TWI271246B - Electrolytic processing apparatus and method - Google Patents
Electrolytic processing apparatus and method Download PDFInfo
- Publication number
- TWI271246B TWI271246B TW092100219A TW92100219A TWI271246B TW I271246 B TWI271246 B TW I271246B TW 092100219 A TW092100219 A TW 092100219A TW 92100219 A TW92100219 A TW 92100219A TW I271246 B TWI271246 B TW I271246B
- Authority
- TW
- Taiwan
- Prior art keywords
- electrode
- processing
- workpiece
- substrate
- electrolytic
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23H—WORKING OF METAL BY THE ACTION OF A HIGH CONCENTRATION OF ELECTRIC CURRENT ON A WORKPIECE USING AN ELECTRODE WHICH TAKES THE PLACE OF A TOOL; SUCH WORKING COMBINED WITH OTHER FORMS OF WORKING OF METAL
- B23H3/00—Electrochemical machining, i.e. removing metal by passing current between an electrode and a workpiece in the presence of an electrolyte
- B23H3/08—Working media
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23H—WORKING OF METAL BY THE ACTION OF A HIGH CONCENTRATION OF ELECTRIC CURRENT ON A WORKPIECE USING AN ELECTRODE WHICH TAKES THE PLACE OF A TOOL; SUCH WORKING COMBINED WITH OTHER FORMS OF WORKING OF METAL
- B23H3/00—Electrochemical machining, i.e. removing metal by passing current between an electrode and a workpiece in the presence of an electrolyte
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23H—WORKING OF METAL BY THE ACTION OF A HIGH CONCENTRATION OF ELECTRIC CURRENT ON A WORKPIECE USING AN ELECTRODE WHICH TAKES THE PLACE OF A TOOL; SUCH WORKING COMBINED WITH OTHER FORMS OF WORKING OF METAL
- B23H5/00—Combined machining
- B23H5/06—Electrochemical machining combined with mechanical working, e.g. grinding or honing
- B23H5/08—Electrolytic grinding
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
- C25F3/00—Electrolytic etching or polishing
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
- C25F7/00—Constructional parts, or assemblies thereof, of cells for electrolytic removal of material from objects; Servicing or operating
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002001737A JP2003205428A (ja) | 2002-01-08 | 2002-01-08 | 電解加工装置及び方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200301717A TW200301717A (en) | 2003-07-16 |
TWI271246B true TWI271246B (en) | 2007-01-21 |
Family
ID=19190647
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW092100219A TWI271246B (en) | 2002-01-08 | 2003-01-07 | Electrolytic processing apparatus and method |
Country Status (4)
Country | Link |
---|---|
US (1) | US20050115838A1 (ko) |
JP (1) | JP2003205428A (ko) |
TW (1) | TWI271246B (ko) |
WO (1) | WO2003057948A1 (ko) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1453991A4 (en) * | 2001-12-13 | 2007-12-05 | Ebara Corp | APPARATUS AND METHOD FOR ELECTROLYTIC PROCESSING |
DE102006062037B4 (de) * | 2006-12-29 | 2013-10-31 | Advanced Micro Devices, Inc. | Verfahren zum Steuern eines elektrochemischen Ätzprozesses und System mit einer elektrochemischen Ätzanlage |
DE102006062031B3 (de) * | 2006-12-29 | 2008-06-19 | Advanced Micro Devices, Inc., Sunnyvale | System zum Antreiben und Steuern einer bewegbaren Elektrodenanordnung in einer elektro-chemischen Prozessanlage |
MD3808G2 (ro) * | 2007-05-25 | 2009-08-31 | Институт Прикладной Физики Академии Наук Молдовы | Instalaţie de prelucrare electrică a metalelor |
CN104400156B (zh) * | 2014-09-12 | 2017-10-10 | 南京航空航天大学 | 非圆截面电解切割电极及其装置 |
CN106191946B (zh) * | 2016-08-08 | 2018-10-09 | 江苏大学 | 一种多电位吸液电沉积3d打印的装置和方法 |
CN108385158A (zh) * | 2018-03-16 | 2018-08-10 | 江西宏业铜箔有限公司 | 一种高延低峰值超薄铜箔的光面微蚀处理工艺及设备 |
TWI720548B (zh) * | 2019-07-17 | 2021-03-01 | 逢甲大學 | 變脈寬定電流控制之電化學加工方法及其裝置 |
TWI742663B (zh) * | 2020-05-15 | 2021-10-11 | 國立臺灣師範大學 | 電解加工設備及其方法 |
US20230390887A1 (en) * | 2022-06-06 | 2023-12-07 | Applied Materials, Inc. | Face-up wafer electrochemical planarization apparatus |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5149405A (en) * | 1991-05-28 | 1992-09-22 | Lehr Precision Inc. | Four-axis ECM machine and method of operation |
JP3837783B2 (ja) * | 1996-08-12 | 2006-10-25 | 森 勇蔵 | 超純水中の水酸基による加工方法 |
US6652658B1 (en) * | 1998-12-07 | 2003-11-25 | Japan Science And Technology Corporation | Method for machining/cleaning by hydroxide ion in ultrapure water |
JP2001064799A (ja) * | 1999-08-27 | 2001-03-13 | Yuzo Mori | 電解加工方法及び装置 |
JP4513145B2 (ja) * | 1999-09-07 | 2010-07-28 | ソニー株式会社 | 半導体装置の製造方法および研磨方法 |
JP4141114B2 (ja) * | 2000-07-05 | 2008-08-27 | 株式会社荏原製作所 | 電解加工方法及び装置 |
JP4043234B2 (ja) * | 2001-06-18 | 2008-02-06 | 株式会社荏原製作所 | 電解加工装置及び基板処理装置 |
US7101465B2 (en) * | 2001-06-18 | 2006-09-05 | Ebara Corporation | Electrolytic processing device and substrate processing apparatus |
US7638030B2 (en) * | 2001-06-18 | 2009-12-29 | Ebara Corporation | Electrolytic processing apparatus and electrolytic processing method |
-
2002
- 2002-01-08 JP JP2002001737A patent/JP2003205428A/ja active Pending
-
2003
- 2003-01-07 TW TW092100219A patent/TWI271246B/zh not_active IP Right Cessation
- 2003-01-07 US US10/500,576 patent/US20050115838A1/en not_active Abandoned
- 2003-01-07 WO PCT/JP2003/000038 patent/WO2003057948A1/en active Application Filing
Also Published As
Publication number | Publication date |
---|---|
WO2003057948A1 (en) | 2003-07-17 |
US20050115838A1 (en) | 2005-06-02 |
JP2003205428A (ja) | 2003-07-22 |
TW200301717A (en) | 2003-07-16 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |