200936938 九、發明說明： 【發明所屬之技術領域】 本創作係關於一種高集中度、高亮度之LE：D照明晶片之燈泡封 裝’以有效解決現有高亮度LED照明晶片封裝，受制於散熱系統設 計不易，照明亮度難以提升之問題。 【先前技術】 ® 近幾年來高亮度LED(Light Emitting Diode)發光二極體，具有 低耗能、尚売度之功能，在能源價格飆涨的今日，極具運用價值。 且以現有技術要使LE：D晶片發出幾百個流明之光照度，基本上已經 不是一個很大的問題，惟要商品化成為實用之照明產品，則尚存諸 多難處，而主要的癥結在於現用高亮度LED晶片之封裝模式，仍延 用早期LE1D晶片當指示燈用途(低功率）之封裝方法，無法解決高亮 度LED晶片之熱流排放問題。因而影響高亮度LE：D之經濟使用壽命， © 也限制了 之使用功率及發光之照度，嚴触礙了 L_於照明 設備之實用化雜。本發明即針對此權失，提供聽傳統⑽晶 片之封裝模式，以解決高亮度⑽晶片受制於散熱系統無法突破B，曰 難以大幅提升其功率及照度之問題。 5 200936938 【發明内容】 LED運用在照明系統上，大家所追求的目標，是怎樣把一個㈣ 封裝流明數做得越大越好，大到足触财酬彡射目當甚至於超 越。而此項關鍵技術所面臨的就是LE：D晶片發光產生之溫度 (Junction Temperature)必須獲得迅速、有效的排放；而基本瘋結在 於同冗度LE：D晶片主要成分A1GaInP四元素是一個非常不好的熱導 體，工作溫度超過125〇C即會嚴重影響其使用壽命，傳統⑽樹脂封 © 肢散熱器模式，要把晶片之核心熱區（Junction Tempemure)傳 導到散熱區散熱，必須經過多層次不同之封裝介質，包刮排熱效果 差之黏膠封裝、樹脂封褒、金屬導熱等等，最後才由散熱片進行散 熱。因此整體排熱速度對高亮度LED晶片來說，通常是太慢、不足、 不然就是熱導流系統域料方便應驗終端產品，造成難以商品 化等運關題。然LED晶片產生之熱的散逸，實際需要之的環境是 >盈度控制越均勻越好，升降的幅度不要過大（變化過大會弓丨起晶片熱 ❹應力變形_)即可’傳統LED之封裝與散熱之導流模式—直無法解 決前述問題。關-所示為傳統單晶粒的封裝模組，包刮光學 透鏡m、led發光二極體晶片102、透明封裝樹脂1〇3(常與光學透 鏡101相同樹脂）、螢光縣順用於產生白光方法之―）、、兼具散 熱功能之導線腳105、晶片純金接出導線1〇6及另一導線腳贿等構 成，安裝於電路板109之崎導線⑽上使用。通常之作法是以焊 料或散熱膏將LED晶粒102枯在兼具散熱功能之導線腳1{)5上曰 6 200936938 片102之散熱是經過散熱膏及兼具散熱之導線腳i〇5來傳導至電路 板109之銅箔基板1〇8上，及另透過封裝之樹脂1〇1來降低LED之 晶片溫度’這是市面上最廣泛之led單晶粒封裝方式。而在大型產 品應用上’則常將多顆led模組焊在同一電路板上，成一背光條或 陣列形成巨陣或圓形排列，再與銘或銅板製成之大型之散熱基座結 合而成較大面積之照明光源，對於個別LED晶片仍用樹脂封裝。此 種傳統LED之封裝模式，最大缺點是散熱流程長、介面多、效率差 ❹ 無法滿足高亮度LED晶片之散熱需求，嚴重影響LED之使用壽命。 再不然就是散熱系統複雜’不利於終端產品之應用，如照明燈、車 燈或路燈等用途。這類傳統LED之封裝專利散見於相關專利公報上， 如中華民國專利M309253、Μ308370、Μ307191·...等等。本發明即針 月’J述缺失，提供異於傳統led晶片之封裝模式，其所運用之方式為 讓led晶片在開放之空間，直接與大面積兼具散熱片功能之導線座 焊接一起，不用樹脂及散熱膏等不良傳熱介質封裝，且最後LED封 〇 裝是包裹在大型玻璃燈泡内，封裝時封入適量（5〜10%或以上大氣壓 力）不抽及LE：D晶片之二氧化碳或不導電而透光之冷媒氣體或液體， 作為熱之傳導介質’直接把LED晶片核，讀區產生之熱(<Juncti〇n TeniPerature)，透過燈泡内之二氧化碳或冷媒氣體或液體之對流， 來傳達到玻料表散熱至大氣巾，可迅速喊效的降低㈣晶片之 核〜脈度。如此可有效提升LED之承載功率，使LED發光照度得以 大ΊΆ升而成為實用之照明產品，有關本發明詳細結構兹說明如后： 7 200936938 【實施方式】 附圖二所示為本發明實施例運用於球形燈泡產品結構；圖中2〇ι 所示為兼具散熱及導線功能之LE：D晶片構裝架，由金屬薄板構成（詳 如附圖三所示）與導線柱202焊接一起’穿過燈泡與外接電極2〇3連 接作為LED電源輸入端之一。204為LED晶片安裝巢。2〇5為led另 一電極導線，以絕緣層黏貼佈值於LED晶片構裝架2〇1面上，並經 206導線及207導線柱穿透燈泡外另一電極2〇8上，作為LE])另一電 ® 源輸入端。209為LED晶片構裝架玻璃安裝座，21〇為適當大小及厚 度之球狀透明玻璃燈罩。209玻璃安裝座與210玻璃燈罩封裝焊接 ^ 倂封入一疋容量之二氧化碳或環保冷媒氣體（3〜10%或以上之 大氣壓）或液體，使燈泡空間211及LED晶片204a周圍均充滿二氧 化碳或散熱冷媒氣體或液體。當LE：D晶片通電發光時，晶片接面熱 區產生之熱，經周圍兼具散熱及導線功能之構裝架，迅速且就近與 冷煤發生傳導及對流，發散其熱量至玻璃燈罩而傳導至大氣。附圖 〇 三所示為兼具散熱及導線功能之LED晶片構裝架2〇1之詳細結構；圖 中201為整體晶片構裝架由金屬薄板構成，具有多孔結構及多個晶 片安裝巢204，此巢穴本身即為大面積之金屬導體，除作為LED之熱 傳導外，並作為LE：D電極之一。204a為LED發光二極體晶片，焊接 於各個晶片安裝巢204内，其旁側設有散熱功能之鰭片2〇la，以增 加LED晶片散熱面積及充分利用冷媒氣體或液體之流通散熱。2_ 為晶片接面純金導線與另一電極導線2〇5上之2〇5a點連接，經2〇6 導線及207導線柱與燈泡外接電極2〇8(附圖二)連接。使用時燈泡外 8 200936938 接電極（附圖二)203及208電極提供LED所需電源，分別經導線柱 202、LED晶片構裝架201到晶片204a之一端及經另一導線柱207、 導線206、導線電極205、導線電極接點205a、晶片純金導線2_ 等到達LED晶片204a另一端上’使LED發光二極體發出亮光。⑽ 晶片發光後產生之熱，由LED晶片構裝架201直接與燈泡内之冷媒 氣體或液體，就地發生輕射及對流式熱傳導，同時把熱量傳達到更 大面積之玻璃外殼，再經玻璃外殼傳導到空氣中冷卻。其最大優點 為LED晶片核心產生之熱流，可在最短距離及時間内，直接由冷媒 氣體或液體帶離熱區’可有效降低LED晶片之核心工作溫度，如此 即可提高LED晶片之玉作功率及照明度，使LED晶片用於照明產品 成為可能。另本發明為因應不適於全密閉玻璃封裝之產品，則可於 晶片構裝架之玻璃安裝座附圖二中符號212所示位置，預留有對外 縮小之斜度設狀私孔，待賴燒人封裝完全冷卻後，再貫入冷 〇 =氧化碳或舰體歧體，Μ轉皮塞或概賴212貫入孔， 利於儲存燈泡内魔力，也具有安全閥功能，非常容易達成封裝目的。 :上所述’本發明之封裝方式極具有產業應用價值，可廣泛應用於高 又LED之各種照明设備，如附圖四所示為直條形玻璃封裝應用例， ^應用於LCD液晶電視之冷陰極管背絲。關五為運用於桌燈型 2之照明燈泡運⑽，關六為用於路燈聽之巨陣形燈泡之封裝 結構為本發明另一應用例。 9 200936938 【圖式簡單說明】 附圖一為傳統傳統led之封裝模式。 附圖一為本發明實施例用於球形燈泡型之封裝結構。 附圖三為兼具散熱及導線功能之LED晶片構裝架之詳細說明。 附圖四為本發明實施例用於LCD液晶電視用長條形背光光源。 附圖五為本發明實施例用於桌燈用燈泡實施例。 附圖六為本發明實施例用於大型路燈用巨陣結構之燈泡。 〇 【主要元件符號說明】 符號101為光學透鏡。 符號102為LED發光二極體晶片。 符號103為透明封裝樹脂。 符號104為螢光粉封裝。 符號105為兼具散熱功能之導線腳。 符號106為純金導線。 q 符號107另一導線腳。 符號108之銅箔導線。 符號109電路板。 符唬201為兼具散熱及導線功能2LED晶片構裝架。 符號202為導線柱。 符號203為LED燈泡外接電極之一。 符號204為LED晶片安裝巢。 符號205為LED燈泡另一電極導線。 200936938 符號206為與205連接之導線。 符號207為LED另一電極導線柱。 符號208為LED燈泡另一外接電極。 符號209為LED晶片構裝架玻璃安裝座。 符號210為燈泡型玻璃燈罩。 符號211為燈泡内充填二氧化碳或冷煤之氣體或液體。 符號212為燈泡貫充二氧化碳或冷煤之氣體或液體之貫入孔。 〇 符號201a為LED晶片安裝巢之散熱鰭片。 符號204a為LED發光二極體晶片。 符號204b為LED晶片純金導出線。 符號205a為LED晶片另一電極之連接點。 11200936938 IX. Invention: [Technical field of invention] This creation is about a high-concentration, high-brightness LED package for LE:D lighting wafers to effectively solve the existing high-brightness LED lighting chip package, subject to the design of the heat dissipation system. It is not easy, and the brightness of the illumination is difficult to increase. [Prior Art] ® In recent years, the high-brightness LED (Light Emitting Diode) LED has a low energy consumption and a long-lasting function. It is of great value in today's sky-high energy prices. In the prior art, it is basically not a big problem to make the LE:D wafer emit hundreds of lumens of illumination. However, if commercialization becomes a practical lighting product, there are still many difficulties, and the main crux is the current use. The packaging mode of the high-brightness LED chip still uses the packaging method of the early LE1D chip as the indicator light (low power), and cannot solve the heat flow discharge problem of the high-brightness LED chip. Therefore, it affects the economical service life of high-brightness LE:D, and © also limits the use of power and illumination, which hinders the practical use of L_ in lighting equipment. The present invention is directed to this loss, and provides a package mode of listening to a conventional (10) wafer to solve the problem that a high-brightness (10) wafer is subject to a heat dissipation system that cannot break through B, and it is difficult to greatly increase its power and illumination. 5 200936938 [Invention content] LED is used in the lighting system. The goal that everyone pursues is how to make a (four) package lumens as large as possible, and it is too big to touch the financial rewards and even overshoot. The key technology is that the temperature of the LE:D wafer must be obtained quickly and efficiently. The basic madness lies in the same complexity. The main component of the LE:D wafer is A1GaInP. A good thermal conductor, working temperature above 125 °C will seriously affect its service life, the traditional (10) resin seal © limb radiator mode, to transfer the chip's core hot zone (Junction Tempemure) to the heat sink cooling, must go through multiple levels Different packaging media, the adhesive package with poor heat dissipation effect, resin sealing, metal heat conduction, etc., and finally the heat dissipation by the heat sink. Therefore, the overall heat removal rate is usually too slow or insufficient for high-brightness LED chips, otherwise the heat-conducting system domain material is convenient for the end product, which makes it difficult to commercialize and transport problems. However, the heat generated by the LED chip is dissipated, and the actual required environment is > the more uniform the better the gain control, the larger the amplitude of the lift should not be too large (the change of the heat and stress deformation of the wafer _) can be 'traditional LED The diversion mode of package and heat dissipation - can not solve the above problems. Off - shown as a traditional single-die package module, including a scraping optical lens m, a led light-emitting diode wafer 102, a transparent encapsulating resin 1〇3 (often the same resin as the optical lens 101), and a fluorescent county The white light method ―), the heat-dissipating wire leg 105, the wafer pure gold take-out wire 1〇6, and the other wire leg bribe are used, and are mounted on the circuit board 109 saki wire (10). The usual practice is to use the solder or thermal grease to dry the LED die 102 on the wire leg 1{)5 which has the heat dissipation function. 20096 200936938 The heat dissipation of the chip 102 is through the thermal grease and the wire leg i兼5 which has the heat dissipation function. Conducted on the copper foil substrate 1〇8 of the circuit board 109, and through the resin 1〇1 of the package to reduce the wafer temperature of the LED' is the most widely used LED single-die package on the market. In large-scale product applications, multiple LED modules are often soldered on the same circuit board, forming a backlight array or array to form a giant array or a circular array, and then combined with a large heat sink base made of Ming or copper. A larger area of illumination source is still encapsulated with resin for individual LED chips. The biggest disadvantage of this traditional LED package mode is that the heat dissipation process is long, the interface is large, and the efficiency is poor. ❹ The heat dissipation requirement of the high-brightness LED chip cannot be met, which seriously affects the service life of the LED. Otherwise, the heat dissipation system is complex, which is not conducive to the application of end products, such as lighting, lights or street lamps. The packaging patents of such conventional LEDs are disclosed in related patent publications, such as the Republic of China patents M309253, Μ308370, Μ307191... and so on. The invention is characterized by the absence of a needle, which provides a packaging mode different from that of a conventional LED chip. The method used is to let the LED chip be in an open space, and directly solder with a large-area wire holder having a heat sink function. Poor heat transfer medium package such as resin and thermal grease, and the final LED package is wrapped in a large glass bulb, sealed in an appropriate amount (5~10% or more atmospheric pressure), and does not draw carbon dioxide of LE:D wafer or not The conductive and transparent refrigerant gas or liquid acts as a heat conduction medium to directly illuminate the LED chip core and the heat generated by the reading zone (<Juncti〇n TeniPerature) through the convection of carbon dioxide or refrigerant gas or liquid in the bulb. It is conveyed to the glass table to dissipate heat to the air towel, which can quickly reduce the nuclear-pulse of the wafer. In this way, the carrying power of the LED can be effectively improved, and the illumination illuminance of the LED can be greatly increased to become a practical lighting product. The detailed structure of the present invention is as follows: 7 200936938 [Embodiment] FIG. 2 shows an embodiment of the present invention. It is used in the structure of the spherical bulb product; in the figure, 2〇ι shows the LE:D wafer structure frame with heat dissipation and wire function, which is composed of a thin metal plate (as shown in Figure 3) and welded with the wire column 202. Connected to the external electrode 2〇3 through the bulb as one of the LED power input terminals. 204 mounts the nest for the LED wafer. 2〇5 is the LED lead wire, which is adhered to the 2〇1 surface of the LED chip structure by the insulating layer, and penetrates the other electrode 2〇8 of the bulb through the 206 wire and the 207 wire column as LE ]) Another electric source input. 209 is a LED wafer mount glass mount, and 21 is a spherical transparent glass shade of appropriate size and thickness. 209 glass mount and 210 glass lampshade package soldering ^ 倂 enclose a volume of carbon dioxide or environmentally friendly refrigerant gas (3 to 10% or more atmospheric pressure) or liquid, so that the bulb space 211 and the LED chip 204a are filled with carbon dioxide or heat-dissipating refrigerant gas Or liquid. When the LE:D wafer is energized and illuminated, the heat generated in the hot zone of the wafer junction is transmitted and convected rapidly and closely with the cold coal through the surrounding structure with heat dissipation and wire function, and the heat is radiated to the glass lamp cover to conduct To the atmosphere. Figure 3-1 shows the detailed structure of the LED wafer carrier 2〇1 which has both heat dissipation and wire functions. In the figure, 201 is a monolithic wafer carrier composed of a thin metal plate having a porous structure and a plurality of wafer mounting nests 204. The nest itself is a large-area metal conductor, in addition to being the heat conduction of the LED, and as one of the LE:D electrodes. 204a is an LED light-emitting diode chip, which is soldered in each of the wafer mounting nests 204, and has a heat-dissipating fin 2〇la on the side thereof to increase the heat-dissipating area of the LED chip and fully utilize the heat dissipation of the refrigerant gas or liquid. 2_ Connect the pure gold wire of the wafer junction to the 2〇5a point on the other electrode wire 2〇5, and connect the 2〇6 wire and the 207 wire column to the bulb external electrode 2〇8 (Fig. 2). When used, the bulb is externally connected to the electrodes (Fig. 2). The electrodes 203 and 208 provide the power required for the LEDs, respectively, through the conductor post 202, the LED wafer carrier 201 to one end of the wafer 204a, and through the other conductor post 207, the conductor 206. The wire electrode 205, the wire electrode contact 205a, the wafer pure gold wire 2_, etc. reach the other end of the LED chip 204a to cause the LED light emitting diode to emit bright light. (10) The heat generated after the wafer is illuminated, the LED wafer structure 201 directly reacts with the refrigerant gas or liquid in the bulb, and the light radiation and convection heat conduction occur locally, and the heat is transmitted to the larger glass casing and then through the glass. The outer casing is conducted to the air for cooling. The biggest advantage is that the heat flow generated by the core of the LED chip can be directly removed from the hot zone by the refrigerant gas or liquid in the shortest distance and time. This can effectively reduce the core operating temperature of the LED chip, thus improving the power of the LED chip. And illumination, making LED chips possible for lighting products. In addition, the present invention is suitable for a product that is not suitable for a fully enclosed glass package, and can be placed at the position indicated by symbol 212 in the second embodiment of the glass mount of the wafer structure holder, and a private hole for externally narrowing is reserved. After the burnt package is completely cooled, it will pass through the cold heading = carbon oxide or hull body, and the plug or the plug will be inserted into the hole, which is good for storing the magic inside the bulb. It also has a safety valve function, which is very easy to achieve the packaging purpose. The above-mentioned package method has extremely industrial application value and can be widely applied to various illumination devices of high and high LED, as shown in FIG. 4, which is a straight strip glass package application example, and is applied to an LCD liquid crystal television. The cold cathode tube is back wire. Guan Wu is used for the lighting of the table lamp type 2 (10), and the sealing structure of the giant array of light bulbs for the street lamp is another application example of the invention. 9 200936938 [Simple description of the drawing] Figure 1 shows the traditional traditional LED package mode. 1 is a package structure for a spherical bulb type according to an embodiment of the present invention. Figure 3 is a detailed description of the LED wafer carrier with both heat dissipation and wire functions. FIG. 4 is a long strip backlight source for an LCD liquid crystal television according to an embodiment of the present invention. Fig. 5 is a view showing an embodiment of a bulb for a table lamp according to an embodiment of the present invention. Figure 6 is a light bulb of a giant array structure for a large street lamp according to an embodiment of the present invention. 〇 [Explanation of main component symbols] Symbol 101 is an optical lens. Symbol 102 is an LED light emitting diode chip. Symbol 103 is a transparent encapsulating resin. Symbol 104 is a phosphor powder package. Symbol 105 is a wire leg that has a heat dissipation function. Symbol 106 is a pure gold wire. q Symbol 107 another wire leg. Copper foil wire of symbol 108. Symbol 109 circuit board. Fuyu 201 is a 2LED wafer structure mount that combines heat dissipation and wire function. Symbol 202 is a wire post. Symbol 203 is one of the external electrodes of the LED bulb. Symbol 204 is a nest for mounting an LED wafer. Symbol 205 is the other electrode lead of the LED bulb. 200936938 Symbol 206 is a wire connected to 205. Symbol 207 is the other electrode lead post of the LED. Symbol 208 is another external electrode of the LED bulb. Symbol 209 is an LED wafer mount glass mount. Symbol 210 is a bulb type glass lampshade. Symbol 211 is a gas or liquid in which the bulb is filled with carbon dioxide or cold coal. Symbol 212 is a penetration hole for a gas or liquid in which the bulb is filled with carbon dioxide or cold coal. 〇 Symbol 201a is a heat sink fin for the LED chip mounting nest. Symbol 204a is an LED light emitting diode chip. Symbol 204b is an LED wafer pure gold lead-out line. Symbol 205a is the connection point of the other electrode of the LED chip. 11