TWI243456B - Image sensor chip package with level control and method for packaging the same - Google Patents

Abstract

An image sensor chip package with level control and a method for packaging the same are disclosed. The image sensor chip package mainly comprises a substrate, an image sensor chip and an adhesive compound, wherein an upper surface of the substrate defines a chip-attached area. The adhesive compound sticks a backside of the image sensor chip with the chip-attached area of the substrate. The substrate includes a plurality of metal pads on the chip-attached area and a plurality of inner fingers around the chip-attached area. The metal pads are same of a supporting height and are not covered by a solder mask to levelly control the image sensor chip during chip-attached process.

Description

1243456

[Technical field to which the invention belongs] The present invention relates to a method for packaging an image sensing chip, and particularly relates to a level-controlled image sensing chip packaging structure and its packaging method. [Previous technology] Packaging of semiconductor wafers In the field, the image sensing chip [土 ㈣ “s ^ r ^ or chip] is different from the general integrated circuit chip, and cannot be packaged with an impervious sealant, and the image sensing chip has water in a packaging structure: The degree of integration is higher than that of a general integrated circuit chip. It is known that the integrated circuit chip f is slightly inclined in the package structure. As long as the electrical connection is good, it can be regarded as a good one. It will be judged that the mounting failure 'so the level control of the image sensing chip in the package structure is extremely important' and it is necessary to take into account its heat dissipation. In China Patent Publication No. 523 1 69, a conventional image sensing chip package is disclosed. Structure, an image-sensing chip is adhered to a substrate with a flange layer, which is mainly to enhance a light-transmitting layer (that is, transparent glass) at the position of the flange layer, and the flange layer It has a sinker for the positioning of the light-transmitting layer. The method of fixing the image sensor chip and the substrate has not been revealed. The conventional sticky crystal material can be divided into a liquid-applied adhesive boat and a solid-state adhesive. In the packaging structure of image sensing chips, it is common to use adhesive tape to adhere to the image sensing chip, but the heat dissipation is poor and the level is limited. It is easily affected by the solder mask and the curing shrinkage of the tape. If the image sensor chip is fixed with a liquid-applied viscose, serious levelness will be caused.

Page 5 1243456 V. Description of the invention (2) As shown in Fig. 1, a conventional image sensing chip package structure includes a substrate 10, an image sensing chip 20, an adhesive 30, a bonding wire 40, and a frame. The dam 50 and a transparent cover 60 are used for fixing the back surface 22 of the image sensing chip 20 to the upper surface 11 of the substrate 10 and electrically connecting the image sensing chip 20 to the bonding wire 40 through The contact point 14 within the substrate 10 is used to seal the image sensing chip 20 with the frame dam 50 and the transparent cover 60, and the sensing surface 21 of the image sensing chip 20 should be aligned with the transparent cover. 60, to receive the image light source, since the viscose 30 is a liquid or viscous colloidal coating, the substrate 10 passes through the viscose 30 to control the level of the image sensing chip 20 very poorly. When the image sensing chip 20 is adhered and pressed, the adhesive 30 is not yet thermally cured. The sensing surface 21 of the image sensing chip 20 is prone to uncontrolled tilt. In addition, the substrate 丨 〇 upper surface 丨丨 It is covered with a solder mask 1 3 (s〇1 der mask, commonly known as green) ], The solder mask layer 1 3 reveals the internal contacts 丨 4 and the external contacts 丨 5, it is known that the application method of the solder mask layer 13 is liquid printing, which causes the upper surface of the substrate 11 to have The poor level will also have an uncontrolled level effect on the packaged image sensing chip 20. [Summary of the Invention] The main purpose of the invention is to provide a horizontally controlled image sense tf 2 ′ 'Using a sticky crystal region of a substrate, a plurality of metal cymbals cover sheets have a uniform support height and are not protected by the solder resist f ^ I ^ ti supports the back surface of an image sensing chip to improve the level control of the sensing surface of the packaged I image sensing chip. This Month of the Month-The purpose of man is to provide a level-controlled image sense

1243456 — -One-— _____ Five 'invention description (3) One --- ^ L ^ ^ package structure, a plurality of metal and thermal pads are formed by using the die-bonding region of a substrate. The hole is connected to a heat-dissipating metal layer under the substrate, and the metal pads contact the test surface of an image sensing chip to improve the heat dissipation of the image sensing chip. Another object of the present invention is to provide a method for sealing an image sensing wafer. In the die bonding step, a viscose is used to fix the surface of the image sensing wafer and the upper surface of the substrate, and uses the substrate's die bonding area. A plurality of metal gaskets are formed, and some metal gaskets support and contact the surface of the image sensing chip to control the sensing surface of the image sensing chip horizontally. The horizontally controlled image sensing chip package structure according to the present invention mainly includes a substrate, an image sensing chip, and a viscose. The base can I board has an upper surface and a lower surface, and the upper surface of the substrate. The system defines a sticky crystal region. The substrate includes a plurality of internal contacts, a plurality of metal pads, and a plurality of external contacts. The internal contacts are provided on the upper surface of the substrate and along the sticky crystal region. The outer perimeter is arranged in a circle, and the metal pads are arranged in the sticky crystal region of the substrate. The metal pads have a uniform support height and are not covered by the solder resist layer to horizontally support the image sensing chip. The metal pads can be formed from the same metal layer as the internal contacts, and the external contacts are disposed on the lower surface of the substrate and electrically connected to the corresponding internal contacts. The image sensing chip has A sensing surface and a corresponding back surface. The back surface of the image sensing boat wafer is fixed to the die attach region of the substrate with the adhesive and supported and contacted by the metal pads to horizontally control the image sensing wafer. Sensing surface ' Sensing the sensing surface of the image sensor wafer with a plurality of pads, the plurality of electrically conductive bonding based Sook connected to the contacts of the substrate, preferably, on the substrate

1243456 V. Description of the invention (4) A frame dam is formed on the surface for attaching a transparent cover or replacing it with transparent plastic, or directly with a miniature camera module [c〇mpact Camera

Module, CCM] lens [Lens / Holder] combination. [Embodiment] The present invention will be described with reference to the attached drawings. According to a specific embodiment of the present invention, please refer to FIG. 2. A horizontally controlled image sensing chip package structure 100 mainly includes a substrate 110, an image sensing chip 120, and an adhesive 130, wherein the substrate 110 is It has an upper surface 111 and a lower surface 112. The substrate n0 may be a double-layer or multilayer printed circuit board or a ceramic circuit board with a circuit pattern formed on the upper and lower surfaces 111, 112. The upper surface 111 is defined There is a sticky crystal region 11 3 (as shown in FIG. 3). The substrate 110 includes a plurality of inner contacts 11 4 [inner f inger], a plurality of horizontally controlled metal pads 11 5 [metal pad], and A plurality of outer fingers 118 [outer finger]. Please refer to FIGS. 2 and 3. The internal contacts 114 are arranged on the upper surface 1 1 0 of the substrate 11 and are arranged in a circle along the periphery of the sticky region 11 3. The horizontally controlled metal pads 11 5 a is provided on the sticky crystal region 11 3 of the substrate 11 〇, the metal pads 115 have a uniform support height and are not covered by a solder mask Π 9 for horizontally supporting the image sensing chip 1 2 〇, preferably, the metal pads 115 may include a plurality of support pads 115 a and a heat sink 11 5b, and the support pads 11 5a are radially symmetrically arranged or other symmetrical or asymmetrical Any shape can be drained to facilitate the degumming of the viscose body 130. The heat sinks 11 5b are provided around the viscous crystal area 113, and the metal cymbals 115 can be connected to the inner portions. The dot 114 is formed by etching the same metal layer, and

1243456 V. Description of the invention (5) The external points 11 8 are arranged on the lower surface 11 2 of the substrate 11 0 and are electrically connected to corresponding internal contacts 11 4. Preferably, the external points 11 8 are It is arranged around the lower surface 112 of the substrate 110 to enlarge the usable area in the center of the lower surface 112 of the substrate 110. In this embodiment, the substrate 1 1 10 further includes a heat dissipation metal layer 117 on the lower surface 112 of the substrate. Center, and the substrate 11 has at least one through hole 116 [via] formed by metal electric money to be connected to the heat dissipation metal layer 117 and the heat sink pads 115b. In this embodiment, the internal contacts 114. The metal pad 115 and the heat-dissipating metal layer 117 are all exposed on the surface of the substrate 110 and the solder resist layer 1 1 9 is applied to achieve the level control and heat dissipation effect of the image sensing chip 120, and the solder resist layer 119 It is preferable to cover the surface of the substrate 110 between the inner contact points 114 of the turtles. The solder mask layer 1 1 9 on the upper surface 111 of the substrate has an opening corresponding to the sticky crystal region 11 3 to prevent the sticking. The expansion of the gel body 130 and ensure that the top surface of the horizontal support of the metal pads i15a is It is important to note that, in a specific embodiment, the solder mask layer 11 9 has a central opening and a peripheral notch on the upper surface 1 11 of the substrate (as shown by the second circle). The solder mask layer The central opening of 11 9 corresponds to the die-bonding region 11 3 of the substrate 11 0 to expose the metal pads 11 5 ′, and the peripheral notch of the solder resist 11 9 surrounds the periphery of the upper surface 111 to The frame dam 150 is bonded to the substrate 1 10 and can block the diffusion and flow of the waste rubber (f lash) to the internal contacts 114 during the formation process of the frame dam 150. In addition, the substrate 110 is A number of semi-perforations 161a are provided at the peripheral gap of the solder layer 丨 丨 9, and the semi-perforations 丨 6 la should not penetrate to the lower surface 11 2 ′ of the substrate 11 to facilitate the submerged bonding of the frame dam 1 5 . Please refer to FIG. 2. The image sensing chip 20 has a sensing surface. Page 9 1243456 V. Description of the invention (6) 1 2 1 and a corresponding back surface 1 2 2 The image sensing chip 1 2 0 The back surface 1 2 2 is fixed to the viscous region 丨 3 of the substrate 1 with the viscose 1 3 0 and is supported and contacted by the support tabs 115a and the thermal pads 1 i5b for horizontal control. The image sensing chip 1 2 0 has a sensing surface 1 21, and the viscose 1 30 is a liquid or viscous colloidal thermosetting epoxy glue, such as silver glue or B-stage resin glue. Ultraviolet-cured colloid. After the viscose is cured, the metal pads 115 contact the back surface 122 of the image sensing chip 120 and are sealed by the viscose 1 30 to achieve a good level to control the image sense. The test chip 1 2 0 and the heat dissipation of the image sensor chip 丨 2 〇 are improved. The sensing surface 1 2 1 of the image sensor chip 1 2 0 is provided with a plurality of pads 1 2 3 around the pads 123. It is electrically connected to the inner contact 114 of the substrate 110 with a bonding wire 140, and preferably, a frame dam is formed on the upper surface 111 of the substrate 110. 15〇 [frame dam] for supporting a lens with a transparent cover 160 or a miniature camera module, and in addition, 'the sensing surface of the image sensing chip 120 can be combined with a glass substrate or a liquid crystal [液晶 not shown ] To form various optical components, such as a Compact Camera Module (CCM). Therefore, the image sensing chip package structure of the present invention uses a plurality of metal pads provided on the substrate's die-bond region 11 13. The metal pads 115 have a uniform support height and are not The solder resist layer 119 is covered to support and contact the back surface 1 22 of the image sensing chip 120 to achieve the effect of "controlling the sensing surface 121 of the image sensing chip 120 horizontally in the step of sticking the crystals" (detailed later) ], Furthermore, the image sensing chip package structure 100 of the present invention uses a plurality of heat dissipation pads 11 5 b provided in the die attach region 11 3 of the substrate, and the heat dissipation pads 115 b are connected with the through holes 116. To the lower surface 112 of the substrate.

1243456 V. Description of the invention (7) The hot metal layer 11 7 and the heat sinks 11 5b conduct the heat generated by the image sensing chip 120 to the lower surface 112 of the substrate 110 to achieve "the image sensing chip 1 2 0 heat dissipation gain ". The manufacturing method of the image sensing chip package structure 1000 according to the present invention is described in detail below. Please refer to FIGS. 3 and 4A to provide a substrate 110 as described above, and a plurality of metals are provided in the die-bonding region 113 of the substrate 110. Gasket 115. These metal gaskets 115 have a uniform supporting height and are not covered by the anti-glow layer 119. The substrate 110 is integrally formed on a large area matrix substrate [matrix] for mass production. Manufacture; then, referring to FIG. 4B, a frame dam 150 is formed around the upper surface 111 of the substrate 110 without using a pre-mold [pr 〇-mol ding], injection molding, or adhesive bonding. The contact 11 4 and the metal gasket 11 5 have a plurality of bumps 1 5 1 formed on the top surface of the frame dam 1 50 to support a transparent cover 1 60 horizontally. Does not affect the light-sensing characteristics of the image sensing chip 120, the frame dam 150 can be any color, such as red, green, blue and other visually rich colors, to achieve color optical packaging for color management; Please refer to Figure 4C, provide a * The above image sensing chip 120, a liquid or adhesive The thick colloidal viscose 130 is applied to the viscous crystal region 11 3 of the substrate 110, and after the back surface 122 of the image sensing chip 120 is adhered, the viscose 130 is cured and cured by heat curing or ultraviolet curing. The back surface 122 of the image sensing wafer 120 and the glutinous crystal region 113 of the substrate 110 support the back surface 1 22 of the image sensing wafer 120 by the metal pads 115 (the supporting pads 11 5a), and are horizontal. Control the sensing surface 1 2 1 of the image sensing wafer 1 2 0 to avoid the image sensing wafer 1 2 0 from being tilted during the die-bonding step or being affected by the level of the solder mask 119 of the substrate 110

Page 11 1243456 V. Description of the invention (8) degrees; then, referring to Figure 4D, electrically connect the image sensing chip with electrical connection devices such as a plurality of bonding wires 14 () or TAB (Tape Automated Bonding) leads. The solder pads 1 2 3 of 1 2 0 and the inner contacts 1 4 of the substrate 1 4, the fresh lines 14 0 and the image sensing chip 1 2 0 do not exceed the top surface of the frame dam 1 5 0 ; Finally, please refer to FIG. 4E. While maintaining the frame dam in a passive state or vacuum condition within 50 °, a large area of transparent cover is attached to the top surface of the frame dam with a thermosetting colloid. The image sensing wafer is sealed, and the transparent cover 16 is controlled by the bumps 151 of the frame dam 150. In this embodiment, the substrate is simultaneously cut by the cutting tool 70 during the cutting process. 1 (), the frame dam 150 and the transparent cover 160 to avoid affecting the airtight state of the image sensing chip 120, which is the above-mentioned image sensing chip package structure.

Therefore, the image sensing chip package structure and manufacturing method of the present invention are mainly applied to a miniature camera module (Compact Camera Module, CCM). When the cutting sheet is separated into individual image sensing chip package structures 100 (as in the first 2]], the image sensing chip 12 is controlled horizontally by the metal pad 115 of the substrate 110, and the transparent cover 160 is controlled by the bump 1 51 of the frame dam 1550 on the substrate 110. Control, so the sensing surface of the image sensing chip 120 and the transparent cover 16 can be horizontally controlled on the substrate during the thermosetting gel bonding process, and the two are highly parallel, effectively ensuring micro Manufacturing quality of photographic module [CCM]. Any changes and modifications made by anyone skilled in the art without departing from the spirit and scope of the present invention shall fall within the protection scope of the present invention. The scope of protection of the present invention shall be defined by the scope of the attached patent application

Figure 1 on page 12: Schematic cross-sectional view of the package structure of the S-view image sensor chip. Figure 2: Cross-sectional view of a horizontally-controlled image sensing package structure according to the present invention. 3rd circle · According to the present invention, View of the image sensing chip package structure plate •, and FIGS. 4A to 4E: A schematic cross-sectional view of a substrate in the process of packaging the image sensing chip according to the present invention. 〇 Simple explanation of component symbols: ·· 10 Upper surface of substrate 11 12 Lower surface 13 Solder resist 14 Internal contact 5 External pad 20 Image sensing chip 2 1 Sensing surface a Back 30 Adhesive body 40 Welding wire 50 Frame dam 60 Transparent cover 70 Cutting tool 100 Image sensing chip package structure 110 Substrate 111 Upper surface 112 Lower surface 113 Sticky crystal region 114 Inner contact 115 Metal pad 115a Support pad 115b Thermal pad 116 Through hole 116a Half-perforated 117 Thermal metal layer 118 External pad 119 Solder resist layer 120 Image sensor chip 1 21 Sensing surface 122 Back surface 123 Pad 130 Adhesive body 140 Fresh line 150 Frame dam 151 Bump 1 G 0 Transparent mushroom

Page 13

Claims (1)

1243456 --- T No. 92115559___ said in the month of January __ VI. Patent application scope factory one ~ ... 1 [Patent application scope] A: T j. G ______. One by one ~, a level control image sensor chip The package structure includes: a substrate having an upper surface and a lower surface; the upper surface of the substrate is defined with a sticky crystal region; the substrate system includes: a plurality of internal contacts disposed on the substrate The surface and along the periphery of the sticky crystal region; a plurality of horizontally controlled metal pads, which are arranged in the sticky crystal region of the substrate; the metal pads have a uniform supporting height; and a plurality of external points, It is located on the lower surface of the substrate and is electrically connected to the corresponding internal contact points. An image sensing chip has a sensing surface and a corresponding back surface. The back surface of the image sensing chip is fixed to The sticky crystal region of the substrate is supported by the metal pads to maintain the sensing surface of the image sensing chip as a level. The sensing surface of the image sensing chip is provided with a plurality of pads. The pads are Electrically connected to the substrate An internal contact point; and an adhesive body for adhering the back surface of the image sensing chip to the adhesive region of the substrate. 2. The horizontally controlled image-sensing wafer package structure described in item 1 of the scope of the patent application, wherein the substrate includes a solder mask layer, and the solder mask layer does not cover the metal pads. 3. The horizontally controlled image-sensing wafer package structure described in item 2 of the patent application scope, wherein the solder mask layer has a central opening formed on the upper surface of the substrate to expose the die-bonding area. 4. The level-controlled image sensing crystal as described in item 2 of the scope of patent application 6. Scope of patent application The chip package structure, wherein the solder resist layer has a peripheral notch formed on the upper surface of the substrate, which surrounds the periphery of the upper surface to facilitate a frame dam to be connected to the substrate. 5. The horizontally controlled image-sensing wafer package structure as described in item 1 of the scope of the patent application, wherein the metal pads are arranged symmetrically in a radial shape or other glue-dispensable shapes. δ. The level-controlled image-sensing wafer package structure described in item 1 of the scope of the patent application, wherein the metal pads and the internal contacts are formed of the same metal layer. 7. The horizontally controlled image-sensing wafer package structure as described in item 1 of the scope of the patent application, wherein the metal gaskets contact the back of the image-sensing wafer and are sealed by the adhesive. 8. The level-controlled image-sensing wafer package structure described in item 1 of the scope of the patent application, wherein a heat-dissipating metal layer is formed on the lower surface of the substrate. 9. The horizontally controlled image-sensing chip package structure as described in item 丨 or 8 of the scope of the patent application, wherein the metal pads include a plurality of thermally conductive pads. ′, 10, the horizontally controlled image sensing wafer package structure as described in item 9 of the scope of the patent application, wherein the thermally conductive pads are connected to the thermal metal layer with through holes. 11. The horizontal control chip package structure described in item 1 of the scope of patent application, further comprising a -frame dam, which forms the periphery of the upper surface of the sensing base t for joining a transparent cover or a miniature camera module Page 15 1243456 ------ 92115559 VI. Patent application scope. 12. The horizontally controlled factory-made image-sensing chip package structure as described in item 11 of the scope of the patent application, wherein the top surface of the frame field is formed with a plurality of bumps to support the transparent cover or micro-photographic module. Lens. 13. The horizontally controlled image-sensing wafer package structure as described in item 1 of the scope of the patent application, wherein the sticky knee system is a liquid or viscous colloidal applied thermosetting colloid or ultraviolet curable colloid. 14. The horizontally controlled image-sensing wafer package structure described in item 1 of the scope of the patent application, wherein the external points of the substrate are located around the lower surface of the substrate. 15. A package substrate, the substrate having an upper surface and a lower surface. The upper surface of the substrate defines a sticky crystal region. The substrate includes: a plurality of internal contacts, which are disposed on the upper surface of the substrate and Circumferentially arranged along the outer periphery of the sticky crystal region; a plurality of metal pads, which are provided in the sticky crystal region of the substrate, the metal pads have a uniform supporting height; and a plurality of external points, which are provided in The lower surface of the substrate is electrically connected to the corresponding internal contacts. _1 6. The package substrate as described in item 5 of the patent application scope, wherein the substrate system includes a solder resist layer, and the recording prevention layer does not cover the metal cymbals ° 1 7. As the patent application scope number 6 The package substrate according to the above item, wherein the solder resist layer has a central opening on the upper surface of the substrate for exposing .1243456 A --- Case No. 92115559 VI. Scope of patent application The sticky crystal region. 18. The package substrate as described in item 6 of the patent application scope, wherein the solder resist layer has a peripheral notch on the upper surface of the substrate, which surrounds the periphery of the upper surface to facilitate the bonding of a frame dam to The substrate. 19. The package substrate according to item 5 in the scope of the patent application, wherein the 呰 metal pads are arranged symmetrically in a radial shape or other glue-dispensable shapes. 20. The package substrate according to item 5 of the scope of the patent application, wherein the metal pads and the internal contacts are formed by etching the same metal layer. 2 1. The package substrate according to item 5 of the patent application scope, wherein a heat-dissipating metal layer is formed on the lower surface of the base φ plate. 22. The package substrate according to item 15 or 21 of the scope of patent application, wherein the metal pads include a plurality of thermal pads. 23. The package substrate according to item 22 of the scope of patent application, wherein the thermally conductive pads are connected to the heat dissipation metal layer by through holes. 24. The package substrate according to item 5 of the patent application scope, wherein a frame dam is formed on the upper surface of the substrate to join a transparent cover. 25. The package substrate according to item 5 of the scope of application for a patent, wherein the external points of the substrate are located around the lower surface of the substrate. 26. A horizontally controlled image sensing chip packaging method comprising: _ providing a substrate having an upper surface and a lower surface, the upper surface of the substrate including a sticky crystal region, and the substrate defining a plurality of Internal contact points, a plurality of horizontally controlled metal pads and a plurality of external contact points, wherein the internal contact points are arranged on the upper surface of the substrate and are arranged in a circle along the outer periphery of the sticky crystal region; the metal pads are On the substrate 1243456 VI. The patented sticky crystal area. The metal pads have the same support height. The external pads are located on the lower surface of the substrate and are electrically connected to the corresponding internal contacts. Provide an image sense. A sensing chip, the image sensing chip has a sensing surface and a corresponding back surface, the sensing surface of the image sensing chip is provided with a plurality of solder pads, and is electrically connected to the inner contacts of the substrate; and A viscose is used to fix the back surface of the image sensing chip to the sticky crystal region of the substrate, and the back surface of the image sensing chip is supported by the metal pads to control the sensing surface of the image sensing chip horizontally. 27. The horizontally controlled image-sensing chip packaging method as described in item 26 of the scope of the patent application, wherein the substrate includes a solder mask layer, and the solder mask layer does not cover the metal pads. 28. The level-controlled image sensing chip packaging method as described in item 26 of the scope of patent application, wherein the substrate is integrally formed on a matrix substrate 0 29. The level as described in item 26 or 28 of the scope of patent application The controlled image sensing chip packaging method further includes the steps of: forming a frame dam on the periphery of the upper surface of the substrate for bonding a lens of a transparent cover or a micro camera module. 30. The horizontally controlled image sensing ⑩ chip packaging method as described in item 29 of the scope of the patent application, wherein the top surface of the frame dam is formed with a plurality of bumps, and the transparent cover covers the frame dam in a large area. The top surface is horizontally supported by the bumps. 31. Level-controlled image sensing as described in item 26 of the scope of patent application Page 18 1243456 Page 19