TWI268569B - Apparatus and method for cleaning test probes - Google Patents

Apparatus and method for cleaning test probes

Info

Publication number
TWI268569B
TWI268569B TW092101032A TW92101032A TWI268569B TW I268569 B TWI268569 B TW I268569B TW 092101032 A TW092101032 A TW 092101032A TW 92101032 A TW92101032 A TW 92101032A TW I268569 B TWI268569 B TW I268569B
Authority
TW
Taiwan
Prior art keywords
probe tip
abrasive
cleaning apparatus
substrate layer
test probes
Prior art date
Application number
TW092101032A
Other languages
English (en)
Other versions
TW200302537A (en
Inventor
Igor Y Khandros
Benjamin N Eldridge
Treliant Fang
Gaetan L Mathieu
Gary W Grube
Michael A Drush
Christopher C Buckholtz
Original Assignee
Formfactor Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Formfactor Inc filed Critical Formfactor Inc
Publication of TW200302537A publication Critical patent/TW200302537A/zh
Application granted granted Critical
Publication of TWI268569B publication Critical patent/TWI268569B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/48—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00—Cleaning by methods involving the use of tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00—Cleaning by methods involving the use of tools
    • B08B1/10—Cleaning by methods involving the use of tools characterised by the type of cleaning tool
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • B08B7/0028—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by adhesive surfaces
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/06—Preparatory processes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24355—Continuous and nonuniform or irregular surface on layer or component [e.g., roofing, etc.]
    • Y10T428/24372—Particulate matter
    • Y10T428/2438—Coated
    • Y10T428/24388—Silicon containing coating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31652—Of asbestos
    • Y10T428/31663—As siloxane, silicone or silane

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Measuring Leads Or Probes (AREA)
  • Cleaning In General (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
TW092101032A 2002-01-18 2003-01-17 Apparatus and method for cleaning test probes TWI268569B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/050,908 US6840374B2 (en) 2002-01-18 2002-01-18 Apparatus and method for cleaning test probes

Publications (2)

Publication Number Publication Date
TW200302537A TW200302537A (en) 2003-08-01
TWI268569B true TWI268569B (en) 2006-12-11

Family

ID=21968226

Family Applications (1)

Application Number Title Priority Date Filing Date
TW092101032A TWI268569B (en) 2002-01-18 2003-01-17 Apparatus and method for cleaning test probes

Country Status (7)

Country Link
US (1) US6840374B2 (zh)
EP (1) EP1468048A1 (zh)
JP (1) JP2005515645A (zh)
KR (1) KR100959322B1 (zh)
CN (1) CN1643065A (zh)
TW (1) TWI268569B (zh)
WO (1) WO2003062322A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI417149B (zh) * 2009-12-03 2013-12-01 Int Test Solutions Inc 用以清除測試器界面接觸元件和支持硬體之設備、裝置與方法

Families Citing this family (36)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7182672B2 (en) * 2001-08-02 2007-02-27 Sv Probe Pte. Ltd. Method of probe tip shaping and cleaning
US6817052B2 (en) * 2001-11-09 2004-11-16 Formfactor, Inc. Apparatuses and methods for cleaning test probes
US6813804B2 (en) * 2002-06-06 2004-11-09 Samsung Electronics Co., Ltd. Apparatus and method for cleaning probe card contacts
US7392563B2 (en) * 2003-01-14 2008-07-01 Wentworth Laboratories, Inc. Probe pin cleaning system
JP4565813B2 (ja) * 2003-05-13 2010-10-20 日本電子材料株式会社 プローブ先端クリーニング部材
US20070046314A1 (en) * 2004-07-21 2007-03-01 Advanced Semiconductor Engineering, Inc. Process for testing IC wafer
US9833818B2 (en) 2004-09-28 2017-12-05 International Test Solutions, Inc. Working surface cleaning system and method
JP2006165395A (ja) * 2004-12-09 2006-06-22 Jsr Corp プローブクリーニングフィルム及びプローブクリーニング部材
US7784146B2 (en) * 2006-01-09 2010-08-31 International Business Machines Corporation Probe tip cleaning apparatus and method of use
JP2008281413A (ja) * 2007-05-10 2008-11-20 Micronics Japan Co Ltd プローブのためのクリーニング装置
US8287653B2 (en) * 2007-09-17 2012-10-16 Rave, Llc Debris removal in high aspect structures
US10384238B2 (en) 2007-09-17 2019-08-20 Rave Llc Debris removal in high aspect structures
US10618080B2 (en) 2007-09-17 2020-04-14 Bruker Nano, Inc. Debris removal from high aspect structures
US10330581B2 (en) 2007-09-17 2019-06-25 Rave Llc Debris removal from high aspect structures
EP2419929B8 (en) 2009-04-14 2021-08-18 International Test Solutions, LLC. Wafer manufacturing cleaning apparatus, process and method of use
JP2012198024A (ja) * 2009-07-31 2012-10-18 Wit Co Ltd テストプローブ用のクリーニングパッドおよびテストプローブのクリーニング方法
JP5675472B2 (ja) * 2011-04-11 2015-02-25 日東電工株式会社 クリーニングシート、クリーニング部材、クリーニング方法、および、導通検査装置
US9229029B2 (en) 2011-11-29 2016-01-05 Formfactor, Inc. Hybrid electrical contactor
US8928325B2 (en) * 2011-12-08 2015-01-06 Savannah River Nuclear Solutions, Llc Identification of elemental mercury in the subsurface
DE102014103262B3 (de) * 2014-03-11 2015-06-11 Multitest Elektronische Systeme Gmbh Vorrichtung zum Prüfen von elektronischen Bauteilen
TWI770024B (zh) * 2016-05-20 2022-07-11 美商瑞弗股份有限公司 決定粒子及從基板移除之粒子的組成物的方法
US9825000B1 (en) 2017-04-24 2017-11-21 International Test Solutions, Inc. Semiconductor wire bonding machine cleaning device and method
CN108181568B (zh) * 2018-01-11 2021-04-06 上海华虹宏力半导体制造有限公司 晶圆测试保护垫及测试方法
US11434095B2 (en) 2018-02-23 2022-09-06 International Test Solutions, Llc Material and hardware to automatically clean flexible electronic web rolls
US11099212B2 (en) * 2018-03-12 2021-08-24 Aculon Inc. Method for cleaning and coating a tip of a test probe utilized in a test system for an integrated circuit package
US10627426B2 (en) * 2018-03-12 2020-04-21 Aculon Inc. Method and kit for cleaning and coating a tip of a test probe utilized in a test system for an integrated circuit package
AT521098B1 (de) * 2018-04-09 2022-07-15 Gaggl Dr Rainer Verfahren zum Reinigen der Nadelspitzen der Nadeln von Nadelkarten
US11756811B2 (en) 2019-07-02 2023-09-12 International Test Solutions, Llc Pick and place machine cleaning system and method
US10792713B1 (en) 2019-07-02 2020-10-06 International Test Solutions, Inc. Pick and place machine cleaning system and method
US11865588B2 (en) * 2019-11-12 2024-01-09 Alliance Material Co., Ltd. Probe pin cleaning pad and cleaning method for probe pin
US11318550B2 (en) * 2019-11-14 2022-05-03 International Test Solutions, Llc System and method for cleaning wire bonding machines using functionalized surface microfeatures
US11211242B2 (en) 2019-11-14 2021-12-28 International Test Solutions, Llc System and method for cleaning contact elements and support hardware using functionalized surface microfeatures
JP7503915B2 (ja) * 2020-02-28 2024-06-21 富士紡ホールディングス株式会社 クリーニングシート
US11035898B1 (en) 2020-05-11 2021-06-15 International Test Solutions, Inc. Device and method for thermal stabilization of probe elements using a heat conducting wafer
CN112462104B (zh) * 2020-11-28 2022-03-04 法特迪精密科技（苏州）有限公司 测试探针清洁方法
DE102021201669B4 (de) * 2021-02-22 2023-08-17 Carl Zeiss Smt Gmbh Verfahren und vorrichtung zum bearbeiten einer probe

Family Cites Families (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3020260A (en) * 1960-08-18 1962-02-06 Dow Corning Organosiloxane potting compound
US4778326A (en) 1983-05-24 1988-10-18 Vichem Corporation Method and means for handling semiconductor and similar electronic devices
US5476211A (en) 1993-11-16 1995-12-19 Form Factor, Inc. Method of manufacturing electrical contacts, using a sacrificial member
US5917707A (en) 1993-11-16 1999-06-29 Formfactor, Inc. Flexible contact structure with an electrically conductive shell
US4757255A (en) 1986-03-03 1988-07-12 National Semiconductor Corporation Environmental box for automated wafer probing
GB2192142B (en) * 1986-07-04 1990-11-28 Johnson & Johnson Wound dressing
US4774111A (en) * 1987-06-29 1988-09-27 Dow Corning Corporation Heat-curable silicone compositions comprising fumarate cure-control additive and use thereof
US5198752A (en) 1987-09-02 1993-03-30 Tokyo Electron Limited Electric probing-test machine having a cooling system
FR2624874B1 (fr) * 1987-12-18 1990-06-08 Dow Corning Sa Composition gelifiable a base d'organosiloxanes, gel produit a partir de cette composition, et pansement et prothese contenant ce gel
FR2633400B1 (fr) 1988-06-24 1990-11-09 Labo Electronique Physique Systeme de controle automatique de circuits integres
US5198753A (en) 1990-06-29 1993-03-30 Digital Equipment Corporation Integrated circuit test fixture and method
JPH04364746A (ja) 1991-06-12 1992-12-17 Tokyo Electron Yamanashi Kk プローブ装置
JPH0653299A (ja) 1992-07-31 1994-02-25 Tokyo Electron Yamanashi Kk バーンイン装置
US6184053B1 (en) 1993-11-16 2001-02-06 Formfactor, Inc. Method of making microelectronic spring contact elements
US6336269B1 (en) 1993-11-16 2002-01-08 Benjamin N. Eldridge Method of fabricating an interconnection element
KR20030096425A (ko) 1994-11-15 2003-12-31 폼팩터, 인크. 인터포저
US5834946A (en) 1995-10-19 1998-11-10 Mosaid Technologies Incorporated Integrated circuit test head
US5690749A (en) 1996-03-18 1997-11-25 Motorola, Inc. Method for removing sub-micron particles from a semiconductor wafer surface by exposing the wafer surface to clean room adhesive tape material
TW377482B (en) * 1997-04-08 1999-12-21 Tokyo Electron Ltd Cleaner with protuberances for inspection, inspection apparatus and inspection method for integrated circuits
JP3388271B2 (ja) 1997-05-19 2003-03-17 東京エレクトロン株式会社 プローブ装置
JPH1187438A (ja) 1997-09-03 1999-03-30 Mitsubishi Electric Corp プローブ先端のクリーニング部材ならびにクリーニング方法、および半導体ウェーハのテスト方法
EP0955347B1 (en) * 1998-05-06 2011-08-31 Dow Corning France S.A. Method for adhering substrates using adhesive devices containing silicone gels
US6140616A (en) 1998-09-25 2000-10-31 Aehr Test Systems Wafer level burn-in and test thermal chuck and method
KR20070087060A (ko) 1998-12-02 2007-08-27 폼팩터, 인크. 전기 접촉 구조체의 제조 방법
US6255126B1 (en) 1998-12-02 2001-07-03 Formfactor, Inc. Lithographic contact elements
US6777966B1 (en) 1999-07-30 2004-08-17 International Test Solutions, Inc. Cleaning system, device and method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI417149B (zh) * 2009-12-03 2013-12-01 Int Test Solutions Inc 用以清除測試器界面接觸元件和支持硬體之設備、裝置與方法

Also Published As

Publication number Publication date
KR20040077877A (ko) 2004-09-07
WO2003062322A1 (en) 2003-07-31
KR100959322B1 (ko) 2010-05-26
EP1468048A1 (en) 2004-10-20
TW200302537A (en) 2003-08-01
CN1643065A (zh) 2005-07-20
US20030138644A1 (en) 2003-07-24
US6840374B2 (en) 2005-01-11
JP2005515645A (ja) 2005-05-26

Similar Documents

Publication Publication Date Title
TWI268569B (en) Apparatus and method for cleaning test probes
GB2337476B (en) Method and apparatus for cleaning workpiece surfaces and monitoring probes during workpiece processing
EP1492153A3 (en) Method and system for monitoring an etch process
TW200617617A (en) Exposure apparatus and device manufacturing method
WO2000028579A3 (en) Method and apparatus for cleaning the edge of a thin disc
US20060065290A1 (en) Working surface cleaning system and method
DE60029437D1 (de) Verfahren zum reinigen eines chemisch-mechanischen polierkissens
SG99365A1 (en) Reliable metal bumps on top of i/o pads with test probe marks
EP0881484A3 (en) Method and apparatus for in-situ monitoring of thickness during chemical-mechanical polishing
DE60228542D1 (de) Verfahren und Vorrichtung zum Prüfen der Oberfläche von Substraten
DE602005017595D1 (de) Verfahren und vorrichtungen für elektro-chemisch-mechanisches polieren
DE60238892D1 (de) Vorrichtung zum Nachweis einer Feinstruktur an der Oberfläche einer Probe und Verfahren zur Herstellung einer Halbleitervorrichtung
DE602005009026D1 (de) Herstellungsverfahren für halbleiterchips
CN103878150A (zh) 探针的清洁方法及探针清洁装置
WO2006014894A3 (en) Method and apparatus for producing co-planar bonding pads on a substrate
TW200614407A (en) Semiconductor device, method and apparatus for testing same, and method for manufacturing semiconductor device
TW200503125A (en) Method of manufacturing a semiconductor device
CN106504977A (zh) 探针清洁方法及探针清洁装置
JP2002346939A (ja) 接触子クリーニングシート及び方法
CN102485425B (zh) 化学机械抛光的方法、用于化学机械抛光的清洗装置
TW200627618A (en) Analogue measurement of alignment between layers of a semiconductor device
WO2004088739A3 (en) Real-time in-line testing of semiconductor wafers
DE50208273D1 (de) Verfahren und vorrichtung zur reinigung mittels ultraschall
ATE308116T1 (de) Verfahren und einrichtung zum chemisch- mechanischem polieren
TW200709316A (en) Substrate and testing method thereof

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees