TWI256727B - Solid-state imaging device and production method of the same - Google Patents

Solid-state imaging device and production method of the same

Info

Publication number
TWI256727B
TWI256727B TW093137536A TW93137536A TWI256727B TW I256727 B TWI256727 B TW I256727B TW 093137536 A TW093137536 A TW 093137536A TW 93137536 A TW93137536 A TW 93137536A TW I256727 B TWI256727 B TW I256727B
Authority
TW
Taiwan
Prior art keywords
conductivity type
region
light receiving
solid
imaging device
Prior art date
Application number
TW093137536A
Other languages
English (en)
Other versions
TW200524148A (en
Inventor
Hiroshi Iwata
Original Assignee
Sharp Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Kk filed Critical Sharp Kk
Publication of TW200524148A publication Critical patent/TW200524148A/zh
Application granted granted Critical
Publication of TWI256727B publication Critical patent/TWI256727B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
    • H01L27/14689—MOS based technologies
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14609—Pixel-elements with integrated switching, control, storage or amplification elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/08—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof in which radiation controls flow of current through the device, e.g. photoresistors
    • H01L31/10—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof in which radiation controls flow of current through the device, e.g. photoresistors characterised by potential barriers, e.g. phototransistors
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70—SSIS architectures; Circuits associated therewith
    • H04N25/76—Addressed sensors, e.g. MOS or CMOS sensors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/1462—Coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14643—Photodiode arrays; MOS imagers

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Signal Processing (AREA)
  • Multimedia (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
  • Light Receiving Elements (AREA)
TW093137536A 2003-12-05 2004-12-03 Solid-state imaging device and production method of the same TWI256727B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003408343A JP3865728B2 (ja) 2003-12-05 2003-12-05 閾値電圧変調方式のｍｏｓ型固体撮像素子およびその製造方法

Publications (2)

Publication Number Publication Date
TW200524148A TW200524148A (en) 2005-07-16
TWI256727B true TWI256727B (en) 2006-06-11

Family

ID=34708674

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093137536A TWI256727B (en) 2003-12-05 2004-12-03 Solid-state imaging device and production method of the same

Country Status (4)

Country Link
US (1) US20050145905A1 (zh)
JP (1) JP3865728B2 (zh)
KR (1) KR100663101B1 (zh)
TW (1) TWI256727B (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI472019B (zh) * 2009-07-30 2015-02-01 Sony Corp 固態成像裝置及其製造方法

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102004016992B4 (de) * 2004-04-02 2009-02-05 Prema Semiconductor Gmbh Verfahren zur Herstellung eines Bipolar-Transistors
US7208783B2 (en) * 2004-11-09 2007-04-24 Micron Technology, Inc. Optical enhancement of integrated circuit photodetectors
JP4631661B2 (ja) * 2005-11-14 2011-02-16 日本ビクター株式会社 固体撮像素子
JP4345794B2 (ja) 2006-09-28 2009-10-14 ソニー株式会社 固体撮像素子の製造方法
JP5023768B2 (ja) * 2007-03-30 2012-09-12 ソニー株式会社 固体撮像素子及びその製造方法
JP2009272453A (ja) * 2008-05-08 2009-11-19 Sanyo Electric Co Ltd トランジスタ、半導体装置及びその製造方法
US7833819B2 (en) * 2008-07-23 2010-11-16 Aptina Imaging Corporation Method and apparatus for decreasing storage node parasitic charge in active pixel image sensors

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100255135B1 (ko) * 1997-12-31 2000-05-01 윤종용 반도체 장치의 제조 방법
KR100291179B1 (ko) * 1998-06-29 2001-07-12 박종섭 자기정렬된실리사이드층을갖는씨모스이미지센서및그제조방법
US6504194B1 (en) * 1999-12-01 2003-01-07 Innotech Corporation Solid state imaging device, method of manufacturing the same, and solid state imaging system
JP3782297B2 (ja) * 2000-03-28 2006-06-07 株式会社東芝 固体撮像装置及びその製造方法
JP4376516B2 (ja) * 2000-10-19 2009-12-02 クォンタム セミコンダクター リミテッド ライアビリティ カンパニー Ｃｍｏｓと一体化されたヘテロ接合ホトダイオードの製造方法
JP2002353434A (ja) * 2001-05-22 2002-12-06 Sony Corp 固体撮像装置の製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI472019B (zh) * 2009-07-30 2015-02-01 Sony Corp 固態成像裝置及其製造方法

Also Published As

Publication number Publication date
KR20050054860A (ko) 2005-06-10
KR100663101B1 (ko) 2007-01-02
US20050145905A1 (en) 2005-07-07
JP3865728B2 (ja) 2007-01-10
JP2005174968A (ja) 2005-06-30
TW200524148A (en) 2005-07-16

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees