TWI270558B - Latent hardener, manufacturing method for latent hardener, and adhesive - Google Patents

Abstract

This invention is to obtain an adhesive which is curable under conditions of low temperature and short time and has high shelf life. The adhesive has a silane coupling agent, an epoxy resin and a latent curing agent in which curing agent particles composed of a metal chelate are covered with a capsule. Since these curing agent particles are covered with the capsule at ordinary temperature, polymerization reaction of the epoxy resin does not occur, but when the adhesive is heated, the capsule is broken and the metal chelate constituting the curing agent particles reacts with the silane coupling agent to produce a cation, and the epoxy resin is polymerized by the cation (cation polymerization) to cure the adhesive. Since the reaction with which the cation is produced occurs at a lower temperature than a temperature at which conventional adhesive is thermally cured, the adhesive of the present invention is cured at a lower temperature and in a shorter time. As a result, the adhesive of the present invention is low-temperature curing type and has high shelf life.

Description

1270558

File: TW1009 (060314) CRF.doc SUNDIAL CONFIDENTIAL (Description of the invention should be described: the technical field, prior art, content, embodiment and schematic description of the invention) It is related to the adhesive, especially the latent hardener used in the semiconductor wafer and TCP when it is joined by heat pressing. [Prior Art]

In the past, when a semiconductor wafer was to be mounted on a substrate, or a TCP (Tape Carrier Package) and an LCD (Liquid Crystal Display) were used to manufacture an electrical device, an adhesive containing a thermosetting resin epoxy resin was used. As shown in the symbol 111 of Fig. 7(a), the LCD 111 includes a glass substrate 112, and an ITO electrode (Indium tin oxide) 113cLCDl disposed on the glass substrate 112. Next, when the TCP is described later, the ITO electrode of the LCD 111 is first used. The surface to be placed on the 113 is coated with an adhesive. The symbol 125 in Fig. 7(b) is the case where the adhesive is applied to the LCD 111. Reference numeral 115 in Fig. 7(c) shows TCP, and TCP 115 includes a base film 116 and a metal wiring 117 disposed on the surface of the susceptor film 116. The metal wiring 117 of the TCP 115 is disposed toward the adhesive 125 on the LCD 111 on the configured side, after the alignment position, 1270558

File:TW1009(060314)CRF.doc

The arrangement surface of the metal fitting and line 117 of the SUNDIAL CONFIDENTIAL TCP 115 is pressed to the adhesive i25. When the heating is pressed in this state, the (four) 125 will soften, and the metal distribution and the line 117 will soften the subsequent U25 to retreat to contact the surface of the ITO electrode 113. On the above-mentioned adhesive, a curing agent which is superposed on the epoxy resin and is like an imidazol type is added, and when the metal wiring worker 17 and the ιτ〇 electrode 113 are heated in the bonded state, the hardener is added. The catalytic action causes the epoxy to overlap and the adhesive 125 to harden. The symbol ι 〇 1 of Fig. 7 (c) shows the electrical equipment of the adhesive 125 in the post-hardened state. The electric device 1〇1 fixes the TCP 115 and the LCD 111 through the cured adhesive 125 in a state where the metal wiring 117 is in contact with the butadiene electrode 113. Therefore, Tcpn5 is electrically and mechanically connected to LCDU1. However, when the above-mentioned adhesive is hardened, it is necessary to heat the adhesive at a temperature of 18 Torr or more. When the circuit of the metal wiring 117 is very fine, the TCP 115 may be deformed by elongation or shortening during heating. This problem can be solved by lowering the heating temperature, but it prolongs the time required for the heat treatment and reduces productivity. An adhesive which is excellent in hardenability at low temperature has developed a radically polymerizable resin such as Acrylate in recent years.

File: TW1009 (060314) CRF.doc SUNDIAL CONFIDENTIAL and an adhesive containing a radical polymerization initiator. However, such an adhesive is inferior in electrical properties and heat resistance in a hardened state as compared with the use of an epoxy resin. SUMMARY OF THE INVENTION The present invention has been made to solve the above problems of the prior art, and an object thereof is to provide an adhesive which can be hardened under low temperature and short-time conditions while having excellent preservability. The inventors of the present invention have not focused on a hardener which is generally used for bismuth, but have focused on a method in which an epoxy resin is used as a cation. After repeated research, we found the following method: at least one alkoxy group in the structure, the structure containing the Si Xizhuo compound (Silane Coupling) and the metal chelate (or metal Alcoholate) added In the adhesive, the cation generated by the reaction of the metal chelate with the Silane Coupling agent causes the epoxy resin to overlap (cation overlap). A hardening process in which a metal chelate compound and a Silane Coupling agent are added and the epoxy resin is hardened is explained below by the following reaction formulas (1) to (4). 1270558

SUNDIAL CONFIDENTIAL

File:TW1009(060314)CRF.doc [Chemical 1] X-Si-0R+H20-X-Si-OH+R-OH Reaction formula (1) A1 + OH-Si-X^ XAl-0-Si-X +RH reaction formula (2)

R, Al-0-Si-X+X-Si-OH-X-Si-〇-H+ ; Al-〇-Si-X Reaction formula (3) R-CH-CH2-^R-CH-CH2 + - > R-CH-CH2+

\ I I I

Ο H+ OH' R-CH-CH2 O \〇' R-CH-CH2 ΟΗΓ Reaction formula (4) At least one oxygen-burning compound, as shown in reaction formula (1), with water in the adhesive In the reaction, the alkoxy group is hydrolyzed to form a Silanol group. When the adhesive is heated, the sulphuric acid group reacts with a metal chelate such as a chelate compound, and the decane compound binds to the aluminum chelate compound. (Reaction formula (2)) Then, as shown in the reaction formula (3), the decyl alcohol group and the combined aluminum chelate are coordinated by the equilibrium reaction, and other stanol groups remaining in the binder are coordinated, 1270558

File:TW1009(060314)CRF.doc SUNDIAL CONFIDENTIAL Produces Branstade acid point. As shown in reaction formula (4), the epoxy ring at the end of the epoxy resin opens the ring due to the activated proton relationship. The epoxy ring of the epoxy resin is coincident (cationic overlap). Therefore, when a Silane Coupling and a metal chelating agent are added to the adhesive, a thermosetting resin such as an epoxy resin undergoes cation overlap. The reaction represented by the reaction formulas (2) to (4) is carried out at a temperature lower than the temperature at which the old adhesive is cured (180 ° C or higher), so that the above-mentioned adhesive is superior to the conventional adhesive. It can be hardened at a lower temperature and in a shorter time. However, when the metal chelate compound and the metal Alcoholate are directly added to the adhesive together with the Silane Coupling agent, the epoxy resin can be recombined at room temperature, resulting in high adhesive viscosity. . Therefore, the inventors of the present invention have sealed a metal chelating agent in a capsule composed of a resin component which does not react with an epoxy resin at a normal temperature, and have found a method in which a latent curing agent is added to an adhesive. The present invention is based on the above-mentioned invention, and the invention described in claim 1 is a latent curing agent having a hardener particle and a capsule covering the surface of the hardener particle, wherein the hardener particle is a metal. One of the chelate or metal Alcoholate, or both, is the main component. The aforementioned capsule is the potential of fluorinated resin as the main component 1270558

FileiTWl 009 (060314) CRF.doc SUNDIAL CONFIDENTIAL Hardener. The invention described in claim 2 is the latent curing agent according to the first aspect of the invention, wherein the metal chelate compound is a latent curing agent containing a chelating chelate as a main component. The invention described in claim 3 is the latent curing agent according to the first aspect of the patent application, wherein the metal Alcoholate is a latent curing agent containing Alcoholate as a main component. The invention described in claim 4 is a latent sclerosing agent as described in any one of claims 1 to 4 of the patent application. The capsule is a resin particle having an average particle diameter smaller than an average particle diameter of the curing agent particles, and the resin particles adhere to the surface of the curing agent and are melted to form the first to third items as recited in the aforementioned patent scope. Any kind of latent hardener. The invention described in claim 5, wherein the resin particles have a melting point of 30 ° C or more and 350 ° C or less as described in the fourth aspect of the invention. The invention described in claim 6 is the latent hardener according to the fourth aspect of the invention, wherein the resin particles have a thermal decomposition temperature of 50 ° C or more and 500 ° C or less. Applying for the invention described in item 7 of the patent scope, such as applying for a patent model 11 1270558

File:TW1009(060314)CRF.doc οτ

SUNDIAL CONFIDENTIAL The latent hardener described in the fourth item, wherein the resin particles have a softening temperature of 〇 ° C or more and 300 ° C or less. The invention described in claim 8 is the latent curing agent according to the fourth aspect of the invention, wherein the resin particles have a glass transition temperature of from -40 ° C to 300 ° C. The invention described in claim 9 is a method for producing a latent curing agent, which comprises a hardener particle, a knee capsule coated on the surface of the hardener particle, and a process for producing the hardener particle. The capsule is a latent hardener which is a main component of Dunhua resin, and is a method for producing a latent hardener. The method comprises the above-mentioned resin component as a main component and an average particle diameter of the hardener. The powdery resin particles having small particles adhere to the surface of the hardener particles, and the resin particles adhering to the surface of the hardener particles are dissolved to form an encapsulation process of the capsules. The invention described in the Patent Application No. 1G has two types of work in the method for producing a latent curing agent contained in the third paragraph of the Patent Application No. 9. 1 is the above-described encapsulation process in which the above-mentioned hardener particles are mixed with the above-mentioned capsule material, and the above-mentioned capsule material is adhered to the surface of the above-mentioned hardener particles. 1 is a scrambler in which the aforementioned hardener particles are adhered to the capsule; the shape of the bucket is disturbed, and the capsule material is melted. 12 1270558

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SUNDIAL CONFIDENTIAL Process 0 Patent Application No. 9 of the Patent Application No. 9 and the manufacturing method of the first-part hardening agent of the application item, the invention described in the item of the average particle diameter of the capsule material, such as any one of the application patents No. 10 The average granule size of the potential uranium hardener particles described is 100:80. The date of application for the patent application is 12th, 菰 0, L ^, 汴. The method of manufacturing the latent hardener described in item 9 of the scope of patent application and the scope of application of the patent, 筮月Axe~ dry solid 10, Φ 乂The ratio of the average particle diameter to the average particle diameter of the aforementioned capsule material was 100:50. The invention described in claim 13 contains a thermosetting resin, a silane coupling, and any one of items 8 to 8 of the patent application scope 1 to ef patent*. An adhesive for latent hardeners. According to the configuration of the present invention, after the powdery capsule material and the hardener particles are mixed and stirred, the capsule material adheres to the surface of the hardener particles due to the electrostatic effect. In this state, when the hardener particles are agitated at a high speed, the resin particles adhering to the surface of the hardener particles due to static electricity collide with the agitator, the inner wall, and other resin particles on the surface of the hardener particles in the stirring device because The energy generated by this physical impact dissolves the black resin particles or breaks into the core material (hardener particles). Dissolved 13 1270558

File:TW1009(0603 l4)CRF.doc

SUNDIAL CONFIDENTIAL Resin particles are fused into a body to form a capsule covering the surface of the hardener particles. When the above-mentioned latent curing agent is mixed with a decane coupling (su(10) diterpenal) agent and an epoxy resin to form an adhesive, the surface of the hardener particles is coated with a capsule at room temperature, and does not overlap with the epoxy resin. Therefore, it is then remembered that the preservative is very high, but when the adhesive is heated, the winning capsule will soften or melt, and the mechanical strength of the capsule will be significantly lowered. Therefore, when the binder is heated, the hardener particles are easily damaged by physical shocks such as thermal expansion and compression at the time of hot pressing, and the hardener particles are released into the adhesive. In this state, if the heating is continued, the main component of the hardener particles, the metal chelate, reacts with the decane coupling (Silane c〇upHng) in the adhesive to form a cation, which is superposed with the epoxy resin due to the cation (cation Coincidence), the adhesive will harden. The reaction of the hardener particles with the Silane Coupling agent at a temperature higher than the temperature at which the adhesive is thermally cured is also low, so that the adhesive of the present invention can be hardened at a lower temperature and in a shorter time. In order to increase the area in contact with the epoxy resin, the average particle size of the hardener particles is preferably smaller, but when the average particle diameter of the hardener particles becomes too small, the difference in particle size from the resin particles becomes small, which is difficult. Forming a capsule, so 14 1270558

File: TW1009(060314)CRF.doc SUNDIAL CONFIDENTIAL The average particle size of the hardener particles is preferably 〇. 5 // m or more and 5 0 // m or less. In addition, when the mixing of the resin particles and the hardener particles is required to produce a latent curing agent, a mixing and agitating device (for example, "NHS-0" manufactured by Nara Machinery Co., Ltd.) can be used. The ratio of addition of the hardener particles to the capsule material herein is calculated by the following formula (1). Formula (1)...M/m=DXF/(4xdxf) In the above formula (1), Μ is the amount of addition of the hardener particles (g), m is the amount of addition of the capsule material (g), and D is powder. The average particle diameter (/zm) of the bulk hardener particles, d is the average particle diameter (/zm) of the capsule material, F is the specific gravity of the hardener particles, and f is the specific gravity of the capsule material. In addition, the specific gravity refers to the density ratio of each substance to the density of water at a standard substance at 4 °C. However, the above formula (1) is a theoretical formula, and the optimum addition ratio of the hardener particles to the capsule material is determined depending on the condition. Further, if a thermoplastic resin is added to the adhesive, the properties of the thermoplastic resin increase the cohesive force, and the adhesion of the adhesive is higher. If a highly polar thermoplastic resin is used, the thermoplastic resin will not only be added to the hardening reaction of the epoxy resin, but also the inorganic material will be bonded through the Silane Coupling agent. Therefore, not only the curability of the adhesive is increased, but also the affinity with the coated body of the inorganic material is improved. The above described objects, features, and advantages of the present invention will become more apparent and understood.

File:TWl009(060314)CRF.doc

SUNDIAL CONFIDENTIAL is as follows: [Embodiment] The following is a description of the process for producing the latent hardener of the present invention. First, the metal chelate compound-aluminum chelate compound is dissolved in an organic solvent to prepare a metal chelate dissolving agent, and then the metal compound solution is spray-dried by a spray drying device to obtain a hardener particle (spray drying). Spray dryer method). Symbol 31 in the first (a) diagram shows curable particles. Then, the melting point is 3 (TC or more and 35 CTC or less, the thermal decomposition temperature is 5 (TC or more and 500 or less, and the softening temperature is 0 or more and 3 〇 (rc or less, glass transition temperature is -40 ° C or higher and 300 ° C or lower, etc.) Powder-like resin (resin particle) of various conditions. The average particle diameter of the resin particle to the hardener particle material has an average particle diameter ratio of 丨〇〇: 80 or more. Next, the curable particle 31 and the resin particle are regulated. After the addition ratio is mixed and stirred in the mixing device, the resin particles having an average particle diameter smaller than the hardener particles 31 are coated on the surface of the hardener particles 31 by electrostatic adhesion (mixing process). b) The capsule material in this state is shown in the figure 32. The surface of one hardener particle 31 is covered with a plurality of resin particles 32. The hardener particles 31 having electrostatically attached resin particles 32 on the surface are provided. Pour the resin particles 32 on the surface of the hardener particles 3 of the stirring device because 1270558

File: TW1009 (060314) CRP.doc SUNDIAL CONFIDENTIAL Collisions with the resin particles 32 on the surface of the other hardenable particles 31, or the rotating blades, inner walls, etc. of the stirring device, or frictional heat generation, and the resin particles 32 are melted and melted. The resin particles 32 become integrated (stirring process). The symbol 33 of the first (C) diagram shows a capsule formed by combining the resin particles 32. The capsule 33 covers the entire surface of the hardener particles 31, and the hardener particles 31 and the capsule 33 constitute a latent curing agent 30°. Next, the adhesive of the present invention prepared using the above-mentioned latent curing agent 30 and the use of the present invention will be described. Manufacturing work of electrical equipment made by the adhesive of the invention. The epoxy resin, the thermoplastic resin, the Silane Coupling agent, the above-mentioned latent curing agent 30, the conductive particles, and the solvent which are thermosetting resins are mixed and stirred at a predetermined addition ratio, respectively Agent. In this state, the adhesive is paste-like. The symbol 21 of the second (a) figure shows a peeling film. The above-mentioned subsequent agent is applied to the surface of the release film 21 in a predetermined amount, and after drying, the solvent in the adhesive is volatilized to form a coating layer of the adhesive (Fig. 2(b)). Reference numeral 20 in Fig. 2(b) shows an adhesive film in which the state of the coating layer 25 is formed. Symbol 27 of the figure shows conductive particles dispersed in the adhesive together with the latent curing agent 30. In this state, the potential 17 1270558

File: TW1009 (060314) CRF.doc SUNDIAL CONFIDENTIAL The curable particles 31 of the curing agent 30 are enclosed in the capsule 33, and the curable particles 30 are not coupled to the decane in the adhesive constituting the coating layer 25 (Silane Coupling). When the agent is in contact, it does not undergo a hardening reaction with the coating layer 25 at normal temperature. The reference numeral 11 in Fig. 3(a) shows an LCD, and the LCD 11 forms a narrow and a plurality of ITO electrodes 13 (Indium tin oxide) on one surface of the glass substrate 12 and the glass substrate 12. This figure shows five ITO electrodes 13. On the surface of the LCD 11 on which the ITO electrode 13 is formed, a TCP portion to be described later is connected to the coating layer 25 of the support film 20 shown in Fig. 2(b) (Fig. 3(b)). Since the adhesion between the release film 21 and the coating layer 25 is smaller than that between the coating layer 25 and the ITO electrode 13, the coating layer 25 remains on the LCD 11 after the release film 21 is peeled off (3 (c )))). The symbol 15 in Fig. 5 shows TCP. The TCP 15 has an elongated base film 16. On one surface of the base film 16, a narrow metal wiring 17 is disposed along the longitudinal direction of the base film 16 (here, five metal wirings are shown here). The ends of the metal wires 17 in the longitudinal direction are respectively located at the ends in the longitudinal direction of the base film 16. 3(d) is a cross-sectional view taken along line AA of FIG. 5, and a coating layer on which the LCD11 ITO electrode 13, the one end of the TCP 15 and the ITO electrode 13 are disposed is disposed on the surface on the side where the TCP15 metal wiring 17 is disposed. 25 relative, 18 1270558

File: TW1009 (060314) CRP.doc The ITO electrode 13 of the LCD11 and the metal wiring 17 of the TCP15 SUNDIAL CONFIDENTIAL are opposed to each other. In this state, the surface on which the metal wiring 17 of the TCP 15 is placed is pressed against the coating layer 25' to press the portion where the TCP 15 and the LCD 11 overlap, and then the whole is heated, so that the coating layer 25 is applied. Softening, since pressing the metal wiring 17 presses and retreats the softened coating layer 25, and the conductive particles 27 in the remaining coating layer 25 are sandwiched between the metal wiring 17 and the ITO electrode 13 (4th (e )))). In this state, if the heating and pressing are continued, the heating causes the capsule 33 to melt or soften, and the mechanical strength of the capsule 33 is remarkably weakened. At this time, since the heat hardener particles are thermally expanded, the capsule 33 which is weakened by mechanical strength is broken, and the hardener particles 31 are coupled with the epoxy resin and the decane in the coating layer 25 (Silane c〇upling). Mix the agents. When the hardener particles 31 are mixed with the epoxy resin and the silane coupling agent in the coating layer 25, the chelating compound constituting the hardener particles 31 is reacted with a silane coupling agent, and coated. The cations in layer 25 will be released. The cation causes the epoxy to proceed (cation overlap), and the metal wiring 17 and the ruthenium electrode 13 sandwich the conductive particles 27, and the coating layer 25 is hardened in this state. (Fig. 4(f)) 19 1270558

File: TW1009 (060314) CRF, doc SUNDIAL CONFIDENTIAL The symbol 10 of Fig. 4(f) shows the electrical equipment of the coating layer 25 in a hardened state. In the electrical device 1A, not only the metal wiring 17 and the It〇 electrode 13 are continuously connected to the electrons of the conductive particles 27, but the LCD layer 11 and the TCP 15 are also hardened by the coating layer 25 to form a mechanical connection, as shown in FIG. . As a result, the adhesive of the present invention not only has excellent preservability, but also hardens the epoxy resin because of the overlapping of the cations, and hardens the adhesive at a low temperature and a short time more than the conventional hardener. [Examples] An aluminum chelate compound (Alumiun Tris acetactate manufactured by Kawasaki Seiko Chemical Co., Ltd.) (trade name "I Lu Chelate A (W)" and Ming Alcoholate (manufactured by Kasei Seiko Chemical Co., Ltd.) were used. Alumium Isopropylate (trade name "AIPD"), which is separately dispersed in the solvent Methyl ethyl ketone to form a 10 chel % metal chelate solution containing the chelating compound, containing aluminum Alcoholate 10% by weight of a metal Alcoholate solution. Next, a spray drying apparatus (manufactured by Yamato Lapochic Co., Ltd., trade name "GC-31") was used to spray the inlet temperature of 80. (:, spray outlet temperature: 60 ° C, spray Pressure lkg/c πί, inflow of dry nitrogen 20 1270558

File: TW1009(060314)CRF.doc SUNDIAL CONFIDENTIAL 0.5m3/min, spray and dry the metal chelate solution and the metal Alcoholate solution to prepare two powdery hardeners (hardener particles) Fog drying method). In addition, resin particles 32, a powdery fluorinated resin (manufactured by Daikin Industrial Co., Ltd., trade name "Lupron L-5", primary particle diameter 0.2/zm, melting point 327 ° C) were prepared. The product of the first (a) and (b) above is manufactured by the Nara Machinery Co., Ltd. product under the trade name "Hybridaizer-NHS-O", and the above-mentioned hardener particles 31 are 20 parts by weight and the above resin. The particles 32 were mixed at a weight of 3 parts, and the resin particles 32 were electrostatically adhered to the surface of the curing agent (mixing process), and stirred at a peripheral speed of 1 〇〇 m / sec and a treatment time of 5 minutes (stirring process) to form a capsule. 33. Two types of latent hardeners 30 are obtained. Adding a thermoplastic resin phenate resin to the 50-weight portion of the thermoplastic resin bis phenol type A epoxy resin (manufactured by Oily Shell Epoxy Co., Ltd., trade name [EP828] (Dongdu Huacheng ( (manufactured by the company, "YP50"), a weight of 50 parts, a sane coupling (Silane Coupling) (manufactured by Uni本Unica Co., Ltd., trade name "A-187"), 1 part by weight, 2.5 parts by weight of conductive particles, 10 parts by weight of each latent hardener, and an organic solvent, and then dispersed to form a paste-like adhesive, with these adhesives in the second (a), (b) drawings of the work 21 1270558

File: TW1009 (060314) CRF.doc SUNDIAL CONFIDENTIAL The adhesive film 20 of Example 2 was produced. Using the adhesive film 20 of each of Examples 1 and 2, the following "room temperature storage test" and "40 ° C storage test" were carried out, respectively. [Room-temperature storage test] Using the adhesive films 20 of Examples 1 and 2 and Comparative Examples 1 and 2, the above-mentioned 3(a) to 3(d), 4(e), 4(f) In the project, after the TCP 15 was connected to the LCD 11, the peel strength (initial peel strength) at the time of peeling off the TCP 15 on the LCD 11 was measured. Further, the adhesive films 20 of the first and second embodiments and the comparative examples 1 and 2 were stored at room temperature (25 ° C) for 1 day, 3 days, and 7 weeks, respectively, and the respective adhesive films 20 after storage were used. In the same procedure, after connecting the TCP 15 and the LCD 11 respectively, the peel strength (peeling strength after storage) at the time of peeling off the TCP 15 on the LCD 11 was measured. [40 ° C storage test] In this test, except that the storage temperature of the adhesive film 20 was adjusted from room temperature to 40 ° C, the film 20 was stored under the same conditions as in the above-mentioned "room temperature storage test", and the TCP 15 was connected to the LCD 11 After the measurement, the peeling after the preservation is strong 22 1270558

File:TW1009F-IP〇.doc SUNDIAL CONFIDENTIAL Degree. In the above-mentioned "room temperature storage test" and "4 〇 ° C storage test", if the peel strength after storage is 90% or more of the initial peel strength, "◎" is drawn, and 80% or more and 90% or less are "〇". 70% or more and 80% or less are drawn as "△", and 70% or less is evaluated as "X". The evaluation results are shown in Table 2 below. [Table 1] Table 1: Results of the evaluation test

Storage at room temperature 40 Torr storage 3 曰 7 曰 3 曰 7 曰 Example 1 ◎ ◎ ◎ 〇 Example 2 ◎ ◎ ◎ 〇 Comparative Example 1 XXXX Comparative Example 2 XX Γ XX Comparative Examples 1 and 2 of Table 1 above are examples The two types of hardener particles used in 1, 2 are directly added to the adhesive without forming a capsule. Further, the TCP 15 is arranged at 25 #m intervals with 25/zm metal wiring, and the LCD 11 has a surface area per Icm2. The resistance is formed by a 10 〇 IT 〇 electrode 13, which is overlapped between the TCP 15 and the LCD 11 The load of 3Mpa is heated for 10 seconds to increase the temperature of the coating layer 25 by 1270558.

File:TW1009F-IPO.doc 0

SUNDIAL CONFIDENTIAL is connected to 130 °C. k In the above Tables 1 and 2, in the examples 1 and 2 in which the hardener particles 3 i were enclosed in the capsule 33, the evaluation results of the "room storage test" and the "4 (TC storage test) were good. On the other hand, in the comparative example 丄 and 2 in which the capsule rigid hardener was not added to the adhesive, the results of the respective storage tests were poor. From these results, the potential of using the present invention was confirmed. The adhesive of the hardener has excellent storage stability. The above description has been made on the case of using an adhesive to produce a film, but the use of the present invention is not limited thereto, and for example, the adhesive may be used directly in the form of a paste. Fig. 6(a) The symbol 11 is the same as that shown in Fig. 3(a), and is an LCD. When the LCD 11 is connected to the TCpi, it is first applied on the surface of the [cm ITO electrode 13 and connected to the TCP 15 The agent 'forms the coating layer 45 of the adhesive (Fig. 6(b) and then performs the aligned position of Tcpi5 in the work of the above figure (d), in the above 4(e), 4(f) In the engineering, the TCpi5 is connected to the LCmi, and the electrical equipment is obtained (Fig. 6(c)). Illustrates the use of the adhesive connection TCP15 shaped kernel Cloth LCD11 situation of use of the present invention is not limited to this, on a connection substrate of the semiconductor wafer, can be used to manufacture a variety of electrical equipment. 241270558

File: TW1009 (060314) CRF.doc SUNDIAL CONFIDENTIAL The above description is for the case where the conductive particles are dispersed in the adhesive. However, the use of the present invention is not limited thereto, and for example, an adhesive containing no conductive particles is also included. It is within the scope of the invention. As the metal chelate compound, various metal chelate compounds such as a zirconium chelate compound, a titanium chelate compound, and an aluminum chelate compound can be used. Among them, the most reactive aluminum chelate compound is preferably used. Further, the method of producing the hardener particles by the spray drying method has also been described above, but the present invention is not limited thereto. Although the case of using a fluorinated resin having a melting point of 327 ° C has been described above, the scope of use of the present invention is not limited thereto, as long as the melting point is 30 ° C or more and 3 50 ° C or less, and the thermal decomposition temperature is 50 ° C or more and 500 ° C. Hereinafter, a softening temperature of 0 ° C or more and 300 ° C or less, and a glass transition temperature of -40 ° C or more and 300 ° C or less may be used, and a thermoplastic resin, a bridging resin, or a gel resin may be used. For the above-mentioned resin, for example, acryl resin (manufactured by Nippon Paint Co., Ltd., trade name "Micro Gel"), Poly-methyl methacrylate resin ("MP series" manufactured by Soken Chemical Co., Ltd.), Benzoguanamine resin (trade name "Eposter", manufactured by Nippon Shokubai Co., Ltd.), and Philippene resin (trade name "Tospar", manufactured by Toshiba Co., Ltd., GE Toshiba Co., Ltd.). A capsule having the above characteristics is dissolved in a capsule formed in a capsule 25 1270558

File:TWl009(060314)CRF.doc SUNDIAL CONFIDENTIAL In the case of engineering, the resin constituting the resin particles sometimes undergoes chemical deterioration. This may be because the melting point, thermal decomposition temperature, softening temperature, and glass transition temperature of the capsule exceed Pre-resin temperature range.

The above thermosetting resin is exemplified by an epoxy resin, but the use of the present invention is not limited thereto. In the case of a cationically-carrying resin, for example, a urea resin, a melamin resin, a rattan resin, a vinyle ether resin, an Oxetane resin, or the like, but considering the strength of the adhesive after hardening, etc. It is preferable to use an epoxy resin. Further, in the case of the Silane Coupling agent used in the present invention, it is preferable to use the substance represented by the following formula (6). X1—-Si—X3 ...... General Formula (5) (In the above general formula (5), at least one of the substituents in the substituents X1 to X4 is an alkoxy. The alkoxy group is preferably a methoxy group (Methoxy) or an ethoxy group (Ethoxy). Further, among the substituents X1 to X4 other than the alkoxy group, at least one of the substituents is preferably an epoxy group or a vinyl group. Particularly preferred is a Glycidil group having an epoxy substituent. Having B 26 1270558

File: TW 1009 (060314) CRF.doc SUNDIAL CONFIDENTIAL There are, for example, Metacryloxipropil groups. Further, all of the substituents XI to X4 are derived from an Alchoxy group, a so-called Silicate. In addition to Phenoxy resin, thermoplastic resin, such as polyethylene resin, urinary resin, polyvinyl acetate, Ethylene Vinyle Acetate, Polybutadiene, rubber, rubber, etc. Classes can also be used.

Further, an additive such as an anti-aging agent, a filler, a coloring agent or the like may be added to the following in the present invention. In the adhesive of the present invention, since the hardener particles composed of the metal chelate compound are coated with the capsule, the superposition reaction of the epoxy resin does not occur at normal temperature, and the storage property of the adhesive is high. Further, the adhesive of the present invention is hardened by the cationic overlapping reaction of the epoxy resin. The superposition reaction of the cations is lower than the temperature at which the conventional hardener superposition reaction occurs in the past, and therefore, the adhesive of the present invention can be hardened at a low temperature and in a short time as compared with the conventional adhesive. In view of the above, the present invention has been described above in terms of a preferred embodiment, and is not intended to limit the invention, and various modifications may be made without departing from the spirit and scope of the invention. And the scope of the present invention is defined by the scope of the appended claims. 27 1270558

File: TW1009F-IPO.doc SUNDIAL CONFIDENTIAL [Simplified Schematic Description] Figs. 1(a) to 1(c) are diagrams for explaining an example of a latent hardener manufacturing process of the present invention. Figs. 2(a) and 2(b) are drawings for explaining an example of the construction of the adhesive film using the adhesive of the present invention. Figures 3(a) to 3(d) are drawings for the first half of the description of the bonding of the LCD and the TCP using the adhesive of the present invention. Figures 4(e) and 4(f) are diagrams for the half-engineering of TCP and LCD. Figure 5 is a plan view showing the state of the TCP and LCD in an aligned position. Figs. 6(a) to 6(c) are explanatory views of other examples of bonding work using the adhesive of the present invention. Figures 7(a) to 7(c) are explanatory diagrams of the process of bonding LCD and TCP using an adhesive of a conventional technique. DESCRIPTION OF SYMBOLS 20, 45 : Adhesive (coating layer) 3 0 : latent hardener 31 : hardener particle 32 : capsule material 28 1270558

File:TW1009F-IPO.doc SUNDIAL CONFIDENTIAL 33 :Capsule 29

Claims (1)

1270558 File: TWl009 (060314) CRP.doc SUNDIAL CONFIDENTIAL Patent application scope, 1. A latent hardener comprising a hardener particle and a capsule covering the surface of the hardener particle, the hardener particle having a metal chelate And one or both of the metal alkoxides, wherein the main component of the capsule component is a fluorinated resin. 2. The latent hardener according to claim 1, wherein the main component of the metal chelate is a chelate. 3. The latent hardener according to claim 1, wherein the metal Alcoholate has a main component of Ilu Alcoholate. 4. The latent hardener according to claim 1, wherein the capsule has resin particles having an average particle diameter smaller than an average particle diameter of the hardener particles, and the resin particles are attached to the hardener particles. The surface is melted to form any one of the capsules described in the first to third aspects of the above-mentioned patent application. 5. The latent hardener according to claim 4, wherein the resin particles have a melting point of from 30 ° C to 350 ° C. 6. The latent curing agent according to claim 4, wherein the resin particles have a thermal decomposition temperature of from 50 ° C to 500 ° C. 7. The latent hardener according to claim 4, wherein the softening temperature of the 1270558 File: TWl 009 (060314) CRF doc SUNDIAL CONFIDENTIAL resin particles is above 30 (TC or less. & The latent hardener according to Item 4, wherein the glass transition temperature of the resin particles is 30 or more in the book C (TC or less. 9. The method for producing a latent hardener, the latent hardener is further changed W] a particle, a capsule coated on the surface of the hardener particle, the method comprising: equipping the hardener particle, the hardener particle having a metal chelate and a metal plate, or both; - a capsule material having a smaller average particle size than the hardener particles on the surface of the hardener particles - the capsule material having a fluorinated resin and being in the form of a powder; and melting the surface attached to the surface of the hardener particle The capsule material is melted to form the capsule. The method for producing a latent hardener according to claim 9, wherein the step of forming the capsule comprises: mixing the hardener particles with _ a material, the surface of the hardener particles is adhered to the capsule material; and the mixture is stirred in a state in which the hardener particles are adhered to the capsule material, and the capsule material is melted. The potential U is one of the items. Patent Application No. 9 and 1 〇 31 * 1270558 File.TWl〇〇9(〇6〇314) CRF.doc SUNDIAL CONFIDENTIAL A method for producing a hardener, wherein an average particle diameter of the hardener particles is for the capsule material The ratio of the average particle diameter is 1 (10)·8 〇. The method for producing a latent hardener according to any one of claims 9 to 1 wherein the average particle size of the hardener particles is to the gel. The ratio of the average particle diameter of the capsule material is 1 〇〇: 50. 13. An adhesive comprising - a thermosetting resin, a singly coupled (10) 継 Couphng agent, and any of the items i to 8 of the patent application scope A potential hardener described. 32