TWD230745S - Heat dissipation module - Google Patents

Heat dissipation module Download PDF

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Publication number
TWD230745S
TWD230745S TW112305012F TW112305012F TWD230745S TW D230745 S TWD230745 S TW D230745S TW 112305012 F TW112305012 F TW 112305012F TW 112305012 F TW112305012 F TW 112305012F TW D230745 S TWD230745 S TW D230745S
Authority
TW
Taiwan
Prior art keywords
heat dissipation
dissipation module
design
item
diagram
Prior art date
Application number
TW112305012F
Other languages
Chinese (zh)
Inventor
賴威佑
李貽恆
Original Assignee
宏碁股份有限公司 新北市汐止區新台五路一段88號8樓 (中華民國)
宏碁股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 宏碁股份有限公司 新北市汐止區新台五路一段88號8樓 (中華民國), 宏碁股份有限公司 filed Critical 宏碁股份有限公司 新北市汐止區新台五路一段88號8樓 (中華民國)
Priority to TW112305012F priority Critical patent/TWD230745S/en
Publication of TWD230745S publication Critical patent/TWD230745S/en

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Abstract

【物品用途】;本設計物品是一種散熱模組。;【設計說明】;圖式所揭露之虛線部分，為本案不主張設計之部分。[Item Purpose];This design item is a heat dissipation module. ;[Design Description];The dotted line part disclosed in the diagram is the part that this case does not advocate the design of.

Description

散熱模組Heat dissipation module

本設計物品是一種散熱模組。This design item is a cooling module.

圖式所揭露之虛線部分，為本案不主張設計之部分。The dotted line part in the diagram is not the design advocated by this case.

TW112305012F 2023-09-27 2023-09-27 Heat dissipation module TWD230745S (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW112305012F TWD230745S (en) 2023-09-27 2023-09-27 Heat dissipation module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW112305012F TWD230745S (en) 2023-09-27 2023-09-27 Heat dissipation module

Publications (1)

Publication Number Publication Date
TWD230745S true TWD230745S (en) 2024-04-01

Family

ID=91333570

Family Applications (1)

Application Number Title Priority Date Filing Date
TW112305012F TWD230745S (en) 2023-09-27 2023-09-27 Heat dissipation module

Country Status (1)

Country Link
TW (1) TWD230745S (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWD221432S (en) 2022-02-08 2022-10-01 宏碁股份有限公司 Heat dissipation module

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWD221432S (en) 2022-02-08 2022-10-01 宏碁股份有限公司 Heat dissipation module

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