TWD230745S - Heat dissipation module - Google Patents
Heat dissipation module Download PDFInfo
- Publication number
- TWD230745S TWD230745S TW112305012F TW112305012F TWD230745S TW D230745 S TWD230745 S TW D230745S TW 112305012 F TW112305012 F TW 112305012F TW 112305012 F TW112305012 F TW 112305012F TW D230745 S TWD230745 S TW D230745S
- Authority
- TW
- Taiwan
- Prior art keywords
- heat dissipation
- dissipation module
- module
- heat
- design
- Prior art date
Links
- 230000017525 heat dissipation Effects 0.000 title 1
- 238000001816 cooling Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
Images
Description
本設計物品是一種散熱模組。This design item is a cooling module.
圖式所揭露之虛線部分，為本案不主張設計之部分。The dotted line part in the diagram is not the design advocated by this case.
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TWD230745S true TWD230745S (en) | 2024-04-01 |
Family
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Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWD221432S (en) | 2022-02-08 | 2022-10-01 | 宏碁股份有限公司 | Heat dissipation module |
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWD221432S (en) | 2022-02-08 | 2022-10-01 | 宏碁股份有限公司 | Heat dissipation module |
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