KR101007159B1 - 처리 상태 모니터링 및 종점 검출을 위해 기울기를임계값으로 변환하기 위한 방법 및 장치 - Google Patents

처리 상태 모니터링 및 종점 검출을 위해 기울기를임계값으로 변환하기 위한 방법 및 장치 Download PDF

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KR101007159B1
KR101007159B1 KR1020057008757A KR20057008757A KR101007159B1 KR 101007159 B1 KR101007159 B1 KR 101007159B1 KR 1020057008757 A KR1020057008757 A KR 1020057008757A KR 20057008757 A KR20057008757 A KR 20057008757A KR 101007159 B1 KR101007159 B1 KR 101007159B1
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value
threshold
difference
transition point
slope
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KR20050084998A (ko
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예히엘 고트키스
블라디미르 카츠
데이비드 헴커
로드니 키슬러
니콜라스 제이 브라이트
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램 리써치 코포레이션
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    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B23/00—Testing or monitoring of control systems or parts thereof
    • G05B23/02—Electric testing or monitoring
    • G05B23/0205—Electric testing or monitoring by means of a monitoring system capable of detecting and responding to faults
    • G05B23/0218—Electric testing or monitoring by means of a monitoring system capable of detecting and responding to faults characterised by the fault detection method dealing with either existing or incipient faults
    • G05B23/0243—Electric testing or monitoring by means of a monitoring system capable of detecting and responding to faults characterised by the fault detection method dealing with either existing or incipient faults model based detection method, e.g. first-principles knowledge model
    • G05B23/0254—Electric testing or monitoring by means of a monitoring system capable of detecting and responding to faults characterised by the fault detection method dealing with either existing or incipient faults model based detection method, e.g. first-principles knowledge model based on a quantitative model, e.g. mathematical relationships between inputs and outputs; functions: observer, Kalman filter, residual calculation, Neural Networks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/23—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes
    • H10P74/238—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes comprising acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection or in-situ thickness measurement

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Artificial Intelligence (AREA)
  • Evolutionary Computation (AREA)
  • Mathematical Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Automation & Control Theory (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Drying Of Semiconductors (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
KR1020057008757A 2002-12-13 2003-12-11 처리 상태 모니터링 및 종점 검출을 위해 기울기를임계값으로 변환하기 위한 방법 및 장치 Expired - Fee Related KR101007159B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/318,967 2002-12-13
US10/318,967 US6859765B2 (en) 2002-12-13 2002-12-13 Method and apparatus for slope to threshold conversion for process state monitoring and endpoint detection

Publications (2)

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KR20050084998A KR20050084998A (ko) 2005-08-29
KR101007159B1 true KR101007159B1 (ko) 2011-01-12

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KR1020057008757A Expired - Fee Related KR101007159B1 (ko) 2002-12-13 2003-12-11 처리 상태 모니터링 및 종점 검출을 위해 기울기를임계값으로 변환하기 위한 방법 및 장치

Country Status (8)

Country Link
US (2) US6859765B2 (https=)
EP (1) EP1570363B1 (https=)
JP (2) JP2006510228A (https=)
KR (1) KR101007159B1 (https=)
CN (1) CN100350403C (https=)
AU (1) AU2003303494A1 (https=)
TW (1) TWI232530B (https=)
WO (1) WO2004061693A1 (https=)

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US8106651B2 (en) * 2008-04-17 2012-01-31 Novellus Systems, Inc. Methods and apparatuses for determining thickness of a conductive layer
US8618807B2 (en) * 2009-06-30 2013-12-31 Lam Research Corporation Arrangement for identifying uncontrolled events at the process module level and methods thereof
US8473089B2 (en) * 2009-06-30 2013-06-25 Lam Research Corporation Methods and apparatus for predictive preventive maintenance of processing chambers
US8538572B2 (en) * 2009-06-30 2013-09-17 Lam Research Corporation Methods for constructing an optimal endpoint algorithm
US8983631B2 (en) * 2009-06-30 2015-03-17 Lam Research Corporation Arrangement for identifying uncontrolled events at the process module level and methods thereof
CN102541719A (zh) * 2010-12-24 2012-07-04 鸿富锦精密工业（深圳）有限公司 排除错误观测值的系统及方法
US9403254B2 (en) * 2011-08-17 2016-08-02 Taiwan Semiconductor Manufacturing Company, Ltd. Methods for real-time error detection in CMP processing
US9308618B2 (en) * 2012-04-26 2016-04-12 Applied Materials, Inc. Linear prediction for filtering of data during in-situ monitoring of polishing
US20140163907A1 (en) * 2012-12-10 2014-06-12 General Electric Company Systems and methods for fault detection
JP6625098B2 (ja) * 2017-07-20 2019-12-25 株式会社Ｋｏｋｕｓａｉ Ｅｌｅｃｔｒｉｃ 基板処理システム、半導体装置の製造方法およびプログラム
US11504821B2 (en) 2017-11-16 2022-11-22 Applied Materials, Inc. Predictive filter for polishing pad wear rate monitoring
JP6525044B1 (ja) * 2017-12-13 2019-06-05 オムロン株式会社 監視システム、学習装置、学習方法、監視装置及び監視方法
KR102103150B1 (ko) * 2018-03-14 2020-04-22 (주)아이티공간 구동부의 정밀 예지 보전방법
KR102103145B1 (ko) * 2018-03-14 2020-04-22 (주)아이티공간 구동부의 정밀 예지 보전방법
KR102103143B1 (ko) * 2018-03-14 2020-04-22 (주)아이티공간 구동부의 정밀 예지 보전방법
KR102103147B1 (ko) * 2018-03-14 2020-04-22 (주)아이티공간 구동부의 정밀 예지 보전방법
KR102103144B1 (ko) * 2018-03-14 2020-04-22 (주)아이티공간 구동부의 정밀 예지 보전방법
CN109118274B (zh) * 2018-07-25 2021-11-16 武汉轻工大学 任务点去噪分类方法、系统、终端设备及存储介质
WO2020185242A1 (en) * 2019-03-08 2020-09-17 Kla-Tencor Corporation Dynamic amelioration of misregistration measurement
US11455154B2 (en) 2020-12-10 2022-09-27 International Business Machines Corporation Vector-based identification of software dependency relationships

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Also Published As

Publication number Publication date
KR20050084998A (ko) 2005-08-29
US20050125202A1 (en) 2005-06-09
WO2004061693A1 (en) 2004-07-22
TWI232530B (en) 2005-05-11
AU2003303494A1 (en) 2004-07-29
CN1726479A (zh) 2006-01-25
CN100350403C (zh) 2007-11-21
US20040117054A1 (en) 2004-06-17
EP1570363B1 (en) 2011-05-18
US7010468B2 (en) 2006-03-07
JP2012238882A (ja) 2012-12-06
US6859765B2 (en) 2005-02-22
TW200414396A (en) 2004-08-01
EP1570363A4 (en) 2006-04-12
EP1570363A1 (en) 2005-09-07
JP2006510228A (ja) 2006-03-23

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