JP3865728B2 - 閾値電圧変調方式のmos型固体撮像素子およびその製造方法 - Google Patents
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- 238000004519 manufacturing process Methods 0.000 title claims description 30
- 238000003384 imaging method Methods 0.000 title claims description 24
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- FVBUAEGBCNSCDD-UHFFFAOYSA-N silicide(4-) Chemical compound [Si-4] FVBUAEGBCNSCDD-UHFFFAOYSA-N 0.000 claims description 49
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- 238000010438 heat treatment Methods 0.000 claims description 4
- 239000004065 semiconductor Substances 0.000 claims description 4
- 238000000059 patterning Methods 0.000 claims description 2
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- 239000010408 film Substances 0.000 description 136
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- 239000012535 impurity Substances 0.000 description 19
- 230000003287 optical effect Effects 0.000 description 13
- 230000035945 sensitivity Effects 0.000 description 13
- 229910052814 silicon oxide Inorganic materials 0.000 description 9
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 8
- 229910052710 silicon Inorganic materials 0.000 description 8
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 6
- 238000002955 isolation Methods 0.000 description 6
- 239000010703 silicon Substances 0.000 description 6
- 239000000969 carrier Substances 0.000 description 5
- 108091006146 Channels Proteins 0.000 description 4
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- 102000004129 N-Type Calcium Channels Human genes 0.000 description 3
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- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 238000001312 dry etching Methods 0.000 description 2
- 239000011229 interlayer Substances 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 239000011259 mixed solution Substances 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 235000011114 ammonium hydroxide Nutrition 0.000 description 1
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- 238000010030 laminating Methods 0.000 description 1
- 238000004518 low pressure chemical vapour deposition Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 239000012788 optical film Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920005591 polysilicon Polymers 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
- H01L27/14689—MOS based technologies
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14609—Pixel-elements with integrated switching, control, storage or amplification elements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/08—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof in which radiation controls flow of current through the device, e.g. photoresistors
- H01L31/10—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof in which radiation controls flow of current through the device, e.g. photoresistors characterised by potential barriers, e.g. phototransistors
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/70—SSIS architectures; Circuits associated therewith
- H04N25/76—Addressed sensors, e.g. MOS or CMOS sensors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/1462—Coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14643—Photodiode arrays; MOS imagers
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Signal Processing (AREA)
- Multimedia (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
- Light Receiving Elements (AREA)
Description
いられる閾値電圧変調方式のMOS型イメージセンサの固体撮像素子およびその製造方法に関する。
ダイオードの感度特性とを向上できて、低コストで製造可能な閾値電圧変調方式のMOS型固体撮像素子およびその製造方法を提供することを目的とする。
そして、マスクパターン膜45を除去した後、n型不純物を導入してn型不純物領域16を形成する。
2 光信号検出用のMOSトランジスタ
3 キャリアポケット領域(電荷蓄積領域:キャリアポケット領域)
10 MOS型イメージセンサ
10A 単位画素部
11 p型基板
12 受光ダイオードのn型層
13 MOSトランジスタのp型埋め込み層
14 単位画素部領域全体にわたるn型層
15 p型ウェル領域
16 受光ダイオード表面側層のn型不純物領域
17 ウェル分離領域
18 n型ドレイン領域
19 n型ソース領域
20 n型チャネルドープ層
21 ゲート絶縁膜
21A 多層ゲート絶縁膜
21a〜21c 多層ゲート絶縁膜の各層膜
22,22A シリサイド形成防止膜
23 ゲート電極
24 サイドウォール
25a 高融点金属層
25 シリサイド層
26 ソース電極
26a、27a、28a コンタクトホール
27 ドレイン電極
29a、29b 画素間分離電極
30 層間絶縁膜
41〜45 マスクパターン
Claims (6)
- 光照射により電荷を発生する受光領域と、該受光領域からの電荷を蓄積する電荷蓄積領域とを、第1導電型基板の第2導電型半導体層上に設けられた第1導電型ウェル領域内に有し、該該受光領域に隣接して設けられ該電荷蓄積領域の蓄積電荷量に応じた信号読み出しを可能とするトランジスタを備えた単位画素部が二次元状に複数配設された閾値電圧変調方式のMOS型固体撮像素子において、
該トランジスタのゲート絶縁膜となる絶縁膜のみでシリサイド形成防止膜としても該受光領域の表面を覆うように設けられ、
該トランジスタは、該第1導電型ウェル領域の上方に前記ゲート絶縁膜を介してリング状のゲート電極が設けられ、該リング状のゲート電極の内側に位置する、該第1導電型ウェル領域の上面側にソース領域が設けられ、該第1導電型ウェル領域の外側を取り囲むようにドレイン領域が設けられ、該ソース領域、該ドレイン領域および該ゲート電極の各表面にはシリサイド層が設けられている閾値電圧変調方式のMOS型固体撮像素子。 - 前記トランジスタのゲート電極の側面にはサイドウォールが設けられている請求項1記載の閾値電圧変調方式のMOS型固体撮像素子。
- 前記トランジスタのゲート絶縁膜は、それぞれ屈折率が異なる2種類以上の絶縁膜が積層された多層膜である請求項1に記載の閾値電圧変調方式のMOS型固体撮像素子。
- 請求項1に記載の閾値電圧変調方式のMOS型固体撮像素子の製造方法であって、
前記シリサイド形成防止膜として該受光領域の表面を覆う受光領域被覆膜および前記トランジスタのゲート絶縁膜となる絶縁膜を成膜する絶縁膜成膜工程と、
該絶縁膜成膜工程で成膜された絶縁膜のみをパターニングして該トランジスタのゲート絶縁膜と共に受光領域被覆膜を残し、該トランジスタのソース領域およびドレイン領域となる拡散層を露出させる工程と、
該拡散層、該トランジスタのゲート電極および該受光領域被覆膜を含む領域にわたって、シリサイド層を形成するための高融点金属層を成膜する工程と、
熱処理により、該拡散層およびゲート電極の各表面にシリサイド層をそれぞれ形成する工程と、
未反応の高融点金属層を除去する工程とを有する閾値電圧変調方式のMOS型固体撮像素子の製造方法。 - 前記ゲート絶縁膜上に、側面にサイドウォールを有するゲート電極を形成するゲート電極形成工程を有する請求項4に記載の閾値電圧変調方式のMOS型固体撮像素子の製造方法。
- 前記絶縁膜成膜工程において、前記絶縁膜として、それぞれ屈折率が異なる2種類以上の絶縁膜を積層する請求項4に記載の閾値電圧変調方式のMOS型固体撮像素子の製造方法。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003408343A JP3865728B2 (ja) | 2003-12-05 | 2003-12-05 | 閾値電圧変調方式のmos型固体撮像素子およびその製造方法 |
US11/004,381 US20050145905A1 (en) | 2003-12-05 | 2004-12-03 | Solid-state imaging device and production method of the same |
TW093137536A TWI256727B (en) | 2003-12-05 | 2004-12-03 | Solid-state imaging device and production method of the same |
KR1020040101544A KR100663101B1 (ko) | 2003-12-05 | 2004-12-04 | 고체 촬상 소자 및 그 제조 방법 |
Applications Claiming Priority (1)
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JP2003408343A JP3865728B2 (ja) | 2003-12-05 | 2003-12-05 | 閾値電圧変調方式のmos型固体撮像素子およびその製造方法 |
Publications (2)
Publication Number | Publication Date |
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JP2005174968A JP2005174968A (ja) | 2005-06-30 |
JP3865728B2 true JP3865728B2 (ja) | 2007-01-10 |
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JP2003408343A Expired - Fee Related JP3865728B2 (ja) | 2003-12-05 | 2003-12-05 | 閾値電圧変調方式のmos型固体撮像素子およびその製造方法 |
Country Status (4)
Country | Link |
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US (1) | US20050145905A1 (ja) |
JP (1) | JP3865728B2 (ja) |
KR (1) | KR100663101B1 (ja) |
TW (1) | TWI256727B (ja) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
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DE102004016992B4 (de) * | 2004-04-02 | 2009-02-05 | Prema Semiconductor Gmbh | Verfahren zur Herstellung eines Bipolar-Transistors |
US7208783B2 (en) * | 2004-11-09 | 2007-04-24 | Micron Technology, Inc. | Optical enhancement of integrated circuit photodetectors |
JP4631661B2 (ja) * | 2005-11-14 | 2011-02-16 | 日本ビクター株式会社 | 固体撮像素子 |
JP4345794B2 (ja) | 2006-09-28 | 2009-10-14 | ソニー株式会社 | 固体撮像素子の製造方法 |
JP5023768B2 (ja) * | 2007-03-30 | 2012-09-12 | ソニー株式会社 | 固体撮像素子及びその製造方法 |
JP2009272453A (ja) * | 2008-05-08 | 2009-11-19 | Sanyo Electric Co Ltd | トランジスタ、半導体装置及びその製造方法 |
US7833819B2 (en) * | 2008-07-23 | 2010-11-16 | Aptina Imaging Corporation | Method and apparatus for decreasing storage node parasitic charge in active pixel image sensors |
JP5418044B2 (ja) * | 2009-07-30 | 2014-02-19 | ソニー株式会社 | 固体撮像装置およびその製造方法 |
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KR100255135B1 (ko) * | 1997-12-31 | 2000-05-01 | 윤종용 | 반도체 장치의 제조 방법 |
KR100291179B1 (ko) * | 1998-06-29 | 2001-07-12 | 박종섭 | 자기정렬된실리사이드층을갖는씨모스이미지센서및그제조방법 |
TW494574B (en) * | 1999-12-01 | 2002-07-11 | Innotech Corp | Solid state imaging device, method of manufacturing the same, and solid state imaging system |
JP3782297B2 (ja) * | 2000-03-28 | 2006-06-07 | 株式会社東芝 | 固体撮像装置及びその製造方法 |
US6943051B2 (en) * | 2000-10-19 | 2005-09-13 | Quantum Semiconductor Llc | Method of fabricating heterojunction photodiodes integrated with CMOS |
JP2002353434A (ja) * | 2001-05-22 | 2002-12-06 | Sony Corp | 固体撮像装置の製造方法 |
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2003
- 2003-12-05 JP JP2003408343A patent/JP3865728B2/ja not_active Expired - Fee Related
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2004
- 2004-12-03 TW TW093137536A patent/TWI256727B/zh not_active IP Right Cessation
- 2004-12-03 US US11/004,381 patent/US20050145905A1/en not_active Abandoned
- 2004-12-04 KR KR1020040101544A patent/KR100663101B1/ko not_active IP Right Cessation
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Publication number | Publication date |
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KR20050054860A (ko) | 2005-06-10 |
TW200524148A (en) | 2005-07-16 |
JP2005174968A (ja) | 2005-06-30 |
KR100663101B1 (ko) | 2007-01-02 |
TWI256727B (en) | 2006-06-11 |
US20050145905A1 (en) | 2005-07-07 |
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