TWI254156B - Optical system with compensated non-planar focal field of fore optic and method for compensating for non-planar focal field of fore optic used in optical system - Google Patents
Optical system with compensated non-planar focal field of fore optic and method for compensating for non-planar focal field of fore optic used in optical system Download PDFInfo
- Publication number
- TWI254156B TWI254156B TW090132321A TW90132321A TWI254156B TW I254156 B TWI254156 B TW I254156B TW 090132321 A TW090132321 A TW 090132321A TW 90132321 A TW90132321 A TW 90132321A TW I254156 B TWI254156 B TW I254156B
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- Prior art keywords
- substrate
- matrix
- microlens
- planar
- disposed
- Prior art date
Links
- 230000003287 optical effect Effects 0.000 title claims abstract description 39
- 238000000034 method Methods 0.000 title description 18
- 230000005693 optoelectronics Effects 0.000 claims abstract description 55
- 239000000758 substrate Substances 0.000 claims description 47
- 239000011159 matrix material Substances 0.000 claims description 42
- 238000009877 rendering Methods 0.000 claims 1
- 238000000926 separation method Methods 0.000 abstract 1
- 230000004075 alteration Effects 0.000 description 4
- 230000008901 benefit Effects 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 239000000835 fiber Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- 206010011469 Crying Diseases 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000004049 embossing Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000013307 optical fiber Substances 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/806—Optical elements or arrangements associated with the image sensors
- H10F39/8063—Microlenses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
- B29D11/00—Producing optical elements, e.g. lenses or prisms
- B29D11/00009—Production of simple or compound lenses
- B29D11/00278—Lenticular sheets
- B29D11/00298—Producing lens arrays
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B6/12002—Three-dimensional structures
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B6/13—Integrated optical circuits characterised by the manufacturing method
- G02B6/138—Integrated optical circuits characterised by the manufacturing method by using polymerisation
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4249—Packages, e.g. shape, construction, internal or external details comprising arrays of active devices and fibres
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
- G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
- G02B7/04—Mountings, adjusting means, or light-tight connections, for optical elements for lenses with mechanism for focusing or varying magnification
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F77/00—Constructional details of devices covered by this subclass
- H10F77/40—Optical elements or arrangements
- H10F77/407—Optical elements or arrangements indirectly associated with the devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F77/00—Constructional details of devices covered by this subclass
- H10F77/40—Optical elements or arrangements
- H10F77/413—Optical elements or arrangements directly associated or integrated with the devices, e.g. back reflectors
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
- G02B6/4206—Optical features
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
- G02B6/4214—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Health & Medical Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Ophthalmology & Optometry (AREA)
- Mechanical Engineering (AREA)
- Optical Couplings Of Light Guides (AREA)
- Semiconductor Lasers (AREA)
- Lenses (AREA)
- Led Device Packages (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Prostheses (AREA)
- Optical Elements Other Than Lenses (AREA)
- Facsimile Scanning Arrangements (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
- Photovoltaic Devices (AREA)
- Eye Examination Apparatus (AREA)
- Fittings On The Vehicle Exterior For Carrying Loads, And Devices For Holding Or Mounting Articles (AREA)
- Road Signs Or Road Markings (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US09/749,296 US6556349B2 (en) | 2000-12-27 | 2000-12-27 | Variable focal length micro lens array field curvature corrector |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TWI254156B true TWI254156B (en) | 2006-05-01 |
Family
ID=25013142
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW090132321A TWI254156B (en) | 2000-12-27 | 2001-12-26 | Optical system with compensated non-planar focal field of fore optic and method for compensating for non-planar focal field of fore optic used in optical system |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US6556349B2 (https=) |
| EP (1) | EP1346255B1 (https=) |
| JP (1) | JP2004526300A (https=) |
| AT (1) | ATE339708T1 (https=) |
| AU (1) | AU2002241700A1 (https=) |
| DE (1) | DE60123122T2 (https=) |
| TW (1) | TWI254156B (https=) |
| WO (1) | WO2002052335A2 (https=) |
Cited By (2)
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| CN104867951A (zh) * | 2015-04-23 | 2015-08-26 | 豪威科技(上海)有限公司 | 一种背照式传感器芯片及其制造方法 |
| US10139619B2 (en) | 2015-02-12 | 2018-11-27 | Optiz, Inc. | Back side illumination image sensor with non-planar optical interface |
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| KR100940943B1 (ko) * | 2001-08-24 | 2010-02-08 | 쇼오트 아게 | 전자 부품 제조 방법 |
| JP2003143459A (ja) * | 2001-11-02 | 2003-05-16 | Canon Inc | 複眼撮像系およびこれを備えた装置 |
| US6822995B2 (en) | 2002-02-21 | 2004-11-23 | Finisar Corporation | GaAs/AI(Ga)As distributed bragg reflector on InP |
| JP4291615B2 (ja) * | 2002-05-28 | 2009-07-08 | 株式会社巴川製紙所 | 光学素子ウエハ及びその製造方法、光学素子の製造方法 |
| JP2004101848A (ja) * | 2002-09-09 | 2004-04-02 | Nippon Sheet Glass Co Ltd | マイクロレンズアレイ、マイクロレンズアレイを用いた光モジュール、及び光モジュールの位置決め方法 |
| US6822241B2 (en) * | 2002-10-03 | 2004-11-23 | Hewlett-Packard Development Company, L.P. | Emitter device with focusing columns |
| US20040151828A1 (en) * | 2003-02-04 | 2004-08-05 | Anis Zribi | Method for fabrication and alignment of micro and nanoscale optics using surface tension gradients |
| JP4347599B2 (ja) * | 2003-04-10 | 2009-10-21 | オリンパス株式会社 | 個人認証装置 |
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-
2001
- 2001-12-20 EP EP01988388A patent/EP1346255B1/en not_active Expired - Lifetime
- 2001-12-20 JP JP2002553178A patent/JP2004526300A/ja active Pending
- 2001-12-20 DE DE60123122T patent/DE60123122T2/de not_active Expired - Lifetime
- 2001-12-20 AT AT01988388T patent/ATE339708T1/de not_active IP Right Cessation
- 2001-12-20 AU AU2002241700A patent/AU2002241700A1/en not_active Abandoned
- 2001-12-20 WO PCT/US2001/050094 patent/WO2002052335A2/en not_active Ceased
- 2001-12-26 TW TW090132321A patent/TWI254156B/zh not_active IP Right Cessation
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10139619B2 (en) | 2015-02-12 | 2018-11-27 | Optiz, Inc. | Back side illumination image sensor with non-planar optical interface |
| CN104867951A (zh) * | 2015-04-23 | 2015-08-26 | 豪威科技(上海)有限公司 | 一种背照式传感器芯片及其制造方法 |
| CN104867951B (zh) * | 2015-04-23 | 2018-05-04 | 豪威科技(上海)有限公司 | 一种背照式传感器芯片及其制造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| EP1346255B1 (en) | 2006-09-13 |
| DE60123122D1 (de) | 2006-10-26 |
| WO2002052335A3 (en) | 2003-02-13 |
| AU2002241700A1 (en) | 2002-07-08 |
| EP1346255A2 (en) | 2003-09-24 |
| JP2004526300A (ja) | 2004-08-26 |
| US20030011888A1 (en) | 2003-01-16 |
| DE60123122T2 (de) | 2007-09-13 |
| ATE339708T1 (de) | 2006-10-15 |
| US6556349B2 (en) | 2003-04-29 |
| WO2002052335A2 (en) | 2002-07-04 |
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