TWI378754B - Method for manufacturing printed circuit board - Google Patents

Description

1378754 • VI. Description of the invention: r [Technical Field of the Invention] The present invention relates to a circuit board manufacturing technique, and more particularly to a method of fabricating a circuit board. [Prior Art], With the development of electronic products in the direction of miniaturization and high speed, the circuit boards have also evolved from single-sided circuit boards and double-sided circuit boards to multilayer circuit boards. A multi-layer circuit board refers to a circuit board having a plurality of layers of conductive lines, which has a large wiring area and a high mutual φ continuation degree, and thus is widely used, see the literature Takahashi, A. Ooki, N. Nagai, A. Akahoshi, H. Mukoh, A. Wajima, M. Res. Lab., High density multilayer printed circuit board for HITAC M-880 > IEEE Trans, on

Components, Packaging, and Manufacturing Technology, 1992, 15(4): 418-425 〇 The board fabrication process typically includes exposure, development, engraving, drilling, and electrominening. Taking a multilayer circuit board as an example, it is fabricated by a lamination method. Specifically, the package: the first step is to expose the conductive line on the surface of the copper-clad substrate by exposure, development, and side processes; the second step is to have two or more The double panel of the line is pressed to form the inner layer of the multi-layer board; the third step is to press the layer on both sides of the (10) line; the fine step is to pass through the copper-clad substrate at the predetermined position of the pure copper ride. 'The copper layer is formed by the electroplating process on the via hole wall; in the sixth step, the conductive line is formed on the pure copper box layer by an exposure and side process, so that the plurality of conductive lines are electrically connected by the plated hole. $ ί The method of 3 through holes is to realize the process of manufacturing the outer conductive line and the inner conductive line, and the manufacturing process is complicated, and the operation of forming the through hole with the through hole === hole becomes more and more difficult. 】 4 1378754 production two = method 'in order to simplify the circuit board two mouth = the conductive substrate formed a sentence and died 4 x remove the ^ knife conductive substrate 'to make

In addition to the electricity θ 'bad by the domain transfer process money side Wang Yiqian engraved layer of the corpse - the structure of the conductive column from the third surface exposed J electric column; in the first conductive to; lead:; f: edge layer Having: away from the first conductive layer: the third 1:; the tL complex is electrically connected by the plurality of first conductive pillars. w circuit and shirt-conducting layer borrowing advantages and ί pre-technical ==ΐ scheme of the circuit board manufacturing method has the following through hole strip ^ to: the electric column β left insulation material, to avoid insulation ^ affect the conductive layer = $ [embodiment Step of the system = ϊ: = number of embodiments of the circuit board provided by the present technical solution The method of manufacturing the circuit board provided by the first embodiment of the present invention may include the following first step to provide a conductive substrate 100 The conductive substrate (10) may be electrolyzed or may be a rolled copper flute. - First, the first conductive substrate is formed on the surface to form a first photoresist layer (10), and the photoresist is coated on the surface by a tjci method, and then the photoresist is exposed to form a first photoresist layer 120. In this embodiment, the first-film is photoresist, thereby forming the first photoresist layer 120. And the post-image transfer process and the side process remove a portion of the conductive substrate. The two-body's exposure to the first photoresist layer (four) is sequentially performed, and = 3 is performed, and _ is performed. The commonly used means in the field of can be counted in the ‘&&;== two-line selective exposure, no hollowing out” shot and remain intact. The photoresist is not exposed to light. At the same time, the portion of the conductive layer A1 is not covered by the conductive A1, and the portion covered by the brain is not covered by the dummy substrate 100. A structure including the first conductive layer 110 surface t is formed. * a conductive layer 110 having an opposite first surface 112, the plurality of first conductive pillars 113 from the second step of the first table 120, removing the remaining first photoresist layer on the plurality of first conductive pillars 113 After the remaining first photoresist layer 120 is removed by using a strong solution such as a sodium hydroxide solution, the structure of the conductive substrate _ is as follows: 1378754 sound 13Γ step m The first surface 111 of the electrical layer u is formed with a first insulation im, and the third surface m of the first conductive layer 110 is exposed. From the third surface of the first insulating layer 130, the electric column is filled with the liquid insulating material on the bismuth dioxide U ,U, which is adjacent to the third surface of the first insulating layer 130. between. In the liquid expansion ‘, iii: the Uf material will be approaching the first guide 113 埴 right η 王 王 王 conductive pillar 113. In order to avoid the overflow of the liquid insulating material, the thickness of the liquid-filled material, the liquid-filled material, and the material of the edge of the material are not more than the first conductive pillar 113;; lilt 22, poly-resin resin, poly-imine, Teflon, poly Thiamine, polyfluorenyl 2 Ϊ One or more of the present copolymers. In the conventional oil-based jade art or the fifth step, a second conductive layer 14 is formed on the first insulating layer 130. Before pre-i4G, the surface of the first insulating layer i3G may be subjected to a second process to improve the interface bonding between the second conductive layer 140 and the first insulating layer 130 and ensure the first The surface of the two conductive layers 140 is + uniform, thereby improving the fabrication precision of the second conductive layer 140. The 32nd floor of the clothing surface is formed by directly bonding the formed conductive metal case to the third surface 131 of the first insulating layer 130 by a pressing process. The second conductive layer 14 is formed in the gap 141 between the second conductive layer 14 and the first first edge layer 130. Conductive mad U3 and 7 1378754 The sixth step, in the second conductive layer 14 〇 image transfer process and silver engraving process etch resist layer (9), by the number of first conductive pillar U3 from the third surface ^ 2, conductive layer 140 and the complex-conductive column 113 are flush with the third table from 131. Out of the road. p points to make the plural number

The second photoresist layer 15 is formed in a manner that the second photoresist layer 150 is exposed to the upper portion of the H pillar 113; and - see FIG. 7 and FIG. 8 'the plural first conductive Chuanxing = brother — Conductive layer insulation residual layer and the first conductive column

- The portion of the first insulating layer 130 is removed, and the first conductive column is protected. Since Na-f1314=the second photoresist, the portion of the insulating layer 130 is laterally removed, and the second conductive sound 140 乂 first, and the edge layer 130 is already present in the gap 141, the communication a cross-section of the hole 笫-conductive pillar 113, thereby exposing the second conductive layer 140 above the number of posts 113, the insulation residue = 曰m, and the first conductive pillar m exposed to the first insulating layer The two columns 13 are all exposed. Preferably, after the singularity, the conductive pillar 113 is flush with the first insulating layer 130, so that the conductance between the first conductive layer 11G and the subsequent conductive layer is facilitated by the first conductive pillar 113. through. In a seventh step, the first conductive layer 14 is formed into a second conductive line, and the conductive line 160 and the first conductive layer 11 are electrically connected by a plurality of first conductive pillars ι 3 . First, the conductive hole 142 is filled in the communication hole 142 of the second conductive layer 140, and the second conductive layer 140 filled with the conductive material is formed into the second conductive substrate 143. A chemical copper layer 144 having a predetermined thickness is formed by electroless plating on the via hole 142 of the second conductive layer 140, as shown in FIG. Then, an electroplated copper layer 145 is electroplated on the chemical copper layer ^44 1378754 until the communication hole 142 of the galvanized steel layer 145, and is flush with the second conductive layer 14G, and the second conductive substrate of the conductive layer 140 143. Thus, as shown in FIG. 1A, second, the second layer on the second conductive substrate 143 is removed: connected to the conductive! U-Qi Tian plural number - conductive column 113 conduction ίίί _ can be formed using the wet method _ process. Specifically, = selective exposure is performed with Ge = first resistance, so that ϊ = ΐ ί = dissolves in the developer, thereby puncturing part of the copper:

The Ctit is exposed to expose a second conductive line (10) electrically connected to the first conductive layer 110 by the plurality of first conductive pillars 113. /, the younger conductor conducts the first, the line 17G' to make the first electrical connection, as shown by the plurality of first conductive electrodes 113 and the complex second conductive layer 110 including the first conductive line 170 to the column 113 Forming a second insulating layer on the side of the second conductive pillar and the plurality of first conductive insulated conductive pads, forming a fourth insulating layer, and forming a fourth surface on the plurality of second conductive layers The surface of the layer is exposed to the surface of the second surface. The second layer of the second layer of the second layer of the second conductive pillar is exposed by the image transfer process and the etching process. Part of it, 1378754 kg? 1 wherein the second conductive pillar is flush with the fourth surface; finally, the third conductive J layer J is formed into a third conductive line, and the third conductive line is made up of (10) the plurality of electric poles and the first conductive line 17G Electrically connected, the second conductive line 160 is electrically connected to the first conductive pillar 113 by the plurality of first conductive pillars 113. The method for fabricating the circuit board provided by the second embodiment of the present invention may include the following steps: The substrate ί is provided as =f^2()G, and the thickness A is in the conductive 211 (10) of the first embodiment: : Plural first guide Thunder m ♦ Mountain has an insulating residual layer 232. The 232 is embedded in the second conductive layer 24. And ^ two $ to: 241, as shown in Figure 15. 〒 增 增 空 空 空 空 空 空 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 The 231th is flush, as shown in Figure I6. Exposure to the first insulating layer one point = layer = - two column two 丄: > / δ 〇 4 communication hole 242. The second conductive layer 24G is formed into the second conductive line 260, and the electric column line 260 and the first conductive layer 210 are filled with the plurality of first holes to connect the plurality of communication holes 242 of the conductive layer 240. The conductive material, the second conductive layer 24G of the material forms a second conductive substrate (not shown in FIG. 11 by electroless plating in the via hole 242 of the 11th conductive layer 24G and has a tear-off Λ=Λ243, and then chemical The copper layer 243 is electrically formed on the electricity: the mt 44 fills the communication hole 242 of the second conductive layer 240, and the disk-conductive layer 24G is flush, thereby licking the third conductive substrate. ...,: by the shirt Image transfer process and etch process __ (2) = the second conductive substrate is made into the second conductive line - 213 material - weighted first = ^ 1 side of the fourth step to remove the complex first conductive The portion of the column 213 that exits from the first surface 231 simultaneously forms the second conductive layer and fills the communication hole with the conductive material to obtain a plurality of connected conductive lines. Thus, one image rotation can be omitted. Adding a first conductive layer to the first conductive line 27 (), and causing the electric line 270 to pass through the plurality of first conductive columns 213 and the second The formation of the first conductive line 27 is preferably 126G electrically connected. The second conductive ray _ 29 _ ;; the map is not the same ' and the third conductive layer is formed into the nl:! w 270" w as shown in FIG. . The conductive guinea 214 is electrically connected to each other, and the 11th ancient insulating layer 280 can be formed by pressing. Second insulating the fourth surface 281 of the first conductive layer 210, the plurality of second conductive covers the first surface, and the second insulating residual layer (not shown) leads to form a third conductive layer on the second insulating layer The plurality of second bodies 1 are embedded in the third conductive layer for the portion of the fourth surface 281 and the second conductive layer and the vacant layer, and the electrical layer of the third conductive layer is S The etched process side removes a portion of the third conductive guide, which is exposed from the fourth surface 281, so that the plurality of first conductive pillars 2U are flush with the fourth surface 281. The second conductive layer is formed into a third conductive line 290, and the first conductive line 270 and the second conductive line 260 are electrically connected to the first conductive pillar 213 and the plurality of second conductive pillars 214. Moreover, the formation of the second conductive circuit 260 is substantially the same as that of the second conductive circuit 260. The advantages of the step and the manufacturing method of the circuit board have the following advantages: Guide 5, and greatly simplify the electric-insulation@|®, the case exposes the conductive column to X, and the Dan-Chen tongue violently passes on the conductive column on the surface of the first insulating layer, which can remove the insulating material remaining on the g-electrode to avoid the insulating material. Affecting the electrical connection between the conductive layers, other variations can be made within the spirit of the present invention. ♦ Any changes made by God should be included in the present invention: 12 丄J/δ/Μ Inside. '等>文彳> Decoration or change, white should be covered in the following patent application scope [Simple description of the drawing] Intended to provide a reference to the silk reading method Figure 2 is based on the conductive substrate shown in Figure i One surface forming a first photoresist layer

3, after exposure, development, side, the conductive layer of the figure and the Fuxiang-conductive column. Figure 4 is a schematic view showing the formation of a first insulating layer on the first conductive layer shown in Figure 4 after removing the first photoresist layer on the plurality of first conductive pillars of Figure 3. FIG. 6 is a schematic view showing the formation of a second conductive layer on the first insulating layer shown in FIG. . 7 is a schematic view of the second column of the second conductive layer shown in FIG. 6 after the formation of the second photoresist layer, after the development, side, exposed the plurality of the first guide in FIG. 7 is shown in FIG. A chemical copper is formed in the communication hole of the second conductive layer. Figure 10 is a schematic view showing the formation of an electroplated copper layer on the chemical copper layer shown in Figure 9. FIG. 12 is a diagram showing the second photoresist layer on the second conductive layer shown in FIG. 10 after the second conductive layer is formed into a second conductive line. FIG. The structure of the conductive substrate provided by the method of manufacturing the circuit board provided by Fangsi Ershiguan. Figure 14 is a diagram showing the electric column of the drawing a and the multifilament-filament-conducting layer, the first plurality of second guiding patterns, the first conductive layer shown in Fig. 4, the first insulating layer, and the first conductive layer, and the first conductive layer is exposed, developed, and laterally exposed. 'Exposing the plural number in Figure 15 -. Figure 17 is a schematic view showing the second conductive layer of Figure 16 after forming a second conductive line. Figure 18 is a schematic diagram of the first conductive layer of Figure 17 after forming a first conductive line ===, a second insulating layer is formed on the first conductive line, and

100'200 111 112 [Description of main component symbols] First surface of the conductive substrate Second surface of the first conductive layer First conductive pillar First photoresist layer First insulating layer Third surface 110 113, 213 120 130 , 230 131 Insulating residual layer second conductive layer 132 140, 240 14 1378754 gap 141 second photoresist layer 150 communication hole second conductive edge second conductive substrate chemical copper layer electroplated copper layer first conductive line first conductive layer second conductive枉 first surface second surface third surface insulating residual layer void conductive line second insulating layer third conductive line fourth surface 142 160 143 144 145 170 214 211 211 231 232 241 270 280 290 281 242 260 243 244 15

Claims (1)

1378754 The seven application patent garden provides: the financial wire, the package is as follows: by the image transfer process and the etching process, the electric substrate is formed to include a phase - m having a phase i from the first conductive layer. Forming a first-insulating layer, the first insulating layer is formed on the first insulating layer; and removing a portion of the second conductive layer and the U-side is exposed a method for manufacturing the circuit board according to the first aspect of the present invention, wherein the second conductive circuit of the plurality of the first conductive lines is used in the method of manufacturing the circuit board, wherein the second conductive circuit and the side process are removed by a portion After the conductive layer and the portion of the first surface exposed from the third surface, the second conductive layer forms a plurality of first conductive pillars exposed from the plurality of interconnecting holes and the first: a conductive line and a conductive line The first conductive layer is filled with a conductive material by a plurality of first conductive pillars electrically connecting the plurality of conductive vias of the second conductive layer, and the second conductive layer of the electrical material forms a second conductive substrate; and By image transfer X art and side JL art riding second guide The second conductive base wire is guided. & (10) 仃 _ 3 · The manufacturing method of the circuit board as described in claim 2, 坌 ΐΪΪΐυ ( 四 四 四 四 四 所述 所述 所述 所述 所述 所述 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 1 16 16 The image transfer X fine domain is green, wherein the conductive layer is exposed from the third surface by the conductive pillar and the plurality of first conductive holes, and the plurality of first conductive pillars are formed, and the second conductive layer is formed. The plurality of surfaces are flush, and the second layer of potential holes are exposed and associated with the third conductive line and the first conductive layer by "the second conductive layer is made of a conductive layer for surname" The material is electrically connected to the plurality of first conductive pillars. 5. The conductive layer of the circuit board according to claim 4 is made into a first transfer process and the process removes a portion of the second conductive layer. In the method of manufacturing the circuit board according to the above item 1, wherein the second surface of the "fc conductive θ forms the first insulating layer comprises the steps of: filling the insulating material with the liquid The first conductive pillar of the plurality of first conductive pillars is used to form a liquid insulating material between the plurality of I conductive pillars to form a first insulating layer. The method for fabricating a circuit board according to the invention, wherein the first conductive + 3 is made into a first conductive line and the second conductive line is made with or after the second conductive line is formed The first electrical line is electrically connected by a plurality of first conductive columns. The method for manufacturing a circuit board according to the invention of claim 1, wherein the structure formed by the conductive earth material after etching the partial conductive substrate by the image transfer process and the etching process further comprises a plurality of The second conductive surface extending outwardly from the second surface is 378754. The manufacturing method of the circuit board further includes the steps of: forming the first conductive layer into a first conductive line, and the second conductive line and the first conductive line a conductive line is electrically connected by a plurality of first conductive pillars; 〃 = a second surface of the first conductive layer forms a second insulating layer, and the second insulating layer has a fourth surface away from the first conductive layer, And exposing the plurality of second ray from the fourth surface of the second insulating layer; forming a third conductive layer on the second insulating layer; ^ image transfer X art and side process side wire portion third guide a portion of the four surfaces exposed to make the plurality of second conductive: the conductive layer is made into a second conductive line, and the third conductive line is made up of the second conductive line and the first conductive line Road $ Wei The first conductive pillar is electrically connected to the first conductive line, and the manufacturing method of the circuit board described in the first item is described, and the circuit board-shaped circuit is formed after the first insulating layer is formed on the surface of the conductive layer. a plurality of second conductive wires and a plurality of first conductive columns are respectively connected to the first conductive line and connected with a plurality of edges, and the first insulating layer has a far-formed-secondary And the plurality of second guides are formed from the fourth surface of the second path, and the third conductive layer is formed on the second insulating layer; the surface is exposed; - by the image transfer process and the simplified work The second conductivity of her fine surface is 丄犮, except for the third conductive layer and the complex with the fourth surface; Sicking so that the plurality of second conductive pillars form the third conductive layer of the cable by the plurality of second conductive pillars and such that the third conductive line conductive line borrows (4) the plural number - ^ The electric circuit is electrically connected, the second electric pole, and the first conductive line are electrically connected. 18