TWI257992B - Lighting device with highly efficient heat dissipation structure - Google Patents
Lighting device with highly efficient heat dissipation structure Download PDFInfo
- Publication number
- TWI257992B TWI257992B TW093127615A TW93127615A TWI257992B TW I257992 B TWI257992 B TW I257992B TW 093127615 A TW093127615 A TW 093127615A TW 93127615 A TW93127615 A TW 93127615A TW I257992 B TWI257992 B TW I257992B
- Authority
- TW
- Taiwan
- Prior art keywords
- heat
- light
- micro
- vapor
- electrode circuit
- Prior art date
Links
- 230000017525 heat dissipation Effects 0.000 title claims abstract description 12
- 238000010438 heat treatment Methods 0.000 claims abstract description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 2
- 239000000956 alloy Substances 0.000 claims description 2
- 229910045601 alloy Inorganic materials 0.000 claims description 2
- 229910052802 copper Inorganic materials 0.000 claims description 2
- 239000010949 copper Substances 0.000 claims description 2
- 239000000463 material Substances 0.000 claims description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims 2
- 238000005286 illumination Methods 0.000 claims 2
- 239000002184 metal Substances 0.000 claims 2
- 229910052751 metal Inorganic materials 0.000 claims 2
- 238000000034 method Methods 0.000 claims 2
- 238000005496 tempering Methods 0.000 claims 2
- 229910010293 ceramic material Inorganic materials 0.000 claims 1
- 239000010410 layer Substances 0.000 claims 1
- 150000002739 metals Chemical class 0.000 claims 1
- 239000000203 mixture Substances 0.000 claims 1
- 229910052759 nickel Inorganic materials 0.000 claims 1
- 239000002861 polymer material Substances 0.000 claims 1
- 239000011241 protective layer Substances 0.000 claims 1
- 238000009413 insulation Methods 0.000 abstract 1
- 230000000694 effects Effects 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 238000002791 soaking Methods 0.000 description 1
- 231100000331 toxic Toxicity 0.000 description 1
- 230000002588 toxic effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/648—Heat extraction or cooling elements the elements comprising fluids, e.g. heat-pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Led Device Packages (AREA)
- Fastening Of Light Sources Or Lamp Holders (AREA)
- Planar Illumination Modules (AREA)
- Electroluminescent Light Sources (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Description
1257992 九、發明說明: 【發明所屬之技術領域】 本發明係有關一種發光源結構,特別是有關一種將發光源直接鋪設在 散熱裝置表面上的具高效率散熱結構之發光裝置。 【先前技術】 按,現今液晶螢幕的背光源大多是冷陰極螢光燈管(CQldCath()deFlu()rescent —’^?[)’但隨著科技的發展,發光二極體(1推1^_1^,]^0)效能己 漸漸的取代CCFL,主要原因是CCFL不能再薄下去,只能維持目前的厚度, 且CCFL在升壓到600伏特電壓時會發生干擾,另外CCFL汞污染的議題 也疋倍夂爭議的事實,所以,在不久的未來部份國家中也將予以禁用。而 且CCFL的色彩飽和度與自然光相比只達7成而已。所以LED取代CCFL 己係未來的趨勢。 目刚LED應用的產品非常廣泛,如3C產品中音響面板的背光源、手 機按鍵♦光源及手機螢幕背光源之應用。然而,因為隨著各界積極的提高 LED的亮度,於是將LED應用在照明上,但是提高LED亮度的同時因LED 的功率消耗大而隨之衍生散熱問題’所以目前使用LED為照明的產品皆有 「散熱」的問題,進而使LED在產品顧上受到侷限。所以如何有效的解 決LED散熱問題目前亟須解決的重要問題。 有鑑於此,本發明係針對上述之問題,提出一種高效率之具高效率散 熱結構之發光裝置,以有效克服上述之缺失。 【發明内容】 本發明之主要目的,係在提供—種具高鱗散熱結構之發光裝处 1257992 高效率且快速的將發光源之熱量移除。 限制 本發明之另-目的,係在提供—種具高效顿熱結構之發光裝置 能有效率_發統之熱量鎌,«辆之轉度及尺林受散熱問題 本發明之再-目的,係在提供高效率散熱結構之發光裝置,因 能有效的解決發光源散綱題,使發絲的朗層面更多元化。 ,根據本發明,-種具高鱗餘結構之發光裝置,包括__蒸氣循環式 微熱均溫器,此蒸氣循環式微熱均溫器具有一第一表 一 衣w及'一第—表面,且 在蒸氣循環式微熱均温器之第—表面上設有至少—電極電路,在此電極電 路與蒸氣循環式微熱均㈣之間設置—輯層,使電極電路錢氣循環式 微熱均溫器·隔絕,另在此蒸氣循環式微熱均溫器之第—表面上再設置 至少-發辆,此發統顯I倾環;该熱均溫肢電極電路形成電又連 接,用以通電時使發光源發光。 底下藉由具體實施例配合所附的圖式詳加說明,當更容易瞭解本發明 之目的、技術内容、特點及其所達成之功效。 【實施方式】 本發明係在提出―種具高效率散熱結構之發光裝置,如第—圖至第二 圖所示’此具高效率賴結構之發絲置包括—舰循環趣熱均㈣ 10 ’此蒸氣循環式微熱均溫器10内注入一工作流體,並將此蒸氣循環式微 熱均溫器維胁真空雜,藉紅作越吸生機化而_迅速均熱 的目的’此减循環式微熱均溫器1G之材質係選自銅、錄、銘及其合金等
Claims (1)
1257992 十、申請專利範圍: 1、-種具高效率散熱結構之發光震置,包括: /蒸氣魏她她,_有十碗十表面,在該 ,與♦電極電路; 、ί 置在該電極電路與該蒸氣循環式微熱均溫器之間, 、:k電極電路躺蒸_環式微綱溫器雜隔絕;以及 至^發光源’其係、設置在該蒸氣循環式微熱均㈣之該第—表面上 厂該熱均溫器及該電極電路形成電性連接,用以通電時使 該發光源發光。 如申叫專利减第1項所述之具高鱗散熱結構之發織置,其中, 該發光源係為發光二極體。 3、 如申請專利範圍第1項所述之具高效率散熱結構之發光裝置,其中, ⑺發先源與知續環式微熱均溫_電極電路電連接之方式係為打線 dre Bonding)方式。 4、 如申請專利範圍第!項所述之具高效率散熱結構之發光裝置,复中, 該發光源與該蒸氣循環式微熱均溫器及該電極電路電為覆 (Flip Chip)方式。 八係為復日日 5、如申物彳範_1猶狀嶽雜觸㈣雜置,其中, 產地&,該細⑽觀微紙 且該蒸氣猶蝴_戰价繼£,㈣環 均溫器之該_移除。 ’、,、_%式微熱 6、如申請專利範圍第5項所述之具高效率散熱結構之發光裝置,其中, 1257992 該散熱裝_為散熱鰭片、導熱管及其混合體其中之一者。 申a專和範㈣6項所述之具高效*散熱結構之發絲置,其中, 。散…、裝⑽為散熱鰭片時,該散熱裝、設置在該蒸氣循環式微熱均溫 器4第一表面上或該蒸氣循環式微熱均溫ϋ未設置該發光源之區域。 :專她㈣6賴述之具高鱗散熱結構之發絲置,其中, 該散熱裝·轉絲時,鱗齡係輕在該統鱗式難均溫器之 侧邊上或該蒸氣觸式微熱均溫器未設置該發光源之區域。 :巾#專#〗範圍第1項所述之具高效率散熱結構之發光裝置,其中, 該發光源上覆蓋-保護層,贱保護該發光源。 W、如申請專利範圍第i項所述之具高效率散熱結構之發光裝置,其中, 該蒸氣循環式微熱均溫器之材質係選自銅、鎳、銘及其合金等金屬。 11、 如申請專利細第1項所述之具高效率散熱結構之發光裝置,其中, 該電極電路之材質係為金屬。 12、 如申請專利細第1項所述之具高效率散熱結構之發光裝置,其中, 該絶緣層係為高分子材料或陶瓷材料其中之一者。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW093127615A TWI257992B (en) | 2004-09-13 | 2004-09-13 | Lighting device with highly efficient heat dissipation structure |
US11/019,223 US7098486B2 (en) | 2004-09-13 | 2004-12-23 | Light source assembly having high-performance heat dissipation means |
JP2004372625A JP2005101658A (ja) | 2004-09-13 | 2004-12-24 | 高効率の散熱構造を有する発光装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW093127615A TWI257992B (en) | 2004-09-13 | 2004-09-13 | Lighting device with highly efficient heat dissipation structure |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200609457A TW200609457A (en) | 2006-03-16 |
TWI257992B true TWI257992B (en) | 2006-07-11 |
Family
ID=34465027
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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TW093127615A TWI257992B (en) | 2004-09-13 | 2004-09-13 | Lighting device with highly efficient heat dissipation structure |
Country Status (3)
Country | Link |
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US (1) | US7098486B2 (zh) |
JP (1) | JP2005101658A (zh) |
TW (1) | TWI257992B (zh) |
Families Citing this family (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4650075B2 (ja) * | 2005-04-18 | 2011-03-16 | ソニー株式会社 | 発光ユニットの放熱装置、バックライト装置及び画像表示装置 |
US7431475B2 (en) * | 2005-07-22 | 2008-10-07 | Sony Corporation | Radiator for light emitting unit, and backlight device |
US8100567B2 (en) * | 2005-10-19 | 2012-01-24 | Rambus International Ltd. | Light-emitting devices and related systems |
CN101004515A (zh) * | 2006-01-21 | 2007-07-25 | 鸿富锦精密工业(深圳)有限公司 | 直下式背光模组 |
US20070211183A1 (en) * | 2006-03-10 | 2007-09-13 | Luminus Devices, Inc. | LCD thermal management methods and systems |
US20070211184A1 (en) * | 2006-03-10 | 2007-09-13 | Luminus Devices, Inc. | Liquid crystal display systems including LEDs |
US20070211182A1 (en) * | 2006-03-10 | 2007-09-13 | Luminus Devices, Inc. | Optical system thermal management methods and systems |
TW200824143A (en) * | 2006-11-22 | 2008-06-01 | Tai Sol Electronics Co Ltd | Light emitting diode and the assembly of liquid/vapor phase heat sink device |
US20080205078A1 (en) * | 2007-02-23 | 2008-08-28 | Luminus Devices, Inc. | Illumination tiles and related methods |
CN101296564B (zh) * | 2007-04-27 | 2010-11-10 | 富士迈半导体精密工业(上海)有限公司 | 具良好散热性能的光源模组 |
US7985004B1 (en) | 2008-04-30 | 2011-07-26 | Genlyte Thomas Group Llc | Luminaire |
US7972036B1 (en) | 2008-04-30 | 2011-07-05 | Genlyte Thomas Group Llc | Modular bollard luminaire louver |
US8231243B1 (en) | 2008-08-19 | 2012-07-31 | Philips Koninklijke Electronics N.V. | Vertical luminaire |
JP5202220B2 (ja) * | 2008-09-30 | 2013-06-05 | 三洋電機株式会社 | 画像表示装置 |
US8070328B1 (en) | 2009-01-13 | 2011-12-06 | Koninkliljke Philips Electronics N.V. | LED downlight |
US8197091B1 (en) | 2009-05-15 | 2012-06-12 | Koninklijke Philips Electronics N.V. | LED unit for installation in a post-top luminaire |
US8123378B1 (en) | 2009-05-15 | 2012-02-28 | Koninklijke Philips Electronics N.V. | Heatsink for cooling at least one LED |
US8159821B2 (en) * | 2009-07-28 | 2012-04-17 | Dsem Holdings Sdn. Bhd. | Diffusion bonding circuit submount directly to vapor chamber |
US20110108245A1 (en) * | 2009-11-10 | 2011-05-12 | Dsem Holdings Sdn. Bhd. | Circuit Board Forming Diffusion Bonded Wall of Vapor Chamber |
US8506127B2 (en) | 2009-12-11 | 2013-08-13 | Koninklijke Philips N.V. | Lens frame with a LED support surface and heat dissipating structure |
US8466486B2 (en) | 2010-08-27 | 2013-06-18 | Tsmc Solid State Lighting Ltd. | Thermal management system for multiple heat source devices |
USD657087S1 (en) | 2011-05-13 | 2012-04-03 | Lsi Industries, Inc. | Lighting |
US8585238B2 (en) | 2011-05-13 | 2013-11-19 | Lsi Industries, Inc. | Dual zone lighting apparatus |
US20120294002A1 (en) * | 2011-05-18 | 2012-11-22 | Phoseon Technology, Inc. | Vapor chamber cooling of solid-state light fixtures |
CN109326707B (zh) * | 2018-10-18 | 2020-06-05 | 扬州港信光电科技有限公司 | 一种高效散热的发光二极管 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2000031546A (ja) * | 1998-07-08 | 2000-01-28 | Mitsubishi Electric Corp | Led集合体モジュール |
DE10117889A1 (de) * | 2001-04-10 | 2002-10-24 | Osram Opto Semiconductors Gmbh | Leiterrahmen und Gehäuse für ein strahlungsemittierendes Bauelement, strahlungsemittierendes Bauelement sowie Verfahren zu dessen Herstellung |
AU2003235489A1 (en) * | 2002-05-08 | 2003-11-11 | Tom Mcneil | High efficiency solid-state light source and methods of use and manufacture |
JP2004125381A (ja) * | 2002-08-02 | 2004-04-22 | Mitsubishi Alum Co Ltd | ヒートパイプユニット及びヒートパイプ冷却器 |
JP4352686B2 (ja) * | 2002-11-22 | 2009-10-28 | 日亜化学工業株式会社 | 反射型発光装置 |
US20040261988A1 (en) * | 2003-06-27 | 2004-12-30 | Ioan Sauciuc | Application and removal of thermal interface material |
-
2004
- 2004-09-13 TW TW093127615A patent/TWI257992B/zh not_active IP Right Cessation
- 2004-12-23 US US11/019,223 patent/US7098486B2/en active Active
- 2004-12-24 JP JP2004372625A patent/JP2005101658A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
JP2005101658A (ja) | 2005-04-14 |
TW200609457A (en) | 2006-03-16 |
US7098486B2 (en) | 2006-08-29 |
US20060054911A1 (en) | 2006-03-16 |
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