TW200938043A - Wire structure on circuit board and method for fabricating the same - Google Patents

Abstract

A wire structure on circuit board suitable for connecting to a circuit board is provided. The circuit board includes at least a pad, and a solder mask exposing the pad. The wire structure on circuit board includes a dielectric layer and a conductive pattern layer. The dielectric layer is disposed on the solder mask, and the dielectric layer has at least a hole exposing the pad. The conductive pattern layer is disposed on the dielectric layer and stretched in the hole. The conductive pattern layer is connected to the pad through the hole. Besides, a method for fabricating the wire structure on circuit board is provided, too.

Description

200938043

It is a technical field of the invention. The present invention relates to a circuit structure and a method of manufacturing the same, and more particularly to a circuit structure on a circuit board and a method of fabricating the same. [Prior Art] In the current circuit board process, when the circuit board circuit has been substantially completed, a layer of additional layer is usually fabricated to make the multiple pads of the circuit board lined up neatly. This allows the locations of these interfaces to conform to the wiring specifications of some boards and allows wafers, passive components, active components, and the like. The 卩 electronic component 谷易 is assembled on the circuit board, and the current method of manufacturing the above-mentioned build-up line is substantially the same as the build-up process used in the conventional circuit board process. 1A to 1E are schematic flow charts showing a conventional method of manufacturing a build-up line. Referring to FIG. 1A, a conventional method for manufacturing a build-up line includes the following steps. First, a wiring substrate 11 is provided, wherein the wiring substrate u includes a copper wiring layer 112, 114 and a dielectric layer 116 between the copper wiring layers 112 and 114. The circuit structure in the circuit substrate 11 is substantially completed, and the circuit substrate 110 at this time is not covered by the solder resist layer, that is, the circuit substrate 110 is regarded as a semi-finished product of the circuit board. Referring to Fig. 1B', then 'heating and pressing a resin layer 12 on the wiring substrate 110' where the resin layer 12 is covered with the copper wiring layer η]. The resin layer 120 is usually a film (Prepreg)' and the resin layer 12G is cured after heating. Twf.doc/n 200938043 Please refer to FIG. 1C, after which a laser drilling process is performed to form an opening H1 on the resin layer 120, wherein the opening H1 partially exposes the copper wiring layer 112' and the aspect ratio of the opening H1 ( The ratio of depth to width is usually between 0.4 and 2.4. Referring to Figure m, electroless plating and electroplating are sequentially performed to form a copper metal layer 130 and a conductive blind via structure B1 on the resin layer 12A. Conductive blind hole structure B1 will be from copper gold

The genus layer 130 extends into the opening n H1 and the conductive blind via structure B1 is connected to the copper wiring layer ι12 via the opening H1. It is worth mentioning that after the laser drilling process, there will be some glue collapse at the bottom of the opening, and these glues will cause electrical contact between the copper metal layer 13〇 and the copper circuit layer 112. situation. Therefore, before the copper metal layer 13G is opened, a desmear process is usually performed to remove the glue at the bottom of the opening m. The ginseng is 1D and the figure m, and then, the copper metal process is formed to form a copper circuit layer 13 〇. Thereafter, the shape of the solder resist layer 140, wherein the solder resist layer 140 is partially exposed 130, can be "moving for the connection layer: the electron element (four) moving parts, active components or other external elements. Thus, a circuit board has just been manufactured. Finished. Cheng, go to the rubber material inspection and tear laser drilling system when the mine is reduced, the rate is reduced, the phase sequence is the hole process moment = 6 200938043

Jtwfdoc/n In addition, the laser source equipment required for laser drilling processes is quite expensive, and the photoresist and etching solutions used in lithography and etching processes are also expensive. Second, the resin layer 120 is usually film, and the price of the film is also quite high. Therefore, the manufacturing method of the conventional build-up wiring has the disadvantages of time-consuming manufacturing time and excessive manufacturing cost. SUMMARY OF THE INVENTION The present invention provides a method of manufacturing a wiring structure on a wiring board to reduce manufacturing costs.

SUMMARY OF THE INVENTION The present invention is to provide a wiring structure on a circuit board to shorten manufacturing time. V The present invention proposes a method of manufacturing a wiring structure on a wiring board, which comprises the following steps. First, a wiring board is provided, wherein the wiring board includes a solder resist layer and at least one pad, and the solder resist layer exposes the pads. Next, an electrical layer of 奚·' 71 is formed on the solder resist layer, wherein the dielectric layer has at least one opening that exposes the charge. Next, at least one conductive pattern layer is formed, wherein the conductive pattern layer is disposed on the dielectric layer. The conductive pattern layer extends into the opening and the conductive layer is connected to the pad via the opening. In an embodiment of the invention, the forming the dielectric layer comprises printing an insulating material on the solder resist layer and baking the insulating material. In an embodiment of the invention, the insulating material comprises a thermosetting oil, a resin, a developing ink, a thermosetting insulating film, and a photosensitive insulating film. In an embodiment of the present invention, the method 7 for forming a conductive pattern layer is included in a printing-conductive paste or a conductive paste on a dielectric layer and baking conductively. Or V cream. In an embodiment of the invention, the conductive paste comprises copper glue, silver glue, carbon glue mountain, nano silver or conductive polymer material, and the conductive paste comprises copper paste, silver "stone reverse, nano silver or conductive" 13⁄4 molecular material. In an embodiment of the invention, the method for forming the conductive pattern layer comprises a nozzle, a method, a roller coating method, an electroless plating method, an electroforming method, a gold plating method, an evaporation method, a chemical vapor deposition method or a physical method. Vapor deposition. In an embodiment of the invention, the number of the pads is plural, and the conductive pattern layer is connected to at least one of the pads. In an embodiment of the invention, the method further includes forming a protective layer on the dielectric layer, wherein the protective layer is disposed on the conductive pattern layer. In one embodiment of the invention, the protective layer completely covers the conductive pattern layer or the partially exposed conductive pattern layer. In the embodiment of the present invention, the material of the dielectric layer may be the same or different from the material of the prevention. #曰 ❿ The present invention proposes a circuit structure on a circuit board that is suitable for electrical connection-circuit boards. The circuit board includes at least a layer of exposed material and a wiring structure on the circuit board including a dielectric layer and a conductive electrical layer 2 on the solder resist layer, and the dielectric layer has at least - exposed contacts 4 The conductive pattern layer is disposed on the dielectric layer and extends into the opening. The conductive pattern layer is connected to the interface via the opening. In the above, the aspect ratio of the above opening in the embodiment is between _200938043 and fdoc/n in one embodiment of the invention between micrometers and 30 micrometers. The thickness of the dielectric layer described above is 10 and the thickness of the conductive pattern layer is between 10 microns and 50 microns in one embodiment of the invention. The present invention forms a dielectric layer on the solder resist layer by using a printing method. Therefore, the present invention can directly form a dielectric layer on the line without heating the resin layer and the laser removing process.

on. The features and advantages of the present invention are more apparent and understood from the following description of the present invention. [Embodiment] [First Embodiment] Fig. 2 is a cross-sectional view showing a line structure of a circuit board according to a first embodiment of the present invention. Referring to FIG. 2, the circuit structure 300 on the circuit board of the embodiment can be electrically connected to a circuit board 2, wherein the circuit board 2 is a finished product, and the circuit board 2 includes multiple connections. The pad 21 is bonded to a solder resist layer 220. Although the circuit board 200 shown in FIG. 2 includes two pads 21, in other embodiments not shown in the drawings, the circuit board 2 can include a pad 210 or more than two pads 21〇. . In addition, the type of the solder resist layer 220 shown in FIG. 2 is a solder mask layer definition (SMD), but in other embodiments not shown, the solder resist layer 22 is of the type 9 200938043 itwf. Doc/n

Mask Define, can also be a non-solderproof layer definition (No~s〇lder NSMD). The wiring structure 3 on the wiring board includes a dielectric layer (10) and a conductive pattern layer 32G. The dielectric layer 31G is placed on the solder resist layer 22 and the layer 310 has a plurality of openings H2 exposing the (four) turns. Although the dielectric layer 31〇 shown in FIG. 2 has two openings Η2, it is included according to the wiring board.

The number of the dielectric layers 310 may also have an opening Η2 or more than two openings Η2. In addition, the dielectric layer 310 may be formed by printing an insulating material including a thermosetting ink, a resin, a developing ink, a solid insulating film, a photosensitive insulating film or a polymer dielectric layer, wherein The method of insulating material 可 may include steel plate printing, enamel printing or other suitable printing methods. Of course, the method of fabricating the dielectric layer 310 may also include spraying, developing, roller coating, electroless inspection, miscellaneous inspection, chemical vapor deposition, or physical vapor deposition. The conductive pattern layer 320 is disposed on the dielectric layer 310, and the conductive pattern layer 320 extends into the openings ’2 and is connected to the pads 210 via the openings. The preferred thickness of the conductive pattern layer 320 may be between 1 μm and 50 μm, and the conductive pattern layer 32 may be formed by a printed-conductive paste or a conductive paste, and the difference between the conductive paste and the conductive paste is the difference between the two. (Reynolds number) is different. In detail, the Reynolds number of the conductive paste is larger than that of the conductive paste, that is, the conductive paste is easier to flow than the conductive paste. The conductive paste may be copper glue, silver glue, carbon glue or other low-resistance metal glue, and the conductive paste may be a metal paste with a resistivity of copper. In addition, the conductive paste is made of nano silver, a conductive polymer material or a non-metal formed by chemical synthesis (4). The method of printing a conductive paste or a conductive paste may include steel plate printing, screen printing, or other suitable printing method. From the above, it is known that the conductive pattern layer 320 and the dielectric layer 31 can be formed by printing (four). Therefore, referring to Fig. 1E), the conductive pattern layer 32 and the dielectric layer 31 are different in the copper wiring layer 13A shown in Fig. 1E, and the resin layer 12A. More specifically, the surface of a conductive pattern layer 320 at the opening m is relatively flat (as shown in Fig. 2). Secondly, the side wall of the opening H1 of the prior art is relatively steep. The side wall of the opening H2 of the dielectric layer 31 is relatively flat. Therefore, the opening H2 of the dielectric layer 310 has a small aspect ratio and may have a value between 0.02 and 〇·1. z

The wiring structure 300 on the circuit board may further include a protective layer 33, wherein the protective layer 330 is disposed on the conductive pattern layer 320, and the protective layer 330 has a thickness between 10 micrometers and 30 micrometers. The protective layer 330 may completely cover the conductive pattern layer 320 to protect the conductive pattern layer 320, thereby preventing the conductive pattern layer 320 from being damaged. In addition, the material of the protective layer 330 may be the same as that of the dielectric layer 310 or the solder resist layer 220. In addition, in this embodiment, the conductive pattern layer 320 can serve as a jumper. For example, the conductive pattern layer 320 can be connected to at least one pad 210 ′ or connect one of the pads 210 to another pad 21 (^ Furthermore, the conductive pattern layer 320 can also be connected to the three pads 210. Of course, the conductive pattern layer 320 can be connected to more than four pads 21 of 200938043 ttwf.doc/n=J. 〇' is remote from the conductive pattern layer 320 and double a, one 曰LJ is connected and the main connection is short-circuited. In addition, the wiring structure of the circuit board 2 配置 300 is configured on two circuit boards. The structure of the line structure, and then FIG. 3A to FIG. 3D', the manufacturing method of the line structure 300 on the circuit board will be described in detail.

System, earth, soil & line structure 300 on the circuit board in Figure 2 :: Line 2: 思: thinking,. Referring to FIG. 3A, the circuit board circuit board 2 of the present embodiment (^, the manufacturing method of the cymbal includes the following steps. First, provide - this test ' /, the middle circuit board includes a plurality of 21G and a violent road to catch some The solder resist layer 22 of the pad 210. u Read® 3B 'Next, a dielectric layer 310 is formed on the solder resist layer 22〇

The dielectric layer 31G has a plurality of openings exposing the pads 21 to form a dielectric layer 31G. The method may be a stamper ink, a resin, a horse electrical layer or other insulating material on the solder resist layer 22A. When the dielectric layer 310 is formed by printing a thermosetting ink, the method of forming the dielectric layer may be a baking edge (4). Thus, the insulation (4) is cured to form the dielectric layer 310. Referring to FIG. 3C', then at least one conductive pattern layer 32 is formed on the "electric layer 310. In this embodiment, a conductive paste or conductive paste of the conductive pattern layer 32" is formed on the dielectric layer 310. When conducting When the layer 320 is formed by printing a conductive paste or a conductive paste, the method of forming the conductive pattern layer 32 may be baking the conductive paste or the conductive paste. Thus, the conductive paste or the conductive paste is cured to form a conductive pattern layer. 32〇. 12 200938043 4twf.doc/n The conductive pattern layer 320 can be formed by printing a conductive paste or a printed conductive paste. This embodiment also has other methods of forming the conductive pattern layer 320, such as spray coating. ), roller coating method, electroless ore method, electro-pneumatic method, sputter, steam mirror, chemical vapor deposition (CVD) or physical vapor deposition (Physical Vapor Deposition, PVD) When the conductive pattern layer 320 is formed by the above method, the following steps are included. First, a comprehensive covering dielectric layer 310, a solder resist layer 220, and a conductive film layer of the pads 210 are formed. Then, a lithography and etching process is performed to remove a portion of the conductive film layer to form a conductive pattern layer 32. After the conductive pattern layer 320 is formed, 'substantially, a wiring structure 300 on a circuit board has been manufactured. Referring to FIG. 3D, a protective layer 330 may be formed on the dielectric layer 310, wherein the protective layer 330 may cover the conductive pattern layer 320 in a comprehensive manner, and the forming method and material of the protective layer 330 may be combined with the dielectric layer 31. The second embodiment is a cross-sectional view of the circuit structure on the circuit board of the second embodiment of the present invention. Referring to FIG. 4, the circuit structure 400 on the circuit board of the present embodiment is suitable. Electrically connected to a circuit board 200, wherein the circuit board 2 includes at least one pad 210' and a solder resist layer 220, and the circuit structure 400 on the circuit board includes a dielectric layer 410 and a conductive pattern layer. 42〇 and a protective layer 430. It should be noted that although FIG. 4 only shows one pad 21〇, in the embodiment, the circuit board 200 may also include a plurality of pads, so that in FIG. 4 Connect (four) 〇 'the number and miscellaneous this ^塾 210 13 200938043 ltwf.doc / n The formation method, material and structure of the circuit structure 400 on the circuit board are similar to the first embodiment, so the description will not be repeated, but the circuit board 400 and the first embodiment The difference is that the protective layer 43 〇 partially covers the conductive pattern 420. That is, the protective layer 43 〇 partially exposes the pattern 420. In detail, the conductive pattern 420 is surrounded by the portion exposed by the protective layer 430 (the dotted line in FIG. 4 The portion can be used as a pad for connecting the wafer, the passive component, the active component or other external electronic component, that is, the conductive pattern 420 can be connected to the external electronic component. In summary, the wiring structure of the circuit board of the present invention has a dielectric layer formed by printing an insulating material on the solder resist layer of the circuit board. Therefore, the present invention can directly form a dielectric layer on the solder resist layer of the wiring board without passing through the heat-pressing resin layer, the laser iron hole process, and the stripping/inspection. Compared with the prior art, the method of manufacturing a wiring structure on a circuit board of the present invention can greatly reduce the manufacturing cost and effectively shorten the manufacturing time. — Secondly, by printing a conductive paste or a printed conductive paste, the present invention can form a conductive pattern layer directly on the dielectric layer without passing through a lithography and etching process. Therefore, the method of manufacturing the wiring structure of the wiring board of the present invention does not require the use of photoresist and etching solution. This can reduce the contaminants produced by the wiring structure on the board during the manufacturing process to meet environmental requirements. Although the present invention has been disclosed in the above preferred embodiments, it is not intended to limit the present invention, and those skilled in the art to which the invention pertains will be able to make a few changes without departing from the spirit and scope of the invention. And the scope of the invention is therefore defined by the scope of the appended claims. 200938043 ttwf.doc/n [Simplified Schematic Description] Fig. 1E0 shows a flow of a method for manufacturing a build-up line. Fig. 2 is a schematic view showing a first embodiment of the present invention. ', section of the circuit structure on the road board ❹ Figure 3A to Figure 3D is the schematic of the manufacturing method of the line in Figure 2. The circuit structure on the board is the line/face system on the circuit board according to the second embodiment of the present invention. [The main component symbol description] 100, 200, 200': circuit board 110: line Substrate 112, 114, 130': copper wiring layer 116, 310, 410: dielectric layer 120 · resin layer ® 130: copper metal layer 140, 220, 220': solder resist layer 210, 210': pads 300, 400 : Line structure 320, 420 on the circuit board: conductive pattern layer ° 330, 430: protective layer B1: conductive blind hole structure HI, H2: opening 15

Claims (1)

Twf.doc/n 200938043 X. Application for patents: ^ - A method of manufacturing a circuit structure on a circuit board, comprising: a circuit board, wherein the circuit board includes - an anti-welding layer - the solder resist layer exposes the pad; At least on the solder layer 'where the dielectric layer has an opening exposing the pad; and a dielectric layer 'where the conductive pattern layer is disposed in the layer extending into the opening' and the conductive pattern is connected to the opening The pad. The contact with the community is called the wire on the manufacturing circuit board described in the first paragraph of the patent scope. The soldering prevention method: the method of forming the dielectric layer including the printing-insulating material is described in the second item of the road social application (10). The method for manufacturing the wire edge on the circuit board, the method for forming the ageing layer of the towel further comprises the method of baking the wire on the manufacturing circuit board according to item 2 of the claim 5, wherein the insulating material comprises A thermosetting ink, a resin, a reed ink, a thermal-mesh insulating film, a photosensitive insulating crucible or a polymer dielectric. 5. A wire, a wire on a manufacturing wiring board as described in claim i. The method of forming the conductive pattern comprises printing a conductive paste or a conductive paste on the dielectric layer. 6. The method of manufacturing a wire on a circuit board according to claim 5, wherein the method of forming the conductive pattern layer further comprises baking 16 ^ twf.d〇c/n 200938043 Glue or the conductive paste. Yarn L ΐ Apply for the line on the manufacturing circuit board of the Wei Wei 5th section, wherein the conductive adhesive includes steel glue, silver glue, carbon glue, nai ii south molecular material' and the conductive paste includes copper paste, silver paste, Carbon moon, not silver or conductive polymer materials. ❹ m Road in L t towel, please refer to the line on the circuit board of the first review, the method of swallowing, wherein the method of forming the conductive pattern layer includes spraying, electroless plating, and electro-acoustic recording. Splashing method: steaming to emulsion phase deposition or physical vapor deposition. Road junction two:: Please = the line on the manufacturing circuit board mentioned in item 1 is far away; 1 , , , the number of the pads is multiple, and the conductive pattern layer is transported at least one pad . The silk it is like a + the special fiber around the first line of the manufacturing line on the secret board ‘and includes the formation-dip layer on the medium, wherein the layer is disposed on the conductive pattern layer. The circuit junction 1 is constructed as a method of applying & on the manufacturing circuit board described in Section 1G of the Wei Wei, wherein the protective layer completely covers the conductive pattern layer. The wiring structure is as applied to the method of manufacturing the wiring board described in the 10th handle of the stipulations, wherein the protective layer partially exposes the conductive pattern layer. The structure of the road is the same as that of the manufacturing circuit board described in the first application of the patent scope. The method of the material of the dielectric layer and the material of the solder resist layer, and the method for manufacturing the line on the circuit board according to the first aspect of the patent application, wherein the material of the dielectric layer and the prevention The material of the solder layer is not the same as 17 kwf.doc/n 200938043. I5. - A circuit board on a circuit board. The circuit board includes at least a connection to a circuit. The circuit structure on the circuit board includes an anti-tank layer, a dielectric layer, which exposes the pad. Disposed on the solder mask to expose the opening of the pad; and the % germanium layer has at least - a conductive pattern layer disposed on the dielectric layer and extending into the inner portion through which the conductive pattern layer is connected Pads. "Khankou Society 槿16 Γ Γ 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利The wiring on the circuit board /, 5λ; the thickness of the electrical layer is between 10 micrometers and 30 micrometers. The structural layer of the circuit described in the fifteenth item of the patent range is formed by printing an insulating material. - Structure 'It!, the line on the circuit board mentioned in the 18th patent; the edge material includes thermosetting ink, resin, developing type ' insulating film, photosensitive insulating film or polymer dielectric layer < The green path on the circuit board described in item 15 of the second paragraph is formed, and the pattern layer is printed-conductive rubber or conductive paste and the structure is two == glue 2 ° = said: r line electric polymer Materials: Copper, silver, carbon, nano silver or guide 22 • The line on the circuit board described in item 20 of the patent application is slightly 18 4twf.doc/n 200938043, the mouth structure /, the conductive paste includes Copper paste, silver paste, carbon paste, nano silver or charged polymer materials. ^ 23·If you apply for the scope of the 15th item The circuit on the circuit board is configured as follows: wherein the thickness of the conductive pattern layer is between 1 〇 micrometer and 5 〇 micrometers. 24 线路 线路 如 如 如 如 如 如 如 如 如 如 如 , , , , , , , The material of the electric layer is the same as that of the solder resist layer. Ο ❹ 25·If you apply for full-time (4) 15 lines, the line on the circuit board, 'σ', the material of the dielectric layer is different from the material of the solder resist layer. The last name I broadcasts the line on the circuit board as described in item 15 of the patent scope:: the number of the pads is plural, and the conductive pattern layer is connected to the sister broadcast 2\ The circuit 1 on the circuit board of the present invention further includes a protective layer, wherein the protective layer is disposed on the circuit board of the conductive pattern 2, 8 and the circuit board described in item 27 of the patent scope, The protective layer completely covers the conductive pattern layer. The circuit of the circuit board described in Item 27 of the patent specification (4) is used to partially expose the conductive pattern layer.