TWD213271S - Heat pipe - Google Patents
Heat pipe Download PDFInfo
- Publication number
- TWD213271S TWD213271S TW109306147F TW109306147F TWD213271S TW D213271 S TWD213271 S TW D213271S TW 109306147 F TW109306147 F TW 109306147F TW 109306147 F TW109306147 F TW 109306147F TW D213271 S TWD213271 S TW D213271S
- Authority
- TW
- Taiwan
- Prior art keywords
- design
- heat
- heat dissipation
- heat pipe
- computer
- Prior art date
Links
- 230000017525 heat dissipation Effects 0.000 abstract description 7
- 238000001816 cooling Methods 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 1
Images
Abstract
【物品用途】;本設計係指一種設置於電腦的散熱模組當中的熱管,用於將電腦中的電子元件所產生的熱量傳遞至散熱鰭片來協助散熱。;【設計說明】;圖式所揭露之虛線部分,為本案不主張設計之部分。;請參閱參考圖1以及參考圖2,本設計之熱管可複數個排列後組裝在散熱模組中。[Use of article]; This design refers to a heat pipe installed in the cooling module of a computer, which is used to transfer the heat generated by the electronic components in the computer to the heat dissipation fins to assist in heat dissipation. ;[Design Description];The dotted line portion disclosed in the drawing is the part of this case that does not require design. ; Please refer to Figure 1 and Figure 2. The heat pipes of this design can be arranged in multiples and assembled in the heat dissipation module.
Description
本設計係指一種設置於電腦的散熱模組當中的熱管,用於將電腦中的電子元件所產生的熱量傳遞至散熱鰭片來協助散熱。The design refers to a heat pipe arranged in the heat dissipation module of the computer, which is used to transfer the heat generated by the electronic components in the computer to the heat dissipation fins to assist in heat dissipation.
圖式所揭露之虛線部分,為本案不主張設計之部分。The dotted line exposed in the diagram is a part of this case that does not advocate design.
請參閱參考圖1以及參考圖2,本設計之熱管可複數個排列後組裝在散熱模組中。Please refer to Figure 1 and Figure 2. The heat pipes of this design can be arranged in a plurality of heat pipes and assembled in the heat dissipation module.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW109306147F TWD213271S (en) | 2020-11-05 | 2020-11-05 | Heat pipe |
| US29/761,516 USD1051306S1 (en) | 2020-11-05 | 2020-12-09 | Heat pipe |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW109306147F TWD213271S (en) | 2020-11-05 | 2020-11-05 | Heat pipe |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TWD213271S true TWD213271S (en) | 2021-08-11 |
Family
ID=88971755
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW109306147F TWD213271S (en) | 2020-11-05 | 2020-11-05 | Heat pipe |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | USD1051306S1 (en) |
| TW (1) | TWD213271S (en) |
Family Cites Families (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD452560S1 (en) * | 2000-02-18 | 2001-12-25 | Kanthal Ab | Heating element |
| USD449375S1 (en) * | 2000-02-18 | 2001-10-16 | Kanthal Ab | Heating element |
| USD452561S1 (en) * | 2000-08-18 | 2001-12-25 | Kanthal Ab | Heating element |
| US7806213B2 (en) * | 2004-12-17 | 2010-10-05 | Tokai Rubber Industries, Ltd. | Piping structure for transporting a fuel |
| US20090166006A1 (en) * | 2007-12-27 | 2009-07-02 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat dissipation device |
| TW201015041A (en) * | 2008-10-03 | 2010-04-16 | Golden Sun News Tech Co Ltd | Smoothing-manufacture method to bury the heat-pipe evaporating segment into the heat-conduction base |
| TW201037256A (en) * | 2010-05-14 | 2010-10-16 | Asia Vital Components Co Ltd | Heat dissipating device and manufacturing method thereof |
| CN103032828A (en) * | 2011-09-30 | 2013-04-10 | 鸿富锦精密工业(深圳)有限公司 | Light guiding pillar fixing device |
| TWD148360S1 (en) * | 2011-12-30 | 2012-07-21 | 奇鋐科技股份有限公司 | Heat pipe |
| JP5982870B2 (en) * | 2012-02-28 | 2016-08-31 | キョーラク株式会社 | Foam duct |
| CN103543800A (en) * | 2012-07-11 | 2014-01-29 | 鸿富锦精密工业(深圳)有限公司 | Power source mounting rack |
| CN203934263U (en) * | 2014-07-04 | 2014-11-05 | 讯凯国际股份有限公司 | Heat sink with capillary members |
| US10048017B2 (en) * | 2015-12-01 | 2018-08-14 | Asia Vital Components Co., Ltd. | Heat dissipation unit |
| US10036596B2 (en) * | 2016-01-11 | 2018-07-31 | Asia Vital Components Co., Ltd. | Combination structure of heat dissipation module |
| US10655918B2 (en) * | 2016-10-12 | 2020-05-19 | Baltimore Aircoil Company, Inc. | Indirect heat exchanger having circuit tubes with varying dimensions |
| CN108695275B (en) * | 2017-04-07 | 2019-12-27 | 全亿大科技(佛山)有限公司 | Heat radiator |
| USD1009813S1 (en) * | 2019-12-30 | 2024-01-02 | Asia Vital Components Co., Ltd. | Heat pipe |
| CN113494862A (en) * | 2020-03-19 | 2021-10-12 | 亚浩电子五金塑胶(惠州)有限公司 | Heat pipe |
| USD979714S1 (en) * | 2020-05-08 | 2023-02-28 | Kohler Co. | Faucet |
| US12158309B2 (en) * | 2020-09-15 | 2024-12-03 | Vast Glory Electronics & Hardware & Plastic(Hui Zhou) Ltd. | Heat pipe with composite wick structure |
| CN213841858U (en) * | 2020-11-05 | 2021-07-30 | 亚浩电子五金塑胶(惠州)有限公司 | Heat pipe and heat radiation structure with same |
-
2020
- 2020-11-05 TW TW109306147F patent/TWD213271S/en unknown
- 2020-12-09 US US29/761,516 patent/USD1051306S1/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| USD1051306S1 (en) | 2024-11-12 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWD221432S (en) | Heat dissipation module | |
| TWD222242S (en) | Notebook computer | |
| WO2018157476A1 (en) | Heat dissipation system for use with three-dimensional power amplifier | |
| TWD213271S (en) | Heat pipe | |
| CN209167955U (en) | A computer motherboard with good heat dissipation | |
| CN207488942U (en) | Laptop radiating system | |
| CN107943250A (en) | Laptop radiating system | |
| CN204009732U (en) | A kind of totally enclosed type laptop heat-dissipation structure | |
| CN206790866U (en) | A heat sink with freely splicable structure | |
| CN204948589U (en) | Heat radiation module | |
| TWD236878S (en) | Heat sink module | |
| TWD210809S (en) | A heat-dissipating bracket for notebook computer | |
| CN104329650B (en) | Using the radiator structure of the heat pipe combined LED desk lamp of metal-containing polymer | |
| CN210075875U (en) | Radiating fin, radiating module and electronic equipment | |
| CN206517715U (en) | Heat radiation unit | |
| TWD230746S (en) | Heat dissipation module | |
| TWD230745S (en) | Heat dissipation module | |
| US20090056928A1 (en) | Heat dissipation assembly | |
| TWD234016S (en) | Heat dissipation module | |
| CN206523833U (en) | A computer CPU heat sink | |
| CN206993568U (en) | A double-layer heat conduction radiator | |
| CN202058080U (en) | Small-sized industrial control computer with improved heat radiation effect | |
| TWD223321S (en) | Heat-dissipating bracket | |
| CN201575739U (en) | Thermal guide | |
| CN2852243Y (en) | Structure of computer heat radiator |