AU2003303494A1 - Method and apparatus for slope to threshold conversion for process state monitoring and endpoint detection - Google Patents

Method and apparatus for slope to threshold conversion for process state monitoring and endpoint detection

Info

Publication number
AU2003303494A1
AU2003303494A1 AU2003303494A AU2003303494A AU2003303494A1 AU 2003303494 A1 AU2003303494 A1 AU 2003303494A1 AU 2003303494 A AU2003303494 A AU 2003303494A AU 2003303494 A AU2003303494 A AU 2003303494A AU 2003303494 A1 AU2003303494 A1 AU 2003303494A1
Authority
AU
Australia
Prior art keywords
slope
state monitoring
process state
endpoint detection
threshold conversion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2003303494A
Other languages
English (en)
Inventor
Nicolas J. Bright
Yehiel Gotkis
David Hemker
Vladimir Katz
Rodney Kistler
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lam Research Corp
Original Assignee
Lam Research Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lam Research Corp filed Critical Lam Research Corp
Publication of AU2003303494A1 publication Critical patent/AU2003303494A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B23/00—Testing or monitoring of control systems or parts thereof
    • G05B23/02—Electric testing or monitoring
    • G05B23/0205—Electric testing or monitoring by means of a monitoring system capable of detecting and responding to faults
    • G05B23/0218—Electric testing or monitoring by means of a monitoring system capable of detecting and responding to faults characterised by the fault detection method dealing with either existing or incipient faults
    • G05B23/0243—Electric testing or monitoring by means of a monitoring system capable of detecting and responding to faults characterised by the fault detection method dealing with either existing or incipient faults model based detection method, e.g. first-principles knowledge model
    • G05B23/0254—Electric testing or monitoring by means of a monitoring system capable of detecting and responding to faults characterised by the fault detection method dealing with either existing or incipient faults model based detection method, e.g. first-principles knowledge model based on a quantitative model, e.g. mathematical relationships between inputs and outputs; functions: observer, Kalman filter, residual calculation, Neural Networks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/23—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes
    • H10P74/238—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes comprising acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection or in-situ thickness measurement

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Artificial Intelligence (AREA)
  • Evolutionary Computation (AREA)
  • Mathematical Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Automation & Control Theory (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Drying Of Semiconductors (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
AU2003303494A 2002-12-13 2003-12-11 Method and apparatus for slope to threshold conversion for process state monitoring and endpoint detection Abandoned AU2003303494A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US10/318,967 2002-12-13
US10/318,967 US6859765B2 (en) 2002-12-13 2002-12-13 Method and apparatus for slope to threshold conversion for process state monitoring and endpoint detection
PCT/US2003/039778 WO2004061693A1 (en) 2002-12-13 2003-12-11 Method and apparatus for slope to threshold conversion for process state monitoring and endpoint detection

Publications (1)

Publication Number Publication Date
AU2003303494A1 true AU2003303494A1 (en) 2004-07-29

Family

ID=32506518

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2003303494A Abandoned AU2003303494A1 (en) 2002-12-13 2003-12-11 Method and apparatus for slope to threshold conversion for process state monitoring and endpoint detection

Country Status (8)

Country Link
US (2) US6859765B2 (https=)
EP (1) EP1570363B1 (https=)
JP (2) JP2006510228A (https=)
KR (1) KR101007159B1 (https=)
CN (1) CN100350403C (https=)
AU (1) AU2003303494A1 (https=)
TW (1) TWI232530B (https=)
WO (1) WO2004061693A1 (https=)

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US8538572B2 (en) * 2009-06-30 2013-09-17 Lam Research Corporation Methods for constructing an optimal endpoint algorithm
US8983631B2 (en) * 2009-06-30 2015-03-17 Lam Research Corporation Arrangement for identifying uncontrolled events at the process module level and methods thereof
CN102541719A (zh) * 2010-12-24 2012-07-04 鸿富锦精密工业（深圳）有限公司 排除错误观测值的系统及方法
US9403254B2 (en) * 2011-08-17 2016-08-02 Taiwan Semiconductor Manufacturing Company, Ltd. Methods for real-time error detection in CMP processing
US9308618B2 (en) * 2012-04-26 2016-04-12 Applied Materials, Inc. Linear prediction for filtering of data during in-situ monitoring of polishing
US20140163907A1 (en) * 2012-12-10 2014-06-12 General Electric Company Systems and methods for fault detection
JP6625098B2 (ja) * 2017-07-20 2019-12-25 株式会社Ｋｏｋｕｓａｉ Ｅｌｅｃｔｒｉｃ 基板処理システム、半導体装置の製造方法およびプログラム
US11504821B2 (en) 2017-11-16 2022-11-22 Applied Materials, Inc. Predictive filter for polishing pad wear rate monitoring
JP6525044B1 (ja) * 2017-12-13 2019-06-05 オムロン株式会社 監視システム、学習装置、学習方法、監視装置及び監視方法
KR102103150B1 (ko) * 2018-03-14 2020-04-22 (주)아이티공간 구동부의 정밀 예지 보전방법
KR102103145B1 (ko) * 2018-03-14 2020-04-22 (주)아이티공간 구동부의 정밀 예지 보전방법
KR102103143B1 (ko) * 2018-03-14 2020-04-22 (주)아이티공간 구동부의 정밀 예지 보전방법
KR102103147B1 (ko) * 2018-03-14 2020-04-22 (주)아이티공간 구동부의 정밀 예지 보전방법
KR102103144B1 (ko) * 2018-03-14 2020-04-22 (주)아이티공간 구동부의 정밀 예지 보전방법
CN109118274B (zh) * 2018-07-25 2021-11-16 武汉轻工大学 任务点去噪分类方法、系统、终端设备及存储介质
WO2020185242A1 (en) * 2019-03-08 2020-09-17 Kla-Tencor Corporation Dynamic amelioration of misregistration measurement
US11455154B2 (en) 2020-12-10 2022-09-27 International Business Machines Corporation Vector-based identification of software dependency relationships

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US6859765B2 (en) * 2002-12-13 2005-02-22 Lam Research Corporation Method and apparatus for slope to threshold conversion for process state monitoring and endpoint detection

Also Published As

Publication number Publication date
KR20050084998A (ko) 2005-08-29
US20050125202A1 (en) 2005-06-09
KR101007159B1 (ko) 2011-01-12
WO2004061693A1 (en) 2004-07-22
TWI232530B (en) 2005-05-11
CN1726479A (zh) 2006-01-25
CN100350403C (zh) 2007-11-21
US20040117054A1 (en) 2004-06-17
EP1570363B1 (en) 2011-05-18
US7010468B2 (en) 2006-03-07
JP2012238882A (ja) 2012-12-06
US6859765B2 (en) 2005-02-22
TW200414396A (en) 2004-08-01
EP1570363A4 (en) 2006-04-12
EP1570363A1 (en) 2005-09-07
JP2006510228A (ja) 2006-03-23

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase