TW200301171A - Electrolytic processing apparatus and method - Google Patents

Abstract

There is provided an electrolytic processing apparatus and method that can effect processing of a workpiece, having in the surface an electrically conductive material as a to-be-processed material, with high processing precision and can produce an intended form of processed workpiece with high accuracy of form. The electrolytic processing apparatus includes: a processing electrode which can come close to or in contact with a workpiece; a feeding electrode for feeding electricity to the workpiece; an ion exchanger disposed in at least one of the space between the workpiece and the processing electrode and the space between the workpiece and the feeding electrode; a fluid supply section for supplying a fluid to the space between the workpiece and at least one of the processing electrode and the feeding electrode, in which the ion exchanger is present; and a power source for supplying an electric power between the processing electrode and the feeding electrode while arbitrarily controlling at least one of a voltage and an electric current.

Description

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V. Description of the invention (1) [Technical field to which the invention belongs] The present invention relates to an electrolytic processing device and method, particularly Fu B. A method for processing electrical materials existing on the surface of a substrate (especially a semiconductor wafer) ' Or it is an electrolytic device and method for removing impurities adhering to the substrate surface.先前 [Previous technology] In recent years, the use of copper (Cu) instead of aluminum or aluminum alloys as a material for forming interconnection circuits on a substrate as far as a semiconductor wafer has become quite clear. The copper system has a lower electrical impedance and a higher electronic impedance. Copper interconnects are usually formed by filling copper into minute recesses formed on the substrate surface. Various techniques are known to shape & copper interconnects, including chemical Vapor Deposition (CVD), Subtractive Plating, and Plating & This _ According to any of the techniques described above, the / is first applied to the entire surface of the substrate. The film is then removed by chemical mechanical polishing (CMp) to remove unnecessary 7 indium. Figures 1A to 1C show an example of the plate W, which is formed and the right interconnect line in accordance with the sequence of processing steps. As shown in FIG. 1A, an insulating film 2 such as a silicon steel (s 102) film or a film of a low-k material is deposited on a conductive layer of a semiconductor device, and the screen is formed on On the semiconductor base. The contact hole 4 used as the interconnection line is formed in the insulating film 2 by a lithography / cutting technique. Deben = a barrier layer 5 formed of tantalum nitride (TaN) or a similar material is formed on the surface of ytterbium, and a sub-layer 7 is formed on the barrier layer 5 ′

2uUj〇H7 | 5. Description of the invention (2) Layer-7 is used as the electron supply layer for electroplating. Next, as shown in FIG. 1B, copper plating is performed on the surface of the substrate W to fill the contact holes 3 and the trenches 4 with copper, and at the same time, a copper film 6 is deposited on the insulating film 2 . After that, the copper film 6 and the barrier layer 5 on the insulating film 2 can be removed by chemical mechanical polishing (CMP), so that the copper filled in the contact hole 3 and the trench 4 used as the interconnection line can be removed. The surface of the film 6 and the surface of the insulating film 2 are substantially on the same surface. Thereby, the interconnection line composed of the copper thin film 6 can be formed, as shown in FIG. 1C. ® Components in a variety of different types of equipment have recently become more sophisticated and require greater precision. Since sub-micron manufacturing techniques have been widely adopted, the characteristics of materials are greatly affected by processing methods. Under these conditions, in this conventional processing method in which physical damage is applied to an appropriate portion of the workpiece and the surface of the workpiece is removed with a tool, a considerable amount of blemishes will be generated, and the quality of the workpiece will be deteriorated. Therefore, how to prevent the material characteristics from deteriorating during processing is a very important issue. Certain machining methods have been developed to solve this problem, such as chemical grinding, electrolytic machining, and electrolytic grinding. Unlike the conventional physical processing, these methods use chemical dissolution to perform the removal process or the like. Therefore, these methods do not produce altered layers and dislocations such as plastic deformation. ) Flaws, so that these processing methods can be carried out without destroying the characteristics of the material. As an electrolytic processing method, an electrolytic reaction method using an ion exchanger and a processing method in ultrapure water have been developed.

314269.ptd Page 8 2uUj〇H7i V. Description of Invention (3) The figure shows the principle of this electrolytic processing. Fig. 2 shows that when an ion exchanger 12a mounted on the processing electrode 14 and an ion exchanger 1 2b mounted on the feed electrode 16 are in contact with each other or near the surface of the workpiece 10, the power is supplied via the power source 7 A voltage is supplied between the processing electrode 14 and the feeding electrode 16 and the liquid 1 8 is supplied by the liquid supply portion 19 between the processing electrode 14, the feeding electrode 16 and the workpiece 10 (for example Pure water). In this example of the electrolytic processing method, water molecules 20 in a liquid 18 such as ultrapure water are effectively dissociated into hydroxide ions 22 and hydrogen ions 24 using ion exchangers 12a and 12b. The hydroxide ion 22 thus formed can be carried to the surface of the workpiece facing the processing electrode 14 by, for example, the electric field between the workpiece 10 and the processing electrode 14 and by the flow of the liquid 18, whereby The density of the hydroxide ion 22 near the workpiece 10 will increase, and the hydroxide ion 22 will react with the atom 10a of the workpiece 10. The reaction product 26 produced by this reaction will be dissolved in the liquid 18, and will be removed from the workpiece 10 by the liquid 18 flowing along the surface of the workpiece 10. In this way, the surface of the workpiece 10 can be cleaned. As described above, in the electrolytic processing of a workpiece by an ion exchanger interposed between the workpiece and at least one of the processing electrode and the feeding electrode, it is often difficult to control the processing rate and the end time of the processing. When the electrolytic processing is performed while the current supplied between the processing electrode and the feeding electrode is controlled at a fixed value, in principle, the processing rate becomes fixed so that the processing area of the workpiece does not change, thereby making This processing rate can be easily controlled during processing. Furthermore, because

314269.ptd Page 9 2uUj〇H7i V. Description of the invention (4) In this example, the total amount of current can be easily calculated, so it is possible to easily determine the amount of processing and the end time of processing. • However, if the area to be processed changes, the processing rate will also change. In this regard, as shown in FIGS. 3A to 3D, when the copper thin film 6 buried in the interconnection trench 4 formed on the surface of the substrate W is polished by electrolytic processing with a fixed current The barrier layer 15 made of an insulator is gradually exposed on the surface of the substrate W as the polishing progresses. When the barrier layer 5 has been exposed on the surface of the substrate W, the processing area is reduced in accordance with the straight line / space ratio and the density of the interconnection pattern, which in turn causes the processing rate to increase. Furthermore, when the conductive thin film is removed, such as the copper thin film 6 of the material to be processed on the surface of the substrate W, the resistivity of the conductive thin film increases as the thickness of the thin film decreases. Therefore, when the electrolytic processing is performed under a controlled fixed current, the voltage supplied between the processing electrode and the feed electrode increases with the thickness of the film. When the interconnection pattern is exposed and the electrolytic processing is near the end of its processing, the rate of voltage increase becomes quite large. Fig. 4 shows a state in which an applied voltage is changed (increase i) with time in an electrolytic machining process with a controlled fixed current value. As shown in Figure 4, the greater the current density, the greater the rate at which the voltage increases. The increase in voltage is because the applied voltage is inversely proportional to the film thickness of the copper film. In the case of a sharp rise in voltage, it is difficult to control the processing time. In addition, an excessive rise in the supply voltage can cause insulation failure (so-called discharge) of ultrapure water, which in turn can cause physical damage to the workpiece.

314269.ptd Page 10 2uUj〇I | 7i V. Description of the invention (5) On the other hand, when the electrolytic processing is controlled under the condition that the voltage supplied between the processing electrode and the feeding electrode is constant, The processing rate decreases sharply as the processing area decreases. In this regard, as shown in FIGS. 5A to 5D, when the copper thin film 6 buried in the interconnection trench 4 formed on the surface of the substrate W is polished by electrolytic processing under a fixed voltage The barrier layer 5 made of an insulator is exposed on the surface of the substrate W as the polishing progresses. When the barrier layer 5 is exposed on the surface of the substrate W, the processing area is reduced, making it difficult for current to flow, and the processing rate is drastically reduced. Moreover, the conductive film, such as the copper film 6, increases its resistance as the thickness of the film decreases, and the current value decreases as the resistance increases. The degree of reduction in current value becomes smaller as it approaches the end time of the process. Fig. 6 shows that the current changes with time in the electrolytic processing treatment with a controlled voltage, and the change in the processing rate becomes smaller as the processing time approaches the end time of the treatment. Therefore, compared with the case where the current value is controlled to a fixed value, it is possible to accurately determine the end time of the processing. However, as described above, when the electrolytic processing is performed by supplying a fixed voltage between the processing electrode and the feeding electrode, the current system changes with time. The processing rate also changes with the current, making it difficult to control the processing rate during processing. Furthermore, when an electroconductive process is performed on an electroconductive material by using an ion exchanger in the above-mentioned manner, it cannot directly apply a numerical control mechanism as it is generally applied to a conventional machining process. In this regard, an electrolytic processing method uses an electrode between a hydroxide ion (0H_) and an atom of a workpiece.

314269.ptd Page 11 2uUj〇H7i V. Description of the invention (6) Chemical-chemical reaction. Therefore, even when the workpiece and the tool (electrode) are not in contact with each other, processing may still occur. Therefore, the principle of electrolytic processing is different from the principle of mechanical processing, where the mechanical processing will cause physical damage to the workpiece. In more detail, in the general mechanical plus two processing, the processing is performed to cause the workpiece and the tool that are in contact with each other to move relative to each other, so this will cause physical damage to the workpiece. By releasing the contact of X between the workpiece and the tool (for example, when the required degree of processing is reached), the process of processing can be suspended. At this time, even when the tool passes the surface of the workpiece, the processing will not be made. keep going. In another ^ 5, according to the above-mentioned electrolytic processing method using a chemical reaction between a reactive substance and a workpiece, when the amount of the reactive substance reaches a certain level, the processing phenomenon will continue to occur, even when the tool ( The same applies when the electrode is not in contact with the workpiece. Therefore, when the tool (electrode) passes over the surface of the part of the workpiece for which a predetermined amount of processing has been performed, the processing phenomenon may still proceed improperly. Therefore, in order to enable the electrolytic processing method using a chemical reaction between a reactive substance and a workpiece to process a conductive material with a relatively high degree of processing precision, so that the processed workpiece can have the required structure, The system needs to adopt a control system, which can not only control the contact state between the workpiece and the tool (the position of the tool), but also control the reaction material (such as hydroxide ions) and A chemical reaction between the atoms of a dagger. SUMMARY OF THE INVENTION The present invention has been made in view of the problems existing in the background art described above. because

314269.ptd Page 12 2uUj〇H7i V. Description of the invention (7) Therefore, the object of the present invention is to provide an electrolytic processing device and method that can perform consistent processing without causing a drastic change in processing rate. . Another object of the present invention is to provide an electrolytic processing device and method capable of processing and processing a workpiece with a relatively high degree of precision, wherein the workpiece has a conductive material as a material to be processed on the surface, and can be manufactured with a considerable High shape precision for machining the desired shape of the workpiece. In order to achieve the above object, the present invention provides an electrolytic processing device including: a processing electrode, which can be close to or in contact with a workpiece; a feeding electrode, which is used to feed power to the workpiece; an ion exchanger, which is provided at the In at least one of the space between the workpiece and the processing electrode and the space between the workpiece and the feeding electrode; the fluid supply unit is used to supply fluid to the workpiece and at least one of the processing electrode and the feeding electrode In the space between them, the ion exchanger is present in the space; and the power source is to supply electric energy between the processing electrode and the feeding electrode under the condition of at least one of any control voltage or current. In electrolytic processing, the processing rate increases as the current supplied between the processing electrode and the feed electrode increases (the processing rate decreases as the current decreases). In addition, when the voltage supplied between the feeding electrode and the processing electrode rises, the current flowing between the feeding electrode and the processing electrode becomes larger, resulting in a faster processing rate. Therefore, by arbitrary control (such as changing with time), at least one of the voltage and current supplied between the processing electrode and the feeding electrode can enable the processing rate to be achieved according to the stage (state) of the processing optimize.

314269.ptd Page 13 2uUj〇H7i V. Description of the invention (8)-In the above-mentioned electrolytic processing device, the power supply can supply a fixed voltage between "the processing electrode and the feeding electrode, or the voltage and current At least one of them changes with time. The power supply can supply a fixed voltage or a fixed electric current with a continuously changing value between the processing electrode and the feeding electrode. Therefore, for example, the electrolytic processing can be performed by From the supply of high current or high voltage to the processing electrode < electrode and the feeding electrode, until the processing process is close to the end time of the processing, for example, until the interconnection pattern is exposed, the processing rate can be obtained. Near the end of the process, a low current # low voltage can be supplied to reduce the processing rate to avoid so-called over-etching. The power supply can sequentially supply a fixed current and a fixed voltage to the processing electrode and feed Between electrodes, for example, in the stage of processing where the processing area of the workpiece has not changed, the electrolytic processing can be The fixed current is controlled to maintain a fixed processing rate and help control the processing rate. When the processing area is rapidly reduced near the end of the processing, the electrolytic processing can be performed at a fixed voltage. To help control the processing rate near the end of the process. _ _ The power supply can first supply a fixed current with a continuously changing value, and then supply a fixed voltage with a continuously changing value to the processing electrode and feed. Between electric and electric poles. This makes the electrolytic processing process in the case of supplying a constant fixed current can first change the processing rate, and then changes the processing rate in steps of the electrolytic processing in the case of supplying a constant fixed voltage.

314269.ptd Page 14 2uUj〇H7i V. Description of the invention (9) In addition, the power supply system can continuously change the voltage or current value with time, which allows the electrolytic processing to be performed in accordance with the stage (state) of the processing. Processing rate to proceed. The invention provides an electrolytic processing method, including: providing a processing electrode, a feeding electrode, and an ion exchanger, wherein the ion exchanger is disposed between a space between the workpiece and the processing electrode and a space between the workpiece and the feeding electrode In at least one of the spaces; the processing electrode is brought close to or in contact with the workpiece, while power is fed to the workpiece by the feeding electrode; and the fluid is supplied between the workpiece and at least one of the processing electrode and the feeding electrode In the space, the ion exchanger is present in the space; and in the case of at least one of an arbitrary control voltage or current, power is supplied between the processing electrode and the feeding electrode. The invention also provides an electrolytic processing device, which includes: a processing electrode that can be near or in contact with a workpiece; a feeding electrode for feeding power to the workpiece; an ion exchanger that is arranged between the workpiece and the processing electrode A fluid supply unit for supplying fluid to the space between the workpiece and at least one of the processing electrode and the feeding electrode, The space is provided with the ion exchanger; and a power totalizer for measuring the total power supplied between the processing electrode and the feeding electrode. The invention also provides an electrolytic processing method, comprising: providing a processing electrode, a feeding electrode, and an ion exchanger, wherein the ion exchanger is disposed between a space between the workpiece and the processing electrode and a space between the workpiece and the feeding electrode In at least one of the spaces; bringing the processing electrode closer to or in contact with the

314269.pid Page 15 2uQj〇U7i V. Description of the invention (10) Work-pieces, at the same time, power is fed from the feed electrode to the workpiece; supply a fluid to at least one of the work, the processing electrode, and the feed electrode In the space between them, the ion exchanger is present in the space; and the total electric power supplied between the processing electrode and the feeding electrode is measured, and the processing of the workpiece is determined according to the measured total electric-amount. End of processing and / or processing. < The present invention also provides another electrolytic processing device, including: a fixed base for holding a workpiece freely; a processing electrode for approaching or contacting the workpiece held by the fixed base; and a feeding electrode for Feeding power to the workpiece held by the A] seat; Ion exchangers are provided in at least one of the space between the workpiece and the processing electrode and the space between the workpiece and the feeding electrode; the fluid supply unit Is used to supply fluid to the space between the workpiece and at least one of the processing electrode and the feeding electrode, and the ion exchanger is present in the space; the power source is at least one of the control voltage and the current In the case of one of them, power is supplied between the processing electrode and the feeding electrode; the driving part is used to cause the workpiece and the processing electrode held by the fixed seat to move relative to each other; and the numerical controller is for the driving part And power supply for numerical control. Λ According to this electrolytic processing device, the current value data (or voltage value data) determined according to the predetermined processing time and the processing amount of the coordinate difference value are input into the numerical controller, and the processing amount corresponds to 5 workpieces The coordinate difference between the shape before the processing and the desired workpiece shape after the processing, or the coordinate difference between the shape of the workpiece during the processing and the desired workpiece shape after the processing. According to the entered data, the value

314269.ptd Page 16 2uUj〇H7i V. Description of the invention (11) The controller can numerically control the current (or voltage) supplied by the power source between the processing electrode and the feeding electrode, and the processing can be controlled in this way. Produces the desired shape of the workpiece after machining with high shape accuracy. The above-mentioned control is performed based on the electrolytic processing performed during the predetermined processing time and the condition of processing the workpiece by the processing electrode provided to face the workpiece, and the amount of processing is determined by the processing rate, so Depending on the value of the current (or voltage) supplied between the processing electrode and the feed electrode. In this regard, in this electrolytic processing, the processing rate becomes faster as the value of the current supplied between the processing electrode and the feeding electrode becomes larger. In addition, when a higher voltage is applied between the processing electrode and the feeding electrode, a larger current will flow between the processing electrode and the feeding electrode, thereby making the processing rate faster. The processing throughput is obtained by multiplying the processing rate by the processing time. The device may include a power monitor to monitor and measure the power during processing. As described above, in the electrolytic processing performed under a fixed processing time, the processing amount depends on the current (or voltage) supplied between the processing electrode and the feeding electrode. Therefore, the processing throughput can be measured by monitoring and measuring the amount of power supplied between the processing electrode and the feeding electrode. The numerical controller can control the power source according to the coordinate difference between the coordinate data of the shape measured before the processing of the workpiece and the coordinate data of the shape desired to be formed after the processing of the workpiece, or the numerical control The device can be controlled according to the coordinate difference between the coordinate data of the shape measured during the processing of the workpiece and the coordinate data of the shape desired to be formed by the workpiece.

314269.ptd Page 17 2ϋϋj〇l | 7 | V. Description of the invention (12) This power supply. ^ The numerical controller can determine the end time of the processing according to the power value measured by the power monitor, for example. By determining the end time of the processing in this way, the correlation between the processing amount and the power is used. Therefore, by monitoring and measuring the amount of power supplied during the processing process, the desired shape of the workpiece after processing can have a relatively high shape accuracy. The present invention also provides another electrolytic processing method, including: providing a processing electrode, a feeding electrode, and an ion exchanger. The ion exchanger is provided in a space between a workpiece and a processing electrode held by a fixed base, and the workpiece and IP. In at least one of the spaces between the electric electrodes; bringing the processing electrode close to or in contact with the workpiece held by the fixed seat, while feeding power to the workpiece by the feeding electrode; supplying fluid to the workpiece and the processing electrode and In the space between at least one of the feeding electrodes, the ion exchanger exists in the space; power is supplied between the processing electrode and the feeding electrode, and the voltage and current are numerically controlled by a numerical controller. At least one of them; and the relative movement between the workpiece and the processing electrode held by the fixed seat, and numerically controlling the movement by a numerical controller. The above and other objects, features, and advantages of the present invention will be described by K and the accompanying drawings for a deeper understanding. In the drawings, the preferred embodiments of the present invention are exemplarily described. . [Embodiment] "The preferred embodiment of the present invention will now be described with reference to the drawings. Although the embodiment described below is described by using an electrolytic processing device (electrolytic grinding device) as an example, the electrolytic processing device is Take the substrate as a place

314269.pid Page 18 2ϋϋϋ〇117ί 5. Description of the invention (13) The workpiece is processed, and the copper formed on the substrate surface is removed (ground). However, the invention can also be applied to other workpieces and other electrolytic processing. in.

Figures 7 and 8 show electrolytic processing positions 36 according to an embodiment of the present invention. This electrolytic processing device 36 includes a substrate fixing base 46 and a plate of jealousy: the pole part 48 ', the substrate fixing base 46 is supported on a pivot that can be turned horizontally "is the free end of 44 to hold and fix the substrate w, with the substrate w facing downward (the so-called "face-down" method), the electrode portion 48 俜 is positioned directly below the fixing base 46, and the electrode portion instrument is made of an insulating material J. A fan-shaped processing electrode 50 and a pole 52 are embedded in the electrode portion 48, and the processing electrode 50 and the feeding electrode 52 are staggered with a battery to make the surfaces of the processing electrode 50 and the feeding electrode 52 ( Top surface) Outer two, and the thin film ion exchanger 56 is mounted on the electrode portion. Out of $. The surface of the processing electrode 50 and the feeding electrode 52 is held. The upper surface of the spoon is to cover the processing electrode 50 and the feeding electrode used in the embodiment. The emergency portion 48 is only used as an example. The diameter of the electrode portion 48 is

It is twice as long as the second one, so that the entire surface of the substrate w can be processed by + processing. The j-electrolytic pivot arm 44 is moved up and down via a ball screw 62, and its J-rod 62 is powered by horse it 6. Acting for vertical movement, the 柩 rotating arm: = Ϊ ϊ Ϊthe upper edge end of the rotating shaft 66 ', and the pivoting shaft 66 is pivoted by "64 = moving. The base plate holder 46 is connected to the motor 68 而 = 达 ^ I 忒 Motor 68 is installed at the free end of the pivot arm 44 and can be rotated by rotating the motor 6 8 for rotation.

314269.ptd Page 19

Description of the invention (⑷ This-the middle i pole part 48 is directly connected to the hollow motor 70, and can be rotated by actuating 18 a, two horse # up to 70. The central part of the electrode part 48 is provided with a perforation好 # ° 海牙 孔 48a is used as a pure water supply department to supply pure water, and the most # pure water. The perforation 4 8 3 is connected to the pure water supply pipe 7 2, the pure water; = pipe 72 is vertical Extending inside the hollow motor 70, pure water or ultrapure water: ^, two are supplied to the entire processing surface of the substrate 由 from the perforations 48a and the ion exchanger 56. A plurality of perforations 4 8 a can also be provided, and Each perforation 4 § said that the tank is connected to the pure water supply pipe 72 to help the processing liquid be distributed on the processing surface of the substrate w. In addition, 'for pure water for supplying pure water or ultrapure water The pure water nozzle 74 of the supply part is disposed above the electrode part 48. The pure water nozzle 74 is extended in the radial direction of the electrode part 48 and has a plurality of supply orifices. Therefore, pure water or ultra Pure water is supplied to the surface of the substrate from above and directly below the substrate W. The so-called pure water here has no more than 1 # S / cm water, while ultrapure water refers to the lack of conductivity of not more than 0 · S / Cm '. It can also be a liquid with a conductivity of not more than 500 / z S / cm or any other An electrolytic solution is used instead of pure water. The conductivity referred to in the present invention is the conductivity at 25 ° C and 1 atmosphere pressure (atm). By supplying this liquid during the K treatment, the processing treatment can be eliminated. Time instability (such as reaction products and dissolved gases), and the processing flow can be performed in a consistent manner with good reproducibility. According to this embodiment, a plurality of fan-shaped electrode plates 7 6 series is provided in the electrode part 48 along the peripheral direction, and the anode and cathode of the power source 80 are collected by

Page 20 2uUj〇H7i V. Description of the invention (15) The ring 7 8 is connected to the electrode plate 76 in a staggered manner. The electrode plate 76 connected to the cathode of the power source 80 becomes the processing electrode 50, and the electrode plate 76 connected to the anode of the power source 80 becomes the feeding electrode 52. This can be applied to, for example, copper treatment because the electrolytic treatment of copper is performed on the cathode side. Depending on the material to be processed, the cathode side can also be a feed electrode, and the anode side can be a processing electrode. In particular, when the material to be processed is copper, molybdenum, iron or similar materials, the electrolytic treatment is performed at The cathode electrode plate 76 connected to the cathode of the power source 80 should be the processing electrode 50, and the electrode plate 76 connected to the anode of the power source 80 should be the feed electrode 52. On the other hand, in the case of Shao, silicon or similar materials, the electrolytic treatment is performed on the anode side. Therefore, the electrode plate connected to the anode of the power source should be the processing electrode, and the electrode plate connected to the cathode should be the feed electrode. Electric electrode. Therefore, by arranging the processing electrodes 50 and the feeding electrodes 52 separately and staggered in the circumferential direction of the electrode portion 48, there is no need to fix the conductive film for supplying current to the conductive film of the substrate ( Part to be processed), and the entire surface of the substrate can be processed. In addition, by changing the positive and negative electrodes in a pulsed manner, the electrolytic products can be decomposed, and the flatness of the treated surface can be improved by multiplexing and repeating the treatment. For the processing electrode 50 and the feeding electrode 52, oxidation or decomposition due to electrolytic reaction is a major problem. In view of this, it is preferable to use carbon, a less active precious metal, a conductive oxide, or a conductive ceramic material as the basic material of the feeding electrode 52 instead of a metal compound generally widely used as an electrode material. For example, the electrode can be made by electroplating or plating platinum or iridium on a titanium electrode and then sintering the plated electrode at a high temperature.

314269.ptd Page 21 2uUj〇H7i V. Description of the invention (16) Stabilize and strengthen it so that noble metal electrodes can be obtained. Ceramic products are usually "made by heat-treatment of inorganic raw materials, and ceramic products with various characteristics can be made from a variety of different raw materials, including metal and non-metal oxides, carbides and nitrides. Raw materials. Among these materials, ceramics have electrical conductivity. When the electrodes are oxidized, the resistance value usually increases and causes the supply voltage to increase. However, by using non- / oxidizing materials such as platinum or The conductive oxide of iridium protects the surface of the electrode, so as to avoid the decrease in conductivity caused by the oxidation of the basic material of the electrode. ® Ion exchanger 56 can be a non-woven fabric with anion exchange group or cation exchange group, cation The exchanger preferably has a strongly acidic cation exchange group (sulfate group); however, a cation exchanger with a weakly acidic cation exchange group (carboxylic acid group) can also be used. Although the anion exchanger preferably has a strongly basic anion exchange (Tetrayl ammonium), however, it is also possible to use a weakly basic anion exchange group (tri- or lower) Amino group). The non-woven fabric having a strong basic anion exchange group is made by, for example, the following method: a polyolefin having a fiber diameter of 20 to 50 microns (// m) and a permeability of 90% The non-woven fabric is subjected to a so-called graft graft polymerization (j ^ adiati ο n graft polymerizafion) 5, which includes irradiating imitation mouth onto the non-woven fabric, and then grafting and polymerizing, thereby introducing the graft chain; then, introducing the The graft chain is aminated to introduce the tetrakisamino group 4 into it. The volume of the ion-exchange group introduced is determined by the amount of the graft chain introduced. The graft polymerization system can be used by using such as acrylic acid, styrene, etc. , Aminoacetic acid methacrylate, sodium styrene sulfide, or chlorine

314269.ptd Page 22 2uUjOH7i V. Description of the invention (17) Carrying out of methyl styrene monomer. The amount of graft chain can be controlled by adjusting the monomer concentration, reaction temperature and reaction time. Therefore, the degree of grafting (that is, the ratio of the weight of the non-woven fabric after the graft polymerization to the weight of the non-woven fabric before the graft polymerization) can reach a maximum of 500%. Therefore, the maximum volume of ion exchange groups introduced after graft polymerization can reach 5 meq / g. Nonwoven fabrics with strongly acidic cation exchange groups can be prepared by the following methods: In the case of nonwoven fabrics with strong basic anion exchange groups Similarly, a polyolefin nonwoven fabric having a fiber diameter of 20 to 50 microns and a permeability of 90% is subjected to a so-called radiation graft polymerization process, which includes irradiating gamma rays on the nonwoven fabric, and then grafting polymerization. The graft chain is introduced by this; the graft chain thus introduced is treated with hot sulfuric acid to introduce the sulfuric acid group into it, and if the graft chain is treated with hot phosphoric acid, phosphoric acid can be introduced. The degree of grafting can be up to 500%, and the volume of ion-exchange groups introduced after graft polymerization can reach up to 5meq / g. The basic material of ion exchanger 56 can be polyolefin, such as polyethylene. Or polypropylene, or any other organic polymer. In addition, in addition to the type of non-woven fabric, the ion exchanger can also be of the type of woven fabric, paper, permeable material, mesh or short fiber, and the like. When polyethylene or polypropylene is used as the basic material, the graft polymerization system can generate (radica 1) radiation (radia 1) by irradiating (pre-irradiating) radiation (gray rays or electron beams) on the basic material first, and then By reacting free radicals with monomers, homogeneous compounds with very few impurities can be obtained

314269.ptd Page 23 2uUj〇H7 | V. Description of the invention (18) Linking. On the other hand, when an organic polymer other than polyolefin is used as a basic material, radical polymerization can be performed by implanting monomers in the basic material, and then the base material is irradiated (synchronized) with radioactive rays (synchronous irradiation) ( Gamma rays, electron beams or ultraviolet rays). Although this method cannot provide a homogeneous graft chain, it can be applied to a fairly wide range of different basic materials. By using a woven fabric having anion exchange capacity or cation exchange capacity as the ion exchanger 5 6, pure water or ultrapure water or a liquid such as an electrolytic solution can be freely moved in the woven fabric, and can be very It is easy to reach a reaction IP having a catalytic reaction capable of hydrolyzing the ion in the non-woven fabric, so that many water molecules can be dissociated into hydrogen ions and hydroxide ions. In addition, by moving pure water or ultra-pure water or a liquid such as an electrolytic solution, the hydroxide ion generated by the hydrolyzed ion can be effectively brought to the surface of the processing electrode 50, thereby, even in the case of applying a lower voltage Can still get quite south current. When the ion exchanger 5 6 series has only one of anion exchange capacity or cation exchange capacity, there are restrictions on the materials that can be electrolytically treated, and in addition, impurities may be generated due to polarity. In order to solve this problem, the ion exchanger 56 may have a structure in which the anion exchanger having anion exchange capability and the cation exchanger having ion exchange capability are collectively arranged together. To form the overall structure. The anion exchanger and the cation exchanger can be stacked on the surface to be processed of the substrate, and each anion exchanger and the cation exchanger can also be made into the shape of a fan blade and arranged in a staggered arrangement. Alternatively, the ion exchanger 5 6 itself may have both an anion exchange group and an anion ion.

314269.ptd Page 24 2uUj〇H7i V. Description of the invention (19) Subexchange base. The ion exchanger may also include amphoteric (acid and basic) ion exchangers, in which the anion exchange group and the cation exchange group are randomly distributed, or the ion exchanger system may include bipolar Ion exchanger, wherein the anion exchange group and the cation exchange group exist in a layer type, or the ion exchanger system may include a mosaic type (mosaic) ion exchanger, including a portion containing an anion exchange group and a cation Part of the exchange base exists in the thickness direction in parallel. Incidentally, it is also possible to selectively use an ion exchanger 56 having anion exchange capacity or cation exchange capacity depending on the material to be processed. The electrolytic processing device 36 is provided with a controller 100, and the controller 100 controls the power source 80 so that the power source 80 can arbitrarily control the supply of the processing electrode 50 and the feeding electrode from the power source 80. 5 At least one of voltage and current between 2 The electrolytic processing device 36 also has a current amount accumulator (court meter) 102, which is connected to a wire extended from the anode of the power source 80 to detect the current value and determine The electric power obtained by multiplying the current value and the processing time is accumulated, and the electric power is accumulated to determine the total electric power used. The output signal output by the current totalizer 102 is input to the controller 100, and the output signal output from the controller 100 is input to the power source 80. In addition, according to this embodiment, the wires extending from the anode and cathode of the power source 80 are connected to the controller 100, and the output signal output by the controller 100 is input to the motor 60 for use. In vertical movement, the current supplied between the processing electrode 50 and the feeding electrode 52 can be controlled at a fixed value.

314269.ptd Page 25 2uUj〇H7i V. Description of the invention (20) When the current supplied between the processing electrode 50 and the feeding electrode 52 is controlled to be fixed and straight, it is supplied to the processing electrode 50 and the feeding The current value between the electrodes 52 is measured by a wire extending from the power source 80. For example, when the current value is reduced, the motor 60 for vertical movement can be driven to lower the substrate fixing. The seat 4 6 can reduce the distance between the substrate W and the processing electrode 50 and the feeding electrode 52. Distance, thereby controlling the current value to a fixed value. 1 In addition, as shown in FIG. 8, a regeneration section 8 4 for regenerating the ion exchanger 5 6 is also provided. The regenerating portion 8 4 includes a rotatable swing arm 8 6 having a structure substantially the same as that of the pivoting arm 4 4. The pivoting arm 8 6 is used to hold the substrate fixed J ^ 4 6 and is positioned at the electrode portion 4. The pivotable arm 4 on 8 is on the opposite side, and the regeneration head 8 8 is fixed by the free end of the swingable swing arm 8 6. In operation, the electric potential, which is opposite to the processing, is supplied from the power source 80 to the ion exchanger 5 6 (refer to Figure 7), thereby facilitating the decomposition of external substances, such as adhesion to the ion exchange Copper in the device 5 6. Therefore, the regeneration operation of the ion exchanger 56 can also be performed during processing. The regenerated ion exchanger 56 can be cleaned by pure water or ultrapure water supplied to the upper surface of the electrode portion 48. Next, the electrolytic processing performed by the electrolytic processing apparatus 36 will be described. First, a substrate W, such as the substrate W shown in FIG. 1B, having a copper film 6 on its surface as a conductor film (the portion to be processed) is a substrate holder 4 6 of an electrolytic processing device 3 6 It is sucked and held, and the substrate fixing base 4 6 is moved by the pivot arm 4 4 to a processing position located directly above the electrode portion 48. Next, the substrate holder 4 6 is lowered by the motor 60.

314269.ptd Page 26 2uUjI | 7 | V. Description of the invention (21) The vertical movement allows the substrate W held by the substrate holder 46 to contact or approach the surface of the ion exchanger 56, where the ion exchange The device 5 6 is mounted on the upper surface of the electrode portion 48. Next, when the substrate holder 46 and the electrode portion 48 are rotated, a predetermined voltage or current value that changes with time is applied by the power source 80 between the processing electrode 50 and the feeding electrode 52, and at the same time, ' Pure water or ultrapure water is supplied to the upper surface of the electrode portion 48 from directly below the electrode portion 48 through the perforation 4 8 a, and pure water or ultrapure water is passed through the pure water nozzle 74 at the same time from the electrode. The upper portion of the portion 48 is supplied to the upper surface of the electrode portion 48, thereby filling the space between the processing electrode 50 and the feeding electrode 52 and the substrate W with pure water or ultrapure water. Thereby, the conductor film (copper film 6) formed on the substrate W can be subjected to electrolytic processing by hydrogen ions or hydroxide ions generated in the ion exchanger 56. According to the above-mentioned electrolytic processing device 36, a large amount of hydrogen ions or hydroxide ions can be generated by flowing pure water or ultrapure water into the ion exchanger 56, and a large number of such ion systems can be supplied to the substrate W Surface, which can be more efficient for electrolytic processing. In detail, by flowing pure or ultrapure water into the ion exchanger 5 6, a sufficient amount of water can be supplied to the functional group (in the case of an ion exchanger having a strongly acidic cation exchange group, this function The radical refers to the sulfate group), thereby increasing the number of dissociated water molecules, and the reaction products (including gases) formed by the reaction between the conductor film (copper film 6) and hydroxide ions (or hydroxide). ) Can be removed by water flow, which can improve the efficiency of processing. Therefore, it is necessary to make pure water or ultrapure water flow, and the flow of this water should be kept fixed and uniform. Fixed and uniform water flow

314269.ptd Page 27 2uUj〇H7i V. Description of the invention (22) The stability and uniformity of the ion supply and the removal of reaction products will be generated, so that the processing can be performed uniformly and uniformly. During the electrolytic processing process, at least one of the current and voltage supplied by the power source 80 to the processing electrode 50 and the feeding electrode 52 is changed over time. The following will refer to the ninth to the first 5 Illustration to illustrate. Fig. 9 shows an example in which a fixed voltage having a step-down value is supplied between the processing electrode 50 and the feeding electrode 52. In detail, in the initial stage of the processing, a high fixed voltage V is supplied between the processing electrode 50 and the feeding electrode 52. When the amount of electricity determined by multiplying the current by the processing time is shown in the shaded part of Figure 9 and subsequent figures, when it reaches a predetermined value (at time t 〇, less than the fixed voltage V & the fixed voltage V is supplied to Between the processing electrode 50 and the feeding electrode 52. When the total amount of power reaches a predetermined value (at time 12), it is smaller than the fixed voltage V and the fixed voltage V # is supplied to the processing electrode 50 and the feeding electrode 52 Moreover, when the total amount of power reaches a predetermined value (at time 13), it is smaller than the fixed voltage V & the fixed voltage V 4 is supplied between the processing electrode 50 and the feeding electrode 52. When the total amount of power When the predetermined value is reached (at time 14), that is, at the end time of the processing, the processing processing program ends. By supplying a high fixed voltage in the initial stage of the processing and then when the force processing reaches the end time of the processing By supplying a lower fixed voltage with a step-down value between the processing electrode 50 and the feeding electrode 52 to perform the electrical processing, the processing rate can be obtained in the initial stage of the processing, and the so-called Excessive eclipse In this example, although between the feed electrode 50 and the processing electrode 52

314269.ptd Page 28 2uUj〇H7i V. Description of the invention (23) is to supply a fixed voltage with a step-down value, however, it is also possible to supply a step-down value between the processing electrode 50 and the feed electrode 52. Fixed current. FIG. 10 shows an example in which a current having a continuously varying value is first supplied between the processing electrode 50 and the feeding electrode 52, and then a fixed voltage having a continuously varying value is supplied. Specifically, in the processing electrode 50, And the feeding electrode 5 2 are first supplied with a fixed current having a step-decreasing value (two steps in FIG. 10), and then supplying a step-decreasing value (two steps in FIG. 10) ) Fixed voltage. In more detail, at the initial stage of the processing, a high fixed current I! Is supplied between the processing electrode 50 and the feeding electrode 52, and when the amount of electricity determined by multiplying the current value by the voltage value reaches a predetermined value (At time 13), a fixed current I 2 lower than the fixed current IA is supplied between the processing electrode 50 and the feeding electrode 52. When the total amount of power has reached a predetermined value (at time 16), the fixed voltage V is supplied between the processing electrode 50 and the feeding electrode 52. In addition, when the total amount of power reaches a predetermined value (at time 17), a voltage lower than the fixed voltage V is supplied between the processing electrode 50 and the feeding electrode 52. When the total amount of power has reached the predetermined value (time 18), that is, when the end time of the processing has been reached, the processing is ended. The above-mentioned control of voltage and current can be changed step by step for the processing rate of electrolytic processing at a controlled fixed current value, and then the processing rate of electrolytic processing at a controlled fixed voltage value Make step changes. In addition, it can also perform electrolytic processing with a constant fixed current for the processing stage when the processing area of the workpiece no longer changes. This can continuously maintain a fixed processing rate and help control the processing rate. , And then when the processing area is urgent

314269.ptd Page 29 2uUj〇H7i V. Description of the Invention (24) When the processing time is reduced and the processing is near the end time, the electrolytic processing is performed with a continuous fixed voltage ~, which helps to add processing near the end time. Rate control. Although in the example in FIG. 10, a fixed current having a varying value is supplied in a plurality of steps, and then a fixed voltage having a varying value is also provided in a plurality of steps, however, it may be supplied for a period of time. A current without a change in value of 4 is used for processing (fixed current processing), and then a voltage without a change in value is supplied for a period of time for processing (fixed voltage processing). It is also possible to repeat the cycle of fixed current processing / fixed voltage Θ multiple times. In addition, it is also possible to first supply a fixed current without a change value, and then supply a fixed voltage with a plurality of step changes, or conversely, first supply a fixed current with a plurality of step changes, and then supply no change Fixed voltage. Fig. 11 shows a conventional example in which a fixed voltage is first supplied between the processing electrode 50 and the feeding electrode 52, and then the voltage supplied between the processing electrode 50 and the feeding electrode 52 is decreased. In detail, a high fixed voltage V 7 is first supplied between the processing electrode 50 and the feeding electrode 5 2. When the amount of electricity determined by multiplying the current value by the processing time has reached a predetermined value (at time 19), the supply The voltage between the processing electrode 50 and the electrical electrode 52 can be gradually reduced. When the total power has reached the pre-I value (at time t 1Q), that is, when the end time of the processing is reached, the processing is ended. '' By supplying a fixed voltage at the initial stage of the processing, and then gradually reducing the voltage as the processing progresses, the processing rate can be obtained at the initial stage of the processing, and then as the processing approaches the processing

314269.ptd Page 30 2uUj〇H7i V. Description of the Invention (25) The end time and gradually reduce the processing rate, so as to avoid the so-called over-etching. Fig. 12 shows an example in which a fixed current is first supplied between the processing electrode 50 and the feeding electrode 52, and then the current supplied between the processing electrode 50 and the feeding electrode 52 is decremented. In detail, a high fixed current I 3 is first supplied between the processing electrode 50 and the feeding electrode 5 2. When the amount of electricity determined by multiplying the current value by the processing time has reached a predetermined value (at time t! 〇, The current supplied between the processing electrode 50 and the feeding electrode 52 can be gradually reduced. When the total power has reached a predetermined value (time t 12), that is, when the end time of the processing is reached, the processing processing is ended. By this way of controlling the current, it is also possible to obtain the processing rate as described above and avoid the occurrence of excessive etching. Figure 13 shows an example, which is first supplied between the processing electrode 50 and the feeding electrode 52. Fixed current, and then gradually reduce the current supplied to the processing electrode 50 and the feeding electrode 52, and finally, near the end of the processing, a fixed low voltage is supplied between the processing electrode 50 and the feeding electrode 52 In detail, a high fixed current I 4 is first supplied between the processing electrode 50 and the feeding electrode 52, and when the amount of electricity determined by multiplying the current value by the processing time has reached a predetermined value (at time t 13), you can supply The current between 50 and the feeding electrode 52 is gradually reduced. When the total power reaches a predetermined value (at time 114), a fixed low voltage V 8 is supplied between the processing electrode 50 and the feeding electrode 52; When the total power reaches a predetermined value (at time 115), that is, when the end time of the process is reached, the processing process is ended. This control method helps control the processing rate near the end time of the process.

314269.ptd Page 31 2uUj〇H7i V. Description of the invention (26) • Figure 14 shows an example, which gradually and linearly reduces the voltage supplied between the processing electrode 50 and the feed electrode 5 2 or Current. In detail, for the current I, the current value decreases along the line segment I = I ο- a t (I 0: initial value, a: proportionality constant). For the voltage V, the voltage value decreases along the line. The segment V = V 〇- b t (V 〇: initial value, b: proportional constant) and decreases. When the total power has reached a predetermined value (at time 116), that is, when the end time of the process is reached, 4 ends the processing process. This control method can decrease the processing rate during the entire processing process. Figure 15 shows an example, which continuously changes the voltage or current value between the processing electrode 50 and the feeding electrode 52 along an arbitrary curve. In detail, 'for current I, the current value is changed along any fixed curve · I = f (t), and for voltage V, the voltage value is along any fixed curve: V = f (t) change. When the total amount of electricity has reached a predetermined value (at time t n), that is, reached, and the end time of the processing, the processing is ended. This control method can set the processing rate for the entire processing. After the electrolytic processing is completed, the connection of the power source 80 to the processing electrode 50 and the feeding electrode 52 can be interrupted, and the rotation of the substrate holder 46 and the electrode portion 48 can be stopped. After that, the substrate holder 46 is raised, and then the substrate W passing through is transferred to the next process. ^ This embodiment shows that pure water (preferably ultrapure water) is supplied into the space between the electrode portion 48 and the substrate W. The use of pure water or ultrapure water that does not contain an electrolyte after electrolysis can prevent excessive impurities such as electrolyte from adhering and remaining on the surface of the substrate W. In addition, copper ions or the like decomposed during the electrolytic processing are immediately passed through the ion exchange reaction by the ion exchanger 5 6

314269.ptd Page 32 2uUj〇H7i V. Description of Invention (27) Captured. This can prevent dissociated copper ions or the like from precipitating on other parts of the substrate W, or being oxidized to become fine particles, and contaminating the surface of the substrate W. Ultrapure water has high resistivity, so it is difficult for current to flow through ultrapure water. By reducing the distance between the electrode and the workpiece, or by inserting an ion exchanger between the electrode and the workpiece, the electrical impedance can be reduced. In addition, when using an electrolytic solution mixed with ultrapure water, it can further reduce the electrical impedance and energy consumption. When the electrolytic treatment is performed using an electrolytic solution, the range of the part to be processed of the workpiece is slightly wider than the area of the processing electrode. On the other hand, in the case of mixing ultrapure water with an ion exchanger, since almost no current flows through the ultrapure water, the electrical processing system will only treat the workpiece which is equivalent to the processing electrode and the ion exchanger. Up to the area. It is also possible to use an electrolytic solution obtained by adding an electrolyte to pure water or ultrapure water instead of pure water or ultrapure water. The use of this electrolytic solution can further reduce electrical impedance and energy consumption. Neutral salt solutions (such as NaCl or Na2SO mash) or alkaline solutions (such as ammonia) can also be used as the electrolytic solution, and these solutions can also be selectively used according to the characteristics of the workpiece. When an electrolytic solution is used, it is preferable to provide a slightly smaller distance between the substrate W and the ion exchanger 56, so that the substrate W and the ion exchanger 56 cannot contact each other. In addition, a liquid obtained by adding a surfactant to pure water or ultrapure water can also be used to replace the pure water or ultrapure water, where the conductivity of the liquid will not exceed 500 // S / cm, And preferably not more than 50 //

314269.ptd Page 33 2uUj〇H7. 5. Description of the invention (28) s- / cm, and the best is not more than 0. 1 // s / cm (resistivity is not less than 1 OM · cm). Due to the presence of a surfactant in pure or ultrapure water, the liquid can constitute a layer that can prevent ions from moving uniformly at the interface between the substrate W and the ion exchanger 56, thereby reducing the ions * Concentrations exchanged (metal decomposition) to improve the flatness of the treated surface. The concentration of the surfactant is preferably not more than 100 ppm. According to the present invention, the processing rate can be significantly increased by inserting the ion exchanger 56 between the substrate W and the processing electrode 50 and the feeding electrode 52. In this regard, the electrochemical treatment using ultrapure water is performed by a chemical reaction between the oxygen ion in the ultrapure water and the material to be treated. However, the number of hydroxide ions used as reactants in ultrapure water is as small as 10 〃mol / L (mol / L) under normal temperature and pressure conditions, which is different from that used for cleaning treatment. Other reactions such as an oxide film formation reaction will cause the efficiency of the removal process to decrease. Therefore, it is necessary to increase the hydroxide ion in order to perform the removal treatment efficiently. One method for increasing hydroxide ions is to promote the dissociation reaction of ultrapure water by using a catalyst material, and the ion exchanger system can be effectively used as a catalyst material. In detail, the activation energy (a c t i v a t i ο n en r g y) of the dissociation reaction of water molecules || is due to the reaction between the functional group in the ion exchanger and the water molecules, thereby promoting the dissociation of water and thereby increasing the treatment rate. In addition, according to this embodiment, the ion exchanger 5 6 ′ is in contact with or near the substrate W during the electrolytic treatment. When the ion exchanger 56 is positioned close to the substrate W, although the electrical impedance is large to a certain degree depending on the distance between the substrate W and the ion exchanger 56, it is necessary to compare

314269.ptd Page 34 2uUj〇H7i V. Description of the invention (29) Large voltage to provide the necessary current density. However, on the other hand, due to the non-contact relationship, it is easy to form pure water or ultrapure water flowing along the surface of the substrate W, thereby effectively removing the reaction products formed on the substrate surface. In the example where the electric ion exchanger 56 is in contact with the substrate W, the electrical impedance system becomes extremely small, and therefore only a small voltage needs to be provided, thereby reducing energy consumption. If the voltage rises to increase the current density to increase the processing rate, a discharge occurs when the electrical impedance between the electrode and the substrate (the workpiece to be processed) is large. The occurrence of this discharge will cause the workpiece surface to tilt, so that a uniform and flat treated surface cannot be formed. In contrast, since the electrical impedance when the ion exchanger 56 is in contact with the substrate W is very small, it is possible to avoid the occurrence of a discharge. When the electrolytic treatment of copper is performed by using an ion exchanger 56 having a cation exchange group, after the treatment is completed, the ion exchange group system of the ion exchanger (cation exchanger) 56 will be saturated with copper, thereby reducing Processing efficiency at the next processing. When the electrolytic treatment of copper is by using an ion exchanger 56 having an anion exchange group, fine particles of copper oxide are generated and adhere to the surface of the ion exchanger (anion exchanger) 56, and the particles are contaminated. The surface of the next substrate to be processed. In order to avoid the above-mentioned problems, in operation, the potential which is opposite to the processing is supplied from the power source 80 to the ion exchanger 56, whereby the regeneration of the ion exchanger 56 by the regeneration head 88 can be promoted. Decomposition of copper outer material. Therefore, the regeneration operation of the ion exchanger 56 can be performed during processing, and the regenerated ion exchanger 56 can be supplied to the electrode section 4 8

314269.ptd Page 35 2 ^ 〇jG1171 V. Description of the invention (30) Cleaned by pure water or ultrapure water on the upper surface. Figures 16 and 17 show a construction device 36b according to the present invention. In this electrolytic processing device core b, for example, the rotation of the electrolytic core 00 and the rotation center of the substrate holder 46, and the rotation of the electric power 48. The pole section 48 is centered on the rotation center 0 and * # is from the green d, and the I 46 is centered around the rotation center 0 = rotation, and the substrate fixed base feeding electrode 52 is passed through the current collector if 78fft ^. In addition, the processing electrode 50 and this _ ## 丨 千 & Γ are connected to the power source 80. In addition, according to the direct sum of the substrate fixing seat 46, ei: there is-diameter, the diameter of the stomach is a big heart, and the private day 4 i 4 work to make the turtle pole part 4 8 with the rotation center 0 The seat 4 6 乂 rotates the center 〇 as the center and rotates the whole = two urgently 邛 4 8 such as covering the substrate held by the substrate fixing seat 4 6 ¥ ^ ^ ,, hair removal processing device 3 6 b, substrate The electrolytic processing of the surface is performed by rotating the substrate w with the substrate fixing base 46 and also by actuating the Hongji portion 48 by actuating the intermediate time, ,, and 70, and the same process as the processing is performed Nine is supplied with pure water or ultrapure water to the surface of the electrode portion 48, and a fixed voltage is applied between the processing hammer ^ and the feed electrode 52. Instead of rotary motion, the pot 矣, the pole 4 4 8 or the substrate fixing base 4 6 can also perform holding motions, such as, moving or reciprocating motion. Force 0 = 18 and Figure 19 show the electrolysis according to yet another embodiment of the present invention. In this electrolytic processing device 3 6 d, in the previous embodiment, the positional relationship between the household plate fixing base 46 and the electrode portion 48 is inverted, and the front side of the substrate W of you 1 is oriented (the so-called " "Face up" method), so that the manganese processing is performed on the upper surface of the substrate W. Therefore, the

3] Ptd of 第 Page 36 丄 1? 2υϋ〇〇 五 、 Explanation 1 " --- ~~ The substrate fixing base 46 is provided on the positive part of the electrode part 48 ::: holding substrate_front side facing up, so that Soil plate fixing sickle On the other hand, the electrode portion 48 has a cover plate fM gangan to move. The ion-exchanger 56 is fixed on the free end of the pivot arm 44 above the plate-feeding holder 46 of the processing electrode 46, and its positive]: 52, ^ the electrode portion 48 is a hollow motor 70 and its central axis is used as; ^ 心 来 ^ At the end of the month, and the wire to j is formed on the pivot axis ";;: extends from the power source to the current collector m 78, and passes through the hollow motor 7〇 step by step; Reach the processing electrode 50 and the feeding electrode 52 to apply electricity therebetween. Part of the pure water or ultrapure water is supplied to the substrate by the perforated 48a formed in the central portion of the electrode portion U through a pure water supply tube n. Surface). The regeneration section 92 for regenerating the cymbal switch 56 mounted on the electrode section 48 is provided beside the substrate holder 46, and the cymbal section 92 includes regeneration filled with, for example, a diluted acid solution = 9 4 0 ^ In operation, the electrode portion 48 is moved to only the position above the foot of the biological storage tank 94 by pivoting the arm 44 and then lowered, so that at least the ion exchanger 56 of the electrode 4S can be immersed in The acidity of the regeneration tank 94 is medium. After that, the potential opposite to the treatment is supplied to the electrode. 7 6 ,， $ ， # By connecting the hard electrode 50 to the anode of the power source 80, and connecting the second electrode, that is, 62 to the cathode of the power source 80, to thereby promote the attachment of ions to external substances (such as Copper), thereby regenerating the ion-exchange °°° 56, and the regenerated ion-exchange state 56 can be powered by, for example, ultrapure water. More than one. In addition, according to this embodiment, the electric hammer part True diameter is designed to be big

2u0jG117i V. Description of the invention (32) For the diameter of the substrate W fixed by the substrate holder 4 6, the electrode portion 48 is lowered to conduct electricity so that the ion exchanger 56 contacts or approaches the substrate holder. 4 6 the fixed substrate W, then rotate the substrate fixing seat 46 and the electrode portion 48, and at the same time, pivot the pivot arm 4 4 to move the electrode portion 4 8 along the β upper surface of the substrate W And, by supplying pure water or ultrapure water to the upper surface of the substrate, and then applying a predetermined voltage between the processing electrode 50 and the feeding electrode 52, an electrolytic processing process can be performed on the surface of the substrate W. Figures 20 and 21 show an electrolytic device 3 6e according to yet another embodiment of the present invention. This electrolytic processing apparatus 3 6 e uses an electrode portion 48 having a diameter much smaller than the diameter of the substrate W fixed by the substrate holder 46, so that the surface of the substrate W is not completely covered by the electrode portion 48. In this embodiment, the ion exchanger 56 is a three-layer structure (laminated body). The ion exchanger 56 is composed of a pair of strongly acidic cation exchange fibers 5 6 a and 5 6 b, and is inserted in the fiber. It is composed of 5 6 a and 5 6 b, which is a strongly acidic cationic film. The ion exchanger (layered body) 5 6 has good water permeability and high hardness, and has an excellent surface smoothness with respect to the exposed surface (lower surface) of the substrate W. The other structures of the ion exchanger 5 6 are: The structure is the same as that shown in Figs. The structure of the ion exchanger 56 can be designed such that the _Θ sub-exchange film is used as an exposed surface, and the laminate of the ion-exchange fibers is disposed above the exposed ion-exchange film. r By making the ion exchanger 56 a laminated layer containing an ion exchange material. (Such as non-woven fabrics, woven fabrics, and permeable membranes), which can also increase the overall ion exchange volume, thereby,

314269.ptd Page 38 2uUj〇H7i V. Description of the invention (33) Avoid the formation of oxides during the removal (grinding) process, and then suppress the oxidants from improperly affecting the treatment rate. In this regard, when the total ion exchange volume of the ion exchanger 56 is smaller than the volume of copper ions received in the ion exchanger during the removal process, it may be inappropriately generated on the surface or inside the ion exchanger. Oxides, where the oxides have an adverse effect on the processing rate. Therefore, the formation of oxides is controlled by the ion exchange volume of the ion exchanger, and copper ions exceeding this volume will become oxides. Therefore, by using a multilayer ion exchanger composed of a laminated layer of ion exchange materials and having an enhanced ion exchange volume as the ion exchanger 56, the formation of oxides can be effectively suppressed. According to the above-mentioned embodiments, uniform processing can be performed on, for example, conductive materials without a drastic change in processing rate, even when the insulating material used to form interconnects is exposed on the processed surface. FIG. 22 is a longitudinal sectional front view of an electrolytic processing apparatus according to yet another embodiment of the present invention. The electrolytic processing device includes a substrate fixing base 130 and an electrode head 138. The substrate fixing base 130 is used to hold and hold the substrate W with the front side of the substrate W facing upward (so-called π face up π method), the electrode tip 1 3 8 has a dish-like electrode portion 1 3 6 made of an insulating material. A fan-shaped processing electrode 1 3 2 and a feeding electrode 1 3 4 are embedded in the electrode portion 1 3 6. The processing electrode 1 3 2 and the feeding electrode 1 3 4 are arranged in a staggered manner, and the surface (lower Surface). The ion exchanger 140 composed of a laminated layer (laminated body) is mounted on the lower surface of the electrode portion 136 to cover the surfaces of the processing electrode 1 3 2 and the power feeding electrode 1 3 4.

314269.pid Page 39 2υϋ〇〇

V. Description of the invention (34) • The base plate fixing base 130 is directly connected to the upper edge of the motor shaft i 44 of the base 2 and is called Ang—the base plate W and the processing electrode i 3 2 held by the motor of the drive unit. The substrate fixing seat 130 can be actuated by a motor (the first drive is called “two: the relative movement is performed, and the plate fixing seat 130 is held in place, so that the substrate W is moved by the base. F 乂 和The 5H board fixing base together with the electrode head 1 3 8 series is connected to the pivot arm 146 series can be horizontally pivoted. Pivot; | 14 f by end, the pivotable hollow pivot shaft 1 52 upper edge end The base of the middle two 9 is connected to the middle tired rod 150 to move vertically, and the shaft 152 can be moved vertically by actuation of the roller. Motor 15: =; 丄 5_ is fixed by the base plate by the motor m Seat! 30. A driving part held by the younger brother can perform relative movement therebetween. The motor processes the side of the electrode 132 and can be connected to the pivoting arm 152 next to the pivoting arm 152 together with the pivoting arm 146. 46 and the motor (the first-private movement. Timing belt 1 56 is pivoted as a whole. 、,, 达 (Brother No. 1 driving section) 1 5 4 and electrode head 1 The 38 series is directly connected to the hollow motor 1 ^ 0 to serve as the third drive unit. From the GM motor I and its extension W 溆 test decoration 4 4 乂 make the substrate I 'fixed by the substrate holder 1 30, processing € A relative motion can be formed between the poles i 32 by actuating the rotation of the 160 (second driving part).… In this embodiment, the ion exchanger 140 is composed of: a layer type, a structure (Laminated body), the ion exchanger 1440 is composed of ^ ^ ion exchange 162a, 162b, and is inserted in the cation exchange layer (fiber ^

Page 40 2u (jj〇i | 7i V. Description of the invention (35) Strong acidic cation exchange layer (film) 1 6 2 c between 1 6 2 a and 16 2 b. The ion exchanger (layered The 1 4 0 series has good water permeability and high hardness, and has a good surface smoothness with respect to the exposed surface (lower surface) of the substrate W. Each laminated layer of the ion exchanger 1 4 0 1 6 2 a, 1 6 2 b and 1 6 2 c are preferably those having a strong acidic cation exchange group (sulfate group); however, ion exchangers having a weakly acidic cation exchange group (carboxylic acid group) can also be used, which have strong alkalinity Anion exchangers with anion-exchange groups (tetraylammonium groups), or ion exchangers with weakly basic anion-exchange groups (tri- or lower amino groups). By using anion-exchange groups or cation-exchange groups The non-woven fabric that can penetrate water is used as the laminated layers of the ion exchanger 1 40, 16 2a, 16 2b, and 16 2c. It is easy to come between the ions in the liquid and the ion exchange groups of the ion exchanger. An ion exchange reaction occurs. The ion exchanger 1 4 0 is best Has "water permeability and water absorption". In addition, at least the part of the material relative to the workpiece is preferably high hardness and good surface smoothness. For example, a commercially available foam-grade polyamine The gallate `` 1 (: 1 0 0 0 '' (manufactured by 161 (made by 161)) is usually used as a gasket for CMP. Its texture is hard and has excellent abrasion resistance. By By providing a plurality of perforations, this product can be used as the material of the ion exchanger 1 40. It is also possible to provide openings in the resin plate to form a water-permeable plate for use in the ion exchanger 1 40 . Of course, the resin is best to have "water absorption characteristics". Pure water nozzle 170 is arranged above the substrate fixing seat 130, where the

314269.ptd Page 41 2uQj〇U7i V. Description of the invention (36) Pure water nozzle 1 70 is used as the pure water supply unit to supply liquid (such as pure water or ultrapure water) to the substrate holder The substrate W held by 130 and the electrode head 138 positioned below are held. Thereby, pure water or ultrapure water can be supplied to the ion exchanger 140. The electrolytic processing device has a numerical controller 1 72 to perform numerical control of the driving section, that is, a motor (first driving section) 1 4 2, a motor (second driving section) 1 5 4 and a motor (third The numerical control of the driving part 16 is performed such that the substrate W held by the substrate fixing seat 130 and the processing electrode 1 32 facing each other can perform relative movement. Therefore, the motor (drive part) 1 4 2, _ 4 and 16 0 can be used as numerically controllable servo motors, and the rotation angle and speed of these motors can be output by the numerical controller 1 7 2 Signal for numerical control. According to this embodiment, the motor 1 4 8 for vertical movement may also be a servo motor, and may be numerically controlled by a signal output from the numerical controller 17 2. The electrolytic processing device also has a power monitor 1 74, which is connected to a power line extending from a power source 168 to monitor and measure the power used during the processing process. According to this embodiment, the power monitor 174 includes a power totalizer (coulomb counter). The power monitor measures the power by multiplying the current value supplied by the power source 168 households & processing time, and is tired. P This power is used to determine the total power used and the processing time. The signal output by the power monitor 174 is input to the numerical controller 172. According to this embodiment, during the electrolytic processing process within a predetermined time, the numerical controller 17 2 performs coefficient value control: the substrate W held by the substrate holder 1 30 is passed through the motor (first driving section) 1 42 Rotation speed

314269.ptd Page 42 2uUj〇H7i V. Description of the invention (37) degrees; the electrode head 1 3 8 caused by the pivot of the pivot arm 1 4 6 by the motor (second driving part) 1 5 4 Speed of horizontal movement; speed of rotation of the electrode tip 138 caused by the motor (third driving part) 160; and speed of relative movement between the substrate W and the electrode tip 138. In addition, in the electrolytic processing, electric energy is supplied between the processing electrode 1 2 and the feeding electrode 1 3 4 and at least one of the current and voltage values is controlled at the same time. Examples of numerical control will now be described with reference to FIGS. 23 and 24. First, as shown in Figure 23, first measure the shape of the workpiece before processing. In detail, in the XYZ coordinate system (where the Z axis is perpendicular to the XY plane as the reference plane), various coordinate points of the pre-processed shape are measured, and the measured pre-processed shape data is input to the numerical control器 1 7 2 中. In addition, for the coordinate points (X, y, z!) Of the pre-processed shape, the corresponding coordinate points (X, y, z 2) of the desired processed shape are also determined by the type of shape data to be obtained. Enter the numerical controller 1 7 2. In addition, the unit processes the shape data (such as the processing rate by voltage), that is, the relationship between the processing rate and the voltage supplied to the processing electrode 1 3 2 and the feeding electrode 1 3 4 and the processing electrode 1 3 2 and the substrate The relative speed data between W is input to the numerical controller 172 in advance or at any time. When the electrolytic processing is performed with a controlled fixed processing time while controlling the relative motion speed between the processing electrode 1 3 2 and the substrate W, the processing processing amount depends on the processing rate, and is therefore also related to the The voltage (or current) between the processing electrode 1 3 2 and the feeding electrode 1 3 4 is related. Therefore, in the case of a fixed processing time, that is, a period in which the substrate W and the processing electrode 132 are in a face-to-face position and the electrolytic processing phenomenon occurs

314269.ptd Page 43 2uUj〇H7i V. Description of the invention (38) Time-(Residence time), only for the voltage (or current) value applied between the processing electrode 1 3 2 and the feeding electrode 1 3 4 Control can produce the processed workpiece shape with high precision and degree. Therefore, according to this embodiment, the processing amount Z to Z 2 in the z direction can be determined for each coordinate point according to the data input to the numerical controller 1 72, and according to the processing amount Z to Z 2, the voltage (or current value) to be applied between the processing electrode 1 3 2 and the feeding electrode 1 3 4 can be determined for each seat > vote, and the signal is input to the power supply 1 6 8 In order to numerically control the voltage (or current value) applied by the power source 168 to the processing electrode 1 3 2 and the feeding electrode 1 3 4. Next, an electrolytic processing process performed by this electrolytic processing apparatus will be described. First, a substrate W (for example, the substrate W shown in FIG. 1B) has a copper film 6 (a portion to be processed) as a conductor film on the surface, and the substrate W is held by a substrate fixing seat 130 It is sucked and fixed, and the electrode head 1 3 8 is moved to a processing position directly above the substrate W held by the substrate fixing seat 130 by a pivot arm 1 4 6. Then, the electrode head 1 3 8 is lowered by the actuation of the motor 1 4 8 for vertical movement, so that the ion exchanger 1 4 installed on the lower surface of the electrode part 1 3 6 of the electrode head 1 3 8 0 may contact or approach the upper surface of the substrate W held by the substrate fixing seat 130. '' Next, apply electrical energy from the power source 168 to the processing electrode 1 3 2 and the feeding electrode 1 3 4 while controlling at least one of the voltage and the current, and rotate the substrate holder 1 3 0 and the electrode head 1 3 8. In addition, pivot the locust boom

314269.ptd Page 44 51. Description of the invention (39) ^ ----— 1 of 4 in the interval 1 to move the electrode head 1 3 8 horizontally. At the same time, pure water or ultrapure water is supplied to the substrate shirt from above the seat 1 30, which can be fixed by the substrate, thereby filling pure water or ultrapure water into the space between the processing electrode tips 138 and 34 and the substrate W in. Therefore, by using the hydrogen ions or hydroxide ions generated at the 2 and ^ feed electrodes, electrolytic processing can be performed on the ^ sub-converter 1 40 conductor film (copper film 6), and the substrate W can be more detailed. Say 'pure water or ultrapure water is dissociated into hydroxide ions with the help of a catalytic reaction in ionization & the parent + ancestor 1 4 0 The son (OH-) system will charge in the vicinity of the copper film 6 To turn = Li ^. Hydrogen ionization is performed on the copper thin film 6 on the substrate w, and the film is removed (polished). In order to prevent the feeding of hydrogen, in order to use it to generate hydrogen, ions that cannot be penetrated by gas = ^ pole 1 3 4 produced cation exchange membrane 1 6 2 c, which can be blocked as a strong acid by The pure oxygen generated by the rotation of the electrode portion 1 36 can be removed to the outside by hydrogen. / ", the flow of water to be processed before or during processing, = or during processing during processing = processing shape = processing shape data, and processing electrode parts, data, units plus this input The number of relative movements to the numerical control 7 is the horizontal movement speed of the pivoting arm pericardium a master 1 38 by the motor (the first driving section ": 2 to 3. 3. The fixed == wide ...) 154; 辂The electrode heads 丄 38 丄, ,,,-caused by the σ 1 60 produced, and the area of the electrode ~

2uUj〇H7i V. Description of the invention (40) The relative speed of movement between the poles 1 38. In the electrolytic processing, the electric energy is supplied between the processing electrode 1 2 and the feeding electrode 1 3 4 under the control of at least one of the current and the voltage. The electrolytic processing can generate a warp having a highly accurate shape. Process the desired shape of the workpiece. During the electrolytic processing process, the amount of power supplied between the processing electrode 1 3 2 and the feed electrode 1 3 4 by the power source 16 8 is monitored by the power monitor 1 7 4. Therefore, the amount of electricity can be obtained by multiplying the current value supplied by the power supply 168 and the processing time, and the amount of electricity can be accumulated to determine the total amount of electricity used. During a certain period of electrolytic processing, the amount of processing is related to the current (or voltage) supplied between the processing electrode 1 2 and the feed electrode 1 3 4. Therefore, the processing process can be determined by monitoring and measuring the power amount. When the total power amount reaches a predetermined value, that is, when the processing end time is reached, the processing process is ended. By determining the end time of the process in this way, by utilizing the correlation between the amount of processing and the amount of electricity, and by monitoring and measuring the amount of power supplied during the processing, it is possible to produce the desired shape of the processed workpiece with a South precision shape shape. After the electrolytic processing is completed, the power supply 168 can be interrupted, and the rotation of the substrate holder 130 and the electrode head 138 can be stopped, and the pivoting of the pivot arm 146 can be stopped. After that, the electrode tip 138 can be raised, and the processed workpiece held by the substrate holder # 130 can be transferred to the next processing process. According to this embodiment, a relative step operation can also be selectively implemented. Therefore, the motor 14 2 for rotating the substrate holder 130 for holding the substrate W (workpiece) is mounted on the upper surface of the X-Y platform (fourth driving section) 1 78, where the

314269.ptd Page 46 2uUj〇H7i V. Description of the invention (41) X-Y platform (fourth drive unit) 1 7 8 is an X platform that can be moved in the X direction by actuation of a motor 17 5 a 1 7 6 a and a Y platform 1 76 b that can be moved in the y direction by actuation of a motor 1 7 5 b. The motors 1 75a and 1 75b are numerically controllable servo motors, and their rotation angles and speeds can be numerically controlled by signals output by the numerical controller 172. An example of numerical control for realizing step operation will be described below with reference to Figs. First, as shown in FIG. 23, firstly, in the XYZ coordinate system (where the Z axis is perpendicular to the XY plane as a reference plane), different coordinate points of the pre-processed shape are measured to measure the workpiece before processing. The shape and the measured pre-processed shape data are input to the numerical controller 172. Furthermore, for the coordinate points (X, y, z!) Of the pre-processed shape, the corresponding coordinate points (X, y, z 2) of the desired processed shape are also input into the numerical controller 172. In addition, the unit processes the shape data (such as the processing rate depending on the voltage) and the time data during which the workpiece faces the processing electrode are input to the value controller 172 in advance or at any time. According to this embodiment, the processing amount Z to Z 2 in the z direction can be determined for each coordinate point according to the data input to the numerical controller 172, and according to the processing amount z true Z 2, The voltage (or current value) to be applied between the processing electrode 1 3 2 and the feeding electrode 1 3 4 can be determined for each coordinate point, and the signal is input to the power supply 1 6 8 so as to supply power When the processing electrode 1 3 2 and the feeding electrode 1 3 4 are numerically controlled, the voltage (or current value) applied between the processing electrode 1 3 2 and the feeding electrode 1 3 4 by the power source 16 8 is numerically controlled.

314269.ptd Page 47 2uUj〇H7i V. Description of the Invention (42)-According to this embodiment, for example, the substrate W shown in FIG. 1B is provided with a conductor film on the surface of the-substrate W The copper thin film 6 (part to be left), and the substrate W is sucked and fixed by the substrate fixing seat 130. The ion exchanger 1 40 mounted on the processing electrode 1 2 3 will approach or contact the surface of the substrate W. Then, by supplying electric energy between the processing electrode 1 2 and the feeding electrode 1 3 4, the electrolytic processing can be performed, and at the same time, the numerical controller 1 7 2 and the electrode head 1 3 are rotated. 8 to control voltage (or current). During the electrolytic processing process, the step operation is an operation in which the substrate W is repeatedly moved and stopped in the X or Y direction. For this operation, as mentioned earlier, the pre-processing shape data, desired shape data, unit processing data, and workpiece-electrode face-to-face time data are input into the numerical controller 1 72 in advance, thereby numerically controlling: the electrode tip 1 3 8 is rotated by the motor 160; the X-Υ platform (fourth drive part) 178 is moved by the motors 175a, 17 5b; and is applied to the processing electrode 1 3 2 and fed by the power source 1 6 8 The voltage (or current) between the electrical electrodes 1 3 4. Therefore, the processing time (that is, the time elapsed when the electrode tip 1 3 8 faces the portion of the substrate on which the electrolytic processing is to be performed) can be controlled by the motor 17 of the motor 16 and the X-Y stage 1 7 8 respectively. 5a, 1 7 5 b to control, so that the electrolytic processing can be performed for a set time. During the electrolytic processing process, the voltage (or current) supplied between the processing electrode 1 2 2 and the feed electrode 1 3 4 is numerically controlled. This electrolytic processing process can produce a warp with a highly accurate shape. The desired shape of the substrate is processed. The "π relative stepping operation" here is a method that enables the X-Y platform and

314269.ptd Page 48 ^ U ϋ j G ”7 s

V. Description of the Invention (43) One or both of the electrodes 1 2 are moved or moved at the same time, so that the processing electrode 1 2 can be repeatedly moved and stopped on the substrate W at a certain distance.

Fig. 26 shows an electrolytic processing device according to yet another embodiment of the present invention. The electrolytic processing device has three clothes-like contact holding plates 1 800 on the upper surface periphery of the substrate fixing seat 130. A plurality of inwardly protruding contacts 1 8 2 serving as feeding electrodes are mounted on the contact holding plate i 8 0 at a certain distance. This =, the electrode tip 138 has a processing electrode 184 to replace the electrode portion used in the real yoke example in FIG. 22, the processing electrode i 8 4 is connected to the power source 168 via a slip ring 186 The anode, and the contact (feeding electrode) 182 is connected to the cathode of the power source 168. The other structure is the same as the device shown in FIG. 22

Eh ^^, + + In this example, when the substrate W is held by the substrate holder 130, the Λ electrode? I82 will be deposited on the surface of the substrate with copper ㈣ copper 溥 film 6 as the material to be processed, as shown in Figure 1 B ^ ^ = The processing is carried out to the processing electrode in the same way as in the previous embodiment. 184 and contacts (at the time of feeding ^ ,, ^ The electric moon is applied by the power source I68

Make at least one voltage * electricity,: letter :) Shi 2 the same as the numerical control pole 1 38 # miscellaneous system * value of B temple, the same here, the substrate holder 1 30 and the electrode head 1 38: two Refer to J and the pivot arm 146 is pivoted to horizontally move the electric i 3 〇 me 1 and its f electrode head 138 is rotated, and is operated by the substrate holder, that is, γ '\ 178 and Repeat the movement and stop by the pure water nozzle m while // == 2 ^ Sameday Temple, pure water or ultrapure water is between the substrate w and the processing electrode] 8 4. Such as

Page 49 2uUjOH7i V. Description of the Invention (44) In this way, the electrolytic processing of the conductive film (copper film 6) of the substrate W can be performed. _ Before the electrolytic processing is performed, as in the previous embodiment, the pre-processing shape data, desired shape data, unit processing data, etc. are first input to the numerical controller 1 7 2 in order to control the processing time, that is, The control substrate W and the processing electrode 1 8 4 pass between the temples during the position facing each other, so that the electrolytic processing phenomenon occurs within a predetermined time (residence time), and at the same time numerical control is applied to the processing electrode 1 8 4 And the contact (feeding electrode) between 1 8 2 voltage (or current). The electrolytic plus 41 treatment performed under this control can produce a desired shape of the processed substrate W having a highly accurate shape. The voltage control system applied between the processing electrode 1 8 4 and the contact (feeding electrode) 1 8 2 can use the following principle, that is, when the voltage increases, the current flowing between the processing electrode and the feeding electrode It will become larger, and the processing rate will be proportionally faster, and vice versa. The shape measurement of the workpiece can be performed not only before the processing, but also any number of times at any time during the processing. Because of this relationship, the actual processing time will not match the scheduled processing time. , And the time difference will cause the shape accuracy of the processed shape to be reduced. This reduction in accuracy can be eliminated or reduced by performing measurement operations as many times as possible during the processing of the workpiece. Therefore, increasing the number of measurements during processing can enhance the accuracy of processing. According to the above-mentioned embodiment, according to the predetermined processing time and the

314269.ptd Page 50 2ϋϋj〇i | 7 | V. Description of the invention (45) The coordinate difference between the shape of the workpiece before processing and the desired shape after processing or the shape and processing of the workpiece during processing The processing amount of the coordinate difference between the desired shapes after processing determines the current value data or voltage value data, and the current data (voltage value data) is input into the numerical controller. According to the input data, the numerical controller can numerically control the current (or voltage) supplied by the power source between the processing electrode and the feeding electrode, and the controlled processing can produce a processing with high shape accuracy. The desired shape of the subsequent workpiece. Although the specific embodiments of the present invention have been shown and described in detail above, it should be understood that the above-mentioned embodiments may have many modifications and changes without departing from the scope of the scope of the attached patent. Industrial Applicability This application is based on International Patent Application No. PCT / JP02 / 0154 No. 5 filed on February 21, 2002, the contents of which are incorporated herein by reference. The present invention relates to an electrolytic processing device and method, and more particularly, to an electrolytic processing device and method for processing conductive materials existing on the surface of a substrate (especially a semiconductor wafer), or for removing impurities adhering to the surface of the substrate. .

314269.ptd Page 51 2uUj〇H7i ffl simple explanation [-simple description of the diagram]. Figures 1 A to 1 C are schematic diagrams in which the examples of forming copper interconnects are shown in order of steps; Figure 2 is Schematic diagram showing the principle of electrolytic processing using an ion exchanger; Figures 3A to 3D are schematic diagrams showing the change in the processing rate of the electrolytic processing under the condition of a controlled fixed current Figure 4 is a graph showing the change in the voltage supplied in the electrolytic processing under a controlled fixed current condition / φ over time; Figures 5A to 5D are schematic diagrams in which the Changes in the treatment rate during electrolytic processing under controlled fixed voltage conditions; Figure 6 is a graph showing the current over time in the electrolytic processing under controlled fixed voltage conditions; Fig. 7 is a longitudinal sectional front view showing an electrolytic processing apparatus according to an embodiment of the present invention; Fig. 8 is a plan view of the apparatus of Fig. 7; The diagram is a diagram showing an example of the voltage and current supplied to the processing electrode and the feeding electrode. FIG. 10 is a diagram showing another example of the voltage and current supplied to the processing electrode and the feeding electrode. Figure 11 is a chart showing another example of the voltage and current supplied between the processing electrode and the feeding electrode;

314269.ptd Page 52 2uUj〇H7i The diagram is briefly explained. The picture 12 is a diagram showing another example of the voltage and current supplied between the processing electrode and the feed electrode. The picture 13 is a diagram showing The voltage and current supplied between the processing electrode and the feeding electrode are another example; FIG. 14 is a chart showing another example of the voltage and current supplied between the processing electrode and the feeding electrode. Fig. 5 is a diagram showing another example of the voltage and current supplied between the processing electrode and the feeding electrode. Fig. 16 is a longitudinal sectional front view showing an electrolytic processing device according to another embodiment of the present invention. Figure 17 is a plan view of the device of Figure 16; Figure 18 is a longitudinal sectional front view showing an electrolytic processing device according to yet another embodiment of the present invention; Figure 19 is Figure 18 Figure 20 is a plan view of the device; Figure 20 is a longitudinal sectional front view showing an electrolytic processing device according to still another embodiment of the present invention; Figure 21 is a plan view of the device of Figure 20; Figure 2 2 Vertical section A front view showing an electrolytic processing device according to yet another embodiment of the present invention; FIG. 23 is a schematic diagram showing a relationship between a pre-processed shape of a workpiece and a desired shape after processing; FIG. 24 is a block FIG. 2 shows an example of numerical control performed by the electrolytic processing device of FIG. 22; FIG. 25 is a block diagram showing the electrolytic processing device by FIG. 22

314269.ptd Page 53 2uUj〇117i Another simple example of numerical control performed by the device; and Figure 26 is a longitudinal sectional front view showing an electrolytic processing device according to yet another embodiment of the present invention . 1 semiconductor base 1 a conductive layer 2 insulating film 3 contact hole 4 trench 5 barrier layer 6 copper film 7 seed layer 10 workpiece 10a atom • a, 12b, 56, 140, 148 ion exchanger 14, 50, 132, 184 processing Electrode 1 6 ^ 52, 134 Feeder electrode 17 ~ 80, 168 Power supply 18 Liquid 19 Liquid supply part 20 Water molecule 22 Hydroxide ion 24 Hydrogen ion 26 Reaction product 36 > 36b, 36d, 36e Electrolytic processing device 4 [46, 86, 146 1 3 0 substrate holder pivot arm, 1 3 6 electrode part 48a perforation 5 6a 56c, 56b cation exchange membrane cation exchange fiber 60 ^ 64, 68, 142, 148 ~ motor 154, 160, 175a, 175b

314269.ptd Page 54 2uUj〇H7i

Brief description of the drawing 62 ~ 150 Ball screw 66 Pivot shaft 70 > 160 Hollow motor 72 Pure water supply pipe 7 [170 Pure water nozzle 76 Electrode plate 78 Collector ring 84, 92 Regeneration section 88 Regeneration head 94 Regeneration tank 100 Control Device 102 Current Integrator 138 Electrode head 144 Motor shaft 152 Hollow rotating shaft 156 Timing belt 162a, 162b, 162c Cation exchange layer (layered layer) 172 Numerical controller 174 Electricity monitor 178 XY platform 178a X platform 178b Y platform 180 contact holding plate 182 contact (feeding electrode) d distance Il-I 4 fixed current (Η, 02 rotation center tl-tl7 time VI V8 fixed voltage W substrate ZI > Z 2 processing throughput 314269.ptd 55th page

Claims (1)

2uUj〇H7i 6. Patent application scope 1. An electrolytic processing device includes: • a processing electrode, which can be close to or in contact with a workpiece; a feeding electrode, which is used to feed power to the workpiece; an ion exchanger, Is provided in at least one of a space between the workpiece and the processing electrode and a space between the workpiece and the feeding electrode; a fluid supply unit for supplying fluid to the workpiece and the processing electrode and A space between at least one of the feed electrodes, wherein the ion exchanger is present in the space; and a power source, which supplies electric energy to the processing electrode and at least one of any control voltage or current, and Between the feeding electrodes. 2. The electrolytic processing device according to item 1 of the scope of the patent application, wherein the power source supplies a fixed voltage between the processing electrode and the feeding electrode. 3. The electrolytic processing device according to item 1 of the scope of patent application, wherein the power source supplies electric energy to the processing electrode and the feeding electrode in a case where at least one of voltage and current changes with time. between. 4. The electrolytic processing device according to item 1 of the scope of patent application, wherein the power supply is a fixed voltage or a fixed current having a continuously changing value between the processing electrode and the feeding electrode. 5. The electrolytic processing device according to item 1 of the scope of patent application, wherein the power supply sequentially supplies a fixed current and a fixed voltage between the processing electrode and the feeding electrode. 6. The electrolytic processing device described in item 1 of the scope of patent application, wherein the 314269.pul Page 56 2uUj〇H7i VI. Scope of patent application The power supply first supplies a fixed current with a continuously changing value, and then supplies a fixed voltage with a continuously changing value between the processing electrode and the feeding electrode. 7. An electrolytic processing method, comprising: providing a processing electrode, a feeding electrode, and an ion exchanger, wherein the ion exchanger is disposed between a space between the workpiece and the processing electrode and between the workpiece and the feeding electrode In at least one of the spaces; bringing the processing electrode close to or contacting the workpiece, and simultaneously feeding power to the workpiece by the feeding electrode; supplying fluid to at least one of the workpiece and the processing electrode and the feeding electrode In the space between them, the ion exchanger is present in the space; and 'supply electric energy between the processing electrode and the feed electrode under the condition of at least one of any control voltage or current. 8. The electrolytic processing method according to item 7 of the scope of patent application, wherein a fixed voltage is supplied between the processing electrode and the feeding electrode. 9. The electrolytic processing method as described in item 7 of the scope of patent application, wherein the power source applies electric energy between the processing electrode and the feeding electrode under the condition that at least one of the voltage and the current changes with time. . 10. The electrolytic processing method according to item 7 of the scope of patent application, wherein the power source applies a fixed voltage or a current having a continuously changing value between the processing electrode and the feeding electrode. 1 1. The electrolytic processing method as described in item 7 of the scope of patent application, wherein the 314269.ptd Page 57 2uUj〇H7i 6. Scope of patent application-The power supply sequentially applies a fixed current and a fixed voltage between the processing electrode and-the feeding electrode. 1 2. An electrolytic processing device including: a processing electrode that can be brought close to or in contact with a workpiece; a feeding electrode for feeding power to the workpiece; an ion exchanger provided between the workpiece and the processing electrode Between at least one of the space between the workpiece and the feeding electrode; and a fluid supply unit for supplying fluid to the workpiece and the routing electrode and the feeding electrode In a space between at least one of them, the ion exchanger is present in the space; and a power totalizer is used to measure the total power supplied between the processing electrode and the feeding electrode. 1 3. An electrolytic processing method including: providing a processing electrode, a feeding electrode, and an ion exchanger, wherein the ion exchanger is disposed between a space between the workpiece and the processing electrode and between the workpiece and the feeding electrode In at least one of the spaces; bringing the processing electrode close to or contacting the workpiece, and at the same time, supplying power to the workpiece by the feeding electrode; supplying fluid to at least one of the workpiece and the processing electrode and the feeding electrode In a space between which the ion exchanger is present; and measuring the total power supplied between the processing electrode and the feed electrode 314269.ptd Page 58 2uUj〇H7i 6. The scope of patent application, and the processing of the workpiece and / or the end time of the processing are detected based on the measured total power. 1 4. An electrolytic processing device, comprising: a fixed base for holding a workpiece freely; a processing electrode for approaching or contacting the workpiece held by the fixed base; a feeding electrode for feeding electric power To the workpiece held by the fixing base; an ion exchanger is provided in at least one of a space between the workpiece and the processing electrode and a space between the workpiece and the feeding electrode; a fluid supply unit Is used to supply fluid to the space between the workpiece and at least one of the processing electrode and the feeding electrode, wherein the ion exchanger is present in the space; the power source is in the control voltage and current In the case of at least one of them, supplying electric energy between the processing electrode and the feeding electrode; a driving unit for causing a relative movement between the workpiece held by the fixing base and the processing electrode; and a numerical controller , The numerical control of the driving part and the power supply. 15. The electrolytic processing device described in item 14 of the scope of patent application, further comprising a power monitor to monitor and measure the amount of electricity during the processing process. 16. The electrolytic processing device described in item 14 of the scope of patent application, wherein: 314269.ptd Page 59 2uUj〇H7 | Among them, the result is medium and the shape is measured. The source of the test, the factory wants to install the equipment after the installation process, the processing, processing, processing and control office to dissolve the processing value, add the difference between the work in progress and the workpiece in the marked part. __The data according to which the 14 data is based on the system, the system, the standard system, the standard system, the system, and the control system. 、 · 六 · '17 shape, electricity in the shape of its shape. It is necessary to set the source to test the equipment in the post. The difference between the value of the work value and the time of the electricity description: If the item standard includes the 15 items that are included in the contract, the data related to the first legal principle is the prescription data model. The coordinates of the coordinated control solution are determined by the singular number of the electrical statement. The shape is as follows: the value is between the empty position and the fixed device; the fixed part of the replacement part holds the power. The solid and the solid electricity should be fed to the electrode by the force of the electrode, and the contactor should be connected to the electric fixture, or the pole feed in the near and near electric, interposed and interposed electrodes to set the space electrode feed system. One of the reasons for emptying the device is to change the room, and it is very rare to use the same. When the device is disconnected from the power supply, the work is sometimes stored in the same device. The pole current and air electric electrode in the feed, the electricity and the electric pressure in the electric feed, the electric place, and the system of the pole control and the electric parts of the air conditioning value, the place should come to, The device body can control the current, change the electric control, and deliver the value for the child to supply the number; Production 314269.ptd Page 60 2uUj〇H7i VI. Relative motion of patent application range, meanwhile numerically control the operation by the numerical controller: processing device control to: processing device includes work system and can include work package plus control value The electric package is controlled, the value difference should be, in the value method, the number of pieces is standard for the number of pieces, the square shape of the work, the work of the work, the work of the work, the addition of the work, and the addition of the condition, and The case of entering the dismantling and dismissing the work is based on the evidence of the electrician. The number of the number between the number and the number of the data is based on the number of the number. The number of the number is one. The number of the number is one. The shape of the shape is less than one line. The shape of the shape is fed to the shape of the feeding shape. The scope of the profile must be measured and the flow must be measured. Special plus office and the electric special plus room, please after the pressure in the pressure, please after the pressure. Apply for it; apply for it at the office; Controlled to the value of the energy difference should be standard for the seat, the situation. The Shaper Wants One Place 314269.ptd Page 61