TWI265867B - Device for step-wise lamination of steps - Google Patents

Device for step-wise lamination of steps Download PDF

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Publication number
TWI265867B
TWI265867B TW093119001A TW93119001A TWI265867B TW I265867 B TWI265867 B TW I265867B TW 093119001 A TW093119001 A TW 093119001A TW 93119001 A TW93119001 A TW 93119001A TW I265867 B TWI265867 B TW I265867B
Authority
TW
Taiwan
Prior art keywords
layer
devices
layers
multilayer
outer layer
Prior art date
Application number
TW093119001A
Other languages
English (en)
Other versions
TW200518930A (en
Inventor
Josef Mai
Original Assignee
Lauffer Maschf
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lauffer Maschf filed Critical Lauffer Maschf
Publication of TW200518930A publication Critical patent/TW200518930A/zh
Application granted granted Critical
Publication of TWI265867B publication Critical patent/TWI265867B/zh

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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/02Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by a sequence of laminating steps, e.g. by adding new layers at consecutive laminating stations
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00Layered products comprising a layer of metal
    • B32B15/04Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00Layered products comprising a layer of metal
    • B32B15/04Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/09Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyesters
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00Layered products comprising a layer of metal
    • B32B15/14Layered products comprising a layer of metal next to a fibrous or filamentary layer
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00Layered products comprising a layer of metal
    • B32B15/20Layered products comprising a layer of metal comprising aluminium or copper
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/02Layered products essentially comprising sheet glass, or glass, slag, or like fibres in the form of fibres or filaments
    • B32B17/04Layered products essentially comprising sheet glass, or glass, slag, or like fibres in the form of fibres or filaments bonded with or embedded in a plastic substance
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/12Layered products comprising a layer of synthetic resin next to a fibrous or filamentary layer
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/26Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer which influences the bonding during the lamination process, e.g. release layers or pressure equalising layers
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00Ancillary operations in connection with laminating processes
    • B32B38/0036Heat treatment
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/46Manufacturing multilayer circuits
    • H05K3/4611Manufacturing multilayer circuits by laminating two or more circuit boards
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/02Composition of the impregnated, bonded or embedded layer
    • B32B2260/021Fibrous or filamentary layer
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/04Impregnation, embedding, or binder material
    • B32B2260/046Synthetic resin
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2262/00Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
    • B32B2262/10Inorganic fibres
    • B32B2262/101Glass fibres
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00Properties of the layers or laminate
    • B32B2307/20Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/204Di-electric
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00Properties of the layers or laminate
    • B32B2307/20Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/206Insulating
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2311/00Metals, their alloys or their compounds
    • B32B2311/12Copper
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2367/00Polyesters, e.g. PET, i.e. polyethylene terephthalate
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/08Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the cooling method
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00Ancillary operations in connection with laminating processes
    • B32B38/0004Cutting, tearing or severing, e.g. bursting; Cutter details
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06Lamination
    • H05K2203/061Lamination of previously made multilayered subassemblies
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06Lamination
    • H05K2203/068Features of the lamination press or of the lamination process, e.g. using special separator sheets
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/46Manufacturing multilayer circuits
    • H05K3/4644Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4652Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern

Landscapes

  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Fluid Mechanics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Laminated Bodies (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Press Drives And Press Lines (AREA)
  • Manufacturing Cores, Coils, And Magnets (AREA)

Description

1265867 九、發明說明: 【發明所屬之技術領域】 本發明關於一種申請專利範圍第1項引文的用於將多 層物(Multilayer)分段層疊的裳置。 【先前技術】 這類裝置也稱「分段式壓機」(Stuf enpresse),因為 一條層疊物(Laminiergut)係分段式地運送通過先後相隨設 置的在迫裝置(壓迫分段),這些壓迫裝置各將整數之隨後 的多層物容納及壓合。該壓迫裝置具有加熱及/或冷却裝 置’且可個別地或成組地調節。在各麼迫裝置中,將該構 成多層物的層疊物壓迫並加熱至一預定溫度或冷却,如有 必要,在有壓迫裝置共同地開放之前保持在此溫度為時一 段預定時段,並將該疊物再運送一步(例如再運送一個壓 迫裝置的距離。為了作運送,在該層疊物上側及下側設有 一條輸送V,其用於輸送的帶段(Trum )通過所有壓迫裝置, 且在壓迫裝置兩端繞過「偏轉滾子」運轉。 多層物一般有一内層,它宜在上下側各層疊上一個外 層。該内層一般也可稱為載體。外層在多層物的場合有一 金屬膜(一般由銅或鋁構成),在層疊後,利用刻蝕由該金 屬膜製造出導線路。為了作層疊(將外層與内層粘合),將 一個或數個中間層放到外層與内層之間,該中間層由可受 熱及壓力熔化的塑膠構成。在多層物的場合。這些中間= 一般稱為「前含浸層」(Prepreg卜它們可呈紙片的) 或分別的帶子的形式或在複合物中呈附著在金屬膜上的帶 1265867 子的形式供應。在後者的情形也稱為複合膜 (Verbundfolie)。為了要能將數個金屬層作層疊到該内層 的上下側,可重覆此層疊過程,其中,該外於外側的金屬 層在將另一中間層及外層作層疊之後,須刻蝕成導電路。 在層疊後將該層疊物切分成板,這些板包含整數的以後的 多層物。這些層疊板在進一步層疊通過時,變成内層。 這些内層係個別地呈板形式供應,或者第一次層疊通 過之時也可呈條帶的方式供應。外層與中間層一般呈條帶 的形式供應,基本上也可考慮將個別的層片疊放上去。 示了多層物外,利用本發明的裝置也可製其他的層疊 物,換言之,例如製造信用卡或金融卡用的層複合板。層 疊作業—般在—抽成真空的m中達成,壓迫裝置設在該 空間中。在該壓迫裝置中利用壓力與溫度的作用,使内層 熔化,如有中間層,目丨,、由丄μ。 則連中間層也熔化,並且在冷却後在 隶後一個或幾個塵迫裝詈 衣置甲將該層豐物的層以材料接合的 方式互相接合。 【發明内容】 本發明的目的在蔣 在^仏一種多層物或一般之層複合材料 的分段層豐的裝置,分 T ^要運轉的輸送帶以將層疊物運 运通過Μ迫裝置。 這種目的依本發明係 達成。本發明的裝置有至小“專利範圍第1項的特點 裝置,它可沿著或逆著—運::沿運送方向的最後的壓迫 後的壓追裝置共同運動。:运方向運動。也可以有數個最 馬了要將層疊物運送通過這些壓 ^265867 f裝置,故將所有的壓迫裝置開纟’只有該可運動的最後 文個[迫4置例外’且使該封閉之可運動的壓迫裝置沿運 运方向移動了-個或數個壓迫裝置的長度(亦即移^一 步)。如此該冑狀層疊物被運送一階段通過該裝置。隨後 :這些開放之不運動的壓迫裝置封閉,並將可運動的壓迫 衣置開放並在它們再度封閉之前移回其起始位置。因此, ?種層疊物呈分段方式通過壓迫裝置的作業依本發明,係 精著將最後數個Μ迫裝置沿運送方向移動而達成。為此, 至少該多層物或層疊物的最下層須為一條貫行的帶子,它 L過所有的壓迫裝置。最好,該層疊物的最上層也是一條 貫行的帶子。以避免該壓迫裝置開放時附著在壓迫裝置的 上壓模上。該層疊物的所有其他的層可為貫行的帶及/或 板或層片,它們位在最下方的帶上並隨之呈分段式運送通 過這些壓迫裝置。 本發明主要有一優點,即··它不需分別的輸送帶(爷 輸送帶另外還需要各二個轉向滾子以及一般之張緊= 置)。另一優點為:該壓迫裝置直接將層疊物加熱或冷却 (亦即設涉及位於其間的輸送帶),如此使熱傳遞改善Τ。 本發明的一種較佳設計有一導離裝置,它沿運送裝置 汉在取後的壓迫裝置之後,且該至少一個最外層在層疊之 後攸该層璺物拿掉。該最外層可為一個具有多個層的外層 勺/、中個層。因此,在此情形中,可供應一複合膜當作 ^ ^牛例而S,戎複合膜具有一金屬膜及一個或數個塑 膠膜其中,在層疊後,最外面的(塑膠)層再除去。也 1265867 可供應數個外声,十„ 纟外層與中間層’其中最外層在層疊後 再除去。所要除土日且ί夂 去的層其㈣宜較高,換言之,它在加埶 及加壓時不烷务,κ θ ^ 而即使在層疊後,也只附著在層疊物上, 層疊物有材料癒合(熔接成一片)的情形。因此 取㈢可由金屬(鋁箔)構成。最好,將層疊物的上側及 下側上的最外層從該層叠物除去。 1及 、/亥供應及導離裝置舉例而言有—捲取裝置,該外層由 此捲取驮置捲離或被捲取到其上。該導離裝置另外有一旋 轉:動器以將最外層捲取起來。該最外層(它依本發明在 J :後由層豐物拿掉)冑一優點,即可避免層疊物污染。 口亥取外層呈新鮮未受污染的方式供應到壓迫裝i,且在層 疊後就拿掉m運轉的輸送帶所必需的清洗作業可I 污染物粒子被帶人壓迫裝置的情事(在運轉的輸送 呗的情形這點常會發生)可避免。因此這點是一大優點, 因為即使只要有最小的污染粒子,都會使多層物或其他層 狀物如l用卡及金屬卡不能使用。由於省却了在運轉的輸 运π不能缺少的清洗裝置,因此本發明這種在層疊後將最 外層從層登物分離的方式可使層疊裝置更廉價。此外由於 万染造成不堪用產物之虞可大為減少。另一優點為,省却 了運轉式輸送帶之向後跑的帶段,因此該壓迫裝置較易探 手而及且調整較簡單,且其結構造也較簡單。 本發明一特點為一切分裝置,在層疊以及最外層除去 後,匕將層疊物切分成板或層片,它們包含整數的多層物。 本發明在以下利用圖式中所示之實施例詳細說明。 1265867 【實施方式】 圖式中所示之本發明的層疊裝置(10)用於將多層物(i2) 作分段式層疊。该層疊裝置(1〇)有四個壓迫裝置(14)(16), 它們沿-運送方向前後設置。各二個壓迫裝置⑽⑽平 行操作,一個層疊物(18)在各程序步驟中每次再運送二個 壓迫裝置(14)(16)的長度。 該二個第-(沿運送方向看為第一)壓迫裝置(⑷有加 熱裝置,該二個最後的壓迫裝置(16)有冷却裝置。該二個 最後的壓迫裝置(16)可供同地移動二個壓迫裴置(i4^(i6) φ 的長度’換言之’沿著或逆著運送方向移動一個程序步驟 (見第1及第2圖)。設置各二個平行操作的壓迫裝置 (14)(16)可提高該層疊裝置⑽的通過量咖㈣如, 英:thr〇ugh-PUt)。基本上也可以各設一壓迫裝置,且該層 疊物可在先後相隨的壓迫裝置中分段式地加熱到高溫並再 冷却下來(圖未示)。 具有先後相隨之壓迫裝置(14)(16)的層疊裝置⑽也 可稱為分段壓機,在圖式中運送方向係由左往右。 # 用板狀内層(20)當作層疊物⑽供應到a迫裝置 (14)(16)。此内層⑽舉例而言’係以一般方式由一個用 樹脂含浸的玻璃纖維布構成,其樹脂受溫度及/或壓力作 用而炼化’然後硬化。此内層係電絕緣者。舉例而言,有 -輸送帶(22)用於供應内層⑽。此内層⑽跑到第一壓 迫裝置(14)前-個下方的外層帶(24)上,該外層帶⑽由 -「儲存滾子」⑽捲離,並經轉向滾子⑽送到屡迫裝 9 1265867 置(14)( 16)。儲存滾子(26)與轉向滾子(28)構成一供應裝 置以供應下外層帶(24)。以外層帶(24)由一金屬/塑膠複合 膜構成,它有一金屬膜,例如由銅構成,附在一塑膠膜 (25)(例如由聚酯構成者)。外層帶(24)的塑膠膜(25)的熔 點比内層(20)高。外層帶(24)的供應方式使金屬膜位在上 方,換言之,内層(20)倚在外層帶(24)的金屬膜上。 一上方的外層帶(3〇)從一儲存滾子(32)捲離,並經由 轉向滾子(34)倚在内層(20)上方的側送到該壓迫裝置 (14)(16)。儲存滾子(32)與轉向滾子(34)構成上外層帶 的供應裝置。上方的外層帶(3〇)一如下方的外層帶(24), 係為複合膜,且有一金屬膜(例如由銅構成),它附著 在一塑膠膜(31)上(例如由聚酯構成者)。上外層帶㈠叼的 供應方式,係使金屬膜位於下方且倚在内層(2〇)上。 在第1圖中所示之第一程序步驟,所有四個壓迫裝置 (14)(16)都封閉,而該可移動的最後兩個壓迫裝置(16)該 層疊物(18)在壓力下加熱直助層(2〇)炼化為纟。在該二 個取後的壓迫裝置(16)中,該層疊物(18)冷却下來,因此 内層(10)的樹脂硬化,而與外層帶(24)(3〇)的金屬膜呈材 料接合的方式連接。外層帶(24)(30)的塑膠膜(25)[其熔點 比内層(20)高]不熔化。 士在第2圖中所示之第二程序步驟中,該二個第一壓迫 裝置(14)開放,而可動的最後二個壓迫裝置(16)移動了二 個屢迫裝置(14)(16)的長度,亦即沿運送方向移動了一個 階段如此該層疊物⑽被層疊裝置(10)運送了二個壓迫裝
• I 1265867 置(14)(16)的長度。在帛3圖所示的第三程序步驟中,該 二個第-壓迫裝置(⑷再封閉’並將層疊物⑽加熱。該 2個最後的壓迫裝置(16)開放(第3圖)且在二個步驟中逆 著運送方向回移了各一個壓迫裝置(14)(16)的長度回到該 二個第一壓迫裝置(14)。此封閉之壓迫裝置(14)將層疊物 (18)保持住,因此它不會被該最後的壓迫裝置(16)[它們逆 著運送方向移回]移回去。 在該最後的壓迫裝置(16)的後端(沿運送方向的後端) 上設有一個切分裝置(36),它具有二個刀具,隨該可動的 參 壓迫裝置(16)—同移動。切分裝置(36)在内層(2〇)之間的 一中間空間中在每次回移步驟後將層疊物(18)切成板,該 板含有多層物(12),且在層疊裝置(1〇)的末端構成二個料 堆。各板可有一個或數個多層物(12)(它們以後要互相分 離)。第4圖及第5圖中顯示切成具有該多層物(12)的板的 情形。 在層疊之後,將外層帶(24)(30)的塑膠膜(25)(31)從 層疊物分離。這點些藉著捲取起來「捲取滾子」(38)(40) ^ 上而達成,該捲取滾子有旋轉驅動器(圖中未示)。捲取 滾子(38)(40)設在裝置(10)末端在層疊物(18)的上方及下 方。塑膠膜(25) (31)可從層疊物(18)撕離,因為外層帶 (24) (30)的塑膠膜(25) (31)的熔點比内層(20)的樹脂高, 且壓迫裝置(14)(16)中的層疊物(18)並未加熱到外層帶 (24)(30)的塑膠膜(25)(31)的熔點。因此,該外層帶(24)(30) 的塑膠膜(25)(31)在層疊後只附著在該層疊物(18),且不 11 1265867 接合。因此塑膠膜 而拿掉。 與該層疊物(18 )呈材料癒合的方式 (25)(31)在層疊後可從層疊物(18)撕離 *當該最後二個壓迫裝置(16)沿運送方向運動時,該外 層帶(24)(30)的塑膠膜(25)(31)繞過最後的壓迫裝置(丨〇 的後緣,且受到壓迫裝置(16)的運動影響而從捲取滾子 (38)(40)捲離,如第2圖所示。在此該捲取滾子(38)(4〇) 可自由轉動或可被剎止住。當最後二個壓迫裝置逆著運送 方向(16)回移時,捲取滾子(38)(4〇)受驅動而旋轉,並將
塑膠膜(25)(31)捲取起來。塑膠膜(25)(31)在最後的壓迫 裝置(16)與切分裝置(36)盤繞,因此它們在層疊物切分成 多層物時不會被切斷。因此,外層帶(24)(3〇)的塑膠膜 (25)(31)從儲存滾子(26)(32)捲離,且在層疊後捲取到該 捲取滾子(38) (40)上。捲取滾子(38) (40)隨其圖中未示的 旋轉驅動器構成一導離裝置的捲取裝置,以將外層帶 (24)(30)的塑膠膜(25)(31)導離。塑膠膜(25)(31)用於保
護層疊物(18)免受污染,它們呈新製成及無污染的形式從 儲存滾不捲離。 該構成外層(24)(30)的複合膜的塑膠膜(25)(31)構成 外層帶(24) (30)的最外層(25)(31)。如不使用複合膜當作 外層帶(24)(30),該金屬膜與塑膠膜也可從分別的儲存滾 子捲離,並送到壓迫裝置(14)(16)(圖中未示)。在層疊後, 藉著捲取到捲取滾子(38)(40)上以將塑膠膜從層疊物(18) 拿掉的作業則保持不變。在此情形,塑膠膜可當成外層帶 的數個外層之一收集。 12 1265867 【圖式簡單說明】 第1圖〜第5圖係本發明的將多層物作分段層疊裝置 作業程序的各個先後相隨的分段的示意簡化側視圖。 【主要元件符號說明】 (10) 層疊裝置 (12) 多層物 (14X16)壓迫裝置 (18) 層疊物 (20) 内層 (22) 輸送帶 (24) 下方的外層帶 (25) 塑膠膜 (26) 儲存滾子 (28) 轉向滾子 (30) 上方的外層帶 (31) 塑膠膜 (32) 儲存滾子 (34) 轉向滾子 (36) 切分裝置 (38X40)捲取滾子 13

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1265867 十、申請專利範圍: 1. 一種用於將多層物分段層疊的裝置 --具有多數壓迫裝置,兮厭、ά壯职 4屋追裝置沿一運送道前後 設置,且具有加熱及/或冷却梦 7叫展置,且可個別地或成組地 調節, 且具有一内層供應裝置,以將該多層物的内層供 應到一個沿運送方向的第一壓迫裝置,並具有至少一外層 供應裝置,以將該多層物的至少一外層帶供應到該内層的 外側以及运到該沿運送方向的第—壓迫裝i,其特徵在: 至少有-個沿運送方向最後面的壓迫裝置(16)可沿著及逆 著該運送方向運動。 2.如申請專利範圍帛1項之用於將多層物分段層疊的 裝置,其中: 5亥裝置(1〇)有一導離裝置(38)(40),沿運送方向設在 取後的壓追裝置(16)後方,且將該外層(24)(30)的至少一 個最外層(25)(31)從多層物(12)〇8)除去。 3 _女申明專利範圍第2項之用於將多層物分段層疊的 裝置,其中: A導離名置(38) (4〇)有一個具一旋轉驅動器的捲取裝 置(38)(40) ’該捲取裝置將該外層(24)(3〇)的至少一層 (25) (31)或數個外層的至少一外層在最後的壓迫裝置(1旳 之後捲取起來。 4·如申凊專利範圍第1或第2項之用於將多層物分段 層疊的裝置,其中: 1265867 該裝置有一切分裝置(36),沿運送方向設在最後的壓 迫裝置(36)之後及導離裝置(38)(40)之後,且將多層物(12) 切分。 十一、圖式: 如次頁
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Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102007010483B4 (de) * 2007-03-03 2010-09-30 Laminatepark Gmbh & Co. Kg Verfahren zur Herstellung eines Paneels mit Kern und Dekorpapier
DE102008031573B4 (de) * 2008-07-07 2012-06-28 Carl Freudenberg Kg Dehnbares Vlies mit Leiterstrukturen
CN103496608B (zh) * 2013-09-29 2016-01-13 大连橡胶塑料机械股份有限公司 胶片连续层合装置
DE102015012242B4 (de) * 2015-09-18 2019-06-19 Leonhard Kurz Stiftung & Co. Kg Verfahren und Vorrichtung zur Herstellung eines mit einem Schichtstoff kaschierten 3D-Substrates
DE102018205802A1 (de) * 2018-04-17 2019-10-17 Homag Gmbh Vorrichtung zum Auftragen eines Haftmittels sowie Verfahren
DE102018205803A1 (de) * 2018-04-17 2019-10-17 Homag Gmbh Beschichtungsvorrichtung
CN112644827B (zh) * 2020-12-21 2023-06-30 海峡(晋江)伞业科技创新中心有限公司 一种自动化贴标流水线
CN114158206B (zh) * 2021-11-02 2022-06-21 深圳市方泰设备技术有限公司 一种叠合机

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3413053A1 (de) * 1983-04-29 1985-01-24 Harro 7500 Karlsruhe Manias Vorrichtung zum einschweissen von flaechigen gegenstaenden zwischen kunststoffolien
DE3413434A1 (de) * 1984-04-10 1985-10-17 Dielektra GmbH, 5000 Köln Verfahren zum kontinuierlichen herstellen von kupferkaschiertem basismaterial fuer leiterplatten
DD300969C4 (de) * 1989-09-13 2002-01-24 Erfurt Umformtechnik Gmbh Entstapel- und Transportvorrichtung fuer Platienen
US5470428A (en) * 1993-06-24 1995-11-28 Alfred D. Lobo Co., L.P.A. Flow-through linear transfer system for making credit cards and the like, from synthetic resinous sheets
JP3084352B2 (ja) * 1995-08-28 2000-09-04 太陽インキ製造株式会社 銅箔ラミネート方式ビルドアップ用絶縁樹脂組成物とこれを用いた多層プリント配線板の製造方法
DE19681635B4 (de) * 1995-11-02 2004-09-30 Komatsu Ltd. Werkstückförderer einer Stufenpresse
DE19962081A1 (de) * 1999-12-21 2001-06-28 Buerkle Gmbh Robert Verfahren und Vorrichtung zur Herstellung laminierter Plastikkarten
DE20017405U1 (de) * 2000-10-11 2002-02-21 Autefa Automation Gmbh Ballenpressanlage

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ATE391600T1 (de) 2008-04-15
CN1832855A (zh) 2006-09-13
KR101100525B1 (ko) 2011-12-29
CN100522608C (zh) 2009-08-05
KR20060052966A (ko) 2006-05-19
DE502004006783D1 (de) 2008-05-21
DE112004001935D2 (de) 2006-10-26
TW200518930A (en) 2005-06-16
DE10335693B3 (de) 2005-04-28
EP1651439A1 (de) 2006-05-03
WO2005014284A1 (de) 2005-02-17
EP1651439B1 (de) 2008-04-09

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