TWD239446S - 基板處理裝置用隔熱環之部分 - Google Patents

基板處理裝置用隔熱環之部分

Info

Publication number
TWD239446S
TWD239446S TW112304677F TW112304677F TWD239446S TW D239446 S TWD239446 S TW D239446S TW 112304677 F TW112304677 F TW 112304677F TW 112304677 F TW112304677 F TW 112304677F TW D239446 S TWD239446 S TW D239446S
Authority
TW
Taiwan
Prior art keywords
design
substrate processing
processing equipment
thermal insulation
insulation ring
Prior art date
Application number
TW112304677F
Other languages
English (en)
Chinese (zh)
Inventor
谷口大騎
西堂周平
Original Assignee
日商國際電氣股份有限公司 (日本)
日商國際電氣股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商國際電氣股份有限公司 (日本), 日商國際電氣股份有限公司 filed Critical 日商國際電氣股份有限公司 (日本)
Publication of TWD239446S publication Critical patent/TWD239446S/zh

Links

TW112304677F 2023-03-13 2023-09-11 基板處理裝置用隔熱環之部分 TWD239446S (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2023004908F JP1755434S (enExample) 2023-03-13 2023-03-13
JP2023-004908 2023-03-13

Publications (1)

Publication Number Publication Date
TWD239446S true TWD239446S (zh) 2025-07-21

Family

ID=88328215

Family Applications (1)

Application Number Title Priority Date Filing Date
TW112304677F TWD239446S (zh) 2023-03-13 2023-09-11 基板處理裝置用隔熱環之部分

Country Status (3)

Country Link
US (1) USD1134251S1 (enExample)
JP (1) JP1755434S (enExample)
TW (1) TWD239446S (enExample)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWD214778S (zh) 2020-01-22 2021-10-21 日商東京威力科創股份有限公司 半導體製造裝置用保溫筒散熱片（四）

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3205936A (en) * 1963-06-20 1965-09-14 Astro Dynamics Inc Stacked-fin heat sink
USD410438S (en) * 1997-01-31 1999-06-01 Tokyo Electron Limited Heat retaining tube for use in a semiconductor wafer heat processing apparatus
USD478556S1 (en) * 2002-01-10 2003-08-19 Nasser Abo Abdo Speaker heat sink
USD615937S1 (en) * 2009-03-06 2010-05-18 Tokyo Electron Limited Heat radiation fin of heat insulating cylinder for manufacturing semiconductor wafers
USD786201S1 (en) * 2015-10-19 2017-05-09 Tymphany Hk Limited Heat sink for woofer
KR101731488B1 (ko) * 2015-10-27 2017-05-02 주식회사 유진테크 기판처리장치 및 튜브 조립체 조립방법
JP1700778S (ja) * 2021-03-15 2021-11-29 基板処理装置用遮蔽具
JP1713190S (enExample) * 2021-10-01 2022-04-21
USD1042374S1 (en) * 2022-03-18 2024-09-17 Applied Materials, Inc. Support pipe for an interlocking process kit for a substrate processing chamber

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWD214778S (zh) 2020-01-22 2021-10-21 日商東京威力科創股份有限公司 半導體製造裝置用保溫筒散熱片（四）

Also Published As

Publication number Publication date
USD1134251S1 (en) 2026-07-14
JP1755434S (enExample) 2023-10-17

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