TWI238027B - Copper foil for laser drilling - Google Patents

Copper foil for laser drilling Download PDF

Info

Publication number
TWI238027B
TWI238027B TW090107469A TW90107469A TWI238027B TW I238027 B TWI238027 B TW I238027B TW 090107469 A TW090107469 A TW 090107469A TW 90107469 A TW90107469 A TW 90107469A TW I238027 B TWI238027 B TW I238027B
Authority
TW
Taiwan
Prior art keywords
copper foil
laser
plating
copper
drilling
Prior art date
Application number
TW090107469A
Other languages
English (en)
Chinese (zh)
Inventor
Masaru Sakamoto
Kouji Kitano
Original Assignee
Nikko Materials Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=18617204&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=TWI238027(B) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Nikko Materials Co Ltd filed Critical Nikko Materials Co Ltd
Application granted granted Critical
Publication of TWI238027B publication Critical patent/TWI238027B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
    • H05K3/0038—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material combined with laser drilling through a metal layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0307—Providing micro- or nanometer scale roughness on a metal surface, e.g. by plating of nodules or dendrites
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0723—Electroplating, e.g. finish plating

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Physics & Mathematics (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Laser Beam Processing (AREA)
  • Laminated Bodies (AREA)
TW090107469A 2000-04-05 2001-03-29 Copper foil for laser drilling TWI238027B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000103505A JP3330925B2 (ja) 2000-04-05 2000-04-05 レーザー穴開け用銅箔

Publications (1)

Publication Number Publication Date
TWI238027B true TWI238027B (en) 2005-08-11

Family

ID=18617204

Family Applications (1)

Application Number Title Priority Date Filing Date
TW090107469A TWI238027B (en) 2000-04-05 2001-03-29 Copper foil for laser drilling

Country Status (4)

Country Link
JP (1) JP3330925B2 (ja)
KR (1) KR100495481B1 (ja)
MY (1) MY122999A (ja)
TW (1) TWI238027B (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10212814B2 (en) 2012-03-01 2019-02-19 Mitsui Mining & Smelting Co., Ltd. Copper foil provided with carrier foil, manufacturing method of the copper foil provided with carrier foil, and copper clad laminate for laser drilling manufactured by using the copper foil provided with carrier foil
CN109788658A (zh) * 2017-11-15 2019-05-21 鹏鼎控股(深圳)股份有限公司 电路板及其制作方法

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3869352B2 (ja) * 2002-11-12 2007-01-17 日鉱金属株式会社 金属箔の熱量測定方法、表面特性の調整方法、レーザー穴開け方法又は熱量測定装置
US7476449B2 (en) 2003-02-27 2009-01-13 Furukawa Circuit Foil Co., Ltd. Electromagnetic shielding copper foil, method of production thereof and electromagnetic shield
JP4458519B2 (ja) * 2003-07-28 2010-04-28 三井金属鉱業株式会社 黒色化処理面を備える表面処理銅箔、その表面処理銅箔の製造方法及びその表面処理銅箔を用いたプラズマディスプレイの前面パネル用の電磁波遮蔽導電性メッシュ
JP4458521B2 (ja) * 2004-03-02 2010-04-28 三井金属鉱業株式会社 灰色化処理面を備える表面処理銅箔、その表面処理銅箔の製造方法及びその表面処理銅箔を用いたプラズマディスプレイの前面パネル用の電磁波遮蔽導電性メッシュ
KR100654737B1 (ko) * 2004-07-16 2006-12-08 일진소재산업주식회사 미세회로기판용 표면처리동박의 제조방법 및 그 동박
JP2006210689A (ja) * 2005-01-28 2006-08-10 Fukuda Metal Foil & Powder Co Ltd 高周波プリント配線板用銅箔及びその製造方法
US7886437B2 (en) 2007-05-25 2011-02-15 Electro Scientific Industries, Inc. Process for forming an isolated electrically conductive contact through a metal package
KR101289803B1 (ko) 2008-05-16 2013-07-26 삼성테크윈 주식회사 회로 기판 및 그 제조 방법
JP2009235580A (ja) * 2009-07-22 2009-10-15 Furukawa Electric Co Ltd:The レーザー穴開け用銅箔
US9338898B2 (en) 2012-03-09 2016-05-10 Mitsui Mining & Smelting Co., Ltd. Method of producing a printed wiring board
KR101400778B1 (ko) * 2012-10-05 2014-06-02 일진머티리얼즈 주식회사 레이저 가공용 동박, 이를 채용한 동부착적층판 및 상기 동박의 제조방법
CN103972513B (zh) * 2013-02-06 2016-08-17 永箔科技股份有限公司 多孔性集流体金属材料连续加工法
KR102356407B1 (ko) * 2013-03-05 2022-01-28 미쓰이금속광업주식회사 레이저 가공용 구리 박, 캐리어 박 구비 레이저 가공용 구리 박, 구리클래드 적층체 및 프린트 배선판의 제조 방법

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10212814B2 (en) 2012-03-01 2019-02-19 Mitsui Mining & Smelting Co., Ltd. Copper foil provided with carrier foil, manufacturing method of the copper foil provided with carrier foil, and copper clad laminate for laser drilling manufactured by using the copper foil provided with carrier foil
CN109788658A (zh) * 2017-11-15 2019-05-21 鹏鼎控股(深圳)股份有限公司 电路板及其制作方法

Also Published As

Publication number Publication date
KR20020084243A (ko) 2002-11-04
KR100495481B1 (ko) 2005-06-14
MY122999A (en) 2006-05-31
JP2001288595A (ja) 2001-10-19
JP3330925B2 (ja) 2002-10-07

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