TW200302537A - Apparatus and method for cleaning test probes - Google Patents

Abstract

A probe cleaning apparatus for cleaning a probe tip use to test semiconductors dies having an abrasive substrate layer an a tacky gel layer on top of the abrasive surface of the abrasive substrate layer. The probe tip is cleaned by passing it through the tacky gel layer so that it comes in contact with the abrasive surface of the abrasive substrate, moving the probe tip across the abrasive surface of the substrate layer, and then removing the probe tip from the successive layers of the cleaning apparatus. The probe tip emerges from the cleaning apparatus free from debris associated with testing the semiconductor dies.

Description

200302537 (1) 发明. Description of the invention [Technical field to which the invention belongs] The present invention relates generally to a probe card for testing on a semiconductor device. More specifically, the present invention relates to a probe element for cleaning these probe card extensions. [Previous Technology] A single semiconductor (integrated circuit) device (die) is usually manufactured using conventional techniques such as reference lithography and deposition to form several identical die on a semiconductor wafer. Generally, these methods are intended to produce many fully functional integrated circuits before dicing (supplying) a semiconductor wafer into a single die. However, in fact, certain physical defects of the wafer itself and certain defects in the wafer processing inevitably lead to some die "good" (complete function), and some die ".bad" (non-functional) . In general, it is best to confirm which dies on the wafer are good before packaging the dies, and it is better to confirm these dies before the wafer is cut. Finally, it is best to use wafer “testers” and “probes” that combine probe cards. Many discontinuous connection pads (lap or contact pads) on the die produce the same number of discontinuous pressure connections. In this way, these semiconductor dies can be tested and used before the dies are cut from the wafer. A conventional component of a wafer tester is a "probe card" to which a number of probe elements are connected, wherein the tip of the probe element makes a pressure connection to an individual pad of a semiconductor die. More specifically, in a representative wafer test method, the probe card is mounted on a detector, and the probe element (referred to as -7- (2) 200302537) ") In contact with a pad formed on the wafer. Non-exclusive examples of such probes include active or spring contact probes (commonly referred to as "spring contacts" or "contact springs"), such as US Patent 6,184,053, entitled "Making Microelectronic Spring Contact Elements," "Met hod for Manufacturing Electrical

Contacts, Using a Sacrificaial Member "U.S. Patent 5,476,211, U.S. Patent 5,9 1 7,707, entitled" Flexible Contact Structure with an Electrically Conductive Shell "," Method of Modifying the Thinkness of a Plating on a Member by Creating a Temperature Gradient on the Member, Application for Employing Such a Method, and Structures

US Patent 6,110,823 of "Resulting from Such a Method", US Patent 6, 2 5 5, 1 2 6 entitled "Lithographic C ntact E1 ements", and PCT Application "Lithographic Contact Elements" WO 00 As disclosed in / 3 3089, the full text of these patents and applications are incorporated herein by reference. In one of the methods, after the probe contacts the pad, a specific pressure is applied to the probe, so that the probe The needle penetrates the material forming the surface of the pad and makes a low-resistance contact with the main body portion of the pad to achieve the electrical connection between the detector and the pad. When the probe tip contacts and penetrates the pad, it is transferred to the probe The tip pad material may contaminate the probe element. The transferred and contaminated materials may include the original pad material or the oxide of the pad material. Depending on the operating conditions of the item, the pad material may also be Alloy (melt) with the probe tip material. -8- (3) (3) 200302537 Alternatively, the pad surface material penetrated by the probe tip may generate fragments (for example, metal debris) These fragments are sometimes removed later. Usually, elastic or spring probes are used to obtain a stable electrical connection between the probe and the pad. After the pressure is applied, some contact technologies require the probe to strike strongly with some X-axis direction and optionally in the Y-axis direction, which causes the part of the material forming the surface of the pad (for example, a metal oxide film) to be scratched This can result in fragments in the form of, for example, metal "chips," which may have an oxide film. Such movement across the pad surface may also result in "chips" (e.g., metal and / or oxide films) of fragments caused by the material forming the pad surface. Even non-slip contacts may be contaminated during material detection due to material transfer and / or alloying, and loose fragment particles adhering to the side of the probe element. However, foreign fragments are not limited to metal shavings and / or metal oxide debris, but may also contain substances such as dust, polymerization byproducts, or metal oxide byproducts, which are on the wafer along with the construction of integrated circuits Formed by various methods, or any other material that may interfere with obtaining the proper electrical connection between the probe tip and the surface of the die, or interfere with the proper positioning of the probe with the die. Various approaches have been taken to address these issues with a view to achieving a desired electrical connection between the probe and the pad. These approaches include cleaning the probe tip during the die test cycle. In a conventional probe cleaning method, a wear pad is used to remove foreign materials that stick to the probe tip. The wear pad may consist of a mixture of an elastic substrate material and ground uranium particles. Alternatively, the wear pad may be made of tungsten carbide group -9-(4) (4) 200302537. By repeating the cleaning cycle of pushing and pulling the probe tip away from the pad, scrape off the foreign material adhering to the probe tip. The push and pull cycle includes moving the wear pad vertically (e.g., in the z-axis direction) toward the probe and then leaving the probe vertically. The disadvantage of the above-mentioned conventional cleaning method is that the substrate material portion (such as silicone) and / or abrasive particles (such as abrasive particles) may fall from the pad or form debris during the pressing and pulling process. This creates additional foreign material that will stick to the probe tip. In addition, foreign materials (previously removed from the probe) that fell on the wear pad may later stick to the probe in the clean. Therefore, additional cleaning steps are required to properly clean the probe. Additional steps may include blowing an organic solvent over the probe and then blowing dry air over the probe. The use of these solvents is disadvantageous for many reasons. For example, blowing organic solvents is time consuming and can be messy or dangerous. In addition, blowing dry air is time consuming. In addition, blowing solvent and dry air requires special equipment. The probe has also been cleaned with a small brush. Lu's other attempts to improve the conventional probe cleaning method include using a cover polymer substrate to remove foreign materials after the aforementioned push and pull cleaning cycles. More specifically, positioning a gel pad under the probe and then bringing it into contact with the probe is similar to the method of pushing and pulling the wear pad described above. As a result, the fragments that have come loose or the abrasion pad will stick to the gel pad, and these fragments are removed from the probe. The disadvantage of this cleaning method is that the operator must exchange the wear pad and gel pad during cleaning. Because this method hinders fully automated wafer testing and significantly reduces wafer testing -10- (5) (5) 200302537 trial output, this method is not good. Therefore, there is a need for improved methods and devices for cleaning probes. [Summary of the Invention] The present invention relates to a device and a method for a 式 -type probe. The 丨 | fj test 丨 Rongjin ten series is used for semiconductor test machines of many types with test probes, and its + Shai test probe A test probe used to contact the surface of a semiconductor wafer to test one or more dies formed on the wafer. The clean test probe can be any kind of probe, such as tungsten needle, vertical probe, cobra probe, L · type probe, plunger probe, spring probe, formed on the diaphragm. Contact bump probe and so on. In the first embodiment, the cleaning device of the present invention includes an abrasive substrate layer and an adhesive gel layer, which are located on the abrasive surface of the abrasive substrate layer. method. The third embodiment of the present invention relates to a method for cleaning the tip of a probe. The fourth embodiment of the present invention relates to an adhesive gel layer of the cleaning device. The fifth embodiment of the present invention relates to a method for manufacturing an adhesive gel layer of the cleaning device. [Embodiment] Table of contents I. Inventive term II. Cleaner device-11-(6) (6) 200302537 A · Abrasive substrate layer B · Adhesive gel layer / material 1. Silicone-based resin 2 Cross-linking compound 3. Orientation of components II. Method of manufacturing the cleaning device IV. Method of cleaning the probe tip of the cleaning device. I. The term "probe tip" used in the present invention refers to the test of semiconductor devices. The tip part of the probe element. The term `` probe element '' refers to, but is not limited to, tungsten needles, vertical probes, cobra probes, L-shaped probes, plunger probes, spring probes, and contact bumps formed on the diaphragm. needle. Spring contact probe (also known as "spring contact") or "contact spring") means but is not limited to a Delaware company-FormFacto, repair

Inc. currently works with any spring contacts supplied in the future. Any kind of spring contact conventionally known can be used in the present invention. Examples of spring contacts that can be used in the present invention are lead bonding, multilayer lithography, and integrally formed springs. The term "substrate" refers to the carrier material. The term "abrasive substrate" refers to a carrier material having an abrasive surface. The term "abrasive surface" refers to a non-smooth surface of an abraded substrate. `` Heterogeneous abrasive substrate '' refers to an abrasive substrate layer made of at least two materials, one of which forms a substrate layer on which at least one -12- (7) (7) 200302537 has an abrasive surface other materials. The material constituting the substrate layer and the material having the abrasive surface layer are different materials. II. Cleaning device FIG. 1A depicts a cleaning device according to a first embodiment of the present invention, which includes (i) a selective protective layer (130), which is indicated by a dotted line; (ii) located on the protective layer A ground uranium substrate layer (Π0); and (iii) an adhesive gel layer located on the abraded substrate layer (110). The surface abrasions or protrusions (120) are represented by a zigzag pattern between the two layers. However, the sawing pattern shown by 'is not used in any way to limit the structure of the ground uranium surface. In the case where the structure of the cleaning device includes a selective protective substrate layer (130), when the probe tip penetrates the abrasive substrate layer (n), the protective substrate layer will protect the structural integrity of the probe tip. Sex. Therefore, penetrating the abrasive substrate layer (Π 0) rather than touching a hard surface (for example, during operation, the surface of the cleaning device of the present invention may be placed)-it may damage the probe tip. --- When the probe tip comes into contact with a softer, more compliant material, it will not damage the physical integrity of the probe tip. According to this embodiment, a suitable material for the protective substrate layer is, but is not limited to, polysiloxane as a base rubber material. FIG. 1B depicts a cleaning device including a heterogeneous abrasive substrate layer (140), which has: (i) a substrate layer (141) on which (ii) a friction layer (142) is laminated, and a material and a substrate layer (141) ) Are different and have surface abrasions (120). Laminated on the abrasive substrate layer (14) is a glue -13- (8) (8) 200302537 viscous gel layer (100). This structure also optionally includes a protective substrate layer (130) as described above. Fig. 1C depicts a spool (150) containing the cleaning device (105) of Fig. 1A or 1B, which is pulled through a pressure plate (1 60) by a winding mandrel or roller (17). The pressure plate (1 60) is a pressure-resistant plate (i.e., a bearing surface), which causes the probe tip (180) to react with the rolled cleaning device (105). The probe card (180) containing the probe tip (185) is located above the platen. Moving the probe card (1 80) downward will push the probe tip (1 85) through the adhesive gel layer (1 00), so that the probe tip (1 85) and the adhesive gel layer (100 ) The abrasive surface of the underlying ground uranium substrate layer (110, 140) is in contact. The roller (190) is a "positioning roller" that helps to maintain the proper orientation of the cleaning device of Fig. 1A or 1B on the platen (160). The structure shown in FIG. 1C is not intended to limit the description of the embodiment of the present invention. The position of the roller in this embodiment of the present invention is not fixed, and it can be adjusted or improved according to the actual needs of a skilled person to maximize the effectiveness of the cleaning device. 0 According to the alternative structure of FIG. 1C, the pressure plate (160) has a ground uranium surface, and the reel (150) may include an adhesive gel material (100): 0 5) '5 Hai adhesive gel material is carried on a fireable film. The adhesive gel material (and the carrier film) moves through the abraded surface of the pressure plate (1 60), exposing the unused area of the adhesive gel layer (100). The probe tip on the probe card is pressed through the adhesive gel material (and the carrier film), so that it is brought into contact with the abrasive surface of the pressure plate (160) to promote clean movement thereon . -14- (9) 200302537 In another, a homogeneous or heterogeneous selective carrier is provided on a carrier with an adhesive gel system, and the gel layer of the present invention is removed by the tip of a probe, and unused The adhesive gel layer and the reeling mandrel A · Abrasion of the substrate layer The types of fragments of the present invention will not damage the probe tip under a fixed distance, a material (1 1 0 : Same as 140) (that is, the same material is made of alloy and compound. Although in the transitional alternative embodiment, the reel (150) may include an abrasive substrate (1 10,140), and the abrasive substrate is a protective substrate ( 130). Therefore, this structure has no layer (100). In this structure, the pressure plate (160) does not have an abrasive surface. In one embodiment, the probe tip is inserted into and removed from the adhesive ring for a period of time, Will reduce the effectiveness of the self-fragmentation of the adhesive gel layer. Therefore, the roll mandrel or roller adhesive gel layer is rotated and placed on the pressure plate (1 60) to make the layer (100) clean The most effective. When the reel is used up, add a new adhesive gel layer Reel, discarding the used adhesive gel layer. The abrasive substrate layer is usually hard or any material that is harder than the probe tip, and usually, but not necessarily, the needle tip itself. Some examples In this case, you can use this material to produce controlled or restricted damage. This method is suitable for situations where a new surface is required on the probe tip. It can be single) (that is, homogeneous) or two or more materials (1 10 ,heterogeneous). The abrasive substrate layer can also be obtained from the probe tip. Generally, the abrasive substrate layer can be made of any metal, gold compound, natural material, or metal organic compound. Any metal-based metal can be used to make the abrasive substrate, but -15- (10) (10) 200302537. Preferred transition metals include, but are not limited to: copper, nickel, palladium, tungsten, chain, and gold. Suitable as abrasive substrates. The materials include, but are not limited to, the alloys of the above-mentioned gold, which may include phosphorus, nitrogen, boron, and / or the like. Specific examples of suitable metal alloys include, but are not limited to: palladium / copper, titanium / tungsten and pins / chrome. Suitable composite (multiple) compounds for abrasive substrates include, but are not limited to: tungsten carbide, silicon carbide, silicon nitride, silicon dioxide, nitride nitride, aluminum oxide, chromium oxide, or titanium nitride. Suitable natural materials for abrasive substrates include, but are not limited to, gravel, alumina, diamond, or diamond-like carbon. The surface feature of the ground uranium substrate layer is a series of disordered, semi-disordered, or ordered ground uranium on the surface of the substrate material. These abrasives can be prepared by roughening the surface of the substrate, plating the surface of the substrate, etching, embossing, cutting into the surface of the substrate, or using a mold, wherein one side of the inner surface of the mold has an abrasive pattern. Other suitable methods for preparing abrasives known to those skilled in the art and the embodiment of the present invention can be used. In one example of the present invention, at least two methods known to those skilled in the art for producing abrasives on a substrate surface are used to prepare the abrasives. The shape of the abrasive may have a defined configuration, such as, for example, a geometry made by a mold, stamp, etch, or any other method that can produce a uniform repeating pattern of protrusions. The abrasive is typically graded and shaped to provide abrasive characteristics. Generally, the size of the abrasive is smaller than the width of the probe tip. The abrasion is preferably small enough to traverse the width of the probe tip. Therefore, the distance between the abrasives -16- (11) (11) 200302537 is small enough to adjust this arrangement. Figure 2 depicts the cross-sectional size relationship of the abrasive (120) with respect to the width of the probe tip (200). Figure 2 also shows that the abrasive material (120) has one of many possible structures on the abrasive substrate layer (110). The ground uranium depicted in Figure 2 has a uniform repeating pattern and is smaller than the size of the probe tip. In an example of the present invention, the width of the abrasive material (1 20) shown in FIG. 2 is about 2 μm, and the distance between the ground uranium materials is about 2 μm. The width of the probe tip (200) is usually about 10 μm. These dimensions are illustrative, rather than limiting the invention in all respects. In addition to having a geometrically uniform repeating pattern, they can also have fragmentary properties, that is, they do not have any geometrically defined shapes. It is also known that such fragmentary ground uranium is dendritic. The dendritic abrasion product can be prepared from any of the above-mentioned materials suitable for manufacturing the abraded substrate 'in a method known to those skilled in the art. It is also possible to prepare an abrasive surface printing pattern of the abrasive substrate layer by sputtering a film such as a metal, an alloy, a compound compound, or a natural material on the surface of the thermal substrate material. If the surface temperature of the substrate material is higher than the melting temperature of the material to be deposited, the formed deposit will have a rough surface printing pattern after cooling. Since the abrasive substrate layer prepared in this way contains different material components, it is heterogeneous. The roughened surface prepared in this way has abraded surface characteristics suitable for use in the present invention. Examples of materials that can be sputtered onto thermal substrates include, but are not limited to, aluminum, silicon, silicon carbide, and aluminum nitride. '& When the plating material is a soft metal, a harder material can be subsequently deposited to retain the roughness of the surface print pattern, such as, for example, tungsten carbide, titanium nitride, diamond, or diamond-like carbon. -17- (12) (12) 200302537 Another method of making the abraded surface feature is to deposit on the surface of the substrate a powder, particle, granule or crystalline form of any of the above materials. The powder, particles or granules of the applied material are usually mixed with a matrix material 'and then applied to the surface of the substrate. It is also possible to grow a crystal of the #t material on the surface of the substrate to prepare an abrasive surface of the substrate. Other methods of manufacturing abrasive surface features of abrasive substrate layers include, but are not limited to: photolithography, use of discharge machine (EDM), laser etching, electroplating, sandblasting, chemical etching, molding, relief, ion sharpening, electrolytic deposition and The above examples of the method of ablating the abrasive surface on the substrate are not intended to limit the present invention. Those skilled in the art will appreciate that any method of making an abrasive surface on a substrate is applicable to the present invention. B. Adhesive gel layer / material The adhesive gel layer of the present invention is the first cleaning layer inserted by the probe tip. The cleaning layer is self-healing (that is, the hole formed by the probe tip is sealed when the probe tip is removed), and when the probe tip is inserted into and / or from the adhesive gel layer When taken out, the adhesive gel material will not stick to the tip of the probe. § The adhesive gel layer contains a mixture of: (a) a silicone resin having Formula I:

-18- (13) (13) 200302537 where R !, R2, R3, 114 and R5 are each selected from hydrogen Cu alkyl, C! .6 haloalkyl, vinyl or Cu propylene alkoxyalkyl, and R !, At least one of R2, R3, R4 and R5 is a vinyl group; D is selected from the group consisting of -〇-, -S-,-(CH2) rCH2-,-(CH2) rCH2〇-, and -〇 (CH2) rCH2- A bivalent bond, where ι · single is an integer from 0-10; and η and m are each an integer from about 0 to 1,000, where the sum of m and η is not less than about 10; and (b) —a kind of cross-linking A compound selected from: (i) a compound having formula 11:

Among them, r ,,, r2 ,, r3 ,, r4 ,, r5 ,, m 'and η' are each selected from the group defining R !, R2, R3, R4, R5, m and η, but their prerequisites are Is the absence of a vinyl group; or (ii) a compound of formula III:

Among them: R6, R7, R8, R9, Ri. And Rh are each selected from: hydrogen, Cm. Alkyl, Cl-20 haloalkyl, phenyl, or Cm0 alkylphenyl; -19- (14) (14) 200302537 p and q are each an integer from 0 to 800; D is selected from a single bond,-( CH2) rCH2-,-(CH2) rCH2〇-or

R

I

Si-〇

Among them, t is an integer from 0 to 10, and R is selected from Cl.2Q alkyl and Ci.2. Halogenated academic, phenyl or CV1. A phenyl group; and s is an integer from 0 to 800; and (c) a catalyst; in addition, wherein: the chain length of the silicone-based resin defined by the sum of m and η 値 in formula I is constant Greater than the chain length of the cross-linked compound defined by the sum of nV and η ′ 値 in formula II or the sum of p, q, and s 式 in formula πI. Alternatively, the adhesive gel layer can also be defined as a composition comprising a mixture of: (a) a resin based on a ketone ketone having a viscosity from about 2000 to 10,000 centipoise (cps); (b) a cross-linked compound having a viscosity from about 2 to 100 cps; and (c) a catalyst. The silicone-based resin chain length (i.e., size) is usually defined by the sum of Formula I-20- (15) (15) 200302537 m and η 値. Similarly, the size of the cross-linked compound is defined by the sum of m 'and η' 値 in the formula π, or by the sum of p, q, and s 値 in the formula II. Generally, in order to obtain the characteristics of the auto-recovery of the adhesive gel layer and non-adhesion to the probe tip, the chain length of the silicone-based resin is constant greater than the chain length of the cross-linking compound. The length of the silicone-based resin that meets this condition is equal to the length of the cross-linking compound, and any ratio that provides the self-healing property of the adhesive gel layer and the feature of not sticking to the probe tip is within the scope of the present invention. Inside. The representative non-limiting ratio of the length of the silicone-based resin to the length of the crosslinking compound is about 10: 1. Other ratios are applicable, but the prerequisite is that the resulting mixture will produce an adhesive gel layer with the characteristics described above. These characteristics can also be obtained by mixing the silicone-based resin with a crosslinking compound having the above-mentioned representative viscosity. 1. Silicone-based resin The compound of formula I is a long-chain polysiloxane polymer resin. Applicable long-term repair The viscosity of the chain polysiloxane polymer at room temperature must be from about 2000 to 10.0 cps, and the glass transition temperature is lower than about minus 65 ° C. Therefore, n and m 値 are selected so that the formed compound conforms to the required viscosity of the long-chain polysiloxane polymer resin. Generally, for a long-chain polysiloxane polymer, the sum of η and m 値 is not less than about 10. The sand-based resin is also quite pure, with low-molecular-weight pollutants not exceeding about 1%, and degassing being less than about 0.5%. This purity water accurately allows no contaminants to remain on the probe tip -21-(16) (16) 200302537 when the probe is removed from the gel. The present invention can use any silicone-based resin of formula I corresponding to the above-mentioned needs. Examples of suitable polysilicon substrate materials include, but are not limited to, Dow Corning 93-500, GE RTV567 (General Electric), PS444 and PS802 (United Chemical Technologies). 2. Cross-linking compound The cross-linking compound is a hydroxysiloxylated compound substituted with a monomer alkyl group, or a hydroxysilane oligomer resin having a short to medium chain length. For short-to-medium chain hydroxysilane oligomeric resins, the room temperature viscosity must be from about 2 to 100 cps. Therefore, for Formula II, P, q and s 値 are selected according to the desired viscosity range of the crosslinked compound. Generally, for short to medium chain long oligomeric resins, the sum of P, q, and s 値 is not greater than about 800. Suitable cross-linking compounds may be selected from, but not limited to, polymers and / or copolymers of PS 123 and PS 542 (United Chemical Technologies), methyl hydrogen-dimethylsiloxane, and hydroxysiloxane. φ This silicone-based resin, cross-linking compound and catalyst react to form the required gel characteristics of an adhesive gel layer. These features include a wide range of self-healing properties, tackiness, adhesion, stiffness, purity and operating temperature. Various components of the mixture can be added to the gel-forming reaction mixture 'or the catalyst can be combined with a cross-linking compound before polymerization with a silicone-based resin. The catalyst may be any catalyst known to those skilled in the art for curing resins, polymers, and the like. The curing catalysts suitable for the present invention include, but are not limited to,-22- (17) (17) 200302537 for platinum-containing catalysts. The amount of cross-linking compound mixed with the polysiloxane as the substrate material controls the desired characteristics of the adhesive gel layer formed. Therefore, one or more of the above-mentioned gel characteristics can be customized by controlling the amount of the crosslinking compound. According to an example of the present invention, a crosslinker is added to the polysiloxane as a substrate material from about 2.0 to 5.0% by weight to achieve the desired gel characteristics. It is preferable to add a crosslinking agent from about 2.0 to about 3.0% by weight of the polysiloxane as the substrate material. If the amount of the cross-linking compound added to the silicone-based resin is less than about 2.0% by weight, the gel may be transferred to the probe tip when the probe tip comes in and out of the adhesive gel layer. In addition, if the amount of the crosslinking agent added to the silicone-based resin is more than about 5.0% by weight, the gel is usually too hard to clean the probe tip. The self-healing property of the adhesive gel layer is generally defined as the ability of the gel to automatically close the holes formed by the probe tip when the probe is removed from the gel. Generally, when the probe is inserted into an adhesive gel layer, the gel material is eliminated, thereby creating holes. When the probe is removed, the excluded gel flows back into the hole. The hole is preferably closed within a few seconds, so the gel flowing back into the hole fills the hole, and its thickness is not less than 50% of the original gel thickness. The 90 degree foil peel test was used to determine the adhesion of the gel layer. For this test, a piece of aluminum foil (Γ X 3 ") was laminated on the gel, and its unpolished surface was in contact with the gel. The foil was attached to a splint, and the code of the splint was increased so that The splint with increased code peels off the foil from the gel at a 90 degree angle. The code is added to the splint until the peel rate reaches 2 inches / minute. The total code recorded at this rate is the gel Adhesive-23- (18) (18) 200302537. The applicable adhesive force of the adhesive gel material of the present invention is in the range of about 0.10 to 100 g / inch. The purity of the gel layer is determined by The quantity of the cured gel product is defined as outgassing. The outgassing percentage of the cured adhesive gel layer suitable for the present invention must be less than 0.5% by weight of the total mass of the gel, which is based on the American Society for Testing of Materials (ASTM) method E595. The operating temperature range of this adhesive gel layer is from about minus 40 ° C to 15 ° C. Within this temperature range, the above characteristics of the adhesive gel layer must be changed very much. With little or no significant change. The thickness of the adhesive gel layer is usually slightly less than The corresponding length of the surface or range of the probe tip. Therefore, this is the case where the probe tip can penetrate the adhesive gel layer and contact the underlying abrasive substrate layer. Generally, the length of the probe tip to be cleaned From about 1 to 250 μηι. Therefore, the thickness of the adhesive gel layer is less than about 1 μηι to about 200 μΐΏ. 3. Orientation of the components According to the second aspect of the present invention, the cleaning device The viscous gel layer (100) is prepared by attaching to the abrasive surface of a homogeneous abrasive uranium substrate (1 丨 〇) or the abrasive surface layer of a heterogeneous abrasive substrate (1 40). The pre-formed gel layer can be prepared by Transfer to the surface of the abrasive substrate, or directly coat the silicone-based resin / crosslinker / catalyst mixture on the abrasive surface of the abrasive substrate layer to form a gel layer on the surface of the abrasive uranium substrate The adhesive gel layer is attached to the abrasive substrate layer (1 1 0,1 40). (19) (19) 200302537 Generally, the space structure of the cleaning device of the present invention is flat, and it can be further described as Abrasive substrate layer (110,140) with adhesive gel layer (1 00) "pad" as shown in Figures 1A and 1B. In another example of the present invention, the pad can also form an interlaced region with an adhesive gel layer and an abrasive substrate layer. Figure 3 shows the cleanliness of the present invention. A perspective view of the device pad, wherein the pad has a region of adhesive gel material (100), which is separated by an abrasive surface (120) on the exposed surface of the abrasive substrate layer (110). The abrasive substrate layer (110) is a homogeneous abrasive substrate layer (110). However, such a structure can also be prepared by using a heterogeneous abrasive substrate layer (140) shown in FIG. 1B. Both the homogeneous and heterogeneous structures can be selectively laminated on the protective substrate (130), as shown by the dashed lines in FIG. In addition, as shown in Fig. 3, the ground uranium surface of the pad has a groove-like pattern, in which these are discharged from the front to the rear of the pad. This pattern is only a representative structure. The trough-like abrasion can also be discharged from one side of the pad to the other (ie, from left to right). During this construction, move the probe tip in the area of the cleaning pad along the alignment of the groove. As such, the tip of the probe moving in the abrasive surface area of the pad typically moves in a single direction. Or 'for the cleaning pad (or FIG. 1A or 1B) of the structure shown in FIG. 3, the abrasive surface characteristics of the abrasive substrate layer (1 10, 1 40) may also be selected from ridges, pillars, ridges, or Roughness formed by sedimentary powder, particles, granules or crystals. In this aspect of the invention, the movement of the probe tip on the abraded surface is a multi-directional movement. In general, multi-directional movement can be obtained from abrasive surface features that do not limit the movement of the probe tip to a single direction. In this concept, the phrase “without limitation on the movement of the probe tip” means any movement that may be damaged by the probe tip, as recognized by those familiar with the technology -25- (20) (20) 200302537. . When the surface abrasion substance of the abrasive substrate layer (110, WO) is, for example, bumps, columns, and / or ridges, if the abraded surface has the same hardness as the probe tip, the vertex and / or edge of the surface abrasion substance constitutes Sharp shapes are preferred. Conversely, 'if the hardness of the surface abraded material of the abraded substrate is greater than the hardness of the tip of the probe', it is preferable that the vertex and / or edge of the surface abraded material form an arc shape. These constructions improve cleaning efficiency and also protect the probe tip from damage during cleaning. Φ FIG. 4 depicts another example of the cleaning device of the present invention, in which an elastomer is used as a substrate material (4 1 0) is laminated on a substrate layer (1 4 1), in which abrasive particles (420) are dispersed and dispersed The elastic body is supported on the substrate material (410). The substrate layer (丨 4 丨) may be any material of the abrasive substrate layer (110,140) discussed above. An adhesive gel layer (ιOO) was laminated on the upper surface of the elastomer as a substrate material (4o). The elastic body is a substrate material (4 1 0) can be any material capable of carrying abrasive particles, and is compliant so as not to damage the probe when the probe tip is inserted into the elastic body as the substrate material (4 1 0). Probe tip. A suitable non-limiting elastomer is a substrate material, which may be polysiloxane as a substrate rubber material. The abrasive particles (420) can be made from any of the materials described above, which are suitable for producing abrasive surfaces, such as metals, alloys, composite compounds, or natural materials. The form of the ground uranium particles may be powder, granules, crystals, or any form suitable for providing abrasive characteristics. With regard to any of the above-mentioned structures of the present invention, a removable protective film can also be covered on the surface of the adhesive gel layer, which can be used in the present cleaning equipment-26- (21) (21) 200302537 Move away before placing. ΠΙ. Method for manufacturing a cleaning device According to a second embodiment of the present invention, as shown in FIG. 5, the first preparation step of the cleaning device is to mix a certain amount of silicone-based resin with about 2- 5% by weight of the cross-linking compound and a certain amount of catalyst (520) are mixed. The catalyst can be added separately or mixed with the crosslinking compound before mixing with the silicone-based resin. In the second step, the formed resin / crosslinker / catalyst mixture is coated on a temporary substrate (54 and 5 50) to be converted into the abrasive substrate layer (554), or it can be directly coated On the surface of abraded substrate layers (540, 560, and 570). When using a temporary substrate (5 50), suitable temporary substrates include but are not limited to glass or polyethylene terephthalate (PET) film. The mixture is applied on one of the substrates using conventional techniques including, but not limited to, transfer coating, spray coating, casting, extrusion, or doctor blade coating. When one of the temporary substrate or the abrasive substrate is coated with a mixture of a desired thickness, the mixture is cured in a third step (552 or 580). The curing method may be any method suitable for curing a resin / crosslinking agent / catalyst mixture. Examples of suitable curing methods include, but are not limited to, heat curing, light curing, or a combination of heat curing and light curing. If the resin / crosslinking agent / catalyst mixture based on the ketone ketone is left at room temperature for at least 48 hours, it has an auto-recovery property. When using thermal curing, the appropriate curing temperature range is from above room temperature to about 150 t, and the duration is from about 0.5 hours to about 48 hours. In general, this curing time is inversely proportional to the curing temperature 'and therefore the time required at a lower curing temperature is shorter. -27- (22) 200302537 After chemical conversion, (5 54), the needle tip is similar to the gel. Normal amount% 〇 In this step,. In this step, when the range of the pure gel layer after the solidification is obtained, the range of the pure gel layer is about 5 30). When the gel layer is prepared on the temporary substrate (5 50), the gel is solidified from the gel. The temporary substrate removes the gel and transforms into an abrasive surface that abrades the substrate layer. The adhesiveness of the gel layer has sufficient adhesion characteristics. The gel layer is fixed on the surface of the abrasive substrate. In the case where the ground uranium substrate is of the same phase material as the exploration system, an additional adhesive layer must be applied to fix the layer on the surface of the ground substrate. Suitable additional adhesive layer can be described as resin / crosslinker / catalyst mixture, but its crosslinker concentration is low. The crosslinker concentration of this additional adhesive layer is from about 0.5 to 2.0 After curing on the surface of the substrate, the fourth step is to purify the formed laminate by heat treatment (5 5 6 or 5 8 2). During the step, outgassing occurs, which removes impurities from the gel. This step is an optional step followed by curing by increasing the temperature, or by continuously curing to the extent required to produce the cured product. However, it is better to increase the temperature under heat. The chemical reaction is usually carried out under a full or partial vacuum, and the bubbles formed in the adhesiveness have the least or no bubbles. A suitable purification temperature is about 100 ° C to 180 ° C 'for about 1 to 100 hours. Purification is performed at atmospheric pressure to a pressure of 0.001 Torr. Purification is measured according to the American Society for Testing Materials (ASTM method). The gel layer suitable for the present invention has a degassing percentage of less than about 0.5% by weight of the gel layer. To the cleaning device of FIG. 3 At this time, the abrasive substrate can be prepared as described above (after the abrasive surface is formed on the substrate, for example, the adhesive -28- (23) (23) 200302537 sex gel material (100) can be directly coated on the abrasive surface of the substrate And use a light-defining step (5 7 5) to form a wiring pattern. The light-defining step is a partial curing step that defines the pattern of the adhesive gel layer on the substrate. The light-defining step can use, for example, a mask, or Any other suitable tool familiar to those skilled in the art to define a pattern on a substrate is performed. After the light definition step is completed, the uncured resin (576) is removed by, for example, washing, and the remaining resin (5 8 0) is cured again, It is then purified (5 8 2). According to this example, a row of adhesive gel material (100) is placed on the surface abrasion (1 2 0) on the surface of ground uranium. In another example, the adhesive can be coagulated. Glue material column (1 〇 ) Is partially embedded in the surface of the ground uranium substrate (110). As for this structure, the ground substrate layer is prepared as described above (530). Generally, the formed abrasive base layer (1 110) is subsequently ) Carry out the following steps: (i) forming grooves or grooves on the surface of the ground uranium substrate (1 10); (ii) forming an adhesive gel (1 10) coating (540) on the surface of the ground substrate, Fill up the grooves or grooves generated; (Hi) For example, 'through the mask corresponding to the groove-shaped area of the abraded substrate, light-defining adhesive glue material (5 7 5); (iv) remove uncured Adhesive gelatin i # material (57 6); (v) the remaining part of the cured adhesive gel material ^ (580); and (vi) purified cured adhesive gel material (5 8 2). Alternatively, before coating the silicone-based resin / crosslinker / catalyst mixture on the substrate surface (540), a photosensitive compound can be added to the & mesh mixture (5 1 0 , 5 20). By adding certain compounds, @ t U 5 ketone-based resin mixture can be made photosensitive, these compounds include -29- (24) (24) 2003 02537 Contains, but is not limited to, acrylic or methacrylic polymer-containing compounds, such as (acrylic acidoxypropyl) methylsiloxane-dimethylsiloxane (PS802,

United Chemical Technologies) in an amount of about 0.5% to 60% by weight of the silicone resin. A photo-starter such as dimethoxyphenylacetophenone may be added to the silicone-based resin mixture in an amount of about 1.0 to 5.0% by weight based on the silicone-based resin. IV. Method for cleaning the tip of a probe The breaks generated during the test of a semiconductor wafer are characterized by loosely adhered fragments or tightly adhered fragments. Non-limiting examples of loose fragments include fragments that change from the surface of the die to the sides of the probe tip while the probe tip moves with the test wafer. Non-limiting examples of fragments that adhere tightly to the probe include fragments that are alloyed (i.e., melted) with the probe. The alloyed fragment may be formed by melting the pad material (from the wafer under test) with the probe tip. This type of fragment has a stronger attachment interaction than a loose fragment normally attached to the side of the probe tip. @ The cleaning device of the present invention is quite suitable for removing these two fragments in a single cleaning cycle (ie, inserting the probe tip into the cleaning device and removing it there). Generally, when the probe tip is inserted into the adhesive gel layer, the adhesive gel layer removes loose fragments (typically located on the side of the probe tip). When the probe tip passes through the ground uranium surface of the ground uranium substrate, the fragment that is more closely attached to the probe is usually loosened or removed. If these fragments are removed by abrading the surface of the substrate, the fragments may remain at or near the interface between the abrasive surface and the adhesive gel layer. If the fragment is only loose and has not been removed by -30- (25) (25) 200302537 over-abrasive surface of the substrate, the adhesive gel layer can be self-adhesive gel at the tip of the probe Remove the loose fragments when the layer is pulled out. Thus, according to the third example of the present invention and as shown in Figs. 6a to 6d, a method of cleaning the probe tip is completed. Since several probe tips are attached to a probe card, they are usually cleaned at the same time. Usually, as shown in Figs. 6a and 6b, one or more probe tips (600) with attached fragments are pressed into and passed through the adhesive gel material (100), so they are brought into contact with the ground uranium substrate. The layer (110) is in contact. When in contact with the surface of the abrasive substrate layer (110), the probe tip (600) is moved in the X-plane (that is, the natural wiping direction), and is selectively moved in the Y-plane. This X movement will make a sound to some extent, in order to make the surface abrasion object remove the fragment (61 1) attached to the probe tip (601), as shown in FIG. 6c. Due to the self-healing nature of the adhesive gel layer (100), X movement of the probe tip will not cause unacceptable damage to the gel layer. Then, remove the probe tip (6 01) from the cleaning device. When the probe tip was taken out from the gel layer (100), the probe tip was pulled out of the gel in the Z-axis direction, so it was loosened by the ground uranium surface of the substrate but still attached to the probe tip's fragment (6 1 2) It will adhere to the adhesive gel layer. In this way, the probe tip (60 1) pulled out from the adhesive gel material does not have any adhesive gel material, nor does it have any fragments. The probe tip penetrates into the gel layer and is taken out of the gel layer to form a cleaning cycle. The cleaning method of the present invention is not limited to a specific cleaning cycle number. This cleansing method can be repeated as many times as the person thinks necessary. Generally, this cycle can be repeated about 1 to 1000 times. If more than one (26) (26) 200302537 cleaning cycle is required, the probe tip may not necessarily penetrate into the same position as it did the first time. After the gel layer is retracted, one of the cleaning devices or probe tips can be moved so that it can then penetrate into the unused area of the adhesive gel layer. In an alternative example, the method of cleaning the probe tip of FIG. 6 described above may be modified so that the probe tip performs a cleaning action without contacting the abrasive surface (120) of the abrasive substrate. In this example, the tip of the probe penetrates the surface of the adhesive gel layer (100), but does not touch the abrasive surface. X-movement is performed through the adhesive gel layer, and then the probe is removed from the adhesive gel layer Tip. The cleaning device having the configuration described in FIG. 3 is cleaned according to FIGS. 7A and 7B and can be used to clean one or more probe tips of the present invention. This structure is very suitable for cleaning spring-type probe tips, such as F ο 1 · m F a c t ο 1 ·, I n c. Generally, as shown in FIG. 7A, one or more probe tips (700) of the attachment fragment (7 1 0) are brought into contact with one or more adhesive gel layer regions (100), and then X The plane (7 1 0) moves. The fragment (7 1 1) is loosened and adheres to the adhesive gel layer (100). The probe tip is removed from the adhesive gel layer (100), and then positioned on the abrasive surface of the abrasive substrate (110) immediately adjacent to the adhesive gel layer (100). As shown in FIG. 7B, the probe tip (702) is then brought into contact with the surface abrasion object (120) of the abrasive substrate (110), and straddles the substrate surface in the X direction (703). As a result of this movement, the fragment (712) stuck to the probe tip (702) is expelled. Then, the probe tip is removed from the surface of the substrate (703). The cleaning cycle can be repeated as many times as necessary, in which the probe tip can alternately contact the abraded surface of the gel region and the substrate. Therefore, the tip of the probe passed through the surface of the cleaning device during the -32- (27) (27) 200302537 cleaning cycle, with each cycle passing through a different area. When the probe tips are arranged in an array on the probe card, a cleaning effect can be performed, so that one or more rows of probe tips are brought into contact with the adhesive gel layer (100), while one or more rows of probe tips are brought into contact. In contact with the abrasive surface of the abrasive substrate layer. During the cleaning cycle, the starting positions of the probe tips of each column are alternately located in the gel zone (100) and the surface abrasion (120), and several times as needed to achieve the required cleaning level. Φ Figure 8 describes the method for cleaning the probe tip when using the cleaning device of Figure 4. In this example, a probe tip (800) with a fragment (8 1 0) is inserted into the adhesive gel layer (1 00). The adhesive gel layer adheres to some fragments (8 1 1), and removes these fragments from the probe tip (80 1). Push the probe tip (801, 802) through the adhesive gel layer (100) and enter the elastomeric resin layer (4 1 0) containing abrasive particles (420). When the probe tip comes into contact with abrasive particles, this contact removes additional fragments (8 1 2), which remain in the elastomeric resin layer (41 0). When the probe tip (802,803) is pulled out from the layers 41 0 and 100 respectively, when the probe tip (803) exits the layer (100), the residue (8 1 4) is removed due to the adhesive gel layer. Any fragment (8 1 3) on the probe tip (8 02). Those skilled in the art may also repeat the cleaning cycle of the invention as often as necessary. In this embodiment of the present invention, as long as the probe tip is within the adhesive gel layer (100), it is possible to move the probe tip in the X plane. Due to the rigidity of the elastomer layer and the substrate particles abraded therein, movement within the elastomer resin layer is usually limited to the Z plane. -33- (28) (28) 200302537 The cleaning device of the present invention and the probe card can be packaged into a set of appliances. The kit includes the cleaning device and a probe card of the above-mentioned example of the present invention. Figure 9 shows the capability of the cleaning device of the present invention, such as the cleaning probe tip described above. FIG. 9A shows the probe tip before cleaning with the cleaning device of the present invention. FIG. 9β shows the probe tip of FIG. 9A after cleaning with the cleaning device of the present invention, which includes Dow Corning 93-500 silicone resin mixed with 2.5% cross-linking compound, which is a low molecular weight dimethyl and Hydrogen methyl polysiloxane. Although specific examples of the present invention have been described, it should be understood that they are merely examples and are not intended to be limiting. Those skilled in the art will understand that without departing from the spirit and scope of the invention as defined by the scope of the appended patent application, various changes can be made in form and detail. Therefore, the scope and scope of the present invention should not be limited to the above-mentioned exemplary examples, but should be defined by the scope of the patent application below and its equivalents. All references cited in this disclosure are incorporated herein by reference in their entirety. [Schematic description] Figure 1 A shows a homogeneous cleaning device. FIG. 1B shows a heterogeneous cleaning device. Fig. 1C shows a cleaning device 'having a cohesive gel layer on its reel and extending across the abrasive surface of the ground uranium substrate. Figure 2 depicts details of the surface of the abrasive substrate relative to the probe tip. Fig. 3 shows a cleaning device having a staggered area of an adhesive gel material and an abrasive surface. -34- (29) (29) 200302537 Fig. 4 shows an adhesive gel layer laminated on an elastic resin layer embedded with abrasive particles. Fig. 5 shows a method for manufacturing a cleaning device according to the present invention. Figures 6A-6D show a method of cleaning the tip of a probe using the homogeneous cleaning device of Figure 1A. 7A and 7B show a method of cleaning the probe tip using the cleaning device of FIG. FIG. 8 shows a method of cleaning the probe tip using the cleaning device of FIG. 4. 9A and 9B show the probe tip before and after cleaning with the cleaning device according to the embodiment of the present invention. [Comparison table of main components] 130 protective layer 11 0 abrasion substrate layer 100 adhesive gel layer 120 protrusion 140 abrasion substrate layer 1 4 1 substrate layer 1 4 2 abrasion layer 1 5 0 reel 105 cleaning device 160 pressure plate 1 7 0 Roller 180 Probe Card -35- (30) (30) 200 302 537 1 8 5 Probe tip 1 9 0 Roller 200 Probe tip 4 1 0 Material based on elastomer 420 Abrasive particles 600 Probe tip 6 1 0 fragment 611 fragment 601 probe tip 700 probe tip 7 1 0 fragment 7 1 1 fragment 702 probe tip 703 probe tip 800 probe tip 8 1 0 fragment 8 1 1 fragment 8 0 1/8 0 2 probe Tip 8 1 2 Fragment 8 1 3 Fragment 5 1 0 Add selective photosensitizer 520 Mix silicone resin with cross-linking agent and catalyst 5 3 0 Prepare ground uranium substrate 540 Apply the mixture to the substrate (31) (31) 200302537 5 5 0 temporary substrate 5 60 homogeneous substrate 570 heterogeneous substrate 57 6 removal of uncured resin mixture 5 5 2 curing 5 80 curing 5 8 2 purification 5 7 5 selective light definition 5 54 curing mixture (adhesive gel transformation Into abrasive substrate 5 5 6 purification

Claims (1)

200302537 Patent application scope 1. A probe cleaning device for cleaning the end portion of a probe, and the probe is used to test a semiconductor wafer. The probe cleaning device includes: (i) an abrasive substrate Layer; and (ii) an adhesive gel layer, wherein the adhesive gel layer is in contact with the abrasive surface of the abrasive substrate; the adhesive gel layer comprises: (a) a silicon having formula I Ketone-based resin: R4- SiH-O—Si-) irD-(-Si-0 ^ -Si ——R4 R5 Me Me R5 where: R], R2, R3, R4 and R5 are each selected from hydrogen, Cu alkyl, Cu haloalkyl , Vinyl or CV6 acryloxyalkyl, and at least one of Ri, R2, R3, R4 and r5 is vinyl; D is selected from _〇-, -S-,-(CH2) rCH2-,- (CH2) rCH2〇- and-〇 (CH2) rCH2- are divalent bonds, where ι · is an integer from 0 to 10; and η and m are each an integer from 0 to 1,000, where: The sum of m and η is not less than about 10; and (b) a cross-linking compound selected from: (i) a compound having formula II: Rc. Xo-L Me R2 'r3 · II • D — (- Si—〇j ^ r-Si — Me R5 · -38- (2) (2) 200302537 Among them, Rr, R2 ,, R3 ,, R4 ,, R5 ,, m, and W are each selected from the definition of R described above, A group of R2, R3, R4, R5, m and n, but its prerequisite is the absence of an ethyl group; or (u) a compound of formula III: Where = R6, R7, R8, R9, R〗. And R11 are each selected from the group consisting of ammonia, Cl-2 0 alkyl, Cm haloalkyl, phenyl, or alkyl phenyl; P and 0 are each an integer from 0 to 800; T is selected from a single bond, -(CHO, CH2- '-(CH2) rCH2〇- or RI ——Si-〇 一 「丨 1 〇I Me Si--Me 〇I Me-Si-Me I Me Where t is from 0 to 10 The integer 'R is selected from Cl-2. Academic base, Cl-2. Haloalkyl, phenyl, or Cmoalkylphenyl; and s is an integer from 0 to 800; and (C) a catalyst; further, wherein : -39- (3) (3) 200302537 The chain length of the polysilicone-based resin defined by the sum of m and η 値 in formula I is greater than the sum of m 'and η' 値 in formula II or formula II The chain length of the cross-linked compound defined by the sum of p, q, and s. 2. The probe cleaning device according to item 1 of the patent application scope, wherein the abrasive substrate layer is selected from transition metals, metal alloys, Composite compounds or materials made of natural materials. 3. The probe cleaning device of item 2 of the patent application scope, wherein the abrasive surface of the abrasive substrate layer includes powder, particles, particles or crystals. 4. The probe cleaning device according to item 3 of the patent application, wherein the abrasive substrate layer is homogeneous or heterogeneous. 5. The probe cleaning device according to item 2 of the patent application, wherein, the The transition metal is selected from the group consisting of copper, nickel, palladium, tungsten, rhenium, rhodium and cobalt. 6. The probe cleaning device according to item 2 of the patent application scope, wherein the metal alloy is selected from the group consisting of palladium / A group consisting of copper, molybdenum / chromium and titanium / tungsten. 7. The probe cleaning device such as the second item of the patent application scope, wherein the composite compound is selected from the group consisting of tungsten carbide, silicon carbide, silicon nitride, A group consisting of silicon oxide, aluminum nitride, aluminum oxide, chromium oxide or titanium nitride. 8. The probe cleaning device according to item 2 of the patent application scope, wherein the natural material is selected from silica, oxide A group consisting of aluminum, diamond, or diamond-like carbon. 9. The probe cleaning device according to item 2 of the scope of patent application, wherein the abrasive substrate layer has surface abrasions, which are: 40- (4) (4) 200302537 layer, uranium engraving, embossing It is made by one or more of the methods of cutting into the surface of the substrate, molding or sputtering. 10. The probe cleaning device according to item 9 of the patent application scope, further comprising a staggered adhesive gel layer and an abrasive surface. 11. The probe cleaning device according to item 10 of the patent application range, wherein the staggered area of the adhesive gel layer is located on the abrasive surface of the abrasive substrate 'or the parent fault of the adhesive gel layer The area is partially buried in the ground uranium substrate 1 2. The probe cleaning device according to item 2 of the patent application scope, wherein the ground substrate layer has an abrasive surface containing dendritic pattern abrasives. 1 3. The probe cleaning device according to item 12 of the application, wherein the dendritic pattern grinding uranium is the same material as the abrasive substrate, and the material is a transition metal. 14. The probe cleaning device according to item 13 of the patent application scope, wherein the transition metal is selected from the group consisting of copper, nickel, palladium, tungsten, chain, germanium, and cobalt. _ 15, such as the probe cleaning device of the scope of application for patent No. 14, in which the transition metal is copper. 16. The probe cleaning device according to item 14 of the scope of application for patent, wherein 'the dendritic pattern grinding uranium substance further comprises a coating of a harder material, wherein the Shai coating has the same structure as the dendritic abrasive substance. The construction. 17. The probe cleaning device according to item 16 of the application, wherein ‘the harder material is selected from tungsten carbide, titanium nitride or diamond. 18. The probe cleaning device according to item 1 of the scope of patent application, in which, -41-(5) 200302537 Formula I 1000 D is R3, R4 should be transferred, the formula is A, and the transfer is 800. The total sum of T and R6 resins based on ketone ketones and η is from about 1 q to 〇9, such as the probe cleaning device of the first scope of the patent application, wherein, oxygen. 20. The probe cleaning device according to item 1 of the scope of patent application, in which vinyl is used. 21. The probe cleaning device such as the scope of application for patent No. 20, in which one or both of R5 and R5 is a methyl group. 22. The probe cleaning device according to item 1 of the patent application scope, wherein the compound has formula II. 23. The probe cleaning device according to item 22 of the application, wherein the silicone-based resin has Formula I and R3 is a vinyl group. 24. For example, the probe cleaning device of the scope of application for patent No. 22, wherein I is one of R4 and R5 of resin based on sand, or both. 25. The probe cleaning device according to item 22 of the application, wherein the silicone-based resin has formula I and D is oxygen. 26. For example, the probe cleaning device according to item 1 of the patent application, wherein the compound has formula III, and the sum of ρ and q is from about 0 to 27. For example, the probe cleaning device according to item 26 of the patent application , Which is a single bond. 28. For example, the probe cleaning device of the scope of application for patent No. 26, wherein R7, R9, R10, R10 and R11 are methyl groups. -42- (6) (6) 200302537 29. A probe cleaning device for cleaning the end portion of a probe, and the probe is used to test a semiconductor wafer. The probe cleaning device includes: ( i) an abrasive substrate layer; and (ii) an adhesive gel layer, wherein the adhesive gel layer is in contact with the abrasive surface of the abrasive substrate; the adhesive gel layer includes: (a) -A kind of vinyl siloxane containing a silicone-based resin, the viscosity of which is from about 2000 to 10,000 cps; and (b)-a kind of hydroxy siloxane containing a cross-linking compound, the viscosity It is from about 2 to 1000 cps, wherein the cross-linking compound does not contain a vinyl group; and (c) a catalyst. 30. The probe cleaning device according to item 29 of the application, wherein the abrasive substrate layer is composed of a material selected from transition metals, metal alloys, composite compounds, or natural materials. 3 1. The probe cleaning device according to item 30 of the patent application scope, wherein the abrasive surface of the abrasive substrate layer includes the material in the form of powder, particles, granules or crystals. 3 2. The probe cleaning device according to item 31 of the patent application scope, wherein the abrasive substrate layer is homogeneous or heterogeneous. 3 3. The probe cleaning device according to item 29 of the patent application scope, wherein the transition metal is selected from the group consisting of copper, nickel, metal, tungsten, rhenium, money, and Ming. 34. The probe cleaning device according to item 29 of the application for a patent, wherein the metal alloy is selected from the group consisting of palladium / copper, brocade / chromium and titanium / tungsten-43- (7) (7) 200302537 35 'The probe cleaning device according to item 29 of the patent application range, wherein' the gastrointestinal compound is selected from the group consisting of tungsten carbide, silicon carbide, silicon nitride, dioxin ft 0 'Mt aluminum, alumina, chromium oxide or A group of titanium nitride. 36 'The probe cleaning device according to item 29 of the patent application range, wherein the material is selected from the group consisting of silica, alumina, diamond, or diamond-like carbon. 37 'The probe cleaning device according to item 29 of the patent application scope, wherein' the abraded substrate layer has a surface abrasion substance, which is composed of: surface roughening, plating, etching, embossing, cutting into the substrate surface, molding or sputtering Prepared by one or more of these methods. 38. If the probe cleaning device according to item 37 of the patent application scope, it also contains the staggered area of the adhesive gel layer and the abrasive surface. 39. The probe cleaning device according to item 38 of the application, wherein the staggered area of the adhesive gel layer is located on the abrasive surface of the ground uranium substrate, or the staggered area of the adhesive gel layer is local The probe cleaning device buried in the ground uranium substrate 40, such as the 29th scope of the patent application, wherein the ground substrate layer has a ground uranium surface including a dendritic pattern ground uranium. 4 1. The probe cleaning device according to item 40 of the patent application scope, wherein the dendritic pattern abrasive is the same material as the ground uranium substrate. The material is a transition metal. 42. The probe cleaning device according to item 41 of the application for a patent, wherein the transition metal is selected from the group consisting of copper, nickel, palladium, tungsten, chain, germanium, and cobalt -44-(8) (8) 200302537 Group. 43. The probe cleaning device according to item 42 of the patent application, wherein the transition metal is copper. 44. For example, the probe cleaning device of the scope of application for patent No. 40, wherein the dendritic pattern abrasive article further comprises a coating of a harder material, wherein the coating layer has the same structure as the dendritic abrasive article. . 45. The probe cleaning device according to item 44 of the application, wherein ‘the harder material is selected from tungsten carbide, titanium nitride or diamond. 46. The probe cleaning device according to item 2 of the application, wherein the abrasive substrate layer is homogeneous and contains a single material having an abrasive surface. 47. The probe cleaning device according to item 46 of the application for a patent, wherein the abrasive substrate is applied on the protective substrate. 48. The probe cleaning device according to item 2 of the patent application scope, wherein the abrasive substrate layer is heterogeneous and includes: (a) a first layer of material, and (b) a second layer of material having an abrasive surface, This material is different from the first layer. 49. The probe cleaning device according to item 1 of the patent application scope, wherein the adhesive gel layer has auto-recoverability. 50. The probe cleaning device according to item 29 of the patent application scope, wherein the adhesive gel layer has an auto-recovery property. 5 1. The probe cleaning device according to item 1 of the scope of patent application, wherein the adhesive gel layer comprises from about 2.0 to 5.0% by weight of a crosslinked compound (9) (9) 200302537. 5 2. The probe cleaning device according to item 51 of the application for a patent, wherein the adhesive gel layer comprises from about 2.0 to 3.0% by weight of a cross-linked compound. 5 3. The probe cleaning device according to item 1 of the scope of the patent application, wherein the catalyst is a curing catalyst. 54. The probe cleaning device according to item 53 of the patent application scope, wherein the curing catalyst is a platinum-containing catalyst. ® 5 5. If the probe cleaning device of item 1 of the patent application scope, it also includes a removable protective film coated on the surface of the adhesive gel layer. 56. The probe cleaning device of claim 29, wherein the adhesive gel layer comprises from about 2.0 to 5.0% by weight of a crosslinked compound. 57. The probe cleaning device according to item 56 of the application, wherein the adhesive gel layer comprises from about 2.0 to 3.0% by weight of a cross-linked compound. ⑩ 5 8. The probe cleaning device according to item 29 of the patent application scope, wherein the catalyst is a curing catalyst. 59. The probe cleaning device according to item 58 of the application, wherein the curing catalyst is a platinum-containing catalyst. 60. The probe cleaning device according to item 29 of the patent application scope further comprises a removable protective film coated on the surface of the adhesive gel layer. 6 1. A complete set of tools, including a probe cleaning device as described in the first patent application scope, and a probe card. -46- (10) 200302537 62. A complete set of tools, including a probe cleaning device such as item 29 of the patent application scope, and a probe card. -47-