TWI232530B - Method and apparatus for slope to threshold conversion for process state monitoring and endpoint detection - Google Patents

Method and apparatus for slope to threshold conversion for process state monitoring and endpoint detection Download PDF

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Publication number
TWI232530B
TWI232530B TW092134960A TW92134960A TWI232530B TW I232530 B TWI232530 B TW I232530B TW 092134960 A TW092134960 A TW 092134960A TW 92134960 A TW92134960 A TW 92134960A TW I232530 B TWI232530 B TW I232530B
Authority
TW
Taiwan
Prior art keywords
value
threshold
slope
point
monitored
Prior art date
Application number
TW092134960A
Other languages
English (en)
Chinese (zh)
Other versions
TW200414396A (en
Inventor
Yehiel Gotkis
Vladimir Katz
David Hemker
Rodney Kistler
Nicolas J Bright
Original Assignee
Lam Res Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lam Res Corp filed Critical Lam Res Corp
Publication of TW200414396A publication Critical patent/TW200414396A/zh
Application granted granted Critical
Publication of TWI232530B publication Critical patent/TWI232530B/zh

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Classifications

    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B23/00—Testing or monitoring of control systems or parts thereof
    • G05B23/02—Electric testing or monitoring
    • G05B23/0205—Electric testing or monitoring by means of a monitoring system capable of detecting and responding to faults
    • G05B23/0218—Electric testing or monitoring by means of a monitoring system capable of detecting and responding to faults characterised by the fault detection method dealing with either existing or incipient faults
    • G05B23/0243—Electric testing or monitoring by means of a monitoring system capable of detecting and responding to faults characterised by the fault detection method dealing with either existing or incipient faults model based detection method, e.g. first-principles knowledge model
    • G05B23/0254—Electric testing or monitoring by means of a monitoring system capable of detecting and responding to faults characterised by the fault detection method dealing with either existing or incipient faults model based detection method, e.g. first-principles knowledge model based on a quantitative model, e.g. mathematical relationships between inputs and outputs; functions: observer, Kalman filter, residual calculation, Neural Networks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/23—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes
    • H10P74/238—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes comprising acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection or in-situ thickness measurement

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Artificial Intelligence (AREA)
  • Evolutionary Computation (AREA)
  • Mathematical Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Automation & Control Theory (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Drying Of Semiconductors (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
TW092134960A 2002-12-13 2003-12-11 Method and apparatus for slope to threshold conversion for process state monitoring and endpoint detection TWI232530B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/318,967 US6859765B2 (en) 2002-12-13 2002-12-13 Method and apparatus for slope to threshold conversion for process state monitoring and endpoint detection

Publications (2)

Publication Number Publication Date
TW200414396A TW200414396A (en) 2004-08-01
TWI232530B true TWI232530B (en) 2005-05-11

Family

ID=32506518

Family Applications (1)

Application Number Title Priority Date Filing Date
TW092134960A TWI232530B (en) 2002-12-13 2003-12-11 Method and apparatus for slope to threshold conversion for process state monitoring and endpoint detection

Country Status (8)

Country Link
US (2) US6859765B2 (https=)
EP (1) EP1570363B1 (https=)
JP (2) JP2006510228A (https=)
KR (1) KR101007159B1 (https=)
CN (1) CN100350403C (https=)
AU (1) AU2003303494A1 (https=)
TW (1) TWI232530B (https=)
WO (1) WO2004061693A1 (https=)

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Also Published As

Publication number Publication date
KR20050084998A (ko) 2005-08-29
US20050125202A1 (en) 2005-06-09
KR101007159B1 (ko) 2011-01-12
WO2004061693A1 (en) 2004-07-22
AU2003303494A1 (en) 2004-07-29
CN1726479A (zh) 2006-01-25
CN100350403C (zh) 2007-11-21
US20040117054A1 (en) 2004-06-17
EP1570363B1 (en) 2011-05-18
US7010468B2 (en) 2006-03-07
JP2012238882A (ja) 2012-12-06
US6859765B2 (en) 2005-02-22
TW200414396A (en) 2004-08-01
EP1570363A4 (en) 2006-04-12
EP1570363A1 (en) 2005-09-07
JP2006510228A (ja) 2006-03-23

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