EP1453991A4 - Electrolytic processing apparatus and method - Google Patents

Electrolytic processing apparatus and method

Info

Publication number
EP1453991A4
EP1453991A4 EP02788797A EP02788797A EP1453991A4 EP 1453991 A4 EP1453991 A4 EP 1453991A4 EP 02788797 A EP02788797 A EP 02788797A EP 02788797 A EP02788797 A EP 02788797A EP 1453991 A4 EP1453991 A4 EP 1453991A4
Authority
EP
European Patent Office
Prior art keywords
processing apparatus
electrolytic processing
electrolytic
processing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP02788797A
Other languages
German (de)
French (fr)
Other versions
EP1453991A1 (en
Inventor
Mitsuhiko Shirakashi
Masayuki Kumekawa
Hozumi Yasuda
Itsuki Kobata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2001380641A external-priority patent/JP3995463B2/en
Priority claimed from JP2002067393A external-priority patent/JP2003266245A/en
Application filed by Ebara Corp filed Critical Ebara Corp
Publication of EP1453991A1 publication Critical patent/EP1453991A1/en
Publication of EP1453991A4 publication Critical patent/EP1453991A4/en
Withdrawn legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
    • C25F7/00—Constructional parts, or assemblies thereof, of cells for electrolytic removal of material from objects; Servicing or operating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23H—WORKING OF METAL BY THE ACTION OF A HIGH CONCENTRATION OF ELECTRIC CURRENT ON A WORKPIECE USING AN ELECTRODE WHICH TAKES THE PLACE OF A TOOL; SUCH WORKING COMBINED WITH OTHER FORMS OF WORKING OF METAL
    • B23H3/00—Electrochemical machining, i.e. removing metal by passing current between an electrode and a workpiece in the presence of an electrolyte
    • B23H3/02—Electric circuits specially adapted therefor, e.g. power supply, control, preventing short circuits
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23H—WORKING OF METAL BY THE ACTION OF A HIGH CONCENTRATION OF ELECTRIC CURRENT ON A WORKPIECE USING AN ELECTRODE WHICH TAKES THE PLACE OF A TOOL; SUCH WORKING COMBINED WITH OTHER FORMS OF WORKING OF METAL
    • B23H5/00—Combined machining
    • B23H5/06—Electrochemical machining combined with mechanical working, e.g. grinding or honing
    • B23H5/08—Electrolytic grinding
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
    • C25F3/00—Electrolytic etching or polishing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
    • H01L21/321—After treatment
    • H01L21/32115—Planarisation
    • H01L21/3212—Planarisation by chemical mechanical polishing [CMP]
    • H01L21/32125—Planarisation by chemical mechanical polishing [CMP] by simultaneously passing an electrical current, i.e. electrochemical mechanical polishing, e.g. ECMP

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
EP02788797A 2001-12-13 2002-12-11 Electrolytic processing apparatus and method Withdrawn EP1453991A4 (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2001380641 2001-12-13
JP2001380641A JP3995463B2 (en) 2001-12-13 2001-12-13 Electrolytic processing method
JP2002067393 2002-03-12
JP2002067393A JP2003266245A (en) 2002-03-12 2002-03-12 Electrolytic machining device and method
PCT/JP2002/012973 WO2003054255A1 (en) 2001-12-13 2002-12-11 Electrolytic processing apparatus and method

Publications (2)

Publication Number Publication Date
EP1453991A1 EP1453991A1 (en) 2004-09-08
EP1453991A4 true EP1453991A4 (en) 2007-12-05

Family

ID=26625046

Family Applications (1)

Application Number Title Priority Date Filing Date
EP02788797A Withdrawn EP1453991A4 (en) 2001-12-13 2002-12-11 Electrolytic processing apparatus and method

Country Status (4)

Country Link
US (1) US20050051432A1 (en)
EP (1) EP1453991A4 (en)
TW (1) TWI283196B (en)
WO (1) WO2003054255A1 (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7638030B2 (en) 2001-06-18 2009-12-29 Ebara Corporation Electrolytic processing apparatus and electrolytic processing method
TW592859B (en) * 2001-09-11 2004-06-21 Ebara Corp Electrolytic processing apparatus and method
TWI277473B (en) 2002-01-31 2007-04-01 Ebara Corp Electrolytic processing apparatus and method, fixing method, fixing structure for ion exchanging member
US7476303B2 (en) * 2003-08-11 2009-01-13 Ebara Corporation Electrolytic processing apparatus and electrolytic processing method
US20070062815A1 (en) * 2005-09-19 2007-03-22 Applied Materials, Inc. Method for stabilized polishing process
US20070108066A1 (en) * 2005-10-28 2007-05-17 Applied Materials, Inc. Voltage mode current control
MD3808G2 (en) * 2007-05-25 2009-08-31 Институт Прикладной Физики Академии Наук Молдовы Installation for electrical metal working
CN104419975A (en) * 2013-09-05 2015-03-18 通用电气公司 System and method for controlling electrochemical stripping process
CN109594119B (en) * 2018-12-11 2020-08-14 大连理工大学 Electrochemo-polishing device and working method thereof

Family Cites Families (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4072119A (en) * 1977-03-21 1978-02-07 Williams Barney V Vertical rising boat lift
US4226202A (en) * 1977-11-23 1980-10-07 Conrad Edward G Floating lash barge lifting device
US4615289A (en) * 1978-08-14 1986-10-07 Bloxham Roger W Floating dry dock
US4509446A (en) * 1982-12-21 1985-04-09 Marine Concepts, Inc. Drydocking device having a moment resisting arrangement
US4732102A (en) * 1986-03-10 1988-03-22 Holman Clifford W Portable, self-contained, self-adjustable craft lift and wet/dry storage system
US5099778A (en) * 1990-02-27 1992-03-31 Palen Richard L Craft lift
JP3013377B2 (en) * 1990-03-07 2000-02-28 日産自動車株式会社 Semiconductor substrate etching method
US5036015A (en) * 1990-09-24 1991-07-30 Micron Technology, Inc. Method of endpoint detection during chemical/mechanical planarization of semiconductor wafers
US5499733A (en) * 1992-09-17 1996-03-19 Luxtron Corporation Optical techniques of measuring endpoint during the processing of material layers in an optically hostile environment
US5240347A (en) * 1992-12-08 1993-08-31 Shorethings, Inc. Collapsible boat lift
US5413941A (en) * 1994-01-06 1995-05-09 Micron Technology, Inc. Optical end point detection methods in semiconductor planarizing polishing processes
DE19548115C2 (en) * 1994-12-27 2002-08-29 Nissan Motor Electrochemical etching process for a semiconductor substrate and device for carrying out the process
US5702563A (en) * 1995-06-07 1997-12-30 Advanced Micro Devices, Inc. Reduced chemical-mechanical polishing particulate contamination
US6131528A (en) * 1996-06-24 2000-10-17 Michael Kilpatrick Meek Docking apparatus
JP3837783B2 (en) * 1996-08-12 2006-10-25 森 勇蔵 Processing method with hydroxyl groups in ultrapure water
JP2913473B2 (en) * 1997-01-31 1999-06-28 株式会社チップトン Eddy current barrel processing machine having gap adjusting function, method for forming escape layer, and gap adjusting method
WO1999026758A1 (en) * 1997-11-25 1999-06-03 John Hopkins University Electrochemical-control of abrasive polishing and machining rates
TWI223678B (en) * 1998-03-20 2004-11-11 Semitool Inc Process for applying a metal structure to a workpiece, the treated workpiece and a solution for electroplating copper
US6121152A (en) * 1998-06-11 2000-09-19 Integrated Process Equipment Corporation Method and apparatus for planarization of metallized semiconductor wafers using a bipolar electrode assembly
DE69940611D1 (en) * 1998-12-07 2009-04-30 Yuzo Mori MACHINING / PURIFICATION PROCEDURE USING HYDROXYDE IONES IN ULTRAREINATE WATER
US6032601A (en) * 1999-03-05 2000-03-07 Gates; Craig D. Combination boat lift and dock
JP2001064799A (en) * 1999-08-27 2001-03-13 Yuzo Mori Electrolytic working method and device
JP4513145B2 (en) * 1999-09-07 2010-07-28 ソニー株式会社 Semiconductor device manufacturing method and polishing method
US6379223B1 (en) * 1999-11-29 2002-04-30 Applied Materials, Inc. Method and apparatus for electrochemical-mechanical planarization
US6709563B2 (en) * 2000-06-30 2004-03-23 Ebara Corporation Copper-plating liquid, plating method and plating apparatus
JP4141114B2 (en) * 2000-07-05 2008-08-27 株式会社荏原製作所 Electrolytic processing method and apparatus
US7638030B2 (en) * 2001-06-18 2009-12-29 Ebara Corporation Electrolytic processing apparatus and electrolytic processing method
US7101465B2 (en) * 2001-06-18 2006-09-05 Ebara Corporation Electrolytic processing device and substrate processing apparatus
JP4043234B2 (en) * 2001-06-18 2008-02-06 株式会社荏原製作所 Electrolytic processing apparatus and substrate processing apparatus
US6592742B2 (en) * 2001-07-13 2003-07-15 Applied Materials Inc. Electrochemically assisted chemical polish
US6884724B2 (en) * 2001-08-24 2005-04-26 Applied Materials, Inc. Method for dishing reduction and feature passivation in polishing processes
JP2003205428A (en) * 2002-01-08 2003-07-22 Ebara Corp Electro-chemical machining apparatus, and method

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
No further relevant documents disclosed *

Also Published As

Publication number Publication date
WO2003054255A1 (en) 2003-07-03
EP1453991A1 (en) 2004-09-08
US20050051432A1 (en) 2005-03-10
TWI283196B (en) 2007-07-01
TW200301171A (en) 2003-07-01

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