TWI257175B - Production of lightly doped drain of low-temperature poly-silicon thin film transistor - Google Patents

Production of lightly doped drain of low-temperature poly-silicon thin film transistor

Info

Publication number
TWI257175B
TWI257175B TW093136377A TW93136377A TWI257175B TW I257175 B TWI257175 B TW I257175B TW 093136377 A TW093136377 A TW 093136377A TW 93136377 A TW93136377 A TW 93136377A TW I257175 B TWI257175 B TW I257175B
Authority
TW
Taiwan
Prior art keywords
lightly doped
doped drain
thin film
film transistor
low
Prior art date
Application number
TW093136377A
Other languages
English (en)
Other versions
TW200618300A (en
Inventor
Chia-Nan Shen
Cheng-Nan Hsieh
Po-Chih Liu
Original Assignee
Chunghwa Picture Tubes Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Chunghwa Picture Tubes Ltd filed Critical Chunghwa Picture Tubes Ltd
Priority to TW093136377A priority Critical patent/TWI257175B/zh
Priority to US11/023,436 priority patent/US20060110868A1/en
Publication of TW200618300A publication Critical patent/TW200618300A/zh
Application granted granted Critical
Publication of TWI257175B publication Critical patent/TWI257175B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/66007—Multistep manufacturing processes
    • H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
    • H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
    • H01L29/66409—Unipolar field-effect transistors
    • H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
    • H01L29/66742—Thin film unipolar transistors
    • H01L29/6675—Amorphous silicon or polysilicon transistors
    • H01L29/66757—Lateral single gate single channel transistors with non-inverted structure, i.e. the channel layer is formed before the gate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76—Unipolar devices, e.g. field effect transistors
    • H01L29/772—Field effect transistors
    • H01L29/78—Field effect transistors with field effect produced by an insulated gate
    • H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
    • H01L29/78606—Thin film transistors, i.e. transistors with a channel being at least partly a thin film with supplementary region or layer in the thin film or in the insulated bulk substrate supporting it for controlling or increasing the safety of the device
    • H01L29/78618—Thin film transistors, i.e. transistors with a channel being at least partly a thin film with supplementary region or layer in the thin film or in the insulated bulk substrate supporting it for controlling or increasing the safety of the device characterised by the drain or the source properties, e.g. the doping structure, the composition, the sectional shape or the contact structure
    • H01L29/78621—Thin film transistors, i.e. transistors with a channel being at least partly a thin film with supplementary region or layer in the thin film or in the insulated bulk substrate supporting it for controlling or increasing the safety of the device characterised by the drain or the source properties, e.g. the doping structure, the composition, the sectional shape or the contact structure with LDD structure or an extension or an offset region or characterised by the doping profile
TW093136377A 2004-11-25 2004-11-25 Production of lightly doped drain of low-temperature poly-silicon thin film transistor TWI257175B (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW093136377A TWI257175B (en) 2004-11-25 2004-11-25 Production of lightly doped drain of low-temperature poly-silicon thin film transistor
US11/023,436 US20060110868A1 (en) 2004-11-25 2004-12-29 Production of lightly doped drain of low-temperature poly-silicon thin film transistor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW093136377A TWI257175B (en) 2004-11-25 2004-11-25 Production of lightly doped drain of low-temperature poly-silicon thin film transistor

Publications (2)

Publication Number Publication Date
TW200618300A TW200618300A (en) 2006-06-01
TWI257175B true TWI257175B (en) 2006-06-21

Family

ID=36461432

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093136377A TWI257175B (en) 2004-11-25 2004-11-25 Production of lightly doped drain of low-temperature poly-silicon thin film transistor

Country Status (2)

Country Link
US (1) US20060110868A1 (zh)
TW (1) TWI257175B (zh)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102315120B (zh) * 2011-09-02 2015-02-04 上海芯导电子科技有限公司 降低半导体芯片漏电流的方法
CN106409683A (zh) * 2016-11-07 2017-02-15 信利（惠州）智能显示有限公司 Mos管及其制备方法
CN107481936A (zh) * 2017-08-07 2017-12-15 武汉华星光电技术有限公司 低温多晶硅薄膜晶体管及其制备方法
US20200135489A1 (en) * 2018-10-31 2020-04-30 Atomera Incorporated Method for making a semiconductor device including a superlattice having nitrogen diffused therein

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5654209A (en) * 1988-07-12 1997-08-05 Seiko Epson Corporation Method of making N-type semiconductor region by implantation
US5290712A (en) * 1989-03-31 1994-03-01 Canon Kabushiki Kaisha Process for forming crystalline semiconductor film
JP3103385B2 (ja) * 1991-01-25 2000-10-30 株式会社東芝 ポリシリコン薄膜半導体装置
JP2838338B2 (ja) * 1991-05-21 1998-12-16 株式会社半導体エネルギー研究所 電気光学装置の駆動方法
KR940009608B1 (ko) * 1991-11-30 1994-10-15 삼성전자 주식회사 반도체 메모리장치 및 그 제조방법
CN100465742C (zh) * 1992-08-27 2009-03-04 株式会社半导体能源研究所 有源矩阵显示器
US5596218A (en) * 1993-10-18 1997-01-21 Digital Equipment Corporation Hot carrier-hard gate oxides by nitrogen implantation before gate oxidation
US6228751B1 (en) * 1995-09-08 2001-05-08 Semiconductor Energy Laboratory Co., Ltd. Method of manufacturing a semiconductor device
KR100224704B1 (ko) * 1996-07-23 1999-10-15 윤종용 박막 트랜지스터-액정표시장치 및 그 제조방법
US5861335A (en) * 1997-03-21 1999-01-19 Advanced Micro Devices, Inc. Semiconductor fabrication employing a post-implant anneal within a low temperature high pressure nitrogen ambient to improve channel and gate oxide reliability
US6037639A (en) * 1997-06-09 2000-03-14 Micron Technology, Inc. Fabrication of integrated devices using nitrogen implantation
US5851893A (en) * 1997-07-18 1998-12-22 Advanced Micro Devices, Inc. Method of making transistor having a gate dielectric which is substantially resistant to drain-side hot carrier injection
US6127211A (en) * 1997-10-02 2000-10-03 Matsushita Electric Industrial Co., Ltd. Method of manufacturing transistor
US6111619A (en) * 1999-05-27 2000-08-29 Sharp Laboratories Of America, Inc. Method of forming polycrystalline silicon TFTs with TiN/Cu/TiN interconnections for a liquid crystal display pixel array
JP2002151526A (ja) * 2000-09-04 2002-05-24 Seiko Epson Corp 電界効果トランジスタの製造方法および電子装置
JP2002164442A (ja) * 2000-11-28 2002-06-07 Hitachi Ltd 半導体装置およびその製造方法
US7335544B2 (en) * 2004-12-15 2008-02-26 Taiwan Semiconductor Manufacturing Company, Ltd. Method of making MOSFET device with localized stressor

Also Published As

Publication number Publication date
US20060110868A1 (en) 2006-05-25
TW200618300A (en) 2006-06-01

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees