the topping wire of 5 μ m.Thus, just form the lead that the upper surface is positioned at the insulating resin layer top.
The probe substrate of gained like this, because of on insulating substrate, being formed with insulating resin layer so that its covering is formed on the step part of lead one end, so the tack of lead and insulating substrate is enough, even the cotton rod of dipping ethanol and isopropyl alcohol equal solvent is moved perpendicular to the lead group, when carrying out the cleaning more than 100 times, wire dropping does not take place yet.
The possibility of utilizing on the industry
Aforesaid probe substrate of the present invention and manufacture method thereof cover the jail because lead is insulated resin bed Admittedly be fixed in insulating substrate, be difficult to come off, so be fit to add the inspection of physical property load and utilize molten The lead that agent is carried out cleans.
Claims (14)
1. probe substrate, it is at least one distolateral substrate in the whole length direction two ends of a plurality of layer conductors down of forming with predetermined pattern on insulating substrate, coated the probe substrate of the insulating resin layer that prevents above-mentioned wire dropping, it is characterized in that, coat with insulating resin layer at above-mentioned at least one end of layer conductor down, and the side of the following part that does not coat of layer conductor with insulating resin layer and above stacked topping wire, form the step part between the layer conductor and topping wire down at an end of layer conductor down thus.
2. probe substrate according to claim 1 is characterized in that, also covers the center section of the whole length direction of above-mentioned lead with insulating resin.
3. probe substrate according to claim 1 and 2 is characterized in that, above-mentioned insulating substrate is a resin film.
4. probe substrate according to claim 3 is characterized in that, above-mentioned resin film is a Kapton.
5. probe substrate according to claim 1 is characterized in that, above-mentioned insulating resin layer is made of photonasty acryl resin or photosensitive polyimide resin.
6. probe substrate according to claim 5 is characterized in that, above-mentioned photonasty acryl resin is the resin behind the photosensitive heat curing type heat-proof acrylic resin surface coating paint solidification.
7. probe substrate according to claim 5 is characterized in that, above-mentioned photosensitive polyimide resin is the resin of photosensitive polyimide resin precursor solution after solidifying.
8. the manufacture method of probe substrate, it is characterized in that, for form the space segment of usefulness at least one distolateral formation insulating resin layer of insulating substrate, utilize addition or subtraction on above-mentioned insulating substrate, to form a plurality of following layer conductors of layer conductor down and form operation with predetermined pattern; For covering above-mentioned following layer conductor, insulating resin liquid is coated on the whole surface of above-mentioned insulating substrate, after the drying, carry out ultraviolet exposure and video picture with photomask, form the insulating resin layer that only covers the above-mentioned insulating resin layer of layer conductor one end down and form operation; With coating method with the topping wire lamination in the side of the exposed parts of above-mentioned following layer conductor and above, form jump in the end of layer conductor down and form the upper surface of above-mentioned topping wire and above-mentioned insulating resin layer is positioned at the lead above the above-mentioned insulating resin layer with height or upper surface topping wire forms operation.
9. the manufacture method of probe substrate according to claim 8 is characterized in that, after above-mentioned topping wire forms and has the topping wire of formation in the operation, covers the insulating resin painting process of the whole length direction center section of above-mentioned lead with insulating resin.
10. according to Claim 8 or the manufacture method of 9 described probe substrates, it is characterized in that above-mentioned insulating substrate is a resin film.
11. the manufacture method of probe substrate according to claim 10 is characterized in that, above-mentioned resin film is a Kapton.
12. the manufacture method of probe substrate according to claim 8 is characterized in that, above-mentioned insulating resin liquid is photonasty acryl resin liquid or photosensitive polyimide resin liquid.
13. the manufacture method of probe substrate according to claim 12 is characterized in that, above-mentioned photonasty acryl resin liquid is photosensitive heat curing type heat-proof acrylic resin surface coating coating.
14. the manufacture method of probe substrate according to claim 12 is characterized in that, above-mentioned photosensitive polyimide resin liquid is the photosensitive polyimide resin precursor solution.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP107706/2001 | 2001-04-05 | ||
| JP2001107706 | 2001-04-05 | ||
| JP107706/01 | 2001-04-05 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1500213A CN1500213A (en) | 2004-05-26 |
| CN1254687C true CN1254687C (en) | 2006-05-03 |
Family
ID=18959979
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB028073193A Expired - Fee Related CN1254687C (en) | 2001-04-05 | 2002-04-01 | Probe substrate and method of mfg. probe substrate |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP3983077B2 (en) |
| KR (1) | KR100924891B1 (en) |
| CN (1) | CN1254687C (en) |
| TW (1) | TWI271522B (en) |
| WO (1) | WO2002082104A1 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100741697B1 (en) * | 2005-10-28 | 2007-07-23 | 주식회사 파이컴 | Probe Card And Method Of Fabricating The Same |
| TW201018917A (en) * | 2008-11-13 | 2010-05-16 | Mpi Corp | Method of manufacturing probe card and structure thereof |
| CN114286537A (en) * | 2021-12-21 | 2022-04-05 | 上海嘉捷通电路科技股份有限公司 | Method for processing printed circuit board without lead residue on long and short step golden fingers |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000002746A (en) * | 1998-06-12 | 2000-01-07 | Nitto Denko Corp | Probe structure |
| JP3525761B2 (en) * | 1998-08-19 | 2004-05-10 | ソニーケミカル株式会社 | Manufacturing method of flexible printed wiring board |
| JP2000091722A (en) * | 1998-09-16 | 2000-03-31 | Ibiden Co Ltd | Printed wiring board and its manufacture |
| JP2001033485A (en) * | 1999-07-16 | 2001-02-09 | Toppan Printing Co Ltd | Inspecting jig and its manufacture |
-
2002
- 2002-03-28 JP JP2002092529A patent/JP3983077B2/en not_active Expired - Fee Related
- 2002-04-01 KR KR1020037012446A patent/KR100924891B1/en not_active IP Right Cessation
- 2002-04-01 CN CNB028073193A patent/CN1254687C/en not_active Expired - Fee Related
- 2002-04-01 WO PCT/JP2002/003280 patent/WO2002082104A1/en active Application Filing
- 2002-04-02 TW TW091106589A patent/TWI271522B/en not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| TWI271522B (en) | 2007-01-21 |
| KR100924891B1 (en) | 2009-11-02 |
| JP3983077B2 (en) | 2007-09-26 |
| JP2003014781A (en) | 2003-01-15 |
| WO2002082104A1 (en) | 2002-10-17 |
| KR20030086322A (en) | 2003-11-07 |
| CN1500213A (en) | 2004-05-26 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN1825581A (en) | Printed circuit board, flip chip ball grid array board and method of fabricating the same | |
| CN1292499C (en) | Encapsulation for OLED devices | |
| CN1755522A (en) | Method for forming photosensitive polyimide pattern and electronic devices having the pattern | |
| CN1604723A (en) | Producing method of flexible wired circuit board | |
| CN1309281C (en) | Circuit board and method for manufacturing the same | |
| CN1647262A (en) | Mold release layer transferring film and laminate film | |
| CN1744799A (en) | Wire-laying circuit substrate | |
| CN1359256A (en) | Flexible wire distribution board and making method | |
| CN1805653A (en) | Printed circuit board and manufacturing method thereof | |
| KR102127103B1 (en) | Method of producing electroconductive substrate, electronic device and display device | |
| CN1571626A (en) | Bonding pads for a printed circuit board | |
| CN1575096A (en) | Electronic circuit device and its manufacturing method | |
| CN1805657A (en) | Wired circuit board | |
| CN1421039A (en) | Electronic device and process of making electronic device | |
| JP2008219018A (en) | Forming method of photoresist laminated circuit board using aerosol of metal nanoparticles, plating method of insulating substrate, surface treatment method of metal layer of circuit board, and manufacturing method of multilayer ceramic capacitor | |
| CN1185913C (en) | Wiring circuit board with projecture and its producing method | |
| CN1717161A (en) | Printed circuit board and method for manufacturing printed circuit board | |
| CN1235276C (en) | Method for manufacturing circuit device | |
| CN1183625C (en) | Tubular circuit connector | |
| CN1171300C (en) | Method for making wiring circuit board with convex point and method for forming convex point | |
| CN100344445C (en) | Bonding layer for bonding resin on copper surface | |
| CN1225950C (en) | Circuit board | |
| CN1254687C (en) | Probe substrate and method of mfg. probe substrate | |
| CN1379421A (en) | Ceramic electronic parts and its making method | |
| CN1738040A (en) | Cof semiconductor device and a manufacturing method for the same |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20060503 Termination date: 20150401 |
|
| EXPY | Termination of patent right or utility model |